CN102912291A - Method for forming patterns on metal surface by vacuum coating - Google Patents

Method for forming patterns on metal surface by vacuum coating Download PDF

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Publication number
CN102912291A
CN102912291A CN2012104244472A CN201210424447A CN102912291A CN 102912291 A CN102912291 A CN 102912291A CN 2012104244472 A CN2012104244472 A CN 2012104244472A CN 201210424447 A CN201210424447 A CN 201210424447A CN 102912291 A CN102912291 A CN 102912291A
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China
Prior art keywords
workpiece
line
metal works
plating
vacuum
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Pending
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CN2012104244472A
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Chinese (zh)
Inventor
刘伍健
林铭祥
高启斌
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QIXIANG TECHNOLOGY CO LTD
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QIXIANG TECHNOLOGY CO LTD
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Priority to CN2012104244472A priority Critical patent/CN102912291A/en
Publication of CN102912291A publication Critical patent/CN102912291A/en
Pending legal-status Critical Current

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Abstract

A method for forming patterns on the surface of a metal workpiece by vacuum coating is characterized by comprising the steps of: forming a pattern shielding layer on the surface of a glue film; cleaning the metal workpiece and drying for later use; covering the glue film on the surface of the metal workpiece, so that the pattern shielding layer is in contact with the surface of the metal workpiece; baking the metal workpiece, so that the adhesion between the pattern shielding layer and the surface of the metal workpiece is good; removing the glue film; cleaning and drying the metal workpiece again; carrying out physical vacuum evaporation on the surface of the metal workpiece to complete coating; removing the pattern shielding layer to form the patterns on the surface of the metal workpiece; and cleaning and drying the metal workpiece. The method for forming the patterns on the surface of the metal workpiece by vacuum coating provided by the invention has simple working procedures and high efficiency, and can form exquisite and complicated patterns.

Description

A kind of method that forms the figure line in metallic surface vacuum plating
Technical field:
The present invention relates to a kind of method of vacuum plating formation figure line, especially a kind of method that forms the figure line in metallic surface vacuum plating.
Background technology:
Existing coating processing method, it need provide a metal cover with pierced pattern; Fitted in the surface of this metal cover and metal works again; And then by manually directly shielding the pierced pattern place that printing ink is coated metal cover; After shielding the printing ink oven dry, remove again metal cover; And then carry out physical vapor deposition; After finishing plated film, with removal of solvents shielding printing ink, can form required pattern at surface of workpiece again.But there is following defective in the method: 1, complex procedures, and it is consuming time manually to smear shielding printing ink, and efficient is low.2, the common metal shade can only be made straight line and the larger area geometric scheme of tubbiness, and meticulous lines and composition then are difficult to reach.3, need provide metal cover, with high costs.4, the shielding ink thickness of manually smearing is thicker, produces easily printing ink inside during oven dry and does not parch, and produces printing ink volatilization phenomenon when causing vacuum plating, and it is bad to cause printing ink peripheral region plated film covering, and affects pattern quality.When 5, removing metal cover, the edge of the printing ink of drying is peeled off simultaneously, be difficult for repairing, can cause jagged lines, affect the attractive in appearance of pattern.6, same metal cover is after manually smearing shielding printing ink, and there is obvious difference in the pattern that finally is formed between each metal works.7, directly coating shielding printing ink method is only applicable to the flush type metal works, for the metal works with curved surface, can't directly be coated with.
Summary of the invention:
The object of the present invention is to provide a kind of method at surface of workpiece vacuum plating formation figure line, its operation is simple and efficient is high, can form fineness, complicated figure line.
A kind of method at surface of workpiece vacuum plating formation figure line is characterized in that comprising the steps: forming the pattern screen layer on glued membrane surface;
Clean metal workpiece and dry for standby; Glued membrane is covered in surface of workpiece, the pattern screen layer is contacted with surface of workpiece; The baking metal works adheres to well pattern screen layer and surface of workpiece; Remove glued membrane; Again clean and dry metal works; The physical vacuum evaporation is carried out on the surface of metal works finish plated film; Remove the pattern screen layer, namely form the figure line at surface of workpiece; Clean and the oven dry metal works.
The present invention's the method at surface of workpiece vacuum plating formation figure line has following beneficial effect:
1, compare with existing method, need not to provide metal cover, need not manually to smear shielding printing ink, operation is simple and efficient is high.2, compare with being formed at the tubbiness straight line or the simple geometry pattern that have now on the metal cover, on the present invention's glued membrane surface, can form the pattern screen layer of fineness, complexity, thereby can form fineness, complicated figure line at surface of workpiece.3, need not to provide metal cover, can greatly save cost.4, prosthetic is smeared the step of shielding printing ink and removal metal cover, and the situation that affects figure line quality that can avoid fully occurring existing in the existing method occurs, and further improves figure line quality.5, the present invention's glued membrane is compared with metal cover, can fit with the surface of workpiece of different structure, not only is applicable to the flush type metal works, but also is applicable to the metal works with curved-surface structure, and is applied widely.
As a kind of improvement of such scheme, order repeats above steps, the figure line that the multicoating of being finished by above-mentioned each plated film step in surface of workpiece formation constitutes, and described each layer plated film color is different.
As the further improvement of such scheme, before carrying out above steps, described surface of workpiece can be in advance forms the background color layer by the physical vacuum evaporation, and this background color layer and the described coatings color of finishing through the physical vacuum evaporation are different.
Again step as such scheme improves, and described physical vacuum evaporation comprises the compound arbitrarily of one of vacuum arc plating, magnetron sputtering, hollow cathode plating, electron beam plating, hot evaporation or aforesaid method.
Again step as such scheme improves, and described metal works is the workpiece that titanium alloy workpiece, stainless steel work-piece, Al alloy parts or surface electrical are coated with nickel or chromium.
Again step as such scheme improves, the coatings that forms in the described plated film step, its material is any in oxide compound, nitride or the carbide of titanium, chromium, aluminium, zirconium, above-mentioned four kinds of metals, perhaps its material be in titanium alloy, Chrome metal powder, aluminium alloy or the zirconium alloy any.
Again step as such scheme improves, and the figure line of described formation is made of any lines or dot matrix, and its minimum feature is 0.5cm, and minimum parallel line is apart from being 0.5cm, and the smallest point diameter is 0.5cm, and the smallest point distance is 0.5cm.
Description of drawings:
Fig. 1 is the local structure sectional view of the present invention's glued membrane.
Fig. 2 is the local structure sectional view of the present invention's metal works.
Fig. 3 is the local structure sectional view after the present invention's glued membrane is affixed on metal works.
Fig. 4 is the local structure sectional view of metal works after removing glued membrane of Fig. 3.
Fig. 5 is that the metal works of Fig. 4 is at the local structure sectional view that carries out after the physical vacuum evaporation is finished the plated film step.
Fig. 6 be the metal works of Fig. 5 after removing the pattern screen layer, the local structure sectional view of formation figure line.
Fig. 7 be the metal works of another embodiment of the present invention after removing the pattern screen layer, the local structure sectional view of formation figure line.
Fig. 8 be the metal works of further embodiment of this invention after removing the pattern screen layer, the local structure sectional view of formation figure line.
Fig. 9 be the metal works of yet another embodiment of the invention after removing the pattern screen layer, the local structure sectional view of formation figure line.
Embodiment:
Embodiment one, and a kind of method at surface of workpiece vacuum plating formation figure line comprises the steps:
1, form pattern screen layer 11 on a glued membrane 1 surface, glued membrane 1 is existing common flexible film layer, and it can fit with the surface of workpiece of different structure, as shown in Figure 1.In the present embodiment, the described method that forms the pattern screen layer on the glued membrane surface is prior art, repeats no more herein.
2, clean metal workpiece 2 and dry for standby, described metal works 2 is the workpiece that titanium alloy workpiece, stainless steel work-piece, Al alloy parts or surface electrical are coated with nickel or chromium, in the present embodiment, the surface of metal works 2 is the plane, as shown in Figure 2.
3, glued membrane 1 is affixed on metal works 2 surfaces, as shown in Figure 3.
4, baking metal works 2 makes the pattern screen layer 11 on the glued membrane 1 well invest metal works 2 surfaces.
5, remove glued membrane 1, pattern screen layer 11 breaks away from glued membrane 1 and is attached to metal works 2 surfaces fully, as shown in Figure 4.In the present embodiment, metal works can be soaked in the appropriate solvent, to remove glued membrane.
6, again clean and dry metal works 2.
7, the physical vacuum evaporation is carried out on the surface of metal works 2 and finish plated film, form coatings 21, as shown in Figure 5.The coatings 21 that forms in the described plated film step, its material are any in oxide compound, nitride or the carbide of titanium, chromium, aluminium, zirconium, above-mentioned four kinds of metals, perhaps its material be in titanium alloy, Chrome metal powder, aluminium alloy or the zirconium alloy any.Described physical vacuum evaporation comprises the compound arbitrarily of vacuum arc plating, magnetron sputtering, hollow cathode plating, electron beam plating, hot evaporation or aforesaid method.
8, remove pattern screen layer 11, namely form described figure line on metal works 2 surfaces, as shown in Figure 6.In the present embodiment, can select organic solvent commonly used in the prior art, to remove pattern screen layer 11.The figure line of described formation is made of any lines or dot matrix, and its minimum feature is 0.5cm, and minimum parallel line is apart from being 0.5cm, and the smallest point diameter is 0.5cm, and the smallest point distance is 0.5cm.
9, clean and dry metal works 2.
Embodiment two, be that with embodiment one difference order repeats the above steps of embodiment one, the figure line that the multicoating layer 21,22 of being finished by above-mentioned each plated film step in surface of workpiece formation constitutes, described each layer plated film 21,22 colors are different, as shown in Figure 7.
Embodiment three, be that with embodiment two differences before carrying out above steps, described metal works 2 surfaces can form background color layer 20 by the physical vacuum evaporation in advance, this background color layer 20 is different with described coatings 21,22 colors of finishing through the physical vacuum evaporation, as shown in Figure 8.
Embodiment four: be that with embodiment three differences the surface of the metal works 2 in the present embodiment is curved surface, as shown in Figure 9.
The above is preferred embodiment of the present invention only, is not to limit scope of the invention process, and all equal variation and modifications of doing according to claim of the present invention all fall into the scope that patent of the present invention contains.

Claims (7)

1. the method at surface of workpiece vacuum plating formation figure line is characterized in that comprising the steps:
Form the pattern screen layer on glued membrane surface;
Clean metal workpiece and dry for standby;
Glued membrane is covered in surface of workpiece, the pattern screen layer is contacted with surface of workpiece;
The baking metal works adheres to well pattern screen layer and surface of workpiece;
Remove glued membrane;
Again clean and dry metal works;
The physical vacuum evaporation is carried out on the surface of metal works finish plated film;
Remove the pattern screen layer, namely form the figure line at surface of workpiece;
Clean and the oven dry metal works.
2. a kind of method that forms the figure line in metallic surface vacuum plating according to claim 1, it is characterized in that: order repeats above steps, the figure line that the multicoating of being finished by above-mentioned each plated film step in surface of workpiece formation constitutes, described each layer plated film color is different.
3. a kind of method that forms the figure line in metallic surface vacuum plating according to claim 1 and 2, it is characterized in that: before carrying out above steps, described surface of workpiece can be in advance forms the background color layer by the physical vacuum evaporation, and this background color layer and the described coatings color of finishing through the physical vacuum evaporation are different.
4. according to claim 1 and 2ly a kind ofly form the method for figure line in metallic surface vacuum plating, it is characterized in that: described physical vacuum evaporation comprises the compound arbitrarily of one of vacuum arc plating, magnetron sputtering, hollow cathode plating, electron beam plating, hot evaporation or aforesaid method.
5. according to claim 1 and 2ly a kind ofly form the method for figure line in metallic surface vacuum plating, it is characterized in that: described metal works is the workpiece that titanium alloy workpiece, stainless steel work-piece, Al alloy parts or surface electrical are coated with nickel or chromium.
6. a kind of method that forms the figure line in metallic surface vacuum plating according to claim 1 and 2, it is characterized in that: the coatings that forms in the described plated film step, its material is any in oxide compound, nitride or the carbide of titanium, chromium, aluminium, four kinds of metals of zirconium, perhaps its material be in titanium alloy, Chrome metal powder, aluminium alloy or the zirconium alloy any.
7. a kind of method that forms the figure line in metallic surface vacuum plating according to claim 1 and 2, it is characterized in that: the figure line of described formation is made of any lines or dot matrix, its minimum feature is 0.5cm, minimum parallel line distance is 0.5cm, the smallest point diameter is 0.5cm, and the smallest point distance is 0.5cm.
CN2012104244472A 2012-10-30 2012-10-30 Method for forming patterns on metal surface by vacuum coating Pending CN102912291A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107201493A (en) * 2017-05-26 2017-09-26 宝鸡文理学院 A kind of titanium or titanium alloy method for shaping
CN107738537A (en) * 2016-03-30 2018-02-27 广东欧珀移动通信有限公司 Stainless steel materials and preparation method and electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1460598A (en) * 2003-05-16 2003-12-10 澄海市东田转印有限公司 Thermal transfer printing method
CN102181824A (en) * 2011-01-27 2011-09-14 广东银雨芯片半导体有限公司 Process and structure of patterned substrate and light emitting diode chip
CN102560335A (en) * 2010-12-15 2012-07-11 鸿富锦精密工业(深圳)有限公司 Manufacturing method of housing and housing manufactured thereby

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1460598A (en) * 2003-05-16 2003-12-10 澄海市东田转印有限公司 Thermal transfer printing method
CN102560335A (en) * 2010-12-15 2012-07-11 鸿富锦精密工业(深圳)有限公司 Manufacturing method of housing and housing manufactured thereby
CN102181824A (en) * 2011-01-27 2011-09-14 广东银雨芯片半导体有限公司 Process and structure of patterned substrate and light emitting diode chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107738537A (en) * 2016-03-30 2018-02-27 广东欧珀移动通信有限公司 Stainless steel materials and preparation method and electronic equipment
CN107738537B (en) * 2016-03-30 2020-06-05 Oppo广东移动通信有限公司 Stainless steel plate, preparation method and electronic equipment
CN107201493A (en) * 2017-05-26 2017-09-26 宝鸡文理学院 A kind of titanium or titanium alloy method for shaping

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Application publication date: 20130206