CN102890738A - Method for encapsulating vulnerable elements determined in printed board component under effect of dynamic load - Google Patents

Method for encapsulating vulnerable elements determined in printed board component under effect of dynamic load Download PDF

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CN102890738A
CN102890738A CN201210374739XA CN201210374739A CN102890738A CN 102890738 A CN102890738 A CN 102890738A CN 201210374739X A CN201210374739X A CN 201210374739XA CN 201210374739 A CN201210374739 A CN 201210374739A CN 102890738 A CN102890738 A CN 102890738A
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element
elements
vulnerable
printed board
determining
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CN201210374739XA
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任建峰
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中国电子科技集团公司第十研究所
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Abstract

The invention discloses a method for encapsulating vulnerable elements determined in a printed board component under the effect of dynamic load. The invention aims at providing a method capable of reducing omissions, getting rid of experience dependences effectively, considering the vulnerability of the elements at different positions, sequencing the vulnerability of a plurality of elements and determining the vulnerable elements accurately. The method can be realized by the steps as follows: roughly determining a range of the vulnerable elements in the printed board component by thresholds of feature sizes of the elements, checking the times of each element penetrated by a pitch line of the printed board component in a dominant mode in the determined range, and calculating a vulnerability index P of each element by utilizing the data, wherein the element with the maximum P value is a vibration vulnerable element in the printed board component; then, defining the feature size L of the element as one largest value in three outline dimensions of length, width and height, specifying the threshold of the feature size L as 10mm and taking the L as a foundation for determining the rough range of the vulnerable elements, wherein the L is more than or equal to 10mm; and finally, calculating the P value based on the times of the elements penetrated by the pitch line in the dominant mode.

Description

确定动态载荷作用下印制板组件中易损元件的封装方法 The method of determining the printed board packaging assembly under dynamic load elements Vulnerability

技术领域 FIELD

[0001] 本发明涉及一种确定动载下印制板组件中易损元件的封装方法,尤其是振动载荷作用下印制板组件中易损元件的封装方法。 [0001] The present invention relates to a method for determining the consumables packaging element PCB assembly under dynamic loading, especially printed board assembly packaging method in vibration load vulnerable elements.

背景技术 Background technique

[0002] 电子产品已经广泛服务于航空、航天、航海以及交通、通讯、导航、工业电子、机器人技术等人们生活的方方面面。 [0002] Electronic products have been widely used in all aspects of aviation, aerospace, marine and transportation, communications, navigation, industrial electronics, robotics and other people's lives. 这些电子产品可能会承受多种不同形式的宽频带、多加速度水平的振动载荷作用。 These electronics may be subjected to many different forms of broadband, multi-load vibration acceleration level. 例如,手机、导航仪、PDA等手持式日常消费电子产品可能从使用者手中滑落。 For example, mobile phones, navigation systems, PDA and other handheld consumer electronic products daily may slip from the hands of the user. 当这些手持设备跌落或发生碰撞时,它们内部的印制板组件就开始振动,由于集成电路(IC)元件并不像印制板那样“柔软”,最终将导致焊点的失效。 When these handheld devices fall or collision, their internal components on the printed board starts to vibrate due to an integrated circuit (IC) element is not as PCB as "soft", will eventually lead to failure of the solder joint. 又如,航空、航天电子设备在使用过程中必定要受到来自载体发动机、外围空气等激励源所导致的正弦振动、随机振动和瞬态冲击振动的作用。 As another example, aerospace electronic device during use must be subjected to a sinusoidal vibration excitation source vector engine, air or the like from the periphery caused by random vibration and shock vibration transient effects. 在上述这些多种形式和加速度水平的振动作用下,电子设备内部的印制板组件将产生柔性变形,并可能导致电子设备多种形式的失效,甚至破坏。 In these various forms of action of the level of acceleration and vibration, the internal components of the electronic device will produce a flexible printed board deform, and may result in failure of the electronic apparatus in various forms, even destruction. 可见,振动是导致电子设备失效的一个重要因素。 Visible, vibration is an important factor leading to the failure of electronic equipment. 尤其是在电子设备不断地向小型化和多样化发展的今天,印制板组件的结构更加细小,布线密度越来越大,层数越来越多,振动因素对它们的影响已变得更加突出。 Especially in the electronic device to constantly miniaturization and diversification of today, the structure of printed board assemblies of more small, wiring density increases, more and more layers, the effect of vibration on the factors they have become more protruding.

[0003] 在电子产品设计过程中对其印制板组件进行疲劳耐久性分析是提高电子产品可靠性、降低失效率的有效方法。 [0003] Analysis of Fatigue durability printed board assembly in its electronic product design process is to improve the reliability of electronic products, an effective method of reducing the failure rate. 但是印制板组件上装配有数量众多、大小各异的IC元件,显然如果不加选择地对每个IC元件的振动疲劳耐久性进行分析是极不经济的。 However, the PCB is equipped with a large number of components, IC components of various sizes, obviously if indiscriminately vibration fatigue resistance of each IC element analysis is extremely uneconomical. 为了提高分析的效率,必须从印制板组件上众多元件中K选出对振动载荷敏感、容易出现损坏的元件来分析其振动疲劳耐久性。 In order to improve analysis efficiency, K is selected to be sensitive to vibration loads on a printed board assembly from a number of elements, a damaged element prone to analyze the vibration fatigue durability. 当前,确定这些易损元件的途径主要有两个:一个是,DS Steinberg在上世纪80年代提出的以边长大于25. 4mm (I英寸)作为确定印制板组件中振动易损元件的标准的方法;另一个是,根据已有的类似产品的经验,利用类比的方法确定新的印制板组件中的振动易损元件。 Currently, the way these vulnerable components are determined mainly two: one is, DS Steinberg in the 1980s proposed to length was longer than 25. 4mm (I inch) as a criterion for PCB assembly vibration vulnerable components of method; the other is based on the experience of existing similar products, using the analogy of the method to determine the new printed circuit board assembly vulnerable vibrating element. 利用DS Steinberg的方法确定印制板组件中振动易损兀件,在《Vibration Analysis for Electronic Equipment)) 一书中指出当兀件的尺寸小于25. 4mm (I英寸)时很少会因为振动作用而损坏;当元件的尺寸大于25. 4mm时振动开始引起元件的损坏,但还要依据振动量级和印制板的类型;当元件的尺寸大于50. 8mm(2英寸)时,振动导致的元件损坏将很严重。 DS Steinberg determined using the method of vibrating the printed board assembly Wu wearing parts, in "Vibration Analysis for Electronic Equipment)) when the size of a book that is less than the Wu member when the vibrating action will rarely 25. 4mm (I inch) as damage; when the size is larger than the element 25. 4mm vibration element starts cause damage, but also depending on the type and magnitude of vibration of the printed circuit board; when the size is larger than the element 50. 8mm (2 inches), due to vibration very serious damage to the element. 可见,DS Steinberg将元件尺寸25. 4mm作为易损元件的阀值。 Visible, DS Steinberg 25. 4mm as the element size threshold vulnerable element. 该方法虽然提供了一个确定印制板组件中易损元件的途径,但是该方法具有以下3个缺陷: Although this method provides a printed circuit board assembly is determined route vulnerable elements, but this method has the following three drawbacks:

[0004] (I)遗漏了高度尺寸和重量较大的元件。 [0004] (I) and the weight of the missing height dimension larger element.

[0005] 该方法以元件尺寸25. 4mm为判断易损元件的阀值,但是诸如变压器等元件的尺寸一般为15_左右明显小于这个阀值。 [0005] In the method of the element size is 25. 4mm vulnerable determination threshold element, but other elements such as the size of the transformer is generally about 15_ significantly less than this threshold. 利用该方法这类元件将不会被划为易损元件,但是大量的工程实践表明由于变压器类元件的质量较大,如不采取加固措施,它很容易由于振动而产生损坏。 The method using such elements will not be classified as vulnerable components, but a large number of engineering practice shows that due to the large mass element transformers, such as reinforcement measures are not taken, it is easily damaged due to vibration. 例如图3所示的实际应用中印制板组件上在动载作用下发生损坏的元件,该元件的外形尺寸为15_X6_X4mm,显然现有方法将把图示元件排除在易损元件之外。 For example, component damage occurs under dynamic loading on the PCB assembly shown in Figure 3 the practical application, the dimensions of the element is 15_X6_X4mm, clearly illustrating the conventional method would exclude elements vulnerable components. [0006] (2)忽略了印制板形状、固定方式对元件易损性的影响。 [0006] (2) Ignore the printed board shape, in a fixed manner on the impact element vulnerability.

[0007] 振动载荷作用下,不同的印制板形状和固定方式会使印制板组件具有不同的刚度,显然安装在不同刚度的印制板上的同一元件对振动载荷的耐受能力也是不同的。 [0007] The vibration loads, different shapes and fixedly PCB printed board assemblies will have different stiffness, obviously the same element is mounted on a printed board of different stiffness tolerance to vibration load is different of. 该方法仅以尺寸来确定易损元件,显然是不全面的。 This method determines only the size of the vulnerable components, apparently incomplete.

[0008] (3)忽略了元件在印制板上的位置对元件易损性的影响。 [0008] (3) ignores the effect of the position of the element on the vulnerability of PCB elements.

[0009] 由于印制板局部刚度不同,同一元件安装在同一印制板不同的位置时其振动敏感性也是有所不同的。 [0009] Due to the different local stiffness of the PCB, the same element is mounted on the same printed board of different positions which are different in sensitivity to vibration. 如果仅用元件的尺寸来判断其在振动载荷作用下的易损性,显然也是片面的。 If only the size of the elements to determine their vulnerability vibration under load, it is apparently one-sided.

[0010] 利用经验类比法确定印制板组件中振动易损元件,实际是将新产品与老产品作比较,寻找其共同点,来确定新产品中的易损元件。 [0010] The printed circuit board assembly is determined by using the vibrating element wearing experience analogy, actually new products and old products compared to find common points, to identify new products vulnerable components. 该方法不足之处在于: The shortcomings of this method is that:

[0011] (I)极大地依赖个人经验积累,无法对全新的元件做出判断。 [0011] (I) is highly dependent personal experience, can not make a judgment on the new element.

[0012] 一般情况下,主要依赖经验来判断印制板组件中元件振动易损性的方法,会确定几个可能因振动而损坏的元件,这样会大幅增加后续分析计算的工作量。 [0012] In general, methods rely mainly on experience to judge the printed board assembly element vibrates vulnerability, determines the number of elements may be damaged due to vibration, so a large increase in calculation workload subsequent analysis. 此外,如果使用全新的元件,则无法判断其振动易损性。 Moreover, if the new element, the vibration can not be determined vulnerability.

[0013] (2)经验大都靠个人积累,难以有效地传承。 [0013] (2) most of the experience accumulated by individuals, it is difficult heritage effectively.

[0014] 该方法依赖的经验大都由个人在工作中积累,个体差别大,难以作为稳定的技术传承,极易随着人才流动而流失。 [0014] The method relies on the experience accumulated by individuals in most of the work, large individual differences, it is difficult heritage as a stable technology, talent flow as easily be lost.

[0015] 现有方法没有明确地评价标准,只能大致确定印制板组件中可能的几个甚至更多的易损元件,也不能对这些元件的易损性进行排序。 [0015] The conventional method does not explicitly evaluation standard, determined substantially only possible in several printed board assemblies even more vulnerable components, can not sort the vulnerability of these elements.

[0016] 当元件位于印制板上不同的位置时,它是否被模态节线穿过以及被穿过的次数都是不同的。 [0016] When the elements are located in different positions on the PCB, whether it is through the wire section and the number of modes to be passed through is different. 模态节线是结构模态中与平衡位置相比位移为零的点构成的线,在模态节线附近印制板的曲率会发生急剧的变化。 Section lines are lines modal Modal equilibrium position as compared with the point of zero displacement configuration, the curvature of the printed circuit board near the abrupt change will occur at the section line mode. 曲率的急剧变化将会导致处在该区域的元件承受较大的机械应力的作用,更容易发生损坏。 Will result in dramatic changes in the curvature of the element region is subjected to greater mechanical stress, more prone to damage. 印制板组件的模态节线的分布受到其形状、固定方式等多种因素的影响,如图4所示:不同形状、固定方式的印制板组件其模态节线分布不同。 Modal distribution line section printed board assembly influenced by many factors of the shape, fixing means, etc., as shown in Figure 4: different shapes, PCB assembly fixedly modal distribution of the different line sections.

发明内容 SUMMARY

[0017] 为了克服现有技术不能全面考虑影响元件振动易损性因素的缺点,提供一种能够减少遗漏、有效地摆脱经验依赖,可以兼顾不同印制板固定方式、不同位置的元件易损性,并对多个元件的易损性进行排序,可以更准确地确定易损元件,利用特征尺寸阀值与主导模态节线相结合来确定动态载荷作用下印制板组件中易损元件的封装方法。 [0017] To overcome the disadvantages of the prior art does not fully consider the vulnerability factors vibrating element, there is provided a method for reducing omission, effectively get rid of experience-dependent, takes into consideration the PCB in a fixed manner, positions of different elements vulnerability , and the vulnerability of sorting a plurality of elements can be determined more accurately vulnerable elements, utilizing the feature size threshold dominant mode determining section line combining PCB assembly under dynamic load element vulnerable packaging method.

[0018] 为了实现上述目的,本发明提供了一种确定动态载荷作用下印制板组件上易损组件的封装方法,其特征在于包括如下步骤: [0018] To achieve the above object, the present invention provides a method for packaging components on a printed board assembly under dynamic load vulnerable determined, comprising the steps of:

[0019] (I)利用元件的特征尺寸阀值粗略确定印制板组件中易损元件的范围,检查所确定范围内各个元件被印制板组件主导模态的节线穿过的次数,引入元件易损性指数P值来评价元件易损性,利用这些数据来分别计算各个元件的易损性指数P,P值最大者为该印制板组件中的振动易损元件; [0019] (I) using feature sizes of the threshold elements determining the scope of the printed board assembly coarse vulnerable elements, the number of individual elements within the scope of the PCB assembly through the dominant modes determined pitch line checks, introduced vulnerability index value P elements vulnerability evaluation element, use the data to calculate the index of the vulnerability of the respective elements P, P values ​​for the maximum of the printed board assemblies vulnerable vibrating element;

[0020] (2)然后,将被封装元件的长度、宽度和高度3个外形尺寸中数值最大的一个定义为该元件的特征尺寸L,并且规定该数值最大的特征尺寸L的阀值为10mm,将L ^ IOmm作为确定易损兀件粗略范围的依据;[0021] (3)用式(I)基于元件被主导模态节线穿越的次数来计算P值, [0020] (2) Then, the encapsulated length, width and height of the element values ​​in 3 dimensions the maximum feature size L is defined as a member, and a predetermined maximum value of the threshold characteristic dimension L is 10mm , L ^ IOmm as the basis for determining the scope of the wearing coarse Wu member; [0021] (3) with the formula (I) is calculated based on the number of elements traversed leading modes pitch line P value,

„ Σ» "Σ»

[0022] P = V [0022] P = V

λ ⑴ λ ⑴

[0023] 式中,N为主导模态数叫为表明元件是否被主要模态节线穿越的标志,取值为O或1,0表示未穿越,I表示穿越。 [0023] In the formula, N is the number of modes is called the leading flag indicating whether the element is traversed main section line mode, a value of 0 means no crossing or O, I represents crossing.

[0024] 本发明与现有技术相比具有以下有益效果: [0024] The prior art and the present invention has the following advantages compared to:

[0025] 本发明利用元件特征尺寸阀值及其被印制板组件主导模态节线穿越的次数,综合判断印制板组件中元件的振动易损性。 [0025] The present invention utilizes the feature size threshold and the number of elements traversed printed board assembly line section leading modes, comprehensive judgment vibration vulnerability printed board assembly elements. 采用元件的特征尺寸阀值来粗略确定印制板组件中易损元件的范围,检查所确定范围内各个元件被印制板组件主导模态的节线穿过的次数,引入元件易损性指数P值来评价元件易损性,综合考虑了印制板形状、印制板固定方式和元件的位置等多种因素对元件易损性的影响,较现有技术可以更全面地确定易损元件。 The threshold element using the characteristic dimension range is determined roughly printed board assembly vulnerable elements, the number of individual elements within the scope of the PCB assembly through the dominant modes determined pitch line inspection, introduction member vulnerability index P values ​​vulnerability evaluation element, considering various factors influence the shape of the printed board, and the position of the printed board member or the like fixing means vulnerability of elements can be determined more fully than the prior art element vulnerable .

[0026] 本发明以模态节线作为确定元件易损性的主要技术数据,利用元件是否被模态节线穿过来判断其易损性兼顾了不同位置的元件易损性表现不同的现象。 [0026] In the present invention, the section line mode is determined as the main technical data of the vulnerability element by element whether through section line mode to determine their vulnerability into account the different elements of the performance of different positions of vulnerability phenomena. 充分考虑了不同形状、固定方式的印制板组件,模态节线分布不同的情况。 Full account of the different shapes, the printed board assemblies in a fixed manner, modal distribution line section.

[0027] 本发明引入了元件易损性指数P,并明确了P值的计算公式,以此来量化确定易损元件。 [0027] The present invention introduces a vulnerability index element P, and the clear value of P is calculated in order to determine the quantization vulnerable components. 元件易损性指数P的引入为元件的易损性评价明确了具体技术指标,P值计算公式的定义为P值的具体计算提供了方法。 Vulnerability Assessment introducing vulnerability index for the element P element identified specific technical indicators, P value calculation formula of definition provides a method for the specific value of P calculated. 与现有方法比较可以更准确地确定易损元件。 Comparative consumable element can be determined more accurately with the conventional method. P拥有具体的数值,通过比较P值可以确定印制板组件中的最易损的元件,使之集中于某一个元件,并且可以对多个元件的易损性进行排序。 P has a specific value, may be determined in the printed board assembly by comparing the most vulnerable element of P values, so concentrated in a single element, and to sort the elements of a plurality of vulnerability. 而现有方法没有明确的评价标准,也不能进行易损性排序。 The existing methods there is no clear evaluation criteria, vulnerability can not be sorted.

[0028] 本发明定义了元件的特征尺寸L,并且将L ^ IOmm作为确定易损元件粗略范围的依据,与现有方法技术比较,可以在很大程度上减少遗漏。 [0028] The present invention defines a feature size L elements, and the L ^ IOmm vulnerable components as determined based on a coarse range, compared with the prior art methods can be reduced largely missing. 本发明将元件的长度、宽度和高度3个外形尺寸中数值最大的一个定义为该元件的特征尺寸L,可以更全面地考虑到元件的3维形状对其易损性的影响。 The present invention will length, width and height of the element values ​​in 3 dimensions of a maximum size L is defined as the feature elements may be more fully consider the impact of its three-dimensional shape element vulnerability. 而现有方法中并没有特征尺寸这一定义,其中涉及的形状尺寸仅包括元件平行于印制板板面的长度和宽度。 The conventional method does not define the feature size, shape and size which comprises only the elements involved in parallel to the plate surface of the printed circuit board length and width. 另外,本发明中以IOmm作为阀值,较现有方法中的25. 4mm具有更宽的范围,可以在很大程度上减少遗漏易损元件。 Further, the present invention is to IOmm as a threshold, having a wider range than the conventional method 25. 4mm, omissions vulnerable components can be reduced largely. 例如图2所示在动载作用下发生损坏的元件,现有方法将把图示元件排除在易损元件之外,而利用本发明方法可以确定该元件的特征尺寸L = 15mm, 将被包含在易损元件之内。 Element shown in FIG. 2, for example, damage occurring under dynamic load, the conventional method would exclude elements illustrated vulnerable components, and can be determined using the method of the present invention wherein the size of the element is L = 15mm, to be included within the vulnerable element.

[0029] 使用本发明获得的益处还在于: [0029] A further benefit of the invention is obtained in that:

[0030] 首先,使用本发明的技术可以准确地确定一个印制板组件上的易损元件,为其耐久寿命分析圈定对象。 [0030] First, using the techniques of the present invention may determine the vulnerability of a printed board assembly elements accurately define the objects for endurance life analysis. 本发明基于印制板主导模态的节线来定量地计算元件易损性指数P的大小,通过比较P的大小可以准确地将印制板组件中的最易损元件锁定在某个元件上。 The present invention is to quantitatively calculate the size of the vulnerability index P element based PCB line section leading modes to be printed board assemblies in the most vulnerable components accurately on a locking element by comparing the size P of . 这样在进行印制板组件的耐久性寿命分析时,就只需要针对这个最易损的元件来进行。 When the printed board assembly carrying DURABILTY such analysis would only be for the most vulnerable elements.

[0031] 其次,使用本发明的技术可以极大地节约分析计算工作量,减少对人力和计算资源的占用。 [0031] Next, using the techniques of the present invention can greatly save computational effort analysis, reduce the occupation of human and computing resources. 由于本发明以特征尺寸IOmm作为阀值,并且可以将印制板组件的最易损元件锁定在某个元件上,大大收窄分析对象的范围。 Since the present invention is to IOmm as feature size threshold, and may be the most vulnerable components on the printed board assembly in a locking element, greatly narrowing the range of the analysis object. 利用本发明可以大幅度减少印制板组件分析建模的工作量,同时由于分析对象的单一化还可以降低模型的复杂程度,从而减少计算规模、降低对计算硬件资源的要求,减少计算资源和计算时间的消耗,提高效率、节约成本。 With the present invention can greatly reduce the workload of Modeling and printed board assemblies, and because the analysis of a single object can also reduce the complexity of the model, thereby reducing computational size, reduce the requirements for computational hardware resources, and reduce the computing resources computing time consumption, improved efficiency, cost savings.

[0032] 利用本发明还可以有效地摆脱对人员经验的依赖,更有利于知识的传承。 [0032] With the present invention also can effectively get rid of dependence on personnel experience, more conducive to transmission of knowledge. 本发明引入了元件易损性指数P,并定义了P值的计算公式,使易损元件的判断实现了量化。 The present invention introduces a vulnerability index P element, and defines the calculated P value, the determination of the quantization achieved vulnerable components. 利用计算公式可以方便地确定元件的P值,进而确定易损元件。 Using the calculated value P can be readily determined element, and to determine the vulnerable components. 这就有效地降低了对人员经验的要求,更有利于知识的传承。 This effectively reduces the demand for experienced personnel, more conducive to the transmission of knowledge.

[0033] 本发明可应用于印制板组件的振动疲劳耐久性的分析和计算。 [0033] The present invention can be applied to the analysis and calculation of the vibration fatigue resistance of the printed board assemblies.

附图说明 BRIEF DESCRIPTION

[0034] 下面,结合附图和实施例对本发明进一步说明。 [0034] Hereinafter, the accompanying drawings and examples further illustrate the present invention.

[0035] 图I是本发明基于实验模态数据的第一个实施例的流程图。 [0035] Figure I is a flowchart of an embodiment of the present invention is based on the first experimental modal data.

[0036] 图2是本发明基于仿真模态数据的第二个实施例的流程图。 [0036] FIG 2 is a flowchart of a second embodiment of the present invention is based on the simulation mode data.

[0037] 图3是现有技术实际中发生损伤的元件状态示意图。 [0037] FIG. 3 is a diagram of a state of the prior art injury in practice. [0038] 图4是现有技术不同形状和固定方式的印制板组件的模态节线图。 [0038] FIG. 4 is a section diagram modal prior art printed board and different shapes of the components in a fixed manner.

具体实施方式 Detailed ways

[0039] 在以下描述的确定动态载荷作用下印制板组件中易损元件的封装方法实施例中,根据本发明,首先利用元件特征尺寸阀值及其被印制板组件主导模态节点穿越的次数,综合判断印制板组件中元件的振动易损性。 [0039] The method of packaging printed board assembly vulnerable element in the embodiment of the dynamic load is determined as described below, according to the present invention, firstly element feature size threshold is crossed and their printed board assemblies leading modes node the frequency of vibration is determined vulnerability integrated PCB assembly elements. 利用元件的特征尺寸阀值来粗略确定印制板组件中易损元件的范围,进而检查所确定范围内各个元件被印制板组件主导模态的节线穿过的次数,然后引入元件易损性指数P值来评价元件易损性。 The threshold element using the feature sizes to determine the range of the coarse vulnerable elements printed board assembly, and further checks the number of elements within the range through which the printed board assemblies dominant modes line determination section, and then introduced into the element vulnerable index value P element was evaluated vulnerability. 利用主导模态的节线穿过的这些数据来分别计算各个元件的易损性指数P,P值最大者即为该印制板组件中的振动易损元件。 Using the pitch line passing through the dominant modes of these data to calculate the index of the vulnerability of the respective elements P, P is the greatest value of the vibrating elements of the printed board consumable assembly. 元件易损性由印制板组件的主导模态控制。 Element vulnerability dominant modes is controlled by the printed board assembly. 印制板组件的主导模态是指在垂直印制板板面方向上的对印制板组件的响应起主要作用的模态。 Dominant modes PCB assembly means play a major role in a direction perpendicular to the plane of the PCB board PCB assembly modal response. 主导模态的判断可以通过比较各阶模态在垂直印制板板面方向上的模态参与系数来确定。 Analyzing the dominant modes may be determined by comparing the modal participation factor of each mode in a direction perpendicular to the plane of the PCB board. 主导模态确定后,就可以画出主导模态的节线图,并确定各个元件被其穿越的次数。 After determining the dominant mode, you can draw line section of FIG dominant modes, and to determine the number of individual elements which are traversed. 具体地,用式(I)基于元件被主导模态节线穿越的次数来计算P值。 Specifically, the formula (I) P-value is calculated based on the number of elements traversed line section leading modes. 这是本发明不可缺少的技术特征之一。 This is one of the present invention is indispensable technical features.

[0040] P = [0040] P =

N (I) N (I)

[0041] 式中,N为主导模态数;ai为表明元件是否被主要模态节线穿越的标志,取值为O或1,0表示未穿越,I表示穿越; [0041] In the formula, N is the number of dominant modes; AI is a flag indicating whether the element is mainly through the section line mode, a value of 0 means no crossing or O, I represents crossing;

[0042]印制板组件的模态可以由实验模态分析方法或仿真模态分析的方法获得。 Mode [0042] PCB assembly can be obtained from experimental modal analysis, or modal analysis simulation method. 当采用仿真模态分析获得印制板组件得模态时,可以将L〈10_的元件忽略。 When emulation mode analysis to obtain printed board assemblies have modal, L <10_ elements can be ignored.

[0043] 在图I所示实施例中,基于实验模态数据来确定易损元件的具体步骤如下:基于实验模态数据来确定易损元件的具体步骤如下:(1)实验模态分析的必要准备工作,如工装夹具的准备、实验用到的仪器和设备的校准等;(2)在对印制板组件进行实验模态分析中,获得其固有频率值和模态,利用粗略的仿真计算各模态在垂直板面方向上的参与系数; [0043] In the embodiment shown in FIG. I, vulnerable components determined based on experimental modal data the following steps: determining a vulnerable element based on experimental modal data the following steps: (1) Experimental Modal Analysis necessary preparations, such preparations fixture, calibrating instruments and equipment used in the experiment and the like; (2) the analysis of experimental modal PCB components, obtaining its natural frequency and modal values, using the coarse simulation calculated for each mode in the vertical direction of the plate plane coefficients participate;

(3)用上述仿真获得的各种模态参与系数确定出主导模态;(4)依据确定的主导模态,画出主导模态的模态节线图;(5)同时确定出印制板组件上元件的特征尺寸L ;(6)将L ^ IOmm的元件划入易损元件的粗略范围,把L〈10mm的范围内的元件忽略;(7)然后结合上述主导模态节线,计算划入粗略范围内各元件的P值;(8)对各元件的P值进行比较排序;(9)确定印制板组件中最易损伤的兀件;(10)结束[0044] 在图2所示的另一个实施例中,基于仿真模态数据来确定易损元件的具体步骤包括:(I)完成必要的准备工作(2)确定印制板组件中各元件的特征尺寸L ; (3)将L彡IOmm的元件划入易损元件的粗略范围,同时把L〈10_的元件忽略;(4)依据划入粗略范围内的易损元件,建立印制板组件的详细仿真模型;(5)用有限元分析程序计算并获得印制板组件模态数据;(6)根据模态参与系 (3) various modal participation factor obtained by the above simulation is determined that the dominant modes; (4) according to the determined dominant modes, mode shown in FIG line section leading modes; (5) while printing is determined wherein the size L of the plate member assembly; (6) L ^ IOmm elements included vulnerable components coarse range, the L elements within the range 10mm <ignored; (7) and a combination of these line sections leading modes, P calculated value of each element included in the coarse range; (8) compared to the P value of each sort element; (9) determining the printed board assemblies Wu member most easily damaged; (10) end [0044] in FIG. another embodiment shown in FIG. 2 embodiment, to determine the vulnerable element data based on the simulation mode specifically comprises: (2) determining the characteristic dimension L of the printed board assembly of the elements (I) to complete the necessary preparations; ( 3) the element L San IOmm vulnerable components included coarse range, while the L <10_ element ignored; (4) according to vulnerable components included within the scope of coarse, establishing detailed simulation model of the PCB assembly ; (5) calculates and obtains data printed board assemblies modal finite element analysis program; (6) The system modal participation 确定主导模态;(7)画出主导模态的模态节线图;(8)结合主导模态节线计算粗略范围内各元件的P值;(9)对各元件的P值进行比较排序;(10)确定印制板组件中最易损伤的元件;(11)结束。 Determining the dominant mode; FIG modal section line (7) leading shown modality; (8) binds dominant modes section line P values ​​were calculated for each element in the coarse range; (9) compares the values ​​of the elements P sorting; (10) determines the most vulnerable element printed board assemblies injury; (11) ends. 所述的印制板组件模态数据,包括模态、垂直印制板板面方向的参与系数等。 The PCB assembly modality data, including modal participation coefficient plane direction perpendicular to the PCB board. · ·

Claims (10)

1. 一种确定动态载荷作用下印制板组件上易损组件的封装方法,其特征在于包括如下步骤: (1)利用元件的特征尺寸阀值粗略确定印制板组件中易损元件的范围,检查所确定范围内各个元件被印制板组件主导模态的节线穿过的次数,引入元件易损性指数P值来评价元件易损性,利用这些数据来分别计算各个元件的易损性指数P,P值最大者为该印制板组件中的振动易损元件; (2)然后,将被封装元件的长度、宽度和高度3个外形尺寸中数值最大的一个定义为该元件的特征尺寸L,并且规定该数值最大的特征尺寸L的阀值为10mm,将L ^ IOmm作为确定易损元件粗略范围的依据; (3)用式(I)基于元件被主导模态节线穿越的次数来计算P值, CLAIMS 1. A method for determining the consumables packaging component on a printed board assembly under dynamic load, comprising the steps of: (1) using the device feature size range roughly determined threshold vulnerable elements printed board assembly the number of inspections to be within the scope of the various elements through which the printed board assemblies dominant modes determined pitch line, introducing vulnerability index value P elements vulnerability evaluation element, use the data to calculate the respective elements are vulnerable index P, P the maximum value for the printed board assembly by the vibration vulnerable components; (2) then, the encapsulated length, width and height of the three dimensions of the elements defined as the largest value element a characteristic dimension L, and a predetermined maximum value of the threshold characteristic dimension L is 10mm, the L ^ IOmm vulnerable components as determined based on a coarse range; based element through (3) of formula (I) line section leading modes the number of times to calculate P values,
Figure CN102890738AC00021
式中,N为主导模态数;ai为表明元件是否被主要模态节线穿越的标志,取值为O或1,O表示未穿越,I表示穿越。 Where, N is the number of dominant modes; AI is a flag indicating whether the element is mainly through the section line mode, or a value of O. 1, O indicates no crossing, I represents crossing.
2.如权利要求I所述的确定动态载荷作用下印制板组件中易损元件的封装方法,其特征在于,印制板组件的元件易损性由印制板组件的主导模态控制。 2. The packaging method of determining the vulnerable element of the dynamic loads acting I lower PCB assembly as claimed in claim, characterized in that the printed board assemblies element vulnerability dominant modes is controlled by the printed circuit board assembly.
3.如权利要求I所述的确定动态载荷作用下印制板组件中易损元件的封装方法,其特征在于,印制板组件的主导模态是指在垂直印制板板面方向上的对印制板组件的响应起主要作用的模态。 3. determining the dynamic load of the I component of the printed board packaging method as claimed in claim wearing element, characterized in that the dominant modes PCB assembly means in a direction perpendicular to the plane of the PCB board PCB assembly response plays a major role modality.
4.如权利要求I所述的确定动态载荷作用下印制板组件中易损元件的封装方法,其特征在于,主导模态的判断通过比较各阶模态在垂直印制板板面方向上的模态参与系数来确定。 Determining the dynamic load I as claimed in claim 4. A printed board according to the assembly method for the package of the consumable element, characterized in that the dominant modes is determined by comparing the order of the PCB perpendicular to the plate surface direction modality modal participation factor is determined.
5.如权利要求4所述的确定动态载荷作用下印制板组件中易损元件的封装方法,其特征在于,主导模态确定后,就可以画出主导模态的节线图,并确定各个元件被模态节线穿越的次数。 The dynamic load 4, as determined according to the printed circuit board assembly as claimed in claim vulnerable element encapsulation method, wherein, after determining the dominant mode, the line will be drawn section of FIG dominant modes, and determines the number of elements traversed respective section line mode.
6.如权利要求I所述的确定动态载荷作用下印制板组件中易损元件的封装方法,其特征在于,印制板组件的模态可以由实验模态分析方法或有限元模态分析的方法获得。 6. The packaging method of determining the vulnerable element of the dynamic loads acting I lower PCB assembly as claimed in claim, wherein the printed circuit board assembly may be modal modal analysis of experimental modal analysis or finite element methods the method of obtaining.
7.如权利要求6所述的确定动态载荷作用下印制板组件中易损元件的封装方法,其特征在于,当采用有限元模态分析获得印制板组件模态时,可以将L〈10_的元件忽略。 7. The packaging method of determining the vulnerable element of the dynamic load of the printed circuit board assembly of claim 6, characterized in that, when using Finite Element modal analysis modality to obtain printed board assembly may be L < ignore the element 10_.
8.如权利要求I所述的确定动态载荷作用下印制板组件中易损元件的封装方法,其特征在于,基于实验模态数据来确定易损元件的具体步骤包括:(1)对印制板组件进行实验模态分析,获得其固有频率值和模态;(2)通过粗略的仿真来计算各模态在垂直板面方向上的参与系数;(3)依据参与系数确定主导模态,画出主导模态的模态节线图,确定出印制板组件上元件的特征尺寸L,将L彡IOmm的元件划入易损元件的粗略范围;(4)结合主导模态节线计算范围内元件的P值,对各元件的P值进行排序;(5)确定印制板组件中最易损伤的元件。 8. The packaging method of determining the vulnerable element of the dynamic loads acting I lower PCB assembly as claimed in claim, characterized in that the wearing element is determined based on specific experimental modal data comprises the step of: (1) to India system board components experimental modal analysis to obtain its natural frequency values ​​and modes; participation factor (2) is calculated by a rough simulation of each mode in the perpendicular plane direction of the plate; and (3) determining the dominant mode based on participation factors modal section line shown in FIG dominant modes, wherein determining the coarse range dimension L elements on a printed board assembly, will be assigned to elements L San IOmm vulnerable elements; (4) binding line section leading modes P values ​​calculated within a range of elements, each element of the P values ​​are sorted; (5) determining the most vulnerable element printed board assemblies injury.
9.如权利要求I所述的确定动态载荷作用下印制板组件中易损元件的封装方法,其特征在于,基于仿真模态数据来确定易损元件的具体步骤包括:(1)确定印制板组件上元件的特征尺寸L,将L > IOmm的元件划入易损元件的粗略范围,依据该范围建立印制板组件的仿真模型;(3)用有限元分析程序计算印制板组件模态数据,依据参与系数确定主导模态,画出主导模态的模态节线图;(4)结合主导模态节线计算范围内各元件的P值,对各元件的P值进行排序;(5)确定印制板组件中最易损伤的元件。 (1) determining the printing: 9. I determine the dynamic load under the PCB assembly packaging method wearing element, characterized in that the wearing element is determined based on the simulation mode data comprises the step of specifically claims wherein the system board assembly dimension L element, the L> IOmm elements classified coarse range vulnerable element simulation model range according to the printed board assembly; (3) calculate the printed board assemblies using finite element analysis program modal data, determined based on the dominant mode participation factor, modal section line shown in FIG dominant modes; (4) P binding value of each element in the dominant modes section line calculation range, for values ​​of P sorted elements ; (5) determining the most vulnerable element printed board assemblies injury.
10.如权利要求9所述的确定动态载荷作用下印制板组件中易损元件的封装方法,其特征在于,所述的印制板组件模态数据,包括模态、垂直印制板板面方向的参与系数。 Determining the dynamic load packaging method as claimed in claim 9 the printed board assembly vulnerable element, wherein said printed board assembly modality data, including mode, vertical PCB board participation of the plane direction.
CN201210374739XA 2012-11-12 2012-11-12 Method for encapsulating vulnerable elements determined in printed board component under effect of dynamic load CN102890738A (en)

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