CN103085147B - Production method of medium- and high-density fiberboard ultralow in formaldehyde emission - Google Patents

Production method of medium- and high-density fiberboard ultralow in formaldehyde emission Download PDF

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Publication number
CN103085147B
CN103085147B CN201110339174.7A CN201110339174A CN103085147B CN 103085147 B CN103085147 B CN 103085147B CN 201110339174 A CN201110339174 A CN 201110339174A CN 103085147 B CN103085147 B CN 103085147B
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urea
add
glue
accounts
formaldehyde
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CN201110339174.7A
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Chinese (zh)
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CN103085147A (en
Inventor
张海燕
史国祥
赵金良
石生俊
陈秀兰
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大亚人造板集团有限公司
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Abstract

The invention relates to a production method of a medium- and high-density fiberboard ultralow in formaldehyde emission. 14-18% of melamine-modified urea resin ultralow in formaldehyde content is added. Internal releasing agent accounting for 0.3-0.5% of the total amount of resin glue is added and mixed into the resin. 0.5-1.0kg.m<3> of resin crosslinking agent is independently added to a glue application spot or is mixed with 1.5-2.5% of compound complexing agent to be added to the glue application spot. By the use of the production method, the contradiction between formaldehyde emission and product quality and yield is overcome, product quality is stable, formaldehyde emission is 2.0-3.0mg/100g, and the production method is available for industrial batch production.

Description

The manufacture method of ultra-low formaldehyde emission medium-to-high density fiberboard
Technical field
The invention provides a kind of manufacture method of ultra-low formaldehyde emission medium-to-high density fiberboard.
Background technology
Medium and high density fibre panel is with wood fibre or other plant fiber for raw material, through fiber preparation, applies synthetic resin (in the majority with Lauxite at present), under heating pressurized conditions, and a kind of sheet material be pressed into.Since the production technology of the American invention wood fibre density board sixties in last century, so that it is fine and close, uniform quality, excellent machining property are widely used in the fields such as furniture, indoor decorating, building, packaging to density board, and the ultrathin sheet material of part high density marches IT application field as electronic circuit printed panel.Along with economic growth and social progress, living standard improves constantly, and people more and more focus on the quality of life, and low-carbon environment-friendly theory is rooted in the hearts of the people, and the public has had for living environment in good health and consciously pursues.Under such prerequisite, popular demand has been complied with in the development of ultra-low formaldehyde content medium and high density fibre panel.
In density board, the source of formaldehyde mainly contains the following aspects: the free state formaldehyde of non-complete reaction in production resin process; in formaldehyde and urea synthesizing, the unstable groups such as the ehter bond that may be formed, hemiacetal, discharge formaldehyde when sheet material hot pressing. in resin curing process, easily form unstable ehter bond between methylol active group, in sheet material use procedure, easy fracture discharges formaldehyde. in use, resin is subject to the effect of moisture content and light and aging to density board, constantly decomposes and produces Form aldehyde release.Large quantity research and production all show the effective ways reducing density board burst size of methanal: the formaldehyde and the urea mol ratio that reduce glue.At present, the core technology of domestic production ultra-low formaldehyde emission medium-to-high density fiberboard is: adopt low molar ratio urea-formaldehyde resin synthetic technology, produce the Lauxite of too low free formaldehyde content, for the production of meeting ultra-low formaldehyde content medium and high density fibre panel, but this technology there are the following problems: board cost significantly increases; Production line production capacity degradation; Production process is difficult to stability contorting; The physical and mechanical property of sheet material, especially burst size of methanal and thickness swelling rate, be difficult to stability contorting.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of ultra-low formaldehyde emission medium-to-high density fiberboard
For solving the problems of the technologies described above, the present invention realizes like this
The manufacture method of ultra-low formaldehyde emission medium-to-high density fiberboard, comprise raw material peeling, chip, screen, wash, boiling, defibrator process, applying glue, fiber drying, sorting, mat formation, precompressed, hot pressing, cutting edge, turnover panel cooling, modified, sanding, it is characterized in that:
Defibrator process pressure is 7-8bar, cooking pressure 7-8bar, digestion time 3-4min; Be dried to fiber moisture 10-15%;
Described applying glue step specifically comprises the following steps:
(1), prepare the melamine modified urea-formaldehyde glue of low formaldehyde content, the addition of cyanurotriamide modified urea resin glue accounts for the 14%-18% of bone dry fiber weight ratio;
(2), in applying glue place add separately or mix with curing agent and add resin cross-linking agent, the use amount 0.5-1.0kg/m of crosslinking agent 3,hardener dose 1.5-2.5%;
(3), be cooled to 50 DEG C, add inner pattern releasing agent applicable, inner pattern releasing agent applicable accounts for the 0.3%-0.5% of urea-formaldehyde glue gross weight, stirs after adding, and is cooled to 40 DEG C, adds lye pH adjustment to 7.5-8.2, plastic emitting.
The manufacture method of aforesaid ultra-low formaldehyde emission medium-to-high density fiberboard, is characterized in that the melamine modified urea-formaldehyde glue preparation process of described low formaldehyde content is as follows:
(1), first in reactor, add formaldehyde, regulate pH to 8.8 ~ 9.0 with sodium hydroxide solution after stirring, add melamine and first part of urea of 85 % by weight, stir after 10-15 minute, be warming up to 90-95 DEG C gradually, insulation reaction 20-25 minute; First part of urea addition accounts for the 40-45% of urea gross weight;
Add second part of urea, after insulation reaction 10-15 minute, cool to 80-85 DEG C, add formic acid and adjust pH to 6.40 ~ 6.60, temperature controls at 85-90 DEG C, and a polycondensation end viscosity was at 18.5 ~ 19.5 seconds; Add first part of auxiliary agent, cool to about 88 DEG C and add the 3rd part of urea and residue 15% melamine, under 78 DEG C of-82 DEG C of conditions, be reacted to viscosity is 18.5-19.5 second always; Add second part of auxiliary agent and the 4th part of urea, insulation reaction 10 minutes; When fast cooling is to 45-50 DEG C, hydro-oxidation sodium solution regulates reacting liquid pH value to be 7.8-8.2; Ph and viscosity are surveyed in sampling, and product is pumped out to basin; Second part of urea accounts for the 5.0-5.5% of urea total amount; 3rd part of urea accounts for the 19.0-20.0% of urea total amount; Described auxiliary agent is ET600, and first part of auxiliary agent accounts for the 0.20-0.25% of glue gross weight; Second part of auxiliary dosage accounts for the 0.10-0.12% of glue gross weight; The amount of melamine accounts for the 2.5-5.5% of glue gross weight.
The manufacture method of aforesaid ultra-low formaldehyde emission medium-to-high density fiberboard, is characterized in that the melamine modified urea-formaldehyde glue preparation process of described low formaldehyde content is as follows:
(1), first in reactor, add formaldehyde, regulate pH to 8.8 ~ 9.0 with sodium hydroxide solution after stirring, add melamine and first part of urea of 85 % by weight, stir after 10 minutes, be warming up to 90-91 DEG C gradually, insulation reaction 20 minutes; First part of urea addition accounts for 42.9% of urea gross weight;
Add second part of urea, insulation reaction, after 15 minutes, cools to 83-85 DEG C, and add formic acid and adjust pH to 6.40 ~ 6.60, temperature controls at 88-90 DEG C, and a polycondensation end viscosity was at 18.5 ~ 19.5 seconds; Add first part of auxiliary agent, cool to about 88 DEG C and add the 3rd part of urea and residue 15% melamine, under 78 DEG C of-82 DEG C of conditions, be reacted to viscosity is 18.5-19.5 second always; Add second part of auxiliary agent and the 4th part of urea, insulation reaction 10 minutes; During fast cooling to 46 DEG C, hydro-oxidation sodium solution regulates reacting liquid pH value to be 7.8-8.2; Ph and viscosity are surveyed in sampling, and product is pumped out to basin; Second part of urea accounts for 5.1% of urea total amount; 3rd part of urea accounts for 19.8% of urea total amount; Described auxiliary agent is ET600, and first part of auxiliary agent accounts for 0.23% of glue gross weight; Second part of auxiliary dosage accounts for 0.115% of glue gross weight; The amount of melamine accounts for the 2.5-5.5% of glue gross weight.
The manufacture method of aforesaid ultra-low formaldehyde emission medium-to-high density fiberboard, it is characterized in that described curing agent comprises following component: water, ammonium chloride, hexa, boron chloride, triethanolamine and phosphoric acid, the percetage by weight of each component is: water 70%-2%, ammonium chloride 19-21%, hexa 1.5-2.5%, boron chloride 2-4%, triethanolamine 1.5-2.5%, phosphatase 11-3%.The invention provides that a kind of low cost, high-quality, production technology are simple, the efficient environmental protection density plate of mass.Be embodied in following some:
(1), serialization High-efficient Production in enormous quantities is realized, about the press day per unit area yield producing 20 ten thousand steres per year can reach 1000 sides, shaping: hot pressing factor 7.1-7.2.Density 850kg/m 3, plate moisture content 4.5-6%, inner pattern releasing agent applicable is directly used in combination, simple to operate with glue, solve and glue press steel belt problem;
(2), solve the contradictory problems of burst size of methanal and product quality, the burst size of methanal of product can reach 2.0-3.0mg/100g, reaches E0 grade standard, and constant product quality.7.8mm, 10.8mm medium and high density fibre panel main performance index prepared by the present invention is as shown in table 1:
Table 1
(4), at present, this product lot-sizeization is produced, be supplied to sage resemble wait famous brand name to produce F**** floor and outlet Japanese etc.
accompanying drawing explanation
Fig. 1 is process chart of the present invention.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the present invention is described in further detail.In following process, the alkali lye of the adjust ph used is sodium hydroxide solution.
Fig. 1 is process chart of the present invention.With reference to shown in Fig. 1, a kind of manufacture method of ultra-low formaldehyde emission medium-to-high density fiberboard, specifically comprises the following steps:
(1), raw material peeling: main with poplar, pine, weedtree for raw material, carry out peeling;
(2), chip and screen: the wood chip by wood chipping equipment, above-mentioned trees being cut into length and width 15-25cm, thickness about 5cm, Screening Treatment being had to pass through for excessive (being greater than 55cm) or mistake spile (being less than 4mm), ensures chip quality and morphological requirements.
(3), washing: because mixing impurity such as having sandstone, metal, body refuse, therefore wood chip has to pass through washing process, but this process adds the moisture content of wood chip;
(4), boiling: water washed wood chip enters pre-cooked cylinder to carry out pre-cooked cylinder and carry out pre-cooked, wood chip is heated evenly and carries out preliminarily softened, through plunger spiral, wood chip is sent to boiling cylinder again and carry out sofening treatment, wood chip is boiling at high temperature under high pressure, pre-cooked, cooking pressure control at 7-8bar, and the time is adjustable;
(5), defibrator process: digested wood chip is by discharging screw defibrator process feed, and digested wood chip becomes fiber by abrasive disc solution fibre between mill.For improving fiber water proofing property, adopt the mode of adding paraffin in grinding machine, defibrator process: mill chamber pressure 7-8bar, cooking pressure 7-8bar, digestion time is about 3-4min;
(6), applying glue: each component of impregnation is made solution, and send into measuring tank with pump (water is direct), measuring tank liquid level presets, the start and stop of control pump, the glue modulated by applying glue pump after nozzle atomization in blow-off pipe and fibers mixture, applying glue, resin added 14%-18%, paraffin consumption 7-7.5kg/m 3, curing agent 1.5-2.5%;
(7), dried, classified: the fiber drying pipeline of applying glue carries out being dried to fiber moisture 10-11%, delivers to fiber feed bin after cyclone separator and sorting unit carry out sorting;
(8), shaping: fiber obtained sheet material after preheating of mating formation, hot pressing cutting edge of fiber feed bin, hot pressing factor 7.1-7.2.Density 850kg/m3, plate moisture content: 4.5-6%;
(9), cooling: from press sheet material out because temperature is higher, cooling processing need be carried out through cooling turnover panel, enhance product performance further;
(10), modified: cooled sheet material must carry out the modifier treatment of 3-4 days, and stress, moisture content etc. in balance sheet material, improve its stability;
(11), sanding inspection: the sheet material after modified carries out sanding process according to demand, is removed by surperficial pre-hardening thickness sand, and as required plank is cut into certain specification.
The wherein total mol ratio 0.922 of cyanurotriamide modified urea resin, addition mol ratio 1.811, secondary polycondensation mol ratio 1.312. urea divides 4 inputs, and (feed intake with Un representative, wherein U represents urea at every turn, the number of times that n representative is added), wherein addition stage urea divides 2 inputs.Formaldehyde once drops into, melamine amount accounts for liquid glue gross weight 4.63%, wherein first time three polyamine amounts (feed intake at every turn with Mn representative, wherein M represents melamine, the number of times that n representative is added) account for liquid glue gross weight 3.94%, second time triamine amount accounts for 0.7% of liquid glue gross weight.Auxiliary agent ET600 addition accounts for 0.35% of glue gross weight, and first time, ET600 accounted for 0.12%.
Concrete preparation process is as follows:
(1), formaldehyde is added, hydro-oxidation sodium solution regulates pH to 8.8 ~ 9.0, add M1 and U1, stir after 10 minutes, in 25-30 minute, be heated to 78 DEG C-80 DEG C, after closing thermal source, be warming up to 90-91 DEG C again, survey pH(and require to be not less than 7.0, otherwise hydro-oxidation sodium solution adjusts), insulation reaction 20 minutes; Add U2, insulation reaction, after 15 minutes, surveys pH >=6.7;
(2), cool to 83-85 DEG C, divide and add formic acid 2-3 time, adjust pH to 6.40 ~ 6.60, temperature controls at 88-90 DEG C, when viscosity reaches 15 seconds, surveys a viscosity every 5 ~ 10 minutes, controls viscosity at 18.5 ~ 19.5 seconds (30 DEG C);
(3) part ET-600(1 is added immediately after, reaching viscosity) (different batches that the numeral in bracket is added), and cool to about 88 DEG C and added U3 and M2 with 10-15 minute, under 78 DEG C of-82 DEG C of conditions, be reacted to viscosity is 18.5-19.5 second (30 DEG C) always;
(4), ET600(2 is added), add U4, insulation reaction 10 minutes;
(5), fast cooling to 46 DEG C time, adjustment reacting liquid pH value is 7.8-8.2;
(6), be cooled to less than 42 DEG C, ph and viscosity are surveyed in sampling, and product is pumped out to basin.
Curing agent comprises following component: water, ammonium chloride, hexa, triethanolamine and phosphoric acid, and the weight ratio of each component is: water 71.7%-75.9%, ammonium chloride 20-22%, hexa 2-3%, triethanolamine 0.1-0.3%, phosphoric acid 2-3%.This curing agent effectively can improve the solidification effect of sheet material and resin.
Above-mentioned detailed description of the invention does not limit technical scheme of the present invention in any form, and the technical scheme that the mode that every employing is equal to replacement or equivalent transformation obtains all drops on protection scope of the present invention.

Claims (2)

1. the manufacture method of ultra-low formaldehyde emission medium-to-high density fiberboard, comprise raw material peeling, chip, screen, wash, boiling, defibrator process, applying glue, fiber drying, sorting, mat formation, precompressed, hot pressing, cutting edge, turnover panel cooling, modified, sanding, it is characterized in that:
Defibrator process pressure is 7-8bar, cooking pressure 7-8bar, digestion time 3-4min; Be dried to fiber moisture 10-15%;
Described applying glue step specifically comprises the following steps:
(1), prepare the melamine modified urea-formaldehyde glue of low formaldehyde content, the addition of cyanurotriamide modified urea resin glue accounts for the 14%-18% of bone dry fiber weight ratio;
The melamine modified urea-formaldehyde glue preparation process of described low formaldehyde content is as follows: in reactor, add formaldehyde, pH to 8.8 ~ 9.0 are regulated with sodium hydroxide solution after stirring, add melamine and first part of urea of 85 % by weight, stir after 10-15 minute, be warming up to 90-95 DEG C gradually, insulation reaction 20-25 minute; First part of urea addition accounts for the 40-45% of urea gross weight; Add second part of urea, after insulation reaction 10-15 minute, cool to 80-85 DEG C, add formic acid and adjust pH to 6.40 ~ 6.60, temperature controls at 85-90 DEG C, and a polycondensation end viscosity was at 18.5 ~ 19.5 seconds; Add first part of auxiliary agent, cool to about 88 DEG C and add the 3rd part of urea and residue 15% melamine, under 78 DEG C of-82 DEG C of conditions, be reacted to viscosity is 18.5-19.5 second always; Add second part of auxiliary agent and the 4th part of urea, insulation reaction 10 minutes; When fast cooling is to 45-50 DEG C, hydro-oxidation sodium solution regulates reacting liquid pH value to be 7.8-8.2; Ph and viscosity are surveyed in sampling, and product is pumped out to basin; Second part of urea accounts for the 5.0-5.5% of urea total amount; 3rd part of urea accounts for the 19.0-20.0% of urea total amount; Described auxiliary agent is ET600, and first part of auxiliary agent accounts for the 0.20-0.25% of glue gross weight; Second part of auxiliary dosage accounts for the 0.10-0.12% of glue gross weight; The amount of melamine accounts for the 2.5-5.5% of glue gross weight;
(2), in applying glue place add separately or mix with curing agent and add resin cross-linking agent, the use amount 0.5-1.0kg/m of crosslinking agent 3,hardener dose 1.5-2.5%;
(3), be cooled to 50-55 DEG C, add inner pattern releasing agent applicable, inner pattern releasing agent applicable accounts for the 0.3%-0.5% of urea-formaldehyde glue gross weight, stirs after adding, and is cooled to 48-42 DEG C, adds lye pH adjustment to 7.5-8.2, plastic emitting.
2. the manufacture method of ultra-low formaldehyde emission medium-to-high density fiberboard according to claim 1, it is characterized in that described curing agent comprises following component: water, ammonium chloride, hexa, boron chloride, triethanolamine and phosphoric acid, the percetage by weight of each component is: water 70%-2%, ammonium chloride 19-21%, hexa 1.5-2.5%, boron chloride 2-4%, triethanolamine 1.5-2.5%, phosphatase 11-3%.
CN201110339174.7A 2011-11-02 2011-11-02 Production method of medium- and high-density fiberboard ultralow in formaldehyde emission CN103085147B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103496025B (en) * 2013-09-26 2015-11-25 广西三威林产工业有限公司 The manufacture method of ultra-low formaldehyde emission medium-to-high density fiberboard
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CN104162920B (en) * 2014-08-04 2016-04-13 广西三威林产工业有限公司 Eliminate the method for hickie at the bottom of medium density fibre board (MDF) plate
CN105171886B (en) * 2015-08-21 2017-07-28 广西星岛科技发展有限公司 A kind of production method of ultra micro residual formaldehyde amount fiberboard
CN105563603B (en) * 2015-12-20 2017-12-15 江西绿洲环保新材料股份有限公司 The preparation method of full poplar high density floor base material
CN105348464B (en) * 2015-12-20 2017-10-31 江西绿洲环保新材料股份有限公司 The preparation method of environment-friendly modified urea-formaldehyde resin adhesive
CN105643734A (en) * 2016-01-08 2016-06-08 广西大学 Composite flame retardant and preparation method thereof and application to production of flame retardant plywood
CN106217581A (en) * 2016-08-29 2016-12-14 广西浩林人造板股份有限公司 A kind of environment protection damp-proof flame retardant fibre board and manufacture method thereof
CN106903773A (en) * 2017-03-31 2017-06-30 大亚人造板集团有限公司 The manufacturing process and base material of a kind of ground-heating floor substrate
CN107030812A (en) * 2017-04-06 2017-08-11 大亚人造板集团有限公司 It is a kind of can high-fidelity printing fiberboard production processes
CN109988530A (en) * 2017-12-31 2019-07-09 永隆高新科技(青岛)有限公司 A kind of urea formaldehyde resin adhesive and preparation method thereof of ultralow free formaldehyde content
CN109571696A (en) * 2018-12-12 2019-04-05 大亚木业(茂名)有限公司 A kind of manufacturing method of high density moisture-proof plate
CN109571702A (en) * 2018-12-12 2019-04-05 大亚木业(茂名)有限公司 A kind of manufacturing method of abatvoix substrate
CN109624013A (en) * 2018-12-19 2019-04-16 大亚木业(茂名)有限公司 A kind of manufacturing method of heel high density fiberboard

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101298159A (en) * 2008-06-17 2008-11-05 大亚科技股份有限公司 Routing plate processing technique
CN101307215A (en) * 2008-06-27 2008-11-19 大亚科技股份有限公司 Resin glue adhesive for E0 grade fibre board
CN101306553A (en) * 2008-06-27 2008-11-19 大亚科技股份有限公司 Method for manufacturing low-oxymethylene-releasing high-density fibreboard
CN101392167A (en) * 2008-08-01 2009-03-25 大亚科技股份有限公司 Synthetic resin adhesive for E1 grade fibreboard
CN101550323A (en) * 2009-04-28 2009-10-07 南京工业大学 Preparation method of low-cost UMF resin adhesive used for E0-level plywood
CN101591867A (en) * 2008-05-29 2009-12-02 任玉良 Melamine modified urea-formaldehyde resin used for dipping paper of decorative laminated plate and preparation method thereof
CN101817914A (en) * 2010-05-11 2010-09-01 辽宁恒星精细化工(集团)有限公司 Method for synthesizing methylated melamine formaldehyde resin cross-linking agent with low free formaldehyde content

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8088881B2 (en) * 2008-06-25 2012-01-03 Momentive Specialty Chemicals Inc. Storage stable melamine-urea-formaldehyde resins and applications thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101591867A (en) * 2008-05-29 2009-12-02 任玉良 Melamine modified urea-formaldehyde resin used for dipping paper of decorative laminated plate and preparation method thereof
CN101298159A (en) * 2008-06-17 2008-11-05 大亚科技股份有限公司 Routing plate processing technique
CN101307215A (en) * 2008-06-27 2008-11-19 大亚科技股份有限公司 Resin glue adhesive for E0 grade fibre board
CN101306553A (en) * 2008-06-27 2008-11-19 大亚科技股份有限公司 Method for manufacturing low-oxymethylene-releasing high-density fibreboard
CN101392167A (en) * 2008-08-01 2009-03-25 大亚科技股份有限公司 Synthetic resin adhesive for E1 grade fibreboard
CN101550323A (en) * 2009-04-28 2009-10-07 南京工业大学 Preparation method of low-cost UMF resin adhesive used for E0-level plywood
CN101817914A (en) * 2010-05-11 2010-09-01 辽宁恒星精细化工(集团)有限公司 Method for synthesizing methylated melamine formaldehyde resin cross-linking agent with low free formaldehyde content

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