CN102944707A - System and method for protecting probes - Google Patents
System and method for protecting probes Download PDFInfo
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- CN102944707A CN102944707A CN2012104755389A CN201210475538A CN102944707A CN 102944707 A CN102944707 A CN 102944707A CN 2012104755389 A CN2012104755389 A CN 2012104755389A CN 201210475538 A CN201210475538 A CN 201210475538A CN 102944707 A CN102944707 A CN 102944707A
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Abstract
The invention provides a system for protecting probes. The system comprises a nitrogen generating device, a nitrogen delivery pipeline and a test machine array, wherein the nitrogen generating device is sued for generating nitrogen, the nitrogen delivery pipeline is connected with the nitrogen generating device and the test machine array respectively, the test machine array is composed of N test machines which are connected in parallel, N is a positive integer and is no smaller than 1, probe cards are installed on test machines, and probe protection devices are arranged on probe cards. The invention also provides a method for protecting probes. By the aid of the method, the problem that probes of probe cards are oxidized is solved, so that service lives of probes are prolonged, and the test cost is reduced. By the aid of the system and the method, impurities on wafers can be eliminated to some extent, so that the yield of preliminary surveys can be improved.
Description
Technical field
Present technique is mainly used in protection system and the method in integrated circuit testing field, particularly a kind of probe.
Background technology
As everyone knows, the probe of probe all is exposed aerial in test process, so be easy to oxidizedly, particularly has in the chip of fuse burning test performance obvious especially in test, pass through because have large electric current at the process middle probe of fuse burning, probe is as easy as rolling off a log oxidized.After probe was oxidized, the yield of test can be greatly affected, and at this time must select the mill probe, and the serious pin Ka Chang that can only arrive again changes pin and could improve yield.Probe is oxidized to have following some impact afterwards on test:
1, yield rate step-down has indirectly improved the testing cost of product;
2, card grinding has affected testing efficiency, directly improves the testing cost of product;
3, depot repair pin card, the testing progress of impact.If can cause the test of whole product to stay cool when only having a pin card, directly affect the shipment cycle of product.
On the other hand, general test is the first step operation after wafer dispatches from the factory, and wafer is messy when doing test, the impurity that the above has a lot of our naked eyes not see.If pin just drops on these above impurity in the time of test, thereby the preliminary survey yield that will cause the loose contact impact to be tested has prolonged the test duration, has indirectly increased testing cost.
From whole test industry, do not have at present corresponding technology, method or measure and solve the probe of probe in oxidized this problem of test process.
Summary of the invention
The purpose of this invention is to provide protection system and the method for a kind of probe in test process, in order to the oxidized problem of the probe that solves probe, thereby reduced testing cost the serviceable life of prolongation probe.The present invention can also remove the impurity on the wafer to a certain extent, thereby improves the yield of preliminary survey.
To achieve these goals, the invention provides a kind of probe protection system, this system comprises: nitrogen gas generation device, nitrogen gas delivery-line, tester table array, and described nitrogen gas generation device is for generation of nitrogen; Described nitrogen gas delivery-line is connected with described nitrogen gas generation device and described tester table array respectively; Described tester table array is comprised of N tester table in parallel, and N is positive integer, and N 〉=1; On the described tester table probe is installed; Be provided with probe protection device on the described probe.
Better, described nitrogen gas generation device is in the permanent activation state;
Better, on the described mental disorder conveyance conduit switch being set, described switch is used for controlling the break-make of nitrogen;
Better; described probe protection device comprises flexible gas pipe line, control valve and the nitrogen nozzle of energy free bend; described can free bend flexible gas pipe line respectively with described nitrogen gas delivery-line be connected the nitrogen nozzle and be connected; described control valve is installed on the flexible gas pipe line of described energy free bend, the size that is used for regulating nitrogen amount.
The present invention also provides a kind of probe protection method, may further comprise the steps:
Probe is installed;
Place wafer to be measured to tester table;
Adjust probe protection device, with the surface of contact of nitrogen nozzle alignment wafer and probe, and utilize control valve to regulate the air output of nitrogen nozzle according to the shape of wafer and probe;
Open described switch, be the probe protection device air feed;
Nitrogen blows on the surface of contact of wafer and probe by the nitrogen nozzle;
Probe is finished the test of wafer;
Whether the inquiry test is finished, and is then to carry out final step, otherwise carries out next step;
Change wafer, again test;
Whether the inquiry test is finished, and is then to carry out next step, otherwise carries out previous step;
After test is finished, close successively control valve, switch.
Compared with prior art, the invention enables probe all to be under the protection of nitrogen in the whole process of test, prevent oxidizedly, and the colorless and odorless of nitrogen own is nontoxic, and very easily obtains, and is with low cost, and flowing of nitrogen can also be removed the impurity of wafer.
Description of drawings
Fig. 1: probe protection system architecture diagram of the present invention
Fig. 2: probe protection device structured flowchart of the present invention
Fig. 3: probe protection method flow diagram of the present invention
Embodiment
Please consult simultaneously Fig. 1, Fig. 1 is probe protection system architecture diagram of the present invention.Probe protection of the present invention system better embodiment comprises nitrogen gas generation device, nitrogen gas delivery-line, tester table array, and described nitrogen gas generation device is for generation of nitrogen; Described nitrogen gas delivery-line is connected with described nitrogen gas generation device and described tester table array respectively; Described tester table array is comprised of N tester table in parallel, and N is positive integer, and N 〉=1; On the described tester table probe is installed; Be provided with probe protection device on the described probe.
Described nitrogen gas generation device is in the permanent activation state, and the nitrogen gas generation device can be that nitrogen cylinder or other can uninterruptedly provide the equipment of nitrogen.
On the described mental disorder conveyance conduit switch is set, described switch is used for controlling the break-make of nitrogen.
Concrete, please in conjunction with Fig. 2.
Described probe protection device comprises flexible gas pipe line, control valve and the nitrogen nozzle of energy free bend; described can free bend flexible gas pipe line respectively with described nitrogen gas delivery-line be connected the nitrogen nozzle and be connected; the flexible gas pipe line of described energy free bend can freely be adjusted the position of described nitrogen nozzle in solid space; described control valve is installed on the flexible gas pipe line of described energy free bend, and described control valve is used for regulating the size of nitrogen amount.
See also Fig. 3, Fig. 3 is probe protection method flow diagram of the present invention, and probe protection method better embodiment of the present invention may further comprise the steps:
Probe is installed;
Place wafer to be measured to tester table;
Adjust probe protection device, with the surface of contact of nitrogen nozzle alignment wafer and probe, and utilize control valve to regulate the air output of nitrogen nozzle according to the shape of wafer and probe;
Open described switch, be the probe protection device air feed;
Nitrogen blows on the surface of contact of wafer and probe by the nitrogen nozzle;
Probe is finished the test of wafer;
Whether the inquiry test is finished, and is then to carry out final step, otherwise carries out next step;
Change wafer, again test;
Whether the inquiry test is finished, and is then to carry out next step, otherwise carries out previous step;
After test is finished, close successively control valve, switch.
In conjunction with Fig. 1, Fig. 3 to describing principle of work of the present invention.
Described nitrogen device is in the permanent activation state, before starting working, the probe of suitable wafer to be measured is installed on described probe, according to the shape and size of described wafer to be measured and described probe by described control valve adjust the nitrogen nozzle air output, described switch is placed closure state, the nitrogen that described nitrogen nozzle is carried places probe under the encirclement environment of nitrogen, completely cut off and the contacting of air, simultaneously constantly utilize nitrogen to blow the surface of contact of described probe and chip to be measured, thereby impurity is disposed, close successively control valve and switch after finishing all tests, described probe is taken off in addition seal up for safekeeping at last.In whole process, probe only has the time seldom to expose in air, thereby has greatly reduced the probability of its oxidation, and has improved simultaneously the test yield, reduced testing cost.
Above invention has been described in conjunction with most preferred embodiment, but the present invention is not limited to the embodiment of above announcement, and should contain various modification, equivalent combinations of carrying out according to essence of the present invention.
Claims (6)
1. a probe protection system is characterized in that comprising nitrogen gas generation device, nitrogen gas delivery-line, tester table array, and described nitrogen gas generation device is for generation of nitrogen; Described nitrogen gas delivery-line is connected with described nitrogen gas generation device and described tester table array respectively; Described tester table array is comprised of N tester table in parallel, and N is positive integer, and N 〉=1; On the described tester table probe is installed; Be provided with probe protection device on the described probe.
2. probe protection according to claim 1 system, it is characterized in that: described nitrogen gas generation device is in the permanent activation state.
3. probe protection according to claim 1 system, it is characterized in that: on the described mental disorder conveyance conduit switch is set, described switch is used for controlling the break-make of nitrogen.
4. probe protection according to claim 1 system; it is characterized in that: described probe protection device comprises flexible gas pipe line, control valve and the nitrogen nozzle of energy free bend; described can free bend flexible gas pipe line respectively with described nitrogen gas delivery-line be connected the nitrogen nozzle and be connected; described control valve is installed on the flexible gas pipe line of described energy free bend, the size that is used for regulating nitrogen amount.
5. probe protection according to claim 4 system is characterized in that: the described position that can the flexible gas pipe line of free bend can freely adjust described nitrogen nozzle in solid space.
6. probe protection method may further comprise the steps:
Probe is installed;
Place wafer to be measured to tester table;
Adjust probe protection device, with the surface of contact of nitrogen nozzle alignment wafer and probe, and utilize control valve to regulate the air output of nitrogen nozzle according to the shape of wafer and probe;
Open described switch, be the probe protection device air feed;
Nitrogen blows on the surface of contact of wafer and probe by the nitrogen nozzle;
Probe is finished the test of wafer;
Whether the inquiry test is finished, and is then to carry out final step, otherwise carries out next step;
Change wafer, again test;
Whether the inquiry test is finished, and is then to carry out next step, otherwise carries out previous step;
After test is finished, close successively control valve, switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104755389A CN102944707A (en) | 2012-11-21 | 2012-11-21 | System and method for protecting probes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104755389A CN102944707A (en) | 2012-11-21 | 2012-11-21 | System and method for protecting probes |
Publications (1)
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| CN102944707A true CN102944707A (en) | 2013-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012104755389A Pending CN102944707A (en) | 2012-11-21 | 2012-11-21 | System and method for protecting probes |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105182208A (en) * | 2015-08-13 | 2015-12-23 | 山东浪潮华光光电子股份有限公司 | LED chip test method |
| CN107561319A (en) * | 2017-08-23 | 2018-01-09 | 上海华力微电子有限公司 | A kind of clear needle method of WAT boards probe card |
| CN112630480A (en) * | 2020-07-01 | 2021-04-09 | 强一半导体（苏州）有限公司 | Probe card with side air outlet for high-temperature and high-pressure test of power device |
| WO2021115169A1 (en) * | 2019-12-13 | 2021-06-17 | 山东才聚电子科技有限公司 | Chip detection device, chip detection system, and control method |
| CN116773994A (en) * | 2023-08-21 | 2023-09-19 | 珠海格力电子元器件有限公司 | Wafer test control method, control device, storage medium and electronic equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03257841A (en) * | 1990-03-07 | 1991-11-18 | Mitsubishi Electric Corp | Oxidation preventive device for leading edge of probe card |
| CN1191019A (en) * | 1995-06-07 | 1998-08-19 | 格伦·利迪 | Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| JPH11218548A (en) * | 1998-02-03 | 1999-08-10 | Mitsubishi Electric Corp | Probe card |
| JP2001007164A (en) * | 1999-06-18 | 2001-01-12 | Micronics Japan Co Ltd | Prober |
| JP2001083210A (en) * | 1999-09-16 | 2001-03-30 | Yokogawa Electric Corp | Semiconductor tester |
| US20050261856A1 (en) * | 2004-05-21 | 2005-11-24 | Advantest Corporation | Carrier module for adapting non-standard instrument cards to test systems |
| CN202886420U (en) * | 2012-11-21 | 2013-04-17 | 成都市中州半导体科技有限公司 | Probe protection system |
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2012
- 2012-11-21 CN CN2012104755389A patent/CN102944707A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03257841A (en) * | 1990-03-07 | 1991-11-18 | Mitsubishi Electric Corp | Oxidation preventive device for leading edge of probe card |
| CN1191019A (en) * | 1995-06-07 | 1998-08-19 | 格伦·利迪 | Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| JPH11218548A (en) * | 1998-02-03 | 1999-08-10 | Mitsubishi Electric Corp | Probe card |
| JP2001007164A (en) * | 1999-06-18 | 2001-01-12 | Micronics Japan Co Ltd | Prober |
| JP2001083210A (en) * | 1999-09-16 | 2001-03-30 | Yokogawa Electric Corp | Semiconductor tester |
| US20050261856A1 (en) * | 2004-05-21 | 2005-11-24 | Advantest Corporation | Carrier module for adapting non-standard instrument cards to test systems |
| CN202886420U (en) * | 2012-11-21 | 2013-04-17 | 成都市中州半导体科技有限公司 | Probe protection system |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105182208A (en) * | 2015-08-13 | 2015-12-23 | 山东浪潮华光光电子股份有限公司 | LED chip test method |
| CN107561319A (en) * | 2017-08-23 | 2018-01-09 | 上海华力微电子有限公司 | A kind of clear needle method of WAT boards probe card |
| WO2021115169A1 (en) * | 2019-12-13 | 2021-06-17 | 山东才聚电子科技有限公司 | Chip detection device, chip detection system, and control method |
| CN112630480A (en) * | 2020-07-01 | 2021-04-09 | 强一半导体（苏州）有限公司 | Probe card with side air outlet for high-temperature and high-pressure test of power device |
| CN112649631A (en) * | 2020-07-01 | 2021-04-13 | 强一半导体（苏州）有限公司 | Probe card with double air inlet channel devices for high-temperature and high-pressure test of power device |
| CN112630480B (en) * | 2020-07-01 | 2022-08-16 | 强一半导体（苏州）有限公司 | Probe card with side air outlet for high-temperature and high-pressure test of power device |
| CN112649631B (en) * | 2020-07-01 | 2022-08-19 | 强一半导体（苏州）有限公司 | Probe card with double air inlet channel devices for high-temperature and high-pressure test of power device |
| CN116773994A (en) * | 2023-08-21 | 2023-09-19 | 珠海格力电子元器件有限公司 | Wafer test control method, control device, storage medium and electronic equipment |
| CN116773994B (en) * | 2023-08-21 | 2023-12-01 | 珠海格力电子元器件有限公司 | Wafer test control method, control device, storage medium and electronic equipment |
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Application publication date: 20130227 |