CN103080374A - Apparatus - Google Patents
Apparatus Download PDFInfo
- Publication number
- CN103080374A CN103080374A CN2011800417620A CN201180041762A CN103080374A CN 103080374 A CN103080374 A CN 103080374A CN 2011800417620 A CN2011800417620 A CN 2011800417620A CN 201180041762 A CN201180041762 A CN 201180041762A CN 103080374 A CN103080374 A CN 103080374A
- Authority
- CN
- China
- Prior art keywords
- precursor
- injector head
- matrix
- zones
- zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
- C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The present invention relates to an apparatus at least partly cylindrical surface (4, 5). The apparatus com- prises at least one nozzle head (2) comprising one or more first precursor zone (14) for subjecting the surface (4) or the substrate 7 of the cylindrical object (6) to a first precursor and one or more second precursor zone (16) for subjecting the surface (4) of the cylindrical object (6) to a second precursor. According to the present invention the nozzle head (2) is formed as a cylinder having a central axis and a substantially circular circumference comprising the output face, and that the output face is provided one or more first precursor zones (14) and one or more second precursor zones (16).
Description
Technical field
The present invention relates to a kind of device, it is used for at least the first precursor and the second precursor at least part of columned surface that matrix is processed in surface reaction in succession occuring by the surface that makes matrix, or the surface that conforms to cylindrical surface of processing matrix, especially, the present invention relates to the device of preamble according to claim 1.
Background technology
In the prior art, the device of some types, injector head are used for making the surface of matrix to be subject to the surface reaction in succession that occurs with at least the first precursor and the second precursor according to the principle of ald (atomic layer deposition, ALD).In ALD uses, typically, in the stage of separating two kinds of gaseous precursors are incorporated in the ALD reactor.Gaseous precursors is reacted with the surface of matrix effectively, thus the deposition monoatomic layer.Typically, be the removing stage after the precursor stage, or the precursor stage by the removing stage separately, described know the stage before being introduced separately into other different precursors from matrix surface removal excess precursor.Therefore, ALD processes needs sequentially alternately to make precursor flow to matrix surface.Alternating surface reactions order and the intervenient removing stage of this repetition are typical ALD deposition cycle.
In the prior art, apply in large quantity and process cylindric object in large-scale treatment chamber, wherein, the precursor succeedingly is delivered in this large-scale treatment chamber with the mode pulse that replaces.In batches must be very large, with the higher throughput of acquisition, thereby process cylindric object in the mode of economy.For larger batch, be difficult to use precursor in the mode of optimum, and in some ald is processed, because the difference of air-flow and temperature is difficult to realize good thick consistency in large batch of situation.In addition, because material also can be grown on each process chamber wall in the matrix treating processes, so batch processing causes the cleaning problems on waste of material and the process chamber wall.Also have many dissimilar injector heads to can be used for the surface of Local treatment matrix.Yet the injector head of these prior aries can't be processed cylindric object, and they only form processes smooth matrix or planar substrates.The injector head of prior art is designed to move forward and backward fast, is used for carrying out Multiple-Scan at matrix surface.The shortcoming that is used to form this known technology of some atomic shells is, moves forward and backward and produces mechanical force large and that injector head must bear in the process.When nozzle had stopped at terminal position and again accelerated, Z-TEK was not large.Therefore, easily cause the damage of device and injector head.
Summary of the invention
Thereby, the object of the present invention is to provide a kind of device, make it possible to overcome the problem of above-mentioned prior art.Utilize the device of characteristic according to claim 1 to realize purpose of the present invention, it is characterized in that: injector head and matrix are relative to each other mobile along the direction of the central axis of columned injector head.
The preferred embodiments of the present invention have been described in the dependent claims.
The present invention is based on the conception of the roughly columned injector head that forms such as being right cylinder, sleeve is provided.Cylindric injector head comprises central axis and the periphery with circular of output face, and output face is used for the supply precursor.Injector head can be hollow circular cylinder, and output face can be the internal surface of hollow circular cylinder, or output face can be the outside surface of hollow circular cylinder or solid cylinder.Alternately, injector head can be solid cylinder, and output face is cylindrical outside surface.Injector head comprises the first precursor zone and the second precursor zone successively in output face, and randomly comprises removing gas zones and discharge areas between the precursor zone.Precursor zone, removing gas zones and discharge areas are successively set in the output face along circular circumference is staggered.Precursor zone and removing gas zones can be provided as for supply precursor and the nozzle of removing gas.Injector head and matrix also are arranged to along the direction of central axis relative to each other mobile, and also can rotate around central axis.Injector head is arranged to process the matrix that at least part of columned matrix or processing conform to the surface of at least part of columned matrix carrier.Device of the present invention also is arranged to move cylindric matrix or cylindric matrix carrier along the direction of the central axis of injector head.Alternately, injector head itself is arranged to move along the direction of the central axis of injector head.In addition, injector head and/or matrix can relative to each other rotate around the central axis of injector head.Therefore, by injector head and matrix transmission and randomly rotation relative to each other, can process matrix.
The invention has the advantages that, it provides a kind of device, and described device makes it possible to can not cause lot of materials waste and cleaning problems in the process of processing cylindric matrix or surface.Therefore, the invention provides a kind of economic treatment way of processing a mass of cylindrical matrix or surface.Be subject to the effect of precursor the surface uniform that the present invention also makes it possible to utilize rotational motion to make matrix.Compare with moving forward and backward, rotational motion has reduced stress and reactive force that device is subject to.Rotational motion is so that V-bar is higher than the V-bar that moves forward and backward.Therefore, the invention provides a kind of scheme of processing cylindric matrix and cylindrical surface, it has solved the problem of prior art.
Description of drawings
Below, with reference to accompanying drawing the present invention is described in further detail in conjunction with the preferred embodiments, wherein:
Fig. 1 shows the schematic diagram according to an embodiment of device of the present invention;
Fig. 2 shows the schematic diagram according to another embodiment of device of the present invention; With
Fig. 3 shows the detail drawing of an embodiment of the injector head of device.
Embodiment
Fig. 1 schematically shows one embodiment of the present of invention.Device for the treatment of at least part of cylindrical surface comprises injector head 2.In Fig. 1, injector head 2 is the hollow circular cylinders with central axis and circular perisporium.Perisporium has internal surface and outside surface.In the embodiment in figure 1, the internal surface of perisporium is the output face of injector head 2.Precursor is subject to the effect of precursor via the output face supply for the surface that makes matrix.Thereby as shown in Figure 1, injector head 2 is arranged to the outside surface 4 for the treatment of cylindric matrix 6, so that cylindric matrix 6 can move through hollow spray mouth 2.The first precursor and the second precursor can be any gaseous precursors that can be used for ald.In addition, plasma body also can be used as precursor.Remove gas and can be some rare gas element such as nitrogen, plasma body etc.Precursor, removing gas are supplied to injector head 2 via the fluid web member.Alternately, injector head 2 has one or more precursors and/or removes gas container, bottle etc., so that precursor and/or removing gas can be mobile with injector head 2.This layout has reduced the quantity of the reluctant fluid web member that is connected to mobile injector head 2.
The output face of cylindric injector head 2 has one or more the first precursors zone 14 and one or more the second precursor zone 16, described the first precursor zone 14 makes the outside surface 4 of cylindric matrix 6 be subject to the effect of precursor, and described the second precursor zone 16 makes the outside surface 4 of cylindric object 6 be subject to the effect of the second precursor.As shown in Figure 1, injector head 2 comprises 14 and two the second precursor zones 16, two the first precursor zones, and these 14 and second precursor zones 16, the first precursor zone alternately arrange in succession along output face on the direction of perisporium.When the direction of the arrow 12 of cylindric matrix 6 in Fig. 1 when longitudinal axis rotates, the outside surface 4 of matrix 6 is subject to the effect of the first precursor and the second precursor in the 14 and second precursor zone 16, the first precursor zone.Should be noted that injector head 2 can rotate around central axis, perhaps cylindric matrix 6 and injector head 2 can rotate along identical or different direction.Therefore, in the present invention, injector head 2 and matrix can relative to each other rotate around the central axis of injector head 2, longitudinal axis.In the present invention, cylindric matrix 6 shown in the arrow 8 among Fig. 1 along the direction of the central axis of injector head 2 with respect to cylindric injector head 2 or along cylindric matrix 6 vertically shifting or mobile, with mobile cylindric matrix 6 by hollow spray mouth 2.Should be noted, injector head 2 or cylindric matrix 6 can move along the direction of the central axis of injector head 2, or injector head 2 and cylindric matrix 6 the two all can be mobile in identical or different direction along the direction of central axis.Therefore, along the relatively rotating and relatively moving so that the whole outside surface 4 of matrix 6 can both be subject to the repeatedly effect of the first precursor and the second precursor of the direction of the central axis of injector head 2, be used for producing grown layer at the outside surface 4 of matrix 6.Cylindric matrix 6 can be pipe, bar, cable, optical fiber, glass preformed member or other similar cylindric object.If matrix 6 is flexible, then by matrix 6 is supplied to second roller from the first roller by injector head 2, can process matrix 6 to the mode of roller with roller.In addition, cylindric matrix also can be positioned on the object with columned surface of part only.This means that cylindrical surface can not be 360 degree, but for example can be that only 270 degree, 180 degree, 90 are spent.The present invention is not limited to any cylindric or columned surface of part.
Fig. 2 shows an alternative embodiment of the invention, and wherein injector head 2 corresponds essentially to the injector head of Fig. 1.In this embodiment, matrix 7 conforms to the outside surface 5 of (conform) cylindric matrix carrier 9.In Fig. 2, matrix 7 is continuous strip matrix, but matrix 7 can be to be arranged to comply with cylindric matrix carrier 9 or to be wrapped in any flexible matrix on the cylindric matrix carrier 9.In certain embodiments, the matrix that separates also can be arranged to comply with the surface 5 of cylindric matrix carrier 9, or the matrix that separates can engage or attach to the outside surface 5 of matrix carrier 9.These matrixes that separate can be any flexible or rigid matrix.As shown in Figure 2, by making injector head 2 and cylindric matrix carrier 9 relative to each other mobile along the central axial direction of injector head 2 along the direction of arrow 8, and by injector head 2 and cylindric matrix carrier 9 are relative to each other rotated, matrix 7 can be supplied to injector head 2.Matrix 7 can attach on the matrix carrier 9 in the spirrillum mode as shown in Figure 2, perhaps so that matrix 7 covers whole surperficial 5 of matrix carrier 9.Along with matrix carrier 9 moves with respect to injector head, by the first precursor zone and the second precursor zone the surface 3 of matrix 7 is reacted respectively with the first precursor and the second precursor generation continuous surface.
In Fig. 1,2, injector head 2 is depicted as hollow circular cylinder, and described hollow circular cylinder has the output face on the internal surface that is positioned at perisporium.Yet injector head 2 also can form so that output face is arranged on the outside surface of cylindric injector head.In this embodiment, injector head can be the hollow circular cylinder shown in Fig. 1,2, or injector head can be solid cylinder or the hollow circular cylinder that has central axis and form the outside surface of output face.Output face on the outside surface of injector head 2 has one or more the first precursors zone and one or more the second precursors zone, and these first precursors are regional to be arranged with the direction of the mode identical with mode in Fig. 1,2 the internal surface along circumferential outer surface in succession with the second precursor zone.When the outside surface of cylindric injector head 2 was output face, Plant arrangement of the present invention became the internal surface for the treatment of hollow tubular or cylindric matrix, so that injector head can be positioned at the inboard of matrix.Injector head can identical mode relative to each other move or rotate in the mode of describing among reference Fig. 1,2 with matrix.
In one embodiment, device comprises the first cylindric injector head and the second hollow circular cylinder injector head, the described first cylindric injector head has the first diameter and is positioned at output face on the outside surface of the first cylindric injector head, and described the second hollow circular cylinder injector head has Second bobbin diameter and is positioned at output face on the internal surface of the second hollow circular cylinder injector head.Second bobbin diameter is greater than the first diameter, so that the first cylindric injector head can be arranged in the inboard of the second hollow circular cylinder injector head.The first diameter and Second bobbin diameter form so that have the gap between the output face of the output face of the first cylindric injector head and the second hollow circular cylinder injector head.This layout so that the outside surface of hollow tube (tube) or conduit (pipe) and internal surface at hollow tube or conduit is directed into and be handled simultaneously during by the gap between the first cylindric injector head and the second hollow circular cylinder injector head.
Device of the present invention can comprise the first travel mechanism and the second travel mechanism, described the first travel mechanism is used for moving tubulose or cylindric matrix 6 or tubulose or cylindric matrix carrier 9 along the direction of the central axis of cylindric injector head 2, and described the second travel mechanism is used for rotating tubulose or cylindric matrix 6 or tubulose or cylindric matrix carrier 9 around the central axis of tubulose or cylindric matrix 6 or tubulose or cylindric matrix carrier 9.Device of the present invention can also comprise or substituting the 3rd travel mechanism and the 4th travel mechanism of comprising, described the 3rd travel mechanism is used for moving cylindric injector head 2 along the direction of the central axis of cylindric injector head 2, and described the 4th travel mechanism is used for the central axis slewing circle column injector head 2 around cylindric injector head 2.Should be noted, device of the present invention can comprise one or more in above-mentioned the first travel mechanism, the second travel mechanism, the 3rd travel mechanism and the 4th travel mechanism.In the present invention, injector head 2 and matrix 6 or matrix carrier 9 are relative to each other mobile along the direction of the central axis of cylindric injector head 2.Should be noted, travel mechanism can construct in various known modes, has therefore omitted the detailed description to travel mechanism.
Fig. 3 shows the detail drawing of Fig. 1,2 injector head 2.Injector head 2 is comprising in the following sequence the zone of arranging successively in output face on the internal surface: remove gas zones 13, precursor zone 14,16 and discharge areas 11, these zones are repeated several times randomly.Remove gas zones 13, precursor zone 14,16 and discharge areas 11 alternately arrange successively along the circumferential direction of cylindric injector head 2.As shown in Figure 3, injector head 2 comprises the zone of following order successively in output face: the first precursor zone 14, discharge areas 11, removing gas zones 13, the second precursor zone 16, discharge areas 11 and removing gas zones 13, these zones are repeated several times randomly.Precursor makes surface and the precursor generation surface reaction of matrix via 14 and 16 supplies of precursor zone.Removing removing gas and the precursor supplied in the gas zones utilizes vacuum fan or vacuum unit to discharge at discharge areas.As shown in Figure 3, precursor zone 14,16 can form substantially the passage that extends along the direction of the central axis of cylindric injector head 2.
The layout of Fig. 3 along precursor zone 14,16 and the whole length of removing gas zones 13 uniform air flow is provided, and provide uniform discharging along discharge areas 11.Therefore, precursor zone 14,16 can be provided as the precursor nozzle 14,16 of supplying with precursor along the whole length in precursor zone.And, remove gas zones 13 and can be provided as the removing gas jet 13 of supplying with removing gas along the whole length of removing gas zones, and discharge areas 11 is arranged to discharge precursor and remove gas along the whole length of discharge areas.
In alternate embodiments, output face sets gradually in the following sequence along the circumferential direction of cylindric injector head 2: the first precursor zone 14, the 13, second precursor zone, removing zone 16 and removing gas zones 13, these zones are repeated several times randomly.In this embodiment, the first precursor zone 14 has at least one first entrance of supply the first precursor and is used for discharging at least one first outlet of the first precursor, the second precursor zone 16 has at least one second entrance of supply the second precursor and is used for discharging at least one second outlet of the second precursor, and removing zone 13 has at least one the 3rd entrance for supply removing gas.Remove gas zones 13 and can also comprise one or more the 3rd outlets, or alternately remove gas and can discharge via the outlet in precursor zone.For example, entrance can be positioned at vertical precursor passage and remove the place, an end of gas passage, and outlet can be positioned at another place, end of precursor passage or removing gas passage, so that precursor and removing gas can be along channel flow.Alternately, entrance can be positioned at the roughly middle place of passage, and outlet can be positioned at the relative place, end of passage.
In another alternate embodiments, the inventive system comprises one or more the first precursors zone 14 and one or more the second precursor zone 16, these 14 and second precursor zones 16, first precursors zone roughly alternately arrange in succession along the direction of the central axis of injector head 2. Precursor zone 14,16, removing gas zones 13 and discharge areas 11 can be according to the said sequence settings.Therefore, precursor zone 14,16, remove gas zones 13 and discharge areas 11 and be arranged to the border circular areas that arranges in succession along the direction of the central axis of cylindric injector head 2.When elongated tubular product or cylindric matrix 6 or matrix carrier 9 are transported by cylindric injector head 2 or during through cylindric injector head 2 along the direction of the central axis of cylindric injector head 2, grown layer is formed on surface 3 upper of the surface 4 of matrix 6 and matrix 7.This provides the technical scheme of effectively processing cable, optical fiber, conduit or other three-dimensional cylindrical object.
Technical superiority it is evident that for those of ordinary skills, owing to can be implemented concept of the present invention in many ways.The present invention and embodiment are not limited to above-mentioned example, but can change in the protection domain of claim.
Claims (19)
1. the device that the surface of complying with cylindrical surface (5) (3) of at least part of columned surface (4) of matrix (6) or matrix (7) is processed in surface reaction occurs in surface (3) and at least the first precursor and second precursor that is used for by making matrix (7) in succession, described device comprises at least one injector head (2) with output face, and described injector head (2) comprising:
One or more the first precursor zones (14) are used for making described surface (3,4) be subject to the effect of described the first precursor; And
One or more the second precursor zones (16) are used for making described surface (3,4) be subject to the effect of described the second precursor;
Described injector head (2) forms right cylinder, described right cylinder has central axis and comprises the periphery of the circular of described output face, and described output face is provided with described one or more the first precursor zones (14) and described one or more the second precursor zones (16)
It is characterized in that, described injector head (2) and described matrix (3,4) are arranged to relative to each other move along the direction of the described central axis of columned injector head (2).
2. device as claimed in claim 1 is characterized in that, described output face is provided with roughly along one or more the first precursors zones (14) that the direction of the periphery of described circle is alternately arranged in succession and one or more the second precursor regional (16).
3. device as claimed in claim 2 is characterized in that, described the first and second precursors zones (14,16) are formed by the passage that roughly extends along the direction of the described central axis of described columned injector head (2).
4. device as claimed in claim 1, it is characterized in that, described output face is provided with roughly along one or more the first precursors zones (14) that the direction of the central axis of described injector head (2) is alternately arranged in succession and one or more the second precursor regional (16).
5. device as claimed in claim 4, it is characterized in that, described the first and second precursors zones (14,16) are formed by the direction of the described central axis that is approximately perpendicular to described columned injector head (2) and the passage that extends around described central axis circumferentially.
6. such as each described device in the claim 1 to 5, it is characterized in that, described injector head (2) comprises in described output face in the following sequence successively: remove gas zones (13), precursor zone (14,16) and discharge areas (11), described removing gas zones, precursor zone and discharge areas be repeated several times randomly.
7. such as each described device in the claim 1 to 6, it is characterized in that, described injector head (2) comprises in described output face in the following sequence successively: the first precursor zone (14), discharge areas (11), removing gas zones (13), the second precursor zone (16), discharge areas (11) and removing gas zones (13), described the first precursor zone, discharge areas, removing gas zones, the second precursor zone, discharge areas and removing gas zones be repeated several times randomly.
8. such as each described device in the claim 1 to 5, it is characterized in that, described output face sets gradually in the following sequence: the first precursor zone (14), removing regional (13), the second precursor regional (16) and removing zone (13), described the first precursor is regional, removing is regional, the second precursor is regional and remove randomly repeated several times of zone.
9. device as claimed in claim 8, it is characterized in that, described the first precursor zone (14) has be used at least one entrance of supplying described the first precursor with at least one outlet of discharging described the first precursor, described second removes gas zones (16) has be used at least one entrance of supplying described the second precursor with at least one outlet of discharging described the second precursor, and the described zone (13) of removing has at least one entrance of removing gas for supply.
10. such as each described device in the claim 1 to 9, it is characterized in that, described injector head (2) is hollow circular cylinder, and described output face is the internal surface of described hollow circular cylinder.
11. device as claimed in claim 10 is characterized in that, described Plant arrangement becomes to process the tubulose of injector head (2) inboard that is positioned at hollow cylindrical or the outside surface (4) of cylindric matrix (6).
12. device as claimed in claim 11, it is characterized in that, described Plant arrangement becomes to process to be arranged in the surface (3) of the matrix (7) on the outside surface (5) of the inboard tubulose of the injector head (2) that is positioned at hollow cylindrical or cylindric matrix carrier (9).
13. such as each described device in the claim 1 to 9, it is characterized in that, described output face is the outside surface for columned injector head (2).
14. device as claimed in claim 13 is characterized in that, described Plant arrangement becomes to process the internal surface of hollow tubular or hollow cylindrical matrix, and described columned injector head (2) is positioned at the inboard of described hollow tubular or hollow cylindrical matrix.
15. device as claimed in claim 13, it is characterized in that, the surface that described Plant arrangement becomes to process the matrix on the internal surface that is arranged on hollow tubular or hollow cylindrical matrix carrier (9), described columned injector head (2) is positioned at the inboard of described hollow tubular or hollow cylindrical matrix carrier.
16. such as each described device in the claim 1 to 15, it is characterized in that, described device comprises the first travel mechanism, and described the first travel mechanism is used for moving described tubulose or cylindric matrix (6) or described tubulose or cylindric matrix carrier (9) along the direction of the described central axis of described columned injector head (2).
17. such as each described device in the claim 1 to 16, it is characterized in that, described device comprises the second travel mechanism, and described the second travel mechanism is used for rotating described tubulose or cylindric matrix (6) or described tubulose or cylindric matrix carrier (9) around the central axis of described tubulose or cylindric matrix (6) or described tubulose or cylindric matrix carrier (9).
18. such as each described device in the claim 1 to 17, it is characterized in that, described device comprises the 3rd travel mechanism, and described the 3rd travel mechanism is used for moving described columned injector head (2) along the direction of the described central axis of described columned injector head (2).
19. such as each described device in the claim 1 to 18, it is characterized in that, described device comprises the 4th travel mechanism, described the 4th travel mechanism is used for rotating described columned injector head (2) around the central axis of described columned injector head (2).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20105902 | 2010-08-30 | ||
| FI20105902A FI20105902A0 (en) | 2010-08-30 | 2010-08-30 | Device |
| PCT/FI2011/050747 WO2012028779A1 (en) | 2010-08-30 | 2011-08-29 | Apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103080374A true CN103080374A (en) | 2013-05-01 |
| CN103080374B CN103080374B (en) | 2016-04-13 |
Family
ID=42669406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180041762.0A Active CN103080374B (en) | 2010-08-30 | 2011-08-29 | Device |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN103080374B (en) |
| DE (1) | DE112011102856B4 (en) |
| FI (1) | FI20105902A0 (en) |
| TW (1) | TW201219117A (en) |
| WO (1) | WO2012028779A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI125341B (en) * | 2012-07-09 | 2015-08-31 | Beneq Oy | Apparatus and method for processing substrates |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1841663A (en) * | 2005-03-28 | 2006-10-04 | 三星电子株式会社 | Semiconductor manufacturing apparatus |
| CN1918322A (en) * | 2004-02-09 | 2007-02-21 | 波克股份有限公司 | Barrier layer process and arrangement |
| CN101589171A (en) * | 2006-03-03 | 2009-11-25 | 普拉萨德·盖德吉尔 | Apparatus and method for large area multi-layer atomic layer chemical vapor processing of thin films |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4597986A (en) * | 1984-07-31 | 1986-07-01 | Hughes Aircraft Company | Method for photochemical vapor deposition |
| JP3103186B2 (en) * | 1992-03-19 | 2000-10-23 | 富士通株式会社 | Atomic layer epitaxy apparatus and atomic layer epitaxy method |
| MX9303141A (en) | 1992-05-28 | 1994-04-29 | Polar Materials Inc | METHODS AND DEVICES FOR DEPOSITING BARRIER COATINGS. |
| JP2004014953A (en) * | 2002-06-10 | 2004-01-15 | Tokyo Electron Ltd | Processing system and processing method |
| US20070292974A1 (en) * | 2005-02-17 | 2007-12-20 | Hitachi Kokusai Electric Inc | Substrate Processing Method and Substrate Processing Apparatus |
| EP1884472B1 (en) | 2005-05-27 | 2014-08-13 | Kirin Beer Kabushiki Kaisha | Apparatus and method for manufacturing gas barrier plastic container |
| JP2007111678A (en) * | 2005-10-24 | 2007-05-10 | Sekisui Chem Co Ltd | Plasma treatment apparatus for linear object to be treated |
| US8043432B2 (en) * | 2007-02-12 | 2011-10-25 | Tokyo Electron Limited | Atomic layer deposition systems and methods |
| JP2010073822A (en) * | 2008-09-17 | 2010-04-02 | Tokyo Electron Ltd | Film deposition apparatus, film deposition method, program and computer readable storage medium |
| US20110076421A1 (en) * | 2009-09-30 | 2011-03-31 | Synos Technology, Inc. | Vapor deposition reactor for forming thin film on curved surface |
-
2010
- 2010-08-30 FI FI20105902A patent/FI20105902A0/en not_active Application Discontinuation
-
2011
- 2011-08-29 TW TW100130878A patent/TW201219117A/en unknown
- 2011-08-29 DE DE112011102856.3T patent/DE112011102856B4/en active Active
- 2011-08-29 WO PCT/FI2011/050747 patent/WO2012028779A1/en active Application Filing
- 2011-08-29 CN CN201180041762.0A patent/CN103080374B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1918322A (en) * | 2004-02-09 | 2007-02-21 | 波克股份有限公司 | Barrier layer process and arrangement |
| CN1841663A (en) * | 2005-03-28 | 2006-10-04 | 三星电子株式会社 | Semiconductor manufacturing apparatus |
| CN101589171A (en) * | 2006-03-03 | 2009-11-25 | 普拉萨德·盖德吉尔 | Apparatus and method for large area multi-layer atomic layer chemical vapor processing of thin films |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103080374B (en) | 2016-04-13 |
| DE112011102856T5 (en) | 2013-08-08 |
| TW201219117A (en) | 2012-05-16 |
| DE112011102856B4 (en) | 2023-03-23 |
| FI20105902A0 (en) | 2010-08-30 |
| WO2012028779A1 (en) | 2012-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101497443B (en) | Reactor cleaning apparatus | |
| CN103080373B (en) | For the treatment of the apparatus and method on the surface of matrix | |
| CN103108985B (en) | Apparatus for processing flexible substrate | |
| US8181425B2 (en) | Apparatus for sealing capsules | |
| JP2012519773A5 (en) | ||
| CA2484844A1 (en) | Multistation coating device and method for plasma coating | |
| CN105392915A (en) | Method and apparatus for coating a surface of a substrate | |
| CN104039684A (en) | Device And Method For Filling, Sealing And Labelling Receptacles | |
| CN104508179A (en) | Apparatus for processing surface of substrate and nozzle head | |
| CN103080374A (en) | Apparatus | |
| CN105899710A (en) | Chemical vapor deposition device, and chemical vapor deposition method | |
| CN112585081B (en) | Apparatus and method for processing containers | |
| US5902102A (en) | Diffusion furnace used for semiconductor device manufacturing process | |
| US8561569B2 (en) | Method for coating the inner walls of pipes and device suitable therefor | |
| CN201873751U (en) | Atom layer deposition device for preparing thin film at inner wall of porous material | |
| CN102477544A (en) | Atomic layer deposition method used for preparing inner wall membrane of porous material, and equipment thereof | |
| CN103237921B (en) | Apparatus | |
| CN102140679A (en) | Vapor phase epitaxy apparatus of group III nitride semiconductor | |
| CN201669085U (en) | Material uniform distribution device and chemical reaction kettle thereof | |
| EA027960B1 (en) | Source and arrangement for processing a substrate | |
| US20240018653A1 (en) | Roll-to-roll processing | |
| CA2645621A1 (en) | Method and device for coating an inner surface of a hollow endless geometry, in particular of a pipe | |
| JP2012031454A (en) | Article treatment method | |
| JP2023523463A (en) | Rotary fluid distributors and preform internal processing equipment with such fluid distributors | |
| CN216974077U (en) | Mortar spraying device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230515 Address after: Room 205-5-7, 2nd Floor, East Office Building, No. 45 Beijing Road, Qianwan Bonded Port Area, Qingdao, Shandong Province, China (Shandong) Pilot Free Trade Zone (A) Patentee after: QINGDAO SIFANG SRI INTELLIGENT TECHNOLOGY Co.,Ltd. Address before: Finland Vantaa Patentee before: BENEQ OY |