CN102955368B - A kind of stepping lithographic equipment and method of photolithographic exposure - Google Patents
A kind of stepping lithographic equipment and method of photolithographic exposure Download PDFInfo
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- CN102955368B CN102955368B CN201110241791.3A CN201110241791A CN102955368B CN 102955368 B CN102955368 B CN 102955368B CN 201110241791 A CN201110241791 A CN 201110241791A CN 102955368 B CN102955368 B CN 102955368B
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- work stage
- mask platform
- lithographic equipment
- exposure
- stepping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
Abstract
The present invention discloses a kind of stepping lithographic equipment, comprising: a lighting unit, for providing exposing light beam; One work stage, carries out six-freedom motion for supporting a substrate within the scope of Long Distances; One mask platform, for support a mask expose time in little stroke range relatively described work stage be synchronized with the movement; One projection objective, for being projected to substrate by figure on mask by predetermined ratio; It is characterized in that, after described work stage steps to exposure field successively, described mask platform is synchronized with the movement to the position that described work stage is corresponding and also exposes simultaneously.The present invention discloses a kind of method of photolithographic exposure of this stepping lithographic equipment simultaneously.
Description
Technical field
The present invention relates to integrated circuit equipment manufacturing field, particularly relate to a kind of stepping lithographic equipment and method of photolithographic exposure.
Background technology
Lithographic equipment be a kind of by mask pattern exposure image to the equipment on silicon chip.Known lithographic equipment comprises stepping repetitive and step-by-step scanning type.In the step photo-etching machine of use reduction multiplying power projection objective disclosed in prior art, the multiplying power of this projection objective is what reduce, is namely projeced in substrate by projection objective by mask pattern by the ratio of 1: N.The work stage that step photo-etching machine disclosed in prior art uses, the structure usually adopted is: coarse motion structure combines with micromotion structure, or XY (level to) sports platform combines with universal stage, or even single coarse motion platform structure.And the mask platform of litho machine of the prior art is coarse motion platform.
Stepping exposure method of the prior art is, completes leveling and after aiming at, after work stage steps to assigned address, just can expose after this work stage need be made to keep the steady state (SS) of certain precision when substrate.Adopt stepping projection arrangement and the method for traditional reduction multiplying power, the stepping accuracy of work stage requires very high, and stabilization time requires very short, and for this reason, complete machine difficulty is comparatively large, and production capacity having a strong impact on by stabilization time.
Disclosed in patent US2001/0021009, US6287735 and US2009/0201475 shown in technical scheme content, above-mentioned patent all adopts and reduces stage quality, mode such as simplification Workpiece platform structure, optimal control mode etc. to improve step photo-etching machine, but still there is stepping, to stablize required time long, the defect that productive rate is lower.
Summary of the invention
The object of the invention is to overcome the technological deficiency existed in prior art, a kind of stepping lithographic equipment and method of photolithographic exposure are provided, effectively can reduce stepping stabilization time, reduce exposure required T.T. further, the productive rate of lithographic equipment is improved.
In order to realize foregoing invention object, the present invention discloses a kind of stepping lithographic equipment, comprising: a lighting unit, for providing exposing light beam; One work stage, carries out six-freedom motion for supporting a substrate within the scope of Long Distances; One mask platform, for support a mask expose time in little stroke range relatively described work stage be synchronized with the movement; One projection objective, for being projected to substrate by figure on mask by predetermined ratio; It is characterized in that, after described work stage steps to exposure field successively, described mask platform is synchronized with the movement to the position that described work stage is corresponding and also exposes simultaneously.
Further, the projection multiplying power of this projection objective is 1: 5.
Further, the stepping stroke of this mask platform is less than 30mm, and the stepping stroke of this work stage is greater than 30mm.
Further, this stepping lithographic equipment also comprises a position measuring system.
Further, the level of this work stage is H type structure to telecontrol equipment, and catenary motion device is cam structure.
Further, the level of this mask platform is Lorentz lorentz's motor to telecontrol equipment, and catenary motion device is reed mechanism.
Further, this position measuring system adopts laser interferometer or coded scale.
Further, this mask platform is synchronized with the movement to XY and Rz position corresponding to this work stage.
The present invention discloses a kind of method of photolithographic exposure using above-mentioned stepping lithographic equipment simultaneously, it is characterized in that, step one, carries out exposing front preliminary work; After step 2, work stage step to the first exposure field, mask platform is synchronized with the movement to the position that this work stage is corresponding and also exposes simultaneously; Step 3, judge whether the exposure completing whole exposure field, if judged result is "No", then return step 2; If judged result is "Yes", then end exposure.This step one comprises mask, upper substrate, realizes the whole audience aim at described substrate.
Compared with prior art, workpiece platform micro-motion platform transfer of the prior art is mask platform micromotion structure by the present invention, and complete machine difficulty is reduced.In addition, adopt apparatus of the present invention operation, time near work stage coarse motion to exposure area, mask platform containing micromotion structure dynamically follows the tracks of work stage position immediately, follow the tracks of due to the high frequency among a small circle and be similar to scanning photoetching machine, now can expose simultaneously, therefore, these apparatus and method are adopted not need as traditional step photo-etching machine structure, mask platform is motionless, and work stage stepping just can must expose in position stability to designated precision, thus, adopt these apparatus and method, stepping significantly reduces stabilization time, exposure T.T. correspondingly tails off, productive rate is corresponding to be uprised.
Accompanying drawing explanation
Can be further understood by following detailed Description Of The Invention and institute's accompanying drawings about the advantages and spirit of the present invention.
Fig. 1 is the structural representation of stepping lithographic equipment involved in the present invention;
Fig. 2 is the vertical view of the work stage of stepping lithographic equipment;
Fig. 3 is the side view of the work stage of stepping lithographic equipment;
Fig. 4 is the vertical view of the mask platform of stepping lithographic equipment;
Fig. 5 is the side view of the mask platform of stepping lithographic equipment;
Fig. 6 is the structural representation of the position measuring system of stepping lithographic equipment;
Fig. 7 is the process flow diagram of this method of photolithographic exposure.
Embodiment
Stepping lithographic equipment and the method for photolithographic exposure of a kind of specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.But, the present invention should be understood as and be not limited to this embodiment described below, and technical concept of the present invention can combine with other known technologies or function other technologies identical with those known technologies and implements.
In the following description, in order to clear displaying structure of the present invention and working method, to be described by many Directional words, but should by "front", "rear", "left", "right", " outward ", " interior ", " outwards ", " inwardly ", " on ", the Word Understanding such as D score for convenience of term, and not should be understood to word of limitation.In addition, used " X-axis or X to " word mainly refers in level to parallel coordinate axis or direction in the following description; " Y-axis or Y-direction " word mainly refers to level to coordinate axis vertical with X-axis while of parallel or direction; " Z axis or Z-direction " word mainly refers to the coordinate axis all vertical with X-axis Y-axis or direction; " Rx axle " word mainly refers to the direction rotated around X-axis; " Ry axle " word mainly refers to the direction rotated around Y-axis; " Rz axle " word mainly refers to the direction rotated around Z axis.
Refer to Fig. 1, Fig. 1 is the structural representation of stepping lithographic equipment involved in the present invention.As shown in fig. 1, this stepping lithographic equipment comprises illuminator 1, mask platform 2, and is positioned over the mask 9 on mask platform 2, projection objective 6, work stage 4 and the substrate 7 be positioned on work stage 4, and general frame 5 and position measuring system 3.In this device embodiment, illuminator 1 adopts mercury lamp to throw light on, and provides i line or gh line or ghi line exposing, forms conventional illumination.Projection objective 6 adopts the reduction formula object lens of 1: M (M > 1), preferably adopts the reduction formula object lens of 1: 5.In the present invention, work stage 4 adopts coarse motion structure and is positioned between complete machine framework 5.Mask platform 2 adopts micromotion structure and is positioned on complete machine framework.Substrate 7 steps to each exposure field successively by coarse motion platform 4, and mask 9, when substrate 7 steps near appointment exposure area, is dynamically followed the tracks of the vibration of work stage, exposed while dynamically following the tracks of by mask micropositioner 2.Wherein work stage 4 and mask platform 2 positional information are measured by precision measurement system 3.
Stepping lithographic equipment involved in the present invention operationally, time near work stage 4 coarse motion to exposure area, mask platform 2 containing micromotion structure dynamically follows the tracks of work stage 4 position immediately, follow the tracks of due to the high frequency among a small circle and be similar to scanning photoetching machine, now can expose simultaneously, therefore, adopt these apparatus and method not need as traditional step photo-etching machine structure, mask platform is motionless, and work stage stepping just can must expose in position stability to designated precision.
The detailed construction of work stage 4 refers to Fig. 2 and Fig. 3, and wherein Fig. 2 is the side view of the vertical view of the work stage of stepping lithographic equipment, Fig. 3 work stage.Work stage 4 is six-freedom motion mechanisms, and namely work stage can meet the motion of X, Y, Z, Rx, Ry, Rz six direction.Wherein, level directly drives structure control X, the motion of Y-axis Long travel to employing H type frame structure, and Rz axle designs according to the compatible type interface of H type, and horizontal three-axis measurement adopts interferometer measurement to control.Vertical employing cam mechanism 46 realizes the motion control of Z, Rx, Ry axle, adopts scrambler to measure.
Work stage 4 level adopts the drive scheme of H type to comprise X driving direction and Y driving direction to framework.X driving direction comprises two X direction guiding rails 41.Two motor magnetic stator 43 and guide rail 41 assembly are installed on work head supports framework, and X electric mover 402 and Y-direction beam guideway are connected, provide X to Rz to motion.Y-direction drives and comprises a Y-direction guide rail 45, and Y-direction motor stator is installed on Y-direction beam guideway, and mover is installed on exposure desk framework.Formula linear electric motors of lying are adopted in the middle of beam guideway.H type slide block adopts two guide rail air supporting guiding, and left rail is that level gauge configures 2 vertical floating cushions 47 (vacuum pretension), only provides vertical support and guiding, and horizontal direction is freely.Right rail is two-dimentional guide rail 49, and constraint Y-direction and Z-direction, can adopt U-shaped high rigidity aerostatic slide, each side two floating cushions, each other pretensions, vertical employing two floating cushions (vacuum pretension).Invention also provides the second technical scheme of work stage 4, adopt silicon steel guide rail by right rail, adopt magnetic pretension, aerostatic slide adopts 2 vertical and one-sided Rz floating cushions.Flexible block can be adopted between Rz floating cushion with Y-direction guide rail to be connected.Each 2 X in crossbeam Y guide rail both sides are to floating cushion, and the impulsive force of opposing Y-direction motion and the torque of Rz, pressure gas is pretension each other.Fine motion base of frame adopts high rigidity gas foot 401 design, and by Dali, Shitai County makes guide surface, and total can use 12 floating cushions and 1 gas foot.
Scheme is directly driven except voice coil motor by the catenary motion mechanism of work stage 4, also adopts traditional cam mechanism 46 to drive.
The detailed construction of mask platform 2 refers to Fig. 4 and Fig. 5, and wherein Fig. 4 is the side view of the vertical view of the mask platform of stepping lithographic equipment, Fig. 5 mask platform.The horizontal fine motion motor of mask platform 2 have employed three Lorentz motors and drives, and comprises the Lorentz motors SSZX for providing X-direction, for providing Lorentz motors SSY1 and SSY2 of Y-direction.The lower surface of mask platform 4 adopts air supporting navigation designing, makes planar guide by marble 26.Mask platform 4 installs X, Y-direction two pieces of plane mirrors 22,21, compatible support 5 cun, 6 cun masks.Mask platform 4, without Switch of working position mechanism, provides mask to join interface, and adjustment of the printing plate precision realizes precision index and the stroke compensation of X, Y, RZ Three Degree Of Freedom by fine motion voice coil motor.Mask is attracted to by vacuum to be inhaled on bed 25, inhales bed 25 and adopts boss to design.The vertical actuator of mask platform 4 23 adopts reed mechanism: adopt three vertical supporting springs to connect marble 26 and mask platform framework, have vertical high rigidity, horizontal Low rigidity.Have flexible hinge between reed and marble 26, untie Rx and Ry to coupling.
In this device embodiment, the position measuring system adopted is as Fig. 6, and level adopts laser interferometer measurement to XYRz etc., and Z-direction adopts built-in coded scale to measure.Except mask platform 2 being arranged X to except plane mirror 22, Y-direction plane mirror 21, work stage 4 is provided with equally X to outside plane mirror 42, Y-direction plane mirror 44. the laser of plane mirror reflects laser interferometer outgoing, measure to XYRz for level.
The workflow main points of stepping lithographic equipment disclosed in this invention are used to be: work stage steps to each exposure field successively by coarse motion platform, mask platform is when work stage steps near appointment exposure area, dynamically followed the tracks of the vibration of work stage by mask platform micromotion structure, expose while dynamically following the tracks of.As shown in Figure 7, Fig. 7 is the process flow diagram of this method of photolithographic exposure.Before carrying out photolithographic exposure, first complete the preliminary work before S1 exposure, the preliminary work before exposure specifically comprises mask S11, upper wafer S12, realizes the whole audience aim at S13 to wafer.After obtaining preliminary work S1 before completing exposure, enter first time stepping exposure S2, specifically comprise and work stage is stepped to first exposure field position S21, then mask platform dynamically follows the tracks of work stage micro-locality change S22.When first time stepping exposure S2, the motion of mask platform synchronized tracking work stage, exposes while dynamically following the tracks of.Therefore, when step S2 completes, exposure S3 completes simultaneously.Then carry out second time stepping exposure S4, step and the first time stepping exposure S2 of second time stepping exposure S4 are completely the same, and comprise and work stage is stepped to second exposure field position S41, then mask platform dynamically follows the tracks of work stage micro-locality change S42.After completing exposure S5, judge whether that whole exposure field is exposed S6, if judged result whether, then reenters step S3, if judged result is, then photolithographic exposure terminates, lower wafer or change wafer S7.An optimal technical scheme of the present embodiment is XY and Rz that mask platform only follows the tracks of work stage, is the complicacy in order to reduce system further like this.
The work stage that the present invention defines and mask platform are all can be synchronized with the movement exposing while, and the key distinction of described coarse motion structure and micromotion structure comprises: one, the former XY to stroke ratio comparatively large, be such as all greater than 30mm, and the stroke of the latter is smaller; Its two, the former positioning precision (in wafer face or in wafer face projection) is general lower than the latter.
There is not the micromotion structure of exposure dynamic motion simultaneously in the mask platform of apparatus of the present invention and traditional step photo-etching machine, but is simply locked into structure or other static structure; In addition, the work stage of conventional lithography machine generally comprises coarse motion platform and micropositioner (or XY platform and universal stage, only have only a few to be only by a coarse motion structure for H type).
In addition, not significantly being both of the inventive method and traditional stepper, the present invention while exposure, the motion of mask platform synchronized tracking work stage.And the mask platform of traditional step photo-etching machine does not follow the tracks of work stage motion.
Because work stage of the present invention only has coarse motion structure, thus work stage scheme of the present invention to add micropositioner structure (or XY platform adds Rz platform) than the coarse motion platform that conventional workpiece platform adopts simpler; Simultaneously, because object lens are 1: 5 reduction formula object lens, so mask platform horizontal X Y-direction error ratio relaxes 5 times in the accuracy requirement of work stage, and the positioning error of vertical Z-direction is relaxed 25 times, the structure that therefore in this device, the system of mask platform and work stage composition is more fixing during mask platform exposure than conventional workpiece platform employing coarse motion+micromotion structure is more simple.That is, the micropositioner of the work stage of traditional step photo-etching machine is transferred in mask platform by this programme, and complete machine difficulty is greatly reduced.
Adopt apparatus of the present invention operation, can be different with traditional step photo-etching machine, namely when work stage coarse motion to exposure area, mask platform dynamically follows the tracks of work stage position by micromotion structure, work stage position complete stability is not needed to expose, therefore full-wafer exposure tails off T.T., and productive rate uprises.
Just preferred embodiment of the present invention described in this instructions, above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (10)
1. a stepping lithographic equipment, comprising:
One lighting unit, for providing exposing light beam;
One work stage, carries out six-freedom motion for supporting a substrate within the scope of Long Distances;
One mask platform, for support a mask expose time in little stroke range relatively described work stage be synchronized with the movement;
One projection objective, for being projected to substrate by figure on mask by predetermined ratio;
It is characterized in that, described work stage only has coarse motion structure, and described mask platform only has micromotion structure, and after described work stage steps to exposure field successively, described mask platform is synchronized with the movement to the position that described work stage is corresponding and also exposes simultaneously;
After described work stage steps to exposure field successively, described mask platform is synchronized with the movement to position corresponding to described work stage and exposure is simultaneously, mask platform is when work stage steps near appointment exposure area, dynamically followed the tracks of the vibration of described work stage by the micromotion structure of described mask platform, expose while described dynamic tracking.
2. stepping lithographic equipment as claimed in claim 1, it is characterized in that, the projection multiplying power of described projection objective is 1:5.
3. stepping lithographic equipment as claimed in claim 1, it is characterized in that, the stepping stroke of described mask platform is less than 30mm, and the stepping stroke of described work stage is greater than 30mm.
4. stepping lithographic equipment as claimed in claim 1, it is characterized in that, described stepping lithographic equipment also comprises a position measuring system.
5. stepping lithographic equipment as claimed in claim 1, it is characterized in that, the level of described work stage is H type structure to telecontrol equipment, and catenary motion device is cam structure.
6. stepping lithographic equipment as claimed in claim 1, it is characterized in that, the level of described mask platform is Lorentz lorentz's motor to telecontrol equipment, and catenary motion device is reed mechanism.
7. stepping lithographic equipment as claimed in claim 4, is characterized in that, described position measuring system adopts laser interferometer or coded scale.
8. stepping lithographic equipment as claimed in claim 1, is characterized in that, described mask platform is synchronized with the movement to XY and Rz position corresponding to described work stage.
9. use a method of photolithographic exposure for the stepping lithographic equipment as described in any one of claim 1 to 8, it is characterized in that,
Step one, carry out exposing front preliminary work;
After step 2, work stage step to the first exposure field, described work stage only has coarse motion structure, mask platform only has micromotion structure, described mask platform is synchronized with the movement to the position that described work stage is corresponding and also exposes simultaneously, dynamically followed the tracks of the vibration of described work stage by described mask platform micromotion structure, expose while described dynamic tracking;
Step 3, judge whether the exposure completing whole exposure field, if judged result is "No", then return step 2; If judged result is "Yes", then end exposure.
10. method of photolithographic exposure as claimed in claim 9, it is characterized in that, described step one comprises mask, upper substrate, realizes the whole audience aim at described substrate.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241791.3A CN102955368B (en) | 2011-08-22 | 2011-08-22 | A kind of stepping lithographic equipment and method of photolithographic exposure |
| PCT/CN2012/080031 WO2013026361A1 (en) | 2011-08-22 | 2012-08-13 | Step photolithography device and photolithography exposure method |
| TW101130476A TW201316133A (en) | 2011-08-22 | 2012-08-22 | Step photolithography device and photolithography exposure method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241791.3A CN102955368B (en) | 2011-08-22 | 2011-08-22 | A kind of stepping lithographic equipment and method of photolithographic exposure |
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| Publication Number | Publication Date |
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| CN102955368A CN102955368A (en) | 2013-03-06 |
| CN102955368B true CN102955368B (en) | 2015-09-30 |
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| CN201110241791.3A Active CN102955368B (en) | 2011-08-22 | 2011-08-22 | A kind of stepping lithographic equipment and method of photolithographic exposure |
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| Country | Link |
|---|---|
| CN (1) | CN102955368B (en) |
| TW (1) | TW201316133A (en) |
| WO (1) | WO2013026361A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106154760B (en) * | 2015-04-15 | 2019-01-29 | 上海微电子装备（集团）股份有限公司 | A kind of exposure device and exposure method |
| TWI579662B (en) * | 2015-10-05 | 2017-04-21 | A multi-channel alignment system based on spectrum processing, an alignment signal processing method and a photolithography apparatus | |
| JP6723112B2 (en) * | 2016-08-29 | 2020-07-15 | 株式会社ブイ・テクノロジー | Exposure apparatus and exposure method |
| CN109491201B (en) * | 2018-12-26 | 2024-01-19 | 仪晟科学仪器(嘉兴)有限公司 | High-precision two-dimensional movement mechanism for mask |
| CN111082596B (en) * | 2019-12-23 | 2022-04-15 | 安徽机电职业技术学院 | Freedom degree multi-azimuth micropositioner comprising two-freedom degree actuating mechanism |
| CN114326320B (en) * | 2021-10-26 | 2023-11-07 | 江苏迪盛智能科技有限公司 | Control method, device, equipment and storage medium for stepping photoetching |
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| US5900707A (en) * | 1996-06-19 | 1999-05-04 | Canon Kabushiki Kaisha | Stage-drive control apparatus and method, and scan-projection type exposure apparatus |
| CN1967386A (en) * | 2005-11-17 | 2007-05-23 | 中国科学院电工研究所 | Wafer platform mask platform synchronous control system of step-scan photoetching machine |
| CN102087482A (en) * | 2010-12-27 | 2011-06-08 | 中国科学院光电技术研究所 | Synchronized motion error correction and control system of photoetching machine worktable |
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| JPH08293459A (en) * | 1995-04-21 | 1996-11-05 | Nikon Corp | Stage driving control method and its device |
| CN2393123Y (en) * | 1999-11-01 | 2000-08-23 | 信息产业部电子第五十五研究所 | Large-area step-by-step scanning type exposure machine |
| EP1248288A1 (en) * | 1999-12-16 | 2002-10-09 | Nikon Corporation | Exposure method and exposure apparatus |
| JP2002305140A (en) * | 2001-04-06 | 2002-10-18 | Nikon Corp | Aligner and substrate processing system |
| JP2004072076A (en) * | 2002-06-10 | 2004-03-04 | Nikon Corp | Exposure device, stage unit and method for manufacturing device |
| CN101032068B (en) * | 2004-10-01 | 2010-12-22 | 株式会社尼康 | Linear motor, stage apparatus and exposure apparatus |
| US8902402B2 (en) * | 2008-12-19 | 2014-12-02 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
| CN102012639B (en) * | 2009-09-04 | 2013-09-11 | 上海微电子装备有限公司 | Method and device for protecting silicon wafer edge |
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2011
- 2011-08-22 CN CN201110241791.3A patent/CN102955368B/en active Active
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2012
- 2012-08-13 WO PCT/CN2012/080031 patent/WO2013026361A1/en active Application Filing
- 2012-08-22 TW TW101130476A patent/TW201316133A/en unknown
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5900707A (en) * | 1996-06-19 | 1999-05-04 | Canon Kabushiki Kaisha | Stage-drive control apparatus and method, and scan-projection type exposure apparatus |
| CN1967386A (en) * | 2005-11-17 | 2007-05-23 | 中国科学院电工研究所 | Wafer platform mask platform synchronous control system of step-scan photoetching machine |
| CN102087482A (en) * | 2010-12-27 | 2011-06-08 | 中国科学院光电技术研究所 | Synchronized motion error correction and control system of photoetching machine worktable |
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| Publication number | Publication date |
|---|---|
| TWI561937B (en) | 2016-12-11 |
| CN102955368A (en) | 2013-03-06 |
| TW201316133A (en) | 2013-04-16 |
| WO2013026361A1 (en) | 2013-02-28 |
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Address after: 201203 1525 Zhang Dong Road, Zhangjiang hi tech park, Pudong District, Shanghai Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 1525 Zhang Dong Road, Zhangjiang hi tech park, Pudong District, Shanghai Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |