CN102915136A - Touch panel and touch display device applying same and manufacturing method thereof - Google Patents
Touch panel and touch display device applying same and manufacturing method thereof Download PDFInfo
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- CN102915136A CN102915136A CN2011102227444A CN201110222744A CN102915136A CN 102915136 A CN102915136 A CN 102915136A CN 2011102227444 A CN2011102227444 A CN 2011102227444A CN 201110222744 A CN201110222744 A CN 201110222744A CN 102915136 A CN102915136 A CN 102915136A
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Abstract
The invention relates to a touch panel and a touch display device applying the same and a manufacturing method thereof. The manufacturing method comprises the steps of: first, forming a conductive layer on a substrate; then, forming a dielectric layer to cover the conductive layer; then, patterning the conductive layer and the dielectric layer by using a first photomask to respectively form a plurality of inductive lines and dielectric blocks, wherein the first photomask is a semi-transparent optical mask; then, forming a transparent conductive layer to cover the dielectric layer and the conductive layer; and then, patterning the transparent conductive layer by using a second photomask to form a touch sensing structure. The touch panel can be manufactured by two photomask steps, so that the process time and the cost can be saved. The concave part is designed, so that a through hole of the dielectric layer can be formed by removing fewer dielectric layer materials. As the outer side face of the dielectric layer is connected with the outer side faces of the inductive lines, the touch sensing structure and the part of the touch sensing structure extending along the outer side face are free from sharp turning parts.
Description
Technical field
The invention relates to a kind of contact panel and use its touch control display apparatus and its manufacture method, and particularly relevant for a kind of contact panel and the touch control display apparatus of using it and its manufacture method that adopts half penetrating light masking process to finish.
Background technology
Traditional contact panel comprises substrate and inductive layer.Inductive layer is formed on the substrate.Inductive layer generally all needs multiple tracks photomask technique to form.For example, with first photomask technique, form a plurality of the first sensing units on substrate along a direction; Then, with second photomask technique, form in the direction many strip metals line of induction and be electrically connected described the first sensing unit; Then, with the 3rd road photomask technique, form the insulation course covering metal line of induction; Then, with the 4th road photomask technique, form a plurality of the second sensing units on insulation course and substrate along other direction; Then, with the 5th road photomask technique, form protective seam and cover the first sensing unit and the second sensing unit.
Summary of the invention
The invention relates to a kind of contact panel and use its touch-control display panel and its manufacture method, among the embodiment, with two road photomask techniques, can finish the inductive layer of contact panel, can save process time and cost.
According to one embodiment of the invention, a kind of manufacture method of contact panel is proposed.Manufacture method may further comprise the steps.Form a conductive layer on a substrate; Form a dielectric layer and cover this conductive layer; Utilize a first photomask, patterned conductive layer and dielectric layer, to form respectively many lines of induction and a plurality of dielectric block, wherein the first photomask penetrates (half-tone) photomask for half; Form a transparency conducting layer and cover dielectric layer and conductive layer; And, utilize a second photomask, patterned transparent conductive layer is to form a touch-control sensing structure.
According to one embodiment of the invention, a kind of contact panel is proposed.Contact panel comprises a substrate, many lines of induction, a plurality of dielectric block and touch-control sensing structures.The described line of induction is formed on the substrate.Described dielectric block is formed on the described line of induction and has a plurality of perforations, and the described line of induction exposes from described perforation.Touch-control sensing structure covers dielectric block and extends to the line of induction via perforation.Wherein, the lateral surface of each line of induction or medial surface are connected in the lateral surface of corresponding dielectric block, and the described line of induction and described dielectric block are by forming with half penetrating light mask fabrication.
According to one embodiment of the invention, a kind of touch control display apparatus is proposed.Touch control display apparatus comprises a display unit and just like with aforesaid contact panel.Display unit provides display frame.The contiguous display unit configuration of contact panel is in order to provide the touch-control sensing function.
The beneficial effect of present embodiment is:
(1). contact panel can be finished with two road photomask techniques, process time and cost can be saved.
(2). compared to the design without depressed part, the design of the depressed part of the embodiment of the invention is so that removing the perforation that can form dielectric block in the situation of less dielectric layer material.
(3). because the lateral surface of dielectric block is connected with the lateral surface of the line of induction, so the lateral surface of the lateral surface of dielectric block and the line of induction can not produce serious dislocation or even can not misplace in the junction.Thus, touch-control sensing structure is along the violent turning point of the unlikely generation of part of lateral surface and lateral surface extension.
For there is better understanding above-mentioned and other aspect of the present invention, embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
Figure 1A to Fig. 1 H illustrates the process drawing according to the contact panel of one embodiment of the invention.
Fig. 2 illustrates the top view of Fig. 1 H.
Fig. 3 illustrates according to the dielectric block of the contact panel of another embodiment of the present invention and the cut-open view of the line of induction.
Fig. 4 illustrates according to the dielectric block of further embodiment of this invention and the cut-open view of the line of induction.
Fig. 5 A to Fig. 5 H illustrates the process drawing according to the contact panel of another embodiment of the present invention.
Fig. 6 illustrates the cut-open view according to the touch control display apparatus of one embodiment of the invention.
Drawing reference numeral:
100,400: contact panel
110: substrate
120: conductive layer
121,221,321: the line of induction
121s, 131s, 140s, 221s, 321s, 431s, 443s: lateral surface
130,440 ': dielectric layer
131,331,431: dielectric block
121a, 131a: top
121u, 131u, 140u1: upper surface
132: part
133,333: perforation
140,440: the patterning photoresist layer
140b: lower surface
140u2: groove bottom
141,441: depressed part
142,442: part
150: touch-control sensing structure
150 ': transparency conducting layer
152: the second induction electrodes
1521: the second sensing units
1522: the line of induction
160: the first induction electrodes
221a2: bottom
431ss: medial surface
443: the photoresistance piece
4431: edge part
500: touch control display apparatus
510: display unit
D1: first direction
D2: second direction
Ta, Tb, Tc, Td: connecting portion
Embodiment
Please refer to Figure 1A to Fig. 1 H, it illustrates the process drawing according to the contact panel of one embodiment of the invention.
At first, shown in Figure 1A, form conductive layer 120 on substrate 110.Conductive layer 120 can be complete conductive layer, and namely conductive layer 120 is the conductive layers with pierced pattern, and so this is non-in order to limit the present invention.The method that forms conductive layer 120 for example is chemical vapor deposition, electroless plating method (electroless plating), metallide (electrolytic plating), printing, spin coating, spraying, sputter (sputtering) or vacuum deposition method (vacuum deposition).。The material of conductive layer 120 can be metal, for example is to be selected from the group that is made of gold, silver, copper and combination thereof.
Shown in Figure 1A, form dielectric layer 130 and cover conductive layer 120.Dielectric layer 130 can be complete dielectric layer, and namely dielectric layer 130 is non-pattern dielectric layer, and so this is non-in order to limit the present invention.
After dielectric layer 130 forms, utilize the first photomask, patterned conductive layer 120 and dielectric layer 130, to form respectively many lines of induction 121 (being illustrated in Fig. 1 D) and a plurality of dielectric blocks 131 (being illustrated in Fig. 1 E), wherein the first photomask below is detailed description for half penetrates (Half-tone) photomask.
As shown in Figure 1B, with half penetrating light mask (not illustrating), form patterning photoresist layer 140.Wherein, patterning photoresist layer 140 is formed on the dielectric layer 130 and has a plurality of depressed parts 141.Say further, see through half penetrating light mask, make patterning photoresist layer 140 can form depressed part 141, depressed part 141 extends a distance from the lower surface 140b of the past patterning photoresist layer 140 of upper surface 140u1 of patterning photoresist layer 140, this distance is less than the thickness of patterning photoresist layer 140, and namely depressed part 141 does not run through whole patterning photoresist layer 140.From section, owing to the design of depressed part 141, make the upper surface of patterning photoresist layer 140 formation two differing heights, i.e. the groove bottom 140u2 of corresponding depressed part 141 in the upper surface 140u1 of patterning photoresist layer 140 and the patterning photoresist layer 140.
Half penetrating light mask comprises a plurality of transmission regions, light is behind more than half penetrating light masks, the corresponding different transmission regions of the light intensity that penetrates can be different, so that the part of patterning photoresist layer 140 shine by a light intensity, and another part of patterning photoresist layer 140 is shone by another different light intensity degree.See through this characteristic of half penetrating light mask, behind developing process, can form depressed part 141.
Shown in Fig. 1 C, as shade, pattern dielectric layer 130 (dielectric layer 130 is illustrated in Figure 1B) makes dielectric layer 130 form a plurality of dielectric blocks 131 with patterning photoresist layer 140.In the process of pattern dielectric layer 130, patterning photoresist layer 140 can be used as shade, is patterned the dielectric block 131 that photoresist layer 140 covers with reservation.The method of pattern dielectric layer 130 can be laser or etching (etching) method, for example is dry etching, and in the case, patterning photoresist layer 140 is as etching barrier layer (etch stop layer).Compared to the wet etching erosion, formed lateral surface 131s is more coarse by dry etching.
Because patterning photoresist layer 140 as shade, makes the top 131a of dielectric block 131 be not easy to be removed, its middle and upper part 131a is the part that is connected with patterning photoresist layer 140 in the dielectric block 131.In the case, the lateral surface 131s of dielectric block 131 can be connected with the lateral surface 140s of patterning photoresist layer 140, and connecting portion Ta is shown in Fig. 1 C.In the present embodiment, the lateral surface 131s of dielectric block 131 aligns in fact with the lateral surface 140s of patterning photoresist layer 140, for example is coplanar, and so this is non-in order to limit the present invention.
Because the top 131a of dielectric block 131 is not easy to be removed, and makes the upper surface 131u of dielectric block 131 have large tracts of land.For example, the area of the upper surface 131u of dielectric block 131 can equate in fact with the area of the lower surface 140b of patterning photoresist layer 140.
Shown in Fig. 1 D, take patterning photoresist layer 140 as shade, patterned conductive layer 120 makes conductive layer 120 form many lines of induction 121.In the process of patterning, patterning photoresist layer 140 can be used as shade, is patterned the line of induction 121 that photoresist layer 140 covers with reservation.The method of patterned conductive layer 120 can be lithographic method, for example is the wet etching erosion, and in the case, patterning photoresist layer 140 is as etching barrier layer.
In summary, the formation of dielectric block 131 and the line of induction 121 all forms by patterning photoresist layer 140.Specifically, present embodiment can not need to use in addition in the situation of photomask technique, forms dielectric block 131 and the line of induction 121 by same patterning photoresist layer 140.Thus, dielectric block 131 and the line of induction 121 align in fact, and namely dielectric block 131 and the line of induction 121 are not easy dislocation, so can promote the yield of contact panel.The photomask technique of present embodiment refers to technique or the lithography process (exposure/etching/development) that needs the photomask location.
Because patterning photoresist layer 140 as shade, makes the top 121a of the line of induction 121 be not easy to be removed, its middle and upper part 121a is the part that is connected with dielectric block 131 in the line of induction 121.In the case, the lateral surface 121s of the line of induction 121 can be connected with the lateral surface 131s of dielectric block 131, and connecting portion Tb is shown in Fig. 1 D.In the present embodiment, the lateral surface 121s of the line of induction 121 aligns in fact with the lateral surface 131s of dielectric block 131, for example is coplanar, and so this is non-in order to limit the present invention.
Owing to make the top 121a of the line of induction 121 be not easy to be removed, make the upper surface 121u of the line of induction 121 have large tracts of land.For example, the area of the upper surface 121u of the line of induction 121 can equate that in fact in the case, dielectric block 131 is in fact fully overlapping with the corresponding line of induction 121 with the area of the lower surface 131b of dielectric block 131.Among one embodiment, the area of the lower surface 131b of dielectric block 131 can be greater than the area of the top 121a of the line of induction 121, in the case, and the outstanding side that surpasses the correspondence of the line of induction 121, at least one side of dielectric block 131.
In the present embodiment, patterning photoresist layer 140 covers the upper surface 121u of the whole line of induction 121, and the upper surface 121u of the line of induction 121 is not exposed from patterning photoresist layer 140.Among another embodiment, in the process that forms patterning photoresist layer 140, optionally run through patterning photoresist layer 140, the line of induction 121 is exposed from patterning photoresist layer 140, for example, in the patterning process, the part 142 of corresponding depressed part 141 can be removed in the patterning photoresist layer 140, make depressed part 141 extend to the line of induction 121, so the line of induction 121 can expose from depressed part 141.
Shown in Fig. 1 E, remove the part 132 (being illustrated in Fig. 1 D) of corresponding depressed part 141a in the dielectric block 131, make each dielectric block 131 have a plurality of perforations 133, for example be two perforations 133.The line of induction 121 can expose from perforation 133.Compared to the design without depressed part 141, the design of the depressed part 141 of present embodiment can make the patterning photoresist layer 140 (part 142 of Fig. 1 D) that need remove less, so can form at short notice the perforation 133 of dielectric block 131.
Shown in Fig. 1 F, remove patterning photoresist layer 140 (being illustrated in Fig. 1 E), to expose dielectric block 131, for example be the upper surface 131u that exposes dielectric block 131.The method that removes patterning photoresist layer 140 for example is etching.
Among Fig. 1 F, the lateral surface 121s of the line of induction 121 is connected in the lateral surface 131s of corresponding dielectric block 131, and this is non-in order to limit the present invention.Among another embodiment (Fig. 5 F), the lateral surface 121s of the line of induction 121 can be connected in the medial surface 431ss of corresponding dielectric block 431, and this will be in follow-up detailed description.
Shown in Fig. 1 G, form transparency conducting layer 150 ' and cover dielectric block 131 and the line of induction 121.
Shown in Fig. 1 H, utilize a second photomask, patterned transparent conductive layer 150 ' forms a touch-control sensing structure 150.Wherein, the dielectric block 131 of touch-control sensing structure 150 cover parts and extend to the line of induction 120 via perforation 133.So far, finish contact panel 100.The contact panel 100 of present embodiment is explanation as an example of capacitance type touch-control panel example, and so this is non-in order to limit the present invention.
The line of induction 121, dielectric block 131 and touch-control sensing structure 150 consist of the inductive layer of present embodiment, and the coordinate of touch point can see through and calculate the signal acquisition that inductive layer is responded to.
In the present embodiment; touch-control sensing structure 150 covers a part and the lateral surface 121s of the line of induction 121 and another part that dielectric block 131 covers the upper surface 121u of the line of induction 121 of the upper surface 121u of the line of induction 121; make touch-control sensing structure 150, dielectric block 131 and substrate 110 coat the whole line of induction 121, use the complete preservation line of induction 121.
Because dielectric block 131 and the line of induction 121 align in fact (the lateral surface 131s of dielectric block 131 is connected with the lateral surface 121s of the line of induction 121), so the lateral surface 121s of the lateral surface 131s of dielectric block 131 and the line of induction 121 can not produce serious dislocation or even can not misplace in the junction.Thus, touch-control sensing structure 150 is along the violent turning point of the unlikely generation of part of lateral surface 131s and lateral surface 121s extension.
In sum, present embodiment can be finished contact panel 100 in the situation of two road photomask techniques (Figure 1B and Fig. 1 H).
Please be simultaneously with reference to Fig. 1 H and Fig. 2, Fig. 2 illustrates the top view of Fig. 1 H, and Fig. 1 H is along the cut-open view of direction 1H-1H ' among Fig. 2.Touch-control sensing structure 150 comprises at least one the first induction electrode 160 and at least one the second induction electrode 152, the first induction electrodes 160 along first direction D1 arrangement, and the second induction electrode 152 is arranged along second direction D2.
Express the line of induction 121 for clear, so the line of induction 121 (being represented by dotted lines) is illustrated in dielectric block 131, in fact dielectric block 131 can be fully overlapping with the line of induction 121; Perhaps, dielectric block 131 also can be greater than the line of induction 121, as shown in Figure 2.
As shown in Figure 2, each first induction electrode comprises a plurality of the first sensing units 151.The first sensing unit 151 and the line of induction 121 are formed at the upper surface 110u (substrate 110 and upper surface 110u are illustrated in Fig. 1 H) of substrate 110 and arrange along first direction D1.Adjacent 2 first sensing units 151 are electrically connected at the line of induction 121 via two perforations 133 of the dielectric block 131 of correspondence respectively.The first sensing unit 151 and the line of induction 121 consist of the first induction electrode 160, and touch point can see through corresponding the first induction electrode 160 acquisitions along the coordinate of first direction D1.
Each second induction electrode 152 comprises a plurality of the second sensing units 1521 and many lines of induction 1522.The second sensing unit 1521 and the line of induction 1522 are arranged along second direction D2.Second direction D2 is vertical in fact with first direction D1, and in the present embodiment, first direction D1 for example is X axis, and second direction D2 for example is Y-axis.The line of induction 1522 strides across corresponding dielectric block 131 and connects adjacent 2 second sensing units 1521.The second induction electrode 152 that the second sensing unit 1521 and the line of induction 1522 consist of, touch point can see through corresponding the second induction electrode 152 acquisitions along the coordinate of second direction D2.
In addition, the first sensing unit 151, a plurality of the second sensing unit 1521 and many lines of induction 1522 can be formed by identical material, for example are transparent indium-tin-oxide (Tin-doped Indium Oxide, ITO).
In addition, although the lateral surface 131s of the lateral surface 121s of the above-mentioned line of induction 121 and dielectric block 131 to flush in fact (shown in Fig. 1 D) as the example explanation, so this is non-in order to limit the present invention.The lateral surface of the line of induction also can not flush with the lateral surface of dielectric block, below with Fig. 3 and Fig. 4 explanation.
Please refer to Fig. 3, it illustrates according to the dielectric block of the contact panel of another embodiment of the present invention and the cut-open view of the line of induction.The lateral surface 221s of the line of induction 221 does not flush with the lateral surface 131s of dielectric block 131, and namely lateral surface 221s and lateral surface 131s are non-coplanar.The bottom 221a2 of the line of induction 221 inside contracts with respect to top 221a1 is past.In addition, the lateral surface 221s of the line of induction 221 is connected with the lateral surface 131s of dielectric block 131, and connecting portion Tc as shown in Figure 3.
Please refer to Fig. 4, it illustrates according to the dielectric block of further embodiment of this invention and the cut-open view of the line of induction.The lateral surface 321s of the line of induction 321 does not flush with the lateral surface 131s of dielectric block 131, and namely lateral surface 321s and lateral surface 131s are not coplanar.The bottom 321a2 of the line of induction 321 extends out with respect to top 321a1 is past.In addition, the lateral surface 321s of the line of induction 321 is connected with the lateral surface 131s of dielectric block 131, and connecting portion Td as shown in Figure 4.
Please refer to Fig. 5 A to Fig. 5 H, it illustrates the process drawing according to the contact panel of another embodiment of the present invention.
At first, shown in Fig. 5 A, form conductive layer 120 on substrate 110.
Shown in Fig. 5 B, form a dielectric layer 440 ' and cover conductive layer 120, in the present embodiment, this dielectric layer 440 ' is an organic photoresist layer 440 '.Photoresist layer 440 ' can be complete photoresist layer, and namely photoresist layer 440 ' is non-patterning photoresist layer, and so this is non-in order to limit the present invention.
After dielectric layer 440 ' forms, utilize the first photomask, patterned conductive layer 120 and dielectric layer 440 ' are to form respectively many lines of induction 121 (being illustrated in Fig. 5 D) and a plurality of dielectric blocks 431 (being illustrated in Fig. 5 F), and wherein the first photomask is half penetrating light mask.Below be to describe in detail.
Shown in Fig. 5 C, with half penetrating light mask, pattern dielectric layer 440 ' is to form patterning photoresist layer 440.Wherein, patterning photoresist layer 440 is formed at and has a plurality of depressed parts 441 on the conductive layer 120.The structural similarity of depressed part 441 holds this and repeats no more in depressed part 141.In addition, the patterning photoresist layer 440 of present embodiment for example is organic film.
In addition, patterning photoresist layer 440 comprises a plurality of photoresistance pieces 443.Each photoresistance piece 443 has two depressed parts 441.
Shown in Fig. 5 D, take patterning photoresist layer 440 as shade, patterned conductive layer 120 makes conductive layer 120 form many lines of induction 121.The method of patterned conductive layer 120 can be lithographic method, for example is the wet etching erosion, and in the case, patterning photoresist layer 440 is as etching barrier layer.
The outstanding lateral surface 121s that surpasses the line of induction 121 of the lateral surface 443s of patterning photoresist layer 440.Say that further photoresistance piece 443 can cover the whole upper surface 121u of the line of induction 121, and the edge part 4431 outstanding lateral surface 121s that surpass the line of induction 121 of photoresistance piece 443.
Shown in Fig. 5 E, heating pattern photoresist layer 440, wherein patterning photoresist layer 440 coats the line of induction 121.The edge part 4431 of patterning photoresist layer 440 is flowable state and extends to the lateral surface 121s of the line of induction 121 and form edge part 4431 after heating.Thus, patterning photoresist layer 440 coats the whole line of induction 121.In addition, edge part 4431 may extend to substrate 110 and contacts.
Because the outstanding lateral surface 121s that surpasses the line of induction 121 of the lateral surface 443s of patterning photoresist layer 440, make patterning photoresist layer 440 after heating, be subject to action of gravitation and naturally cover the lateral surface 121s of the line of induction 121 toward downward-extension.
Shown in Fig. 5 F, remove the part 442 (part 442 is illustrated in Fig. 5 E) of corresponding depressed part 441 in the patterning photoresist layer 440, make patterning photoresist layer 440 form a plurality of dielectric blocks 431, each dielectric block 431 has a plurality of perforations 433 of corresponding described depressed part 441, and perforation 433 numbers of each dielectric block 431 for example are two.The perforation 433 of dielectric block 431 forms after the part 442 of patterning photoresist layer 440 is removed, and after perforation 433 formed, the line of induction 121 exposed from perforation 433.
Because edge part 4431 extends to substrate 110, so that after perforation 433 forms, the disengaging of can not dropping of the edge part 4431 of dielectric block 431.Say further, the edge part 4431 of patterning photoresist layer 440 is a undermined edge edge (not extending to substrate 110) among Fig. 5 D, if the patterning photoresist layer 440 of Fig. 5 D is without heating process, then in the step that forms perforation 433, edge part 4431 just can drop and break away from, and so just can't form perforation 433.In addition, in the present embodiment, the medial surface 431ss of dielectric block 431 is connected with the lateral surface 121s of the line of induction 121, and specifically, the medial surface 431ss of dielectric block 431 and the lateral surface 121s of the line of induction 121 fit in fact.
Shown in Fig. 5 G, form transparency conducting layer 150 ' and cover dielectric block 431 and the line of induction 121.
Shown in Fig. 5 H, utilize the second photomask to form touch-control sensing structure 150, wherein touch-control sensing structure 150 covers dielectric block 431 and extends to the line of induction 121 via perforation 433.So far, finish contact panel 400.
In the present embodiment, because the lateral surface 431s of dielectric block 431 is smooth or uniform outer surface, so touch-control sensing structure 150 is along the part of the lateral surface 431s extension of dielectric block 431, the turning point that its unlikely generation is violent.
In the present embodiment; a part and dielectric block 431 that touch-control sensing structure 150 covers the upper surface 121u of the line of induction 121 cover the lateral surface 121s of the line of induction 121 and another part of upper surface 121u; make touch-control sensing structure 150, dielectric block 431 and substrate 110 coat the whole line of induction 121, use the complete preservation line of induction 121.
Fig. 6 illustrates the cut-open view according to the touch control display apparatus of one embodiment of the invention.The contact panel 100 and 400 of above-described embodiment can be applicable in the demonstration field.The explanation as an example of contact panel 100 example, touch control display apparatus 500 comprises display unit 510 and contact panel 100.Display unit 510 provides display frame.Contact panel 100 contiguous display unit 510 configurations are in order to provide the touch-control sensing function.Display unit 510 in the present embodiment can be liquid crystal indicator or organic light emitting diode display device etc., and is neither as limit.
The disclosed contact panel of the above embodiment of the present invention and use its touch control display apparatus and its manufacture method has multinomial feature, below enumerates wherein several:
(1). contact panel can be finished with two road photomask techniques, process time and cost can be saved.
(2). compared to the design without depressed part, the design of the depressed part of the embodiment of the invention is so that removing the perforation that can form dielectric block in the situation of less dielectric layer material.
(3). because the lateral surface of dielectric block is connected with the lateral surface of the line of induction, so the lateral surface of the lateral surface of dielectric block and the line of induction can not produce serious dislocation or even can not misplace in the junction.Thus, touch-control sensing structure is along the violent turning point of the unlikely generation of part of lateral surface and lateral surface extension.
In sum, although the present invention discloses as above with embodiment, so it is not to limit the present invention.
The technical staff in the technical field of the invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is worked as with being as the criterion that claim was defined.
Claims (12)
1. the manufacture method of a contact panel is characterized in that, described manufacture method comprises:
Form a conductive layer on a substrate;
Form a dielectric layer and cover described conductive layer;
Utilize a first photomask, the described conductive layer of patterning and described dielectric layer, to form respectively many lines of induction and a plurality of dielectric block, wherein said first photomask is half penetrating light mask;
Form a transparency conducting layer and cover described dielectric layer and described conductive layer; And
Utilize a second photomask, the described transparency conducting layer of patterning is to form a touch-control sensing structure.
2. manufacture method as claimed in claim 1 is characterized in that, in utilizing described first photomask, comprises in the described step of the described conductive layer of patterning and described dielectric layer:
With described half penetrating light mask, form a patterning photoresist layer, wherein said patterning photoresist layer is formed on the described dielectric layer and has a plurality of depressed parts;
Take described patterning photoresist layer as shade, the described dielectric layer of patterning makes described dielectric layer form described dielectric block;
Take described patterning photoresist layer as shade, the described conductive layer of patterning makes described conductive layer form the described line of induction;
Remove the part of corresponding described depressed part in the described dielectric block, make each described dielectric block have a plurality of perforations; And
Remove described patterning photoresist layer, to expose described dielectric block, wherein said touch-control sensing structure covers described dielectric block and extends to the described line of induction via described perforation.
3. manufacture method as claimed in claim 2 is characterized in that, more comprises in the described step of the described conductive layer of patterning:
Remove the part of corresponding described depressed part in the described patterning photoresist layer.
4. manufacture method as claimed in claim 2 is characterized in that, in the described step of the described conductive layer of patterning, described depressed part does not run through described patterning photoresist layer; Described manufacture method more comprises:
Remove the part of corresponding described depressed part in the described patterning photoresist layer, make described depressed part run through described patterning photoresist layer.
5. manufacture method as claimed in claim 1 is characterized in that, described dielectric layer is an organic photoresist layer, and in utilizing described first photomask, comprises in the described step of the described conductive layer of patterning and described dielectric layer:
With described half penetrating light mask, the described dielectric layer of patterning, to form a patterning photoresist layer, wherein, described patterning photoresist layer forms on the described conductive layer and has a plurality of depressed parts;
Take described patterning photoresist layer as shade, the described conductive layer of patterning makes described conductive layer form the described line of induction;
Heat described patterning photoresist layer, so that described patterning photoresist layer coats the described line of induction; And
Remove the part of the described depressed part of middle correspondence of described patterning photoresist layer, make described patterning photoresist layer form the described dielectric block with a plurality of perforations, wherein said touch-control sensing structure covers described dielectric block and extends to the described line of induction via described perforation.
6. manufacture method as claimed in claim 5 is characterized in that, described patterning photoresist layer is organic film.
7. manufacture method as claimed in claim 5 is characterized in that, in the described step of the described conductive layer of patterning, and the outstanding lateral surface that surpasses each described line of induction of a lateral surface of described patterning photoresist layer.
8. manufacture method as claimed in claim 5, it is characterized in that, in the described step of the described conductive layer of patterning, described patterning photoresist layer comprises a plurality of photoresistance pieces, each described photoresistance piece comprises an edge part, the outstanding lateral surface that surpasses the corresponding described line of induction of the described edge part of each described photoresistance piece; In the described step of the described patterning photoresist layer of heating, the described edge part of each described photoresistance piece extends to the described lateral surface of the corresponding described line of induction.
9. a contact panel is characterized in that, described contact panel comprises:
One substrate;
Many the lines of induction are formed on the described substrate;
A plurality of dielectric blocks are formed on the described line of induction and have a plurality of perforations, and the described line of induction exposes from described perforation; And
One touch-control sensing structure covers described dielectric block and extends to the described line of induction via described perforation;
Wherein, the lateral surface of each described line of induction is connected in a lateral surface or a medial surface of corresponding described dielectric block, and the described line of induction and described dielectric block are by forming with half penetrating light mask fabrication.
10. contact panel as claimed in claim 9 is characterized in that, the described lateral surface of each described line of induction flushes in fact with the described lateral surface of corresponding described dielectric block.
11. contact panel as claimed in claim 9 is characterized in that, the described lateral surface of each described line of induction is fitted in fact with the described medial surface of corresponding described dielectric block.
12. a touch control display apparatus is characterized in that, described touch control display apparatus comprises:
One display unit provides display frame; And
One as contact panel claimed in claim 9, and contiguous described display unit configuration is in order to provide the touch-control sensing function.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090167975A1 (en) * | 2007-12-28 | 2009-07-02 | Au Optronics Corp. | Liquid Crystal Display Unit Structure and Manufacturing Method Thereof |
| US20100053115A1 (en) * | 2008-08-26 | 2010-03-04 | Kang-Woo Kim | Touch screen display |
-
2011
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090167975A1 (en) * | 2007-12-28 | 2009-07-02 | Au Optronics Corp. | Liquid Crystal Display Unit Structure and Manufacturing Method Thereof |
| US20100053115A1 (en) * | 2008-08-26 | 2010-03-04 | Kang-Woo Kim | Touch screen display |
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Address after: 518109 Longhua, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 4, building 1, building Applicant after: Qunkang Technology (Shenzhen) Co., Ltd. Applicant after: Innolux Display Group Address before: 518109 Longhua, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 4, building 1, building Applicant before: Qunkang Technology (Shenzhen) Co., Ltd. Applicant before: Chimei Optoelectronics Co., Ltd. |
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