CN102881560A - Wafer control method and wafer control equipment - Google Patents
Wafer control method and wafer control equipment Download PDFInfo
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- CN102881560A CN102881560A CN2012103668561A CN201210366856A CN102881560A CN 102881560 A CN102881560 A CN 102881560A CN 2012103668561 A CN2012103668561 A CN 2012103668561A CN 201210366856 A CN201210366856 A CN 201210366856A CN 102881560 A CN102881560 A CN 102881560A
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Abstract
The invention provides a wafer control method and wafer control equipment. The method includes: a wafer position detection step which is used for using a position sensor to detect whether a wafer is arranged at an expected position or not or whether the wafer has position deviation or not; a detection result judging step which is used for judging whether the wafer is arranged at the expected position or not or whether the wafer has position deviation or not according to detection results of the wafer position detection step; a conveying tool grabbing step executed when the judging result of the detection result judging step is positive, which is used for utilizing a conveying tool to grab the wafer at the expected position; and a conveying tool suspending step executed when the judging result of the detection result judging step is negative, which is used for enabling the conveying tool to suspend to grab the wafer. By the wafer control method, whether the wafer is at an expected proper position or not can be detected early, so that the conveying tool can be effectively prevented from damaging the wafer, success rate that the conveying tool grabs the wafer is improved, yield is improved, and efficiency of treatment process is improved.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly, the present invention relates to a kind of wafer control method and corresponding wafer control appliance.
Background technology
In the Treatment technique for processing of semiconductor crystal wafer (for example, in etching technics), sometimes need to utilize the operation element such as mechanical arm that the wafer in the chamber is shifted, for example wafer is transferred to another treatment chamber from a treatment chamber.
At this moment, when the mechanical arm that wafer is operated during at grasping silicon wafer, if wafer is not in desired location (namely, if deviation has appearred in the position of the wafer in the chamber), then mechanical arm may not successfully grab wafer, perhaps thereby mechanical arm may by mistake collide wafer and causes wafer breakage or break, thereby causes the decline of productive rate.
For fear of the generation of above-mentioned situation, in prior art, a kind of placement sensor in chamber has been proposed so that whether the sensing mechanical arm successfully grabs the technology of wafer when mechanical arm enters chamber.But, detect mechanical arm iff placement sensor and whether successfully grab wafer, in the situation that mechanical arm does not successfully grab wafer, transducer sends detection signal so, so that whole processing suspends.
Can find out, detection to the mechanical arm grasping silicon wafer in the prior art lacks efficient, in the situation that mechanical arm does not successfully grab wafer, might cause destruction or the damage of wafer, and might cause owing to the time-out of handling process the decline of process efficiency.
Therefore, hope can provide a kind of prevent that process efficiency from descending can improve mechanical arm to the wafer control method of the crawl success rate of wafer.
Summary of the invention
Technical problem to be solved by this invention is for having defects in the prior art, providing a kind of raising mechanical arm of process efficiency decline that can effectively prevent when the mechanical arm grasping silicon wafer to wafer control method and the corresponding wafer control appliance of the crawl success rate of wafer.
According to a first aspect of the invention, provide a kind of wafer control method, it comprises: the wafer position detecting step is used for utilizing position transducer to detect the expectation position and whether has arranged wafer; The testing result determining step is used for judging according to the testing result of wafer position detecting step whether the desired locations place has arranged wafer;
Judged result at described testing result determining step is the delivery means crawl step of carrying out in the situation of sure judgement, is used for utilizing operation element to grasp the wafer at described desired locations place; And be to negate the delivery means pause step of carrying out in the situation about judging in the judged result of described testing result determining step, be used for so that delivery means suspends grasping silicon wafer.
Preferably, in described wafer position detecting step, utilize light-emitting diode and photo-sensitive cell to detect the expectation position and whether arranged wafer.
Preferably, described delivery means is mechanical arm.
Preferably, if the judged result of described testing result determining step is to negate to judge, message gives the alarm.
According to a second aspect of the invention, provide a kind of wafer control appliance, it comprises: delivery means is used for crawl and shifts wafer; The wafer position checkout gear is used for utilizing position transducer to detect the expectation position and whether has arranged wafer; And the testing result judgment means, be used for judging according to the testing result of wafer position detecting step whether the desired locations place has arranged wafer; Wherein, be in the situation of sure judgement in the judged result of testing result judgment means, described wafer control appliance utilizes operation element to grasp the wafer at described desired locations place; And the judged result of testing result judgment means be negate in the situation about judging described wafer control appliance so that delivery means suspends grasping silicon wafer.
Preferably, described wafer position checkout gear comprises light-emitting diode and photo-sensitive cell.
Preferably, described delivery means is mechanical arm.
Preferably, if the judged result of described testing result determining step is negate to judge, the described wafer control appliance message that gives the alarm.
Preferably, described light-emitting diode places described desired locations place, described photo-sensitive cell and described light-emitting diode positioned opposite, thus when not blocking between described photo-sensitive cell and described light-emitting diode, described photo-sensitive cell can receive the light of described light-emitting diode emission.
According to the present invention, can detect early the appropriate location whether wafer is in expectation, thereby can the delivery means of controlling in time such as manipulator occur to be offset in wafer position, thereby can prevent effectively that delivery means from damaging wafer, thereby improved the success rate of delivery means grasping silicon wafer, improve productive rate, and improved the efficient for the treatment of process owing to information processing early.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows the flow chart according to the wafer control method of the embodiment of the invention.
Fig. 2 schematically show according to the wafer control appliance of the embodiment of the invention block diagram.
Fig. 3 schematically shows a concrete example according to the wafer position checkout gear of the embodiment of the invention.
Need to prove, accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Note, the accompanying drawing of expression structure may not be to draw in proportion.And in the accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
The＜the first embodiment 〉
Fig. 1 schematically shows the flow chart according to the wafer control method of first embodiment of the invention.
As shown in Figure 1, comprise according to wafer control method of the invention process:
Wafer position detecting step S1 wherein utilizes position transducer to detect the expectation position and whether has arranged wafer; Specifically, for example can utilize a light-emitting diode and photo-sensitive cell to realize detecting the expectation position and whether arrange wafer, this will specifically describe hereinafter.
Testing result determining step S2 judges according to the testing result of wafer position detecting step whether the desired locations place has arranged wafer.
If the judged result of testing result determining step S2 is sure judgement, then carry out delivery means crawl step S3, wherein utilize operation element to grasp the wafer at described desired locations place.For example, described delivery means is mechanical arm.
On the contrary, if the judged result of testing result determining step S2 is to negate to judge, then carry out delivery means pause step S4, wherein so that delivery means suspends grasping silicon wafer.
Preferably, if the judged result of testing result determining step S2 is to negate to judge, message also gives the alarm.
Wafer control method according to first embodiment of the invention, can detect early the appropriate location whether wafer is in expectation, thereby can when skew occurs wafer position, control in time the delivery means such as manipulator, thereby can prevent effectively that delivery means from damaging wafer, thereby improved the success rate of delivery means grasping silicon wafer, improve productive rate, and improved the efficient for the treatment of process owing to information processing early.
The＜the second embodiment 〉
Fig. 2 schematically shows the block diagram according to the wafer control appliance of the embodiment of the invention.
Wafer control appliance according to the embodiment of the invention comprises:
Delivery means 1 is used for crawl and shifts wafer; For example, described delivery means is mechanical arm;
Wafer position checkout gear 2 is used for utilizing position transducer to detect the expectation position and whether has arranged wafer; And
Testing result judgment means 3 is used for judging according to the testing result of wafer position detecting step whether the desired locations place has arranged wafer;
Wherein, be in the situation of sure judgement in the judged result of testing result judgment means, described wafer control appliance utilizes operation element to grasp the wafer at described desired locations place; And
The judged result of described testing result judgment means be negate in the situation about judging described wafer control appliance so that delivery means suspends grasping silicon wafer.
Preferably, if the judged result of testing result judgment means is to negate to judge, message also gives the alarm.
Fig. 3 schematically shows a concrete example according to the wafer position checkout gear 3 of the embodiment of the invention.
As shown in Figure 3, the wafer position checkout gear 3 according to the embodiment of the invention can comprise: light-emitting diode 31 and photo-sensitive cell 32.
Wherein, light-emitting diode 31 can place described desired locations place, photo-sensitive cell 32 and light-emitting diode 31 positioned opposite, thus when not blocking between described sensitization is without part 32 and described light-emitting diode 31, sensing unit 32 can receive the light of light-emitting diode 31 emissions.
As shown in Figure 3, when wafer correctly is in suitable expectation (, between described photo-sensitive cell 32 and described light-emitting diode 31), the light of light-emitting diode 31 emissions is blocked, thereby photo-sensitive cell 32 can not receive light, thereby photo-sensitive cell 32 disconnects, thereby the voltage at the B point place at photo-sensitive cell 32 1 end places can not become the voltage (being 15V among Fig. 3) of photo-sensitive cell 32 other ends, thereby also can not become the voltage of photo-sensitive cell 32 other ends with the A point of B point phase.
On the other hand, as shown in Figure 3, when wafer correctly is not in suitable expectation (, not between described photo-sensitive cell 32 and described light-emitting diode 31), the light of light-emitting diode 31 emissions is not blocked, thereby photo-sensitive cell 32 receives light, thereby photo-sensitive cell 32 is connected, thereby the voltage at the B point place at photo-sensitive cell 32 1 end places becomes the voltage (being 15V among Fig. 3) of photo-sensitive cell 32 other ends, thereby the A point that links to each other with the B point also becomes the voltage of photo-sensitive cell 32 other ends.
Thus, can produce control signal, whether arrange wafer to inform testing result judgment means 3 desired locations places.
Equally, wafer control appliance according to second embodiment of the invention, can detect early the appropriate location whether wafer is in expectation, thereby can when skew occurs wafer position, control in time the delivery means such as manipulator, thereby can prevent effectively that delivery means from damaging wafer, thereby improved the success rate of delivery means grasping silicon wafer, improved productive rate, and improved the efficient for the treatment of process owing to information processing early.
Be understandable that, although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that skill scheme of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention, according to any simple modification that technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention protection.
Claims (9)
1. wafer control method is characterized in that comprising:
The wafer position detecting step is used for utilizing position transducer to detect the expectation position and whether has arranged wafer or wafer position deviation;
The testing result determining step is used for judging according to the testing result of wafer position detecting step whether the desired locations place has arranged wafer or wafer position deviation;
Judged result at described testing result determining step is the delivery means crawl step of carrying out in the situation of sure judgement, is used for utilizing operation element to grasp the wafer at described desired locations place; And
Judged result at described testing result determining step is to negate the delivery means pause step of carrying out in the situation about judging, is used for so that delivery means suspends grasping silicon wafer.
2. wafer control method according to claim 1 is characterized in that, in described wafer position detecting step, utilizes light-emitting diode and photo-sensitive cell to detect the expectation position and whether has arranged wafer.
3. wafer control method according to claim 1 and 2 is characterized in that, described delivery means is mechanical arm.
4. wafer control method according to claim 1 and 2 is characterized in that, if the judged result of described testing result determining step is to negate to judge, message gives the alarm.
5. wafer control appliance is characterized in that comprising:
Delivery means is used for crawl and shifts wafer;
The wafer position checkout gear is used for utilizing position transducer to detect the expectation position and whether has arranged wafer or wafer position deviation; And
The testing result judgment means is used for judging according to the testing result of wafer position detecting step whether the desired locations place has arranged wafer or wafer position deviation;
Wherein, be in the situation of sure judgement in the judged result of testing result judgment means, described wafer control appliance utilizes operation element to grasp the wafer at described desired locations place; And
The judged result of testing result judgment means be negate in the situation about judging institute's wafer control appliance so that delivery means suspends grasping silicon wafer.
6. wafer control appliance according to claim 5 is characterized in that, described wafer position checkout gear comprises light-emitting diode and photo-sensitive cell.
7. according to claim 5 or 6 described wafer control appliances, it is characterized in that, described delivery means is mechanical arm.
8. according to claim 5 or 6 described wafer control appliances, it is characterized in that, if the judged result of institute's testing result determining step is to negate to judge, the described wafer control appliance message that gives the alarm.
9. wafer control appliance according to claim 6, it is characterized in that, described light-emitting diode places described desired locations place, described photo-sensitive cell and described light-emitting diode positioned opposite, thereby when not blocking between described photo-sensitive cell and described light-emitting diode, described photo-sensitive cell can be received the light of described light-emitting diode emission.
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| CN2012103668561A CN102881560A (en) | 2012-09-27 | 2012-09-27 | Wafer control method and wafer control equipment |
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| CN2012103668561A CN102881560A (en) | 2012-09-27 | 2012-09-27 | Wafer control method and wafer control equipment |
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| CN102881560A true CN102881560A (en) | 2013-01-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111564382A (en) * | 2020-04-08 | 2020-08-21 | 中国科学院微电子研究所 | Wafer detection device and detection method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036528A (en) * | 1998-07-17 | 2000-02-02 | Yaskawa Electric Corp | Wafer carrying device |
| CN1646355A (en) * | 2002-04-16 | 2005-07-27 | 株式会社三协精机制作所 | Work conveying system, work conveying pallet used for the system, and rail connection method in work conveying system |
| CN1667795A (en) * | 2004-03-11 | 2005-09-14 | 大日本网目版制造株式会社 | Substrate processing apparatus and substrate processing method |
| CN1692487A (en) * | 2003-01-06 | 2005-11-02 | 东京毅力科创株式会社 | Semiconductor processing-purpose substrate detecting method and device, and substrate transfer system |
-
2012
- 2012-09-27 CN CN2012103668561A patent/CN102881560A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036528A (en) * | 1998-07-17 | 2000-02-02 | Yaskawa Electric Corp | Wafer carrying device |
| CN1646355A (en) * | 2002-04-16 | 2005-07-27 | 株式会社三协精机制作所 | Work conveying system, work conveying pallet used for the system, and rail connection method in work conveying system |
| CN1692487A (en) * | 2003-01-06 | 2005-11-02 | 东京毅力科创株式会社 | Semiconductor processing-purpose substrate detecting method and device, and substrate transfer system |
| US20050242305A1 (en) * | 2003-01-06 | 2005-11-03 | Tokyo Electron Limited | Semiconductor processing-purpose substrate detecting method and device, and substrate transfer system |
| CN1667795A (en) * | 2004-03-11 | 2005-09-14 | 大日本网目版制造株式会社 | Substrate processing apparatus and substrate processing method |
Non-Patent Citations (3)
| Title |
|---|
| 何希才，薛永毅，姜余祥: "《高等学校通用教材 传感器技术及应用》", 30 April 2005, 北京航空航天大学出版社 * |
| 何希才，薛永毅: "《传感器及其应用实例》", 31 January 2004, 机械工业出版社 * |
| 宋德杰: "《传感器技术与应用》", 30 September 2014, 机械工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111564382A (en) * | 2020-04-08 | 2020-08-21 | 中国科学院微电子研究所 | Wafer detection device and detection method |
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| C06 | Publication | ||
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| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140428 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20140428 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130116 |