CN102867903A - Light emitting device and manufacturing method thereof - Google Patents
Light emitting device and manufacturing method thereof Download PDFInfo
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- CN102867903A CN102867903A CN2011101903223A CN201110190322A CN102867903A CN 102867903 A CN102867903 A CN 102867903A CN 2011101903223 A CN2011101903223 A CN 2011101903223A CN 201110190322 A CN201110190322 A CN 201110190322A CN 102867903 A CN102867903 A CN 102867903A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
A light emitting device comprises a substrate, at least one light emitting diode core, a sealing adhesive positioning layer and a first packaging adhesive body. The substrate is provided with a core setting area, the light emitting diode cores are arranged in the core setting area, the sealing adhesive positioning layer is arranged on the substrate, and at least part of the first packaging adhesive body covers the light emitting diode cores and contacts with the adhesive positioning layer. By the aid of the light emitting device, light emitted from the light emitting diode cores can be prevented from being blocked, and lighting effect can be enhanced.
Description
Technical field
The present invention is about a kind of light-emitting device, especially in regard to a kind of light-emitting device with light-emitting diode.
Background technology
For promoting the light-emitting diode production capacity and saving cost of manufacture, the now many employings of the encapsulation procedure of light-emitting diode batch modes, the glue supervisor is closed and put to a plurality of LED core through die bonds, routing welding in that a substrate (such as circuit board etc.) is upper, in batch process once, to finish simultaneously the encapsulation of most LED core.
Simultaneously, because the lasting pursuit of the progress of semiconductor technology and electronic installation is light, thin, short, little, the size of substrate is more and more less, and the LED core number that be laid in same substrate is more and more.So when some glue processing procedure, more and more easily because adjacent LED core spacing is less, and the phenomenon of the glue that causes overflowing.Serious, this excessive glue phenomenon will affect the light shape of LED core emitted light or even have influence on LED core and the effect of electrical property of substrate binding, thereby reduce the yield of product.
Yet, if LED core is arranged in the reflection housing (housing) with as barricade, although can prevent the situation of excessive glue occurs, but also can be because of the height of reflection housing own, and reduce the rising angle of LED core, for being disadvantageous on the contrary in the application of the large rising angle of needs.
Therefore, how to provide a kind of light-emitting device, when carrying out the some glue processing procedure of LED core, can not need to reflect housing as the glue barricade that overflows, and can control the overflow of glue, become one of important topic.
Summary of the invention
The purpose of this invention is to provide does not a kind ofly need to reflect housing as overflowing the glue barricade, and can control the light-emitting device of the overflow of glue.
The present invention can realize by the following technical solutions.
A kind of light-emitting device of the present invention comprises a substrate, at least one LED core, a sealing alignment layers and one first packing colloid.Substrate has a tube core setting area, and LED core is arranged on the tube core setting area, and the sealing alignment layers is arranged on substrate, and at least part of covering LED core of the first packing colloid also contacts with the sealing alignment layers.
The present invention also proposes a kind of light-emitting device and comprises a substrate, at least one LED core, a sealing alignment layers, location auxiliary body and one first packing colloid.Substrate has a tube core setting area, and LED core is arranged on the tube core setting area, and the sealing alignment layers is arranged on substrate, the location auxiliary body be arranged on the sealing alignment layers, at least part of covering LED core of the first packing colloid and with the location auxiliary body contact.
In one embodiment, light-emitting device also comprises one second packing colloid, and it covers LED core and the first packing colloid.
In one embodiment, the upper edge at the sealing alignment layers of the edge essence of the second packing colloid.
In one embodiment, the second packing colloid covers the sealing alignment layers, and the upper outer rim at the sealing alignment layers of essence.
In one embodiment, the material of sealing alignment layers comprises a metal or an alloy or an anti-welding lacquer.
In one embodiment, the sealing alignment layers is a patterned layer.
In one embodiment, sealing alignment layers ring is located at the tube core setting area.
In one embodiment, sealing alignment layers position is in the tube core setting area.
In one embodiment, light-emitting device also comprises a barricade layer, and it is arranged on substrate, and is arranged on an identical side with the sealing alignment layers.
In one embodiment, has a gap between barricade layer and the sealing alignment layers.
In one embodiment, the material of barricade layer comprises a metal or an alloy or an anti-welding lacquer.
In one embodiment, light-emitting device also comprises a material layer, and it is arranged on substrate, and is right after at the sealing alignment layers.
In one embodiment, the material of material layer comprises a metal or an alloy or an anti-welding lacquer.
In one embodiment, material layer height is less than or equal to the sealing alignment layers.
In one embodiment, the first packing colloid and/or the second packing colloid include material for transformation of wave length.
In addition, the present invention also proposes a kind of manufacture method of light-emitting device, comprises a sealing alignment layers being set at a substrate; At least one LED core is set in a tube core setting area of substrate; And one first packing colloid is set to cover at least one LED core and to contact with the sealing alignment layers.
In addition, the present invention also proposes a kind of manufacture method of light-emitting device, comprises a sealing alignment layers being set at a substrate; At least one LED core is set in a tube core setting area of substrate; One location auxiliary body is set at the sealing alignment layers; And one first packing colloid is set to cover at least one LED core and to contact with the location auxiliary body.
In one embodiment, the manufacture method of light-emitting device also comprises: cover one second packing colloid at LED core and the first packing colloid, and the upper edge at the sealing alignment layers of the edge essence of the second packing colloid.
In one embodiment, the manufacture method of light-emitting device also comprises: a barricade layer is set at substrate, and is arranged on the identical side of substrate with the sealing alignment layers.
In one embodiment, has a gap between the barricade layer of the manufacture method of light-emitting device and the sealing alignment layers.
In one embodiment, the manufacture method of light-emitting device also comprises and a material layer is set at substrate, and is right after at the sealing alignment layers.
From the above, light-emitting device of the present invention is by being arranged on the sealing alignment layers on the substrate, so that the first and/or second packing colloid and the contraposition of sealing alignment layers, and the edge essence of the first and/or second packing colloid is upper at the edge of sealing alignment layers, and then reduce the generation of the glue that overflows.Thus, do not need LED core is arranged in the reflection housing, therefore can not reduce the rising angle of LED core, and then can improve the quality of products.
Description of drawings
Fig. 1 is the schematic top plan view of a kind of light-emitting device of the embodiment of the invention;
Fig. 2 is the schematic side view of a kind of light-emitting device of the embodiment of the invention;
Fig. 3 is the another kind of schematic side view of a kind of light-emitting device of the embodiment of the invention;
Fig. 4 is another schematic side view of a kind of light-emitting device of the embodiment of the invention;
Fig. 5 is another schematic side view of a kind of light-emitting device of the embodiment of the invention;
Fig. 6 is the another kind of schematic top plan view of a kind of light-emitting device of the embodiment of the invention;
Fig. 7 is another schematic side view of a kind of light-emitting device of the embodiment of the invention;
Fig. 8 is another schematic side view of a kind of light-emitting device of the embodiment of the invention;
Fig. 9 is the flow chart of manufacture method of a kind of light-emitting device of preferred embodiment of the present invention; And
Figure 10 is the flow chart of manufacture method of the another kind of light-emitting device of preferred embodiment of the present invention.
The main element symbol description:
1,1a～1f: light-emitting device
11: substrate
111: the tube core setting area
12: LED core
13,13d: sealing alignment layers
14: the first packing colloids
15: the location auxiliary body
16: the second packing colloids
17: the barricade layer
18: material layer
G: gap
P: conductive spacer
S91～S93, S101～S104: the steps flow chart of the manufacture method of light-emitting device
Embodiment
Hereinafter with reference to correlative type, a kind of light-emitting device according to the preferred embodiment of the present invention is described, wherein identical element will be illustrated with identical component symbol.
Please refer to Figure 1 and Figure 2, Fig. 1 is the schematic top plan view of a kind of light-emitting device 1 of preferred embodiment of the present invention, and Fig. 2 is the schematic side view of Fig. 1.Light-emitting device 1 comprises a substrate 11, at least one LED core 12, a sealing alignment layers 13 and one first packing colloid 14.In the present embodiment, light-emitting device 1 is take a lighting device as example, and certainly, light-emitting device 1 also can be backlight, the light source of an electronic installation, indication billboard or the advertising billboard that a liquid crystal display is used.
The first packing colloid 14 at least part covers LED core 12; for example be to cover LED core 12 fully; so that LED core 12 is protected, avoid aqueous vapor, oxygen or dust to enter LED core 12, to guarantee the quality of LED core 12.Behind a glue, the packing colloid 14 of molten state still can outwards flow after covering LED core 12, contacts at least part of sealing alignment layers 13.
Cohesive force by the first packing colloid 14 itself, minimal surface is long-pending to be inclined at the upper surface of staying sealing alignment layers 13 in order to keep, so just in case some during glue the first packing colloid 14 of molten state more, then cover the edge (for example being outer peripheral edges) that LED core 12 backward outer 14 mobile of the first packing colloids can be parked in sealing alignment layers 13, and form as heaving as the globule.Therefore, shape design that can be by sealing alignment layers 13, for example ring be located at LED core 12 around, to limit the flow range of the first packing colloid 14 and/or the second packing colloid 16, can reduce the generation of the glue phenomenon of overflowing.
Please refer to shown in Figure 3ly, it is the schematic side view of the another kind of light-emitting device 1a of preferred embodiment of the present invention.Light-emitting device 1 comprises a substrate 11, at least one LED core 12, a sealing alignment layers 13, location auxiliary body 15 and one first packing colloid 14.Wherein, with above-mentioned light-emitting device 1 difference place be to have increased location auxiliary body 15, it is arranged on the sealing alignment layers 13, and the areal extent that location auxiliary body 15 arranges can be roughly identical with sealing alignment layers 13, or in fact greater than the area of sealing alignment layers 13, and then cover sealing alignment layers 13.The material of location auxiliary body 15 can comprise a resin, a silica gel or a pottery, and at this, location auxiliary body 15 is high reflection resins, for example is white resin.Cohesive force by location auxiliary body 15 itself, for keeping the long-pending upper surface that tends to stay sealing alignment layers 13 of minimal surface, so just in case although the amount of some glue time location auxiliary body 15 is more, still can be parked in the edge of sealing alignment layers 13, and form as heaving as the globule.Then, behind 14 glue of the first packing colloid, contact with location auxiliary body 15.Occur with the situation that reduces the glue that overflows so can rest in the scope of sealing alignment layers 13 by location auxiliary body 15.Other assembly is not given unnecessary details at this in addition at above-mentioned existing detailed description.
Please refer to shown in Figure 4ly, it is the schematic side view of another light-emitting device 1b of preferred embodiment of the present invention.In the present embodiment, light-emitting device 1 can comprise also that one second packing colloid, 16, the second packing colloids 16 cover LED core 12 and the first packing colloid 14.Wherein, it can be indirect covering that the second packing colloid 16 covers LED core 12, because the first packing colloid 14 directly has been covered to LED core 12.Namely can automatically stop flow to the edge of sealing alignment layers 13 when the first packing colloid 14 and/or the second packing colloid 16 after, the edge here refers to the outer peripheral edges of sealing alignment layers 13.Behind the pending colloid curing schedule, the edge of the first packing colloid 14 and/or the second packing colloid 16 then can the upper edge at sealing alignment layers 13 of essence.And the reason that can cause this phenomenon mainly is because the cohesive force of the first packing colloid 14 and/or the second packing colloid 16 itself, for keeping the long-pending upper surface that tends to stay sealing alignment layers 13 of minimal surface, so just in case some during glue the first packing colloid 14 and/or second packing colloid 16 of molten state more, then cover LED core 12 backward outer the first mobile packing colloid 14 and/or 16 edges that can be parked in sealing alignment layers 13 of the second packing colloid, and form as heaving as the globule.Therefore, shape design that can be by sealing alignment layers 13, for example ring be located at LED core 12 around, to limit the flow range of the first packing colloid 14 and/or the second packing colloid 16, can reduce the generation of the glue phenomenon of overflowing.In addition, the first packing colloid 14 and/or the second packing colloid 16 can also comprise at least one material for transformation of wave length, become the light of any color with mixed light, in the present embodiment, then to have material for transformation of wave length in the second packing colloid 16, for example fluorescent material, phosphor powder or its combined hybrid are example in colloid.Certainly, material for transformation of wave length also can be a fluorescent adhesive tape, directly be sticked at the outer surface of the second packing colloid 16, or between the first packing colloid 14 and the second packing colloid 16.
In addition, owing to the second packing colloid 16 directly contacts with the first packing colloid 14, and the material of the first packing colloid 14 and the second packing colloid 16 is close, and therefore, the adhesive force of the second packing colloid 16 can be better.Whereby, can utilize the first packing colloid 14 as sticking together auxiliary layer, thin layer is set first and can not exclusively covers LED core 12, the second packing colloid 16 is set again, its thickness is greater than the first packing colloid 14, covering LED core 12 fully, and can promote its tack by the assistance of the first packing colloid 14.
Explanation is again, metal material (for example wire or die pad) in the tube core of the present invention setting area 111 can utilize same processing procedure to form with sealing alignment layers 13, for example, tube core setting area 111 can be to utilize same shielding and wire mark formation with sealing alignment layers 13.Thus, it is central in sealing alignment layers 13 set zones that tube core setting area 111 gets final product the position, and be arranged on LED core 12 on the tube core setting area 111, behind a glue processing procedure, the shape of the first packing colloid 14 and/or the second packing colloid 16 is located by sealing alignment layers 13 or is limited, so 12 energy positions of LED core are at the center of the first packing colloid 14 and/or the second packing colloid 16, do not arrange simultaneously with the metal material of tube core setting area 111 in the time of can avoiding the excessive glue-line of known techniques to arrange, easily cause repeatedly figure error (overlap error), and the center of causing LED core 12 to depart from the first packing colloid 14 and/or the second packing colloid 16, and then affect light shape or the colourity that LED core 12 is sent.
Please refer to shown in Figure 5ly, it is the schematic side view of another light-emitting device 1c of preferred embodiment of the present invention.In the present embodiment, light-emitting device 1 also can arrange a plurality of sealing alignment layers 13, and its quantity also will not limit.In the present embodiment take the sealing alignment layers 13 of two ring-types as example, the first packing colloid 14 and diameter are than 13 contrapositions of circlet shape sealing alignment layers; 16 ring-type sealing alignment layers 13 contrapositions larger with diameter of the second packing colloid.111 of tube core setting areas are central in a plurality of sealing alignment layers 13 set zones, and its processing procedure does not repeat them here at above-mentioned existing detailed description.By the setting of a plurality of sealing alignment layers 13, also can reduce the generation of the glue phenomenon of overflowing.
Please refer to shown in Figure 6ly, it is the schematic top plan view of the another kind of light-emitting device 1d of preferred embodiment of the present invention.In the present embodiment, be arranged on substrate 11 as example with a plurality of LED core 12 take the matrix arrangement mode.And substrate 11 can be printed circuit board (PCB) or a metal substrate that comprises plastic material, and the present invention is not restricted, at this take the printed circuit board (PCB) that comprises plastic material as example.A plurality of LED core 12 can be arranged in a linear, annular arrangement or arbitrary arrangement, and substrate 11 can be polygonal, circular or other shape arbitrarily.It is worth mentioning that, each sealing alignment layers 13d is respectively a sheet metal or a metal level in the present embodiment, for example be copper or silver or gold or its combination, and its area is greater than LED core 12, but area can be less than tube core setting area 111 (shown in dotted line), so can say that sealing alignment layers 13d position is in tube core setting area 111.At this, sealing alignment layers 13d makes Copper Foil as example take the copper metal, and respectively corresponding each LED core 12 of each sealing alignment layers 13d, forming matrix arranges, this with each sealing alignment layers 13d respectively corresponding LED core 12 be set to example, certainly, each sealing alignment layers 13d also can distinguish corresponding a plurality of LED core 12 settings.In addition, when sealing alignment layers 13d is metal material, for the phenomenon that prevents short circuit occurs, in sealing alignment layers 13d, be provided with independently conductive spacer P and dug perforate (via), independently conductive spacer P and perforate are connected to each other for this, and other circuit that can see through perforate and substrate 11 when LED core 12 routings behind conductive spacer P be made electrically connect.
Fig. 7 is the again aspect schematic diagram of a kind of light-emitting device 1e of preferred embodiment of the present invention, please refer to shown in Figure 7ly, and light-emitting device 1e also comprises a barricade layer 17, and it is arranged on substrate 11, and is arranged on an identical side with sealing alignment layers 13.Has a clearance G between barricade layer 17 and the sealing alignment layers 13.The material of barricade layer 17 can comprise a metal or an alloy or an anti-welding lacquer or its combination, and barricade layer 17 is metal levels in the present embodiment.And the effect of barricade layer 17, main some glue amount when the first packing colloid 14 and/or the second packing colloid 16 is too many, and then when flowing out the scope of sealing alignment layers 13, clearance G and barricade layer 17 can limit excessive glue, to allow the first unnecessary packing colloid 14 and/or the second packing colloid 16 stay in the clearance G.Because can be by the size of clearance G, to determine open ended excessive glue amount, therefore be not to utilize the height of barricade layer 17 to stop excessive glue, so the height of barricade layer 17 can less than, more than or equal to the height of sealing alignment layers 13, present embodiment equals the height of sealing alignment layers 13 as example take the height of barricade layer 17.
Fig. 8 is the again aspect schematic diagram of a kind of light-emitting device 1f of preferred embodiment of the present invention, please refer to shown in Figure 8ly, and light-emitting device 1f also can comprise a material layer 18, is arranged on substrate 11, and is right after at sealing alignment layers 13.Material layer 18 can be that a metal or an alloy or an anti-welding lacquer or its combination or material layer 18 can be the parts of substrate 11, for example be reflective metal layer or circuit layer or the welding resisting layer (solder resist layer) on the substrate 11, present embodiment is that anti-welding lacquer is as example take the material of material layer 18.Wherein, material layer 18 height are less than sealing alignment layers 13, so be not to stop excessive glue with its height as barricade, main purpose is to prevent that the light that LED core sends from escaping toward orientation substrate from the edge of sealing alignment layers 13 with Louing, be arranged on sealing alignment layers 13 so material layer 18 needs to be close to.
Please refer to shown in Figure 9ly, Fig. 9 is the flow chart of manufacture method of a kind of light-emitting device 1 of preferred embodiment of the present invention, is to be applied in above-mentioned light-emitting device 1, and its manufacture method comprises that step S91 is to step S93.In step S91, a sealing alignment layers 13 is set at a substrate 11.In step S92, at least one LED core 12 is set in a tube core setting area 111 of substrate 11.In step S93, one first packing colloid 14 is set to cover at least one LED core 12 and to contact with sealing alignment layers 13.
Please refer to shown in Figure 10ly, Figure 10 is the flow chart of manufacture method of the another kind of light-emitting device 1a of preferred embodiment of the present invention, is to be applied in above-mentioned light-emitting device 1a, and its manufacture method comprises that step S101 is to step S104.In step S101, a sealing alignment layers 13 is set at a substrate 11.In step S 102, at least one LED core 12 is set in a tube core setting area 111 of substrate 11.In step S103, a location auxiliary body 15 is set at sealing alignment layers 13.In step S104, one first packing colloid 14 is set to cover at least one LED core 12 and to contact with location auxiliary body 15.
In addition, the method for producing light-emitting device of present embodiment can also comprise: cover one second packing colloid 16 at LED core 12 and the first packing colloid 14, and the upper edge at sealing alignment layers 13 of the edge essence of the second packing colloid 16; One barricade layer 17 is set at substrate 11, and is arranged on an identical side of substrate 11 with sealing alignment layers 13, and have a clearance G between barricade layer 17 and the sealing alignment layers 13; One material layer 18 is set at substrate 11, and is right after at sealing alignment layers 13.Above-mentioned method step is all described respectively in a plurality of embodiment of aforementioned light-emitting device 1,1a～1f, no longer repeats at this.
In sum, light-emitting device of the present invention is by being arranged on the sealing alignment layers on the substrate, so that packing colloid and the contraposition of sealing alignment layers, and the edge essence of packing colloid is upper at the edge of sealing alignment layers, and then reduce the generation of the glue that overflows.Thus, do not need LED core is arranged in the reflection housing, therefore can not reduce the rising angle of LED core, and then can improve the quality of products.
The above only is illustrative, and non-limiting.Anyly do not break away from spirit of the present invention and category, and to its equivalent modifications of carrying out or change, all should be included in the claim limited range.
Claims (19)
1. a light-emitting device is characterized in that, comprising:
One substrate has a tube core setting area;
At least one LED core is arranged on described tube core setting area;
One sealing alignment layers is arranged on described substrate; And
One first packing colloid, the described LED core of at least part of covering also contacts with described sealing alignment layers.
2. a light-emitting device is characterized in that, comprising:
One substrate has a tube core setting area;
At least one LED core is arranged on described tube core setting area;
One sealing alignment layers is arranged on described substrate;
One location auxiliary body is arranged on described sealing alignment layers; And
One first packing colloid, the described LED core of at least part of covering also contacts with described location auxiliary body.
3. light-emitting device according to claim 1 and 2 is characterized in that, also comprises:
One second packing colloid covers described LED core and described the first packing colloid.
4. light-emitting device according to claim 3 is characterized in that, the upper edge at described sealing alignment layers of the edge essence of described the second packing colloid.
5. light-emitting device according to claim 3 is characterized in that, described the second packing colloid covers described sealing alignment layers, and the upper outer rim at described sealing alignment layers of essence.
6. light-emitting device according to claim 1 and 2 is characterized in that, the material of described sealing alignment layers comprises a metal or an alloy or an anti-welding lacquer.
7. light-emitting device according to claim 1 and 2 is characterized in that, described sealing alignment layers is a patterned layer.
8. light-emitting device according to claim 1 and 2 is characterized in that, described sealing alignment layers ring is located at described tube core setting area.
9. light-emitting device according to claim 1 and 2 is characterized in that, described sealing alignment layers position is in described tube core setting area.
10. light-emitting device according to claim 1 and 2 is characterized in that, also comprises:
One barricade layer is arranged on described substrate, and is arranged on an identical side with described sealing alignment layers.
11. light-emitting device according to claim 10 is characterized in that, has a gap between described barricade layer and the described sealing alignment layers.
12. light-emitting device according to claim 1 and 2 is characterized in that, also comprises:
One material layer is arranged on described substrate, and is right after at described sealing alignment layers.
13. light-emitting device according to claim 12 is characterized in that, described material layer height is less than described sealing alignment layers.
14. light-emitting device according to claim 3 is characterized in that, described the first packing colloid and/or described the second packing colloid include material for transformation of wave length.
15. the manufacture method of a light-emitting device is characterized in that, comprising:
One sealing alignment layers is set at a substrate;
At least one LED core is set in a tube core setting area of described substrate; And
One first packing colloid is set to cover at least one LED core and to contact with described sealing alignment layers.
16. the manufacture method of a light-emitting device is characterized in that, comprising:
One sealing alignment layers is set at a substrate;
At least one LED core is set in a tube core setting area of described substrate;
One location auxiliary body is set at described sealing alignment layers; And
One first packing colloid is set to cover at least one LED core and to contact with described location auxiliary body.
17. according to claim 15 or the manufacture method of 16 described light-emitting devices, it is characterized in that, also comprise:
Cover one second packing colloid at described LED core and described the first packing colloid, and the upper edge at described sealing alignment layers of the edge essence of described the second packing colloid.
18. according to claim 15 or the manufacture method of 16 described light-emitting devices, it is characterized in that, also comprise:
One barricade layer is set at described substrate, and is arranged on the identical side of described substrate with described sealing alignment layers.
19. according to claim 15 or the manufacture method of 16 described light-emitting devices, it is characterized in that, also comprise:
One material layer is set at described substrate, and is right after at described sealing alignment layers.
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| CN2011101903223A CN102867903A (en) | 2011-07-08 | 2011-07-08 | Light emitting device and manufacturing method thereof |
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| CN2011101903223A CN102867903A (en) | 2011-07-08 | 2011-07-08 | Light emitting device and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103682048A (en) * | 2013-12-26 | 2014-03-26 | 东莞市港照照明科技有限公司 | LED (Light-Emitting Diode) package structure and package method |
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| CN101452986A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for white light emitting diode device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682048A (en) * | 2013-12-26 | 2014-03-26 | 东莞市港照照明科技有限公司 | LED (Light-Emitting Diode) package structure and package method |
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