CN102816525A - Heat-conductive coating - Google Patents
Heat-conductive coating Download PDFInfo
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Abstract
The invention relates to a heat-conductive coating. The heat-conductive coating is mainly formed by 4-25wt% of heat-conductive powder, and the balance a synthetic resin, wherein the heat-conductive powder comprises silica, titanium dioxide, zirconium silicate and boron nitride, and also comprises auxiliary materials comprising alumina, silicon carbide and the like; and the synthetic resin is formed by fully mixing a resin with at least one solvent, and the resin is one selected from an epoxy resin, a polyester, an acrylic resin and an organic silicon resin. The heat-conductive coating which can be coated on an electronic device or a mechanical device is formed through the above formula, can rapidly conduct waste heat to the outside for heat dissipation to maintain the operation temperature of the electronic device or the mechanical device, or can rapidly transmit the heat to an article to be heated.
Description
Technical field
The relevant a kind of heat-conductive coating of coating the heating element surface of the present invention is meant a kind of heating element used heat is derived dissipation fast to the outside coating that absorbs especially.
Background technology
Sci-tech product makes rapid progress now, develop at a tremendous pace especially, so the generation of energy consumption problem thereby expansion; At present countries in the world invariably the demand carbon reduction preserve our planet, yet, electronic product or the mechanical means power that it produced of when making, need worrying; Also must avoid product facility in operation, to form too much used heat; And then cause product facility to be damaged, therefore, in the Application Areas of heat radiation; Generally be to adopt material to design a heat-sink unit to carry out the used heat derivation, to keep the operational temperature of electronic product and mechanical means with high thermal conductance.
In general; If machinery or electronic installations such as heating element product LED light fixture, motor, the cold coal heat extraction of air-conditioning, mainframe computer, cpu chip, power packs, it all can produce used heat in operation, if this used heat can not be discharged rapidly and effectively; Product is operated in acceptable TR; Then device product will produce undesirable conditions such as efficient is not good, energy consumption improves, the life-span shortens, if used heat can be discharged the cooling running, then aforementioned undesirable condition will be improved and more can save electricity consumption; Heat radiation like conditioning unit well then can increase the EER value, and the every raising 0.1 of this EER value can be saved 4% power consumption approximately.In addition,, then promptly heat is passed on the article that need heating, likewise can saves about power consumption if heating element water-heater, heating kettle, electrode pliers, electric soupspoon etc. convert electrical energy into the product of heat energy.
Because heat-sink unit is an important factor that influences heat dissipation with the extraneous area size that contacts; Be the bigger the better so when the design heat-sink unit, all can seek area, but the material surface of general high thermoconductivity presents smooth state but not presents concavo-convex state, the area that therefore contacts with the external world promptly is restricted; Make radiating effect upwards to promote; And product facility requirement at present is compact, and the traditional heat-dissipating unit possibly have excessive problem, needs design again.
Yet; Partly too thin short and small product facility can't extraly install a heat-sink unit additional often; Therefore, under the situation that does not change the design of original electronic product or mechanical means, just need to use a kind of heat radiation coating of coating electronic product or mechanical means surface this moment; Carry out the quick derivation of used heat, make the radiating effect of its heat abstractor can effectively obtain to promote.
Summary of the invention
Main purpose of the present invention; Aim to provide a kind of heat-conductive coating of coating electronic installation or mechanical means; Can rapidly used heat outwards be derived extraneous dissipation, keeping the operational temperature of electronic installation or mechanical means, or apace heat is passed to heated.
Secondary objective of the present invention is that heat-conductive coating can add the product that colorant cooperates various different colour systems, and the product that increases after being coated with is attractive in appearance.
For reaching said purpose, heat-conductive coating of the present invention comprises: a heat conduction powder comprises: a silicon-dioxide, and its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; One titanium oxide, its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating; One zirconium silicate, its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; And boron nitride, its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating.And a synthetic resins, above-mentioned synthetic resins cooperates the weight percent of mentioned component to be mixed into 100%.
Wherein, the particle diameter of above-mentioned silicon-dioxide is 10 nanometers to 20 micron, and the particle diameter of above-mentioned titanium oxide is 10 nanometers to 20 micron, and the particle diameter of above-mentioned zirconium silicate is 10 nanometers to 20 micron, and the particle diameter of above-mentioned SP 1 is 10 nanometers to 10 micron.
Heat-conductive coating of the present invention can further comprise a dispersion agent, a skimmer and an anti-sedimentation agent, and wherein, the weight percent of above-mentioned dispersion agent accounts for 0.5%～5% of above-mentioned heat-conductive coating.The weight percent of above-mentioned anti-sedimentation agent accounts for 0.5%～5% of above-mentioned heat-conductive coating again.And the weight percent of above-mentioned skimmer accounts for 0.5%～5% of above-mentioned heat-conductive coating.This moment, synthetic resins cooperated the weight percent of above-mentioned all the components to be mixed into 100%.
In a possible embodiments; Above-mentioned dispersion agent is constituted by unsaturated polyamine ester and low molecular acid property polyester, polyphosphazene polymer amino acid and alkanamine, polyphosphazene polymer amino acid and polyamine acid amides, the copolyesters that contains acidic-group polymkeric substance, tool pigment affinity groups, the polymer bank end copolymerization object, the polymer alkyl alcoholamine acid amides that contain close pigment group, at least a of polymeric amide that contains acid pigment affinity groups high-molecular copolymer, PEMULEN TR2 or unsaturated polyester amino acid; When its when being two or more, each composition can be formed with the ratio of any weight.And above-mentioned anti-sedimentation agent is selected from ZGK 5 or organosilicon.
Above-mentioned skimmer can be made up of polymethyl siloxane or polymeric amide, but this only use into convenient for example, be not in a limitative way the composition of skimmer.
Again, above-mentioned synthetic resins is to be made up of a resin and at least one solvent thorough mixing.Wherein, above-mentioned resin is selected from the wherein a kind of of epoxy resin, polyester, vinyl resin and silicone resin; And above-mentioned solvent is selected from butanone, chloroform, methylene dichloride, Glacial acetic acid min. 99.5, benzene,toluene,xylene, 1-Methoxy-2-propyl acetate, n-butyl acetate and aforementioned any two above mixtures constitute.When its when being two or more, each composition can be formed with the ratio of any weight.
The present invention is in another preferred embodiment, and above-mentioned heat conduction powder comprises a silicon-dioxide, and its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; One titanium oxide, its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating; One zirconium silicate, its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; Boron nitride, its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating; One aluminium sesquioxide, its weight percent accounts for 1%～5% of above-mentioned heat-conductive coating, and a silit, and its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating.Further, the synthetic resin with the weight percent of thermally conductive powder mixed into 100%
Wherein, The particle diameter of above-mentioned aluminium sesquioxide is 10 nanometers to 10 micron; And the particle diameter of above-mentioned silit is 10 nanometers to 25 micron, and other is identical with aforementioned preferred embodiment like the size in silicon-dioxide, titanium oxide, zirconium silicate and boron nitride, does not give unnecessary details at this.
In aforementioned two preferred embodiments; Heat-conductive coating of the present invention can be behind above-mentioned heat conduction powder and synthetic resins thorough mixing; Further add a colorant again,, increase the aesthetic property that product is accomplished in the heat-conductive coating coating the heat-conductive coating furnishing is fit to the corresponding colour system of various variant prodns.
Can know by above stated specification, the invention has the advantages that:, heat energy is transmitted fast with conduction, convection current and three kinds of modes of radiation owing to formed efficient thermal conduction coating.The present invention is good with specific refractory poweres such as aluminium, boron, titanium, silicon, zirconiums, absorption axes heat source ability strong and the good element of thermal conductivity is processed into oxide compound, nitride and carbide; And it is ground to the powder particle of 10 nanometers in 25 micrometer ranges, again with specified proportion evenly and synthetic resins be mixed and made into.Wherein:
Radiant section: because of it has high light source specific refractory power and conductivity, can mainly adopt preset proportion and particle diameter to sneak into, can reach optimal absorption, transmit photothermal effect with disperseing towards three-dimensional space rapidly after light and the thermal source importing with silicon, titanium, zirconium, boron.
Conduction portion: because the oxide compound or the nitride of aluminium, boron, zirconium, element silicon are good conductor, and are controlled at suitable size and ratio, so SP 1, zirconium silicate, aluminium sesquioxide, silit employing preset proportion are sneaked into and can be reached best conducting effect.
Ginkgo Biloba Leaf Extract and radiation part: play the part of most important role with titanium and boron, but the lethality of its barrier ultraviolet ray and radiation, this can reach protects resin can main thermal source be shielded outside, or outside transferring to rapidly, can play the effect of protection and heat biography.
Convection section: because of the heat conduction powder is the nanometer size, make specific surface area double, synthetic materials strengthens with the area that air or other liquid contact equally, lets heat-conductive coating form convection action more easily, helps the product heat radiation.
Description of drawings
Fig. 1 is the thermograph chart of undressed cpu heat,
Fig. 2 is for spray the thermograph chart of the cpu heat of heat sink material of the present invention.
Embodiment
For ease of further structure of the present invention, use and characteristic thereof being had darker clear and definite full and accurate understanding of one deck and understanding, enumerate preferred embodiment at present, conjunction with figs. specifies as follows:
At first; What the transmission of heat energy was leaned on is that conduction, convection current and three kinds of modes of radiation are reached; The present invention will have the special elements of above-mentioned propagation function with the high-efficiency thermal coating that pass to loose, and be mixed and made into heat through processing and pass splendid heat conduction powder, and the synthetic resins that is equipped with suitable proportion form a heat-conductive coating.
In first preferred embodiment, heat-conductive coating of the present invention comprises: a heat conduction powder comprises: a silicon-dioxide (SiO
2), its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; One titanium oxide (TiO
2), its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating; One zirconium silicate (ZrSiO
4), its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; And boron nitride (BN), its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating.And a synthetic resins, above-mentioned synthetic resins cooperates the weight percent of above-mentioned heat conduction powder to be mixed into 100%.
Wherein, The particle diameter of above-mentioned silicon-dioxide is that 10 nanometers (nm) are to 20 microns (um); The particle diameter of above-mentioned titanium oxide is 10 nanometers to 20 micron (um), the particle diameter of above-mentioned zirconium silicate be 10 nanometers (nm) to 20 microns (um), and the particle diameter of above-mentioned SP 1 is that 10 nanometers (nm) are to 10 microns (um).
Because powder size of the present invention is between nanometer and micron; Often having the reunion effect between the powder takes place; Therefore; In order to prevent that the reunion effect takes place between the powder, heat-conductive coating of the present invention can further add a dispersion agent, and the weight percent of above-mentioned dispersion agent accounts for 0.5%～5% of above-mentioned heat-conductive coating.
Can be easy to generate bubble man-hour in order to prevent that powder from adding in addition, heat-conductive coating of the present invention can further add a skimmer, and the weight percent of above-mentioned skimmer accounts for 05%～5% of above-mentioned heat-conductive coating.
In addition; Because the bigger relation of powder proportion, powder tend to rapid subsidence to the synthetic resins bottom, also need stir during use; And also can cause powder to disperse uneven problem; So heat-conductive coating of the present invention can further add an anti-sedimentation agent in addition, the weight percent of above-mentioned anti-sedimentation agent accounts for 0.5%～5% of above-mentioned heat-conductive coating, to prevent foregoing problems.
In a possible embodiments, above-mentioned dispersion agent is selected from unsaturated polyamine ester and low molecular acid property polyester, polyphosphazene polymer amino acid and alkanamine, polyphosphazene polymer amino acid and polyamine acid amides, contains the acidic-group polymkeric substance, the copolyesters of tool pigment affinity groups, the polymer bank end copolymerization object, the polymer alkyl alcoholamine acid amides that contain close pigment group, at least a of polymeric amide that contains acid pigment affinity groups high-molecular copolymer, PEMULEN TR2 or unsaturated polyester amino acid are formed.And above-mentioned anti-sedimentation agent is selected from ZGK 5 or organosilicon.
Above-mentioned again synthetic resins is to be made up of a resin and at least one solvent thorough mixing; It mainly acts on and is to assist above-mentioned heat conduction powder to be attached to treat the heat-dissipating thing surface; And still have weather-proof, corrosion-resistant, self-cleaning; Effects such as high temperature resistant and strong adhesion are assisted the maximum effect of above-mentioned heat conduction powder performance.
Wherein, Resin of the present invention can be selected in response to the conditional request of the product of waiting to dispel the heat; In a preferred embodiment; Be selected from the wherein a kind of of epoxy resin, polyester, vinyl resin and silicone resin, the aforesaid propylene acid resin has the characteristics of air dry, baking and weathering resistance, and above-mentioned silicone resin has baking and resistant to elevated temperatures characteristics.Above-mentioned solvent is selected from butanone, chloroform, methylene dichloride, Glacial acetic acid min. 99.5, benzene,toluene,xylene, 1-Methoxy-2-propyl acetate, n-butyl acetate and aforementioned any two above mixtures and constitutes.
In second preferred embodiment, heat conduction powder of the present invention comprises: a silicon-dioxide (SiO
2), its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; One titanium oxide (TiO
2), its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating; One zirconium silicate (ZrSiO
4), its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; And boron nitride (BN), its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating; One aluminium sesquioxide (Al
2O
3), its weight percent accounts for 1%～5% of above-mentioned heat-conductive coating, and a silit (SiC), and its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating.And above-mentioned synthetic resins cooperates the weight percent of above-mentioned heat conduction powder to be mixed into 100%.
Wherein, The particle diameter of above-mentioned aluminium sesquioxide is that 10 nanometers (nm) are to 10 microns (um); And the particle diameter of above-mentioned silit is that 10 nanometers (nm) are to 25 microns (um); Other is identical with aforementioned preferred embodiment like the size in silicon-dioxide, titanium oxide, zirconium silicate and boron nitride, and this does not give unnecessary details again.
In aforementioned two preferred embodiments; Heat-conductive coating of the present invention can be behind above-mentioned heat conduction powder and synthetic resins thorough mixing; Further add a colorant again,, increase the aesthetic property that product is accomplished in the heat-conductive coating coating the heat-conductive coating furnishing is fit to the corresponding colour system of various variant prodns.
The present invention can pass effect by the heat that following several kinds of modes combine with electronic product or mechanical means to reach best.
1. with the coating+baking of static powder.
2. liquid spraying+baking.
3. liquid spraying self-drying type.
4. spray a jar type.
5. heat stable resin baking can be high temperature resistant.
Reality of the present invention is tested in the test report of computer CPU heat sink and test data following:
One, test purpose:
Heat-conductive coating of the present invention is sprayed at computer CPU heat sink, confirms whether cpu heat can reach preferable radiating and cooling effect, and then keep the operational temperature of CPU, let the stable performance of computingmachine bulk treatment.
Two, testing apparatus and condition:
One of mainframe computer, monitoring is with one in notes shape computingmachine, one of multi-point temp testing recorder, thickness gauge.
Three, tested object and test position:
Tested object: two of computer CPU heat sinks, fan of this scatterer band.
TP: scatterer and CPU contact surface (T1), CPU radiating fin (T2), cpu heat periphery (T3), envrionment temperature (T4).
Four, test event:
To levy test probe case presumptive test point and be fixed on the cpu heat, again the cpu heat normal mounting on CPU, all confirm host housing on the errorless bonnet, begin the test.Below test is all carried out according to same steps as.Test one group of original TP temperature of not carrying out radiating treatment, for comparing in advance; To cpu heat spraying heat-conductive coating of the present invention, the spray film thickness is 20um～25um again, at last the cpu heat of having handled is carried out the same terms test, and the temperature that writes down each TP compares.Following test data all obtains under cpu fan has the state of operation.
Five, test result:
With reference to Fig. 1, be the thermograph chart of untreated cpu heat, data are seen table 1 among Fig. 1:
Table 1
| Mark | TP | Temperature peak (MAX) | Temperature minimum value (MIN) | Temperature-averaging value (AVG) |
| T1 | Scatterer and CPU contact surface | ?39.7℃ | ?33.5℃ | ?36.3℃ |
| T2 | The CPU radiating fin | ?38.8℃ | ?33.0℃ | ?35.3℃ |
| T3 | The cpu heat periphery | ?37.6℃ | ?32.4℃ | ?34.5℃ |
| T4 | Envrionment temperature | ?27.6℃ | ?26.7℃ | ?27.0℃ |
With reference to Fig. 2, be the thermograph chart of the cpu heat that sprays heat sink material, data are seen table 2 among Fig. 2:
Table 2
| Mark | TP | Temperature peak (MAX) | Temperature minimum value (MIN) | Temperature-averaging value (AVG) |
| T1 | Scatterer and CPU contact surface | ?34.7℃ | ?31.3℃ | ?33.4℃ |
| T2 | The CPU radiating fin | ?32.6℃ | ?29.9℃ | ?32.1℃ |
| T3 | The cpu heat periphery | ?33.3℃ | ?30.6℃ | ?32.5℃ |
| T4 | Envrionment temperature | ?28.5℃ | ?27.6℃ | ?28.0℃ |
Six, temperature is relatively:
| Explanation | Be untreated | Handle | With temperature approach | Cooling efficient |
| T1 | 39.7 | 34.7 | 5.0 | 12.5％ |
| T2 | 38.8 | 32.6 | 6.2 | 15.9％ |
| T3 | 37.6 | 33.3 | 4.3 | 11.4％ |
| T4 | 27.6 | 28.5 | -0.9 (ring temperature rise 0.9) | X |
(annotate: following temperature be ℃ T1: scatterer and CPU contact surface, and the T2:CPU radiating fin, the T3:CPU scatterer is peripheral, T4: envrionment temperature)
Seven, conclusion:
Through test relatively, the computer CPU heat sink of spraying heat-conductive coating of the present invention has preferable cooling-down effect, and special TP all has cooling, scatterer when fan running work is arranged and CPU contact surface T1, and cooling efficient reaches 12.5%; CPU radiating fin T2, cooling efficient reaches 15.9%; Cpu heat periphery T3, cooling efficient reaches 11.4%.
By above-mentioned listed, and through experiment and application verification, heat-conductive coating of the present invention has the following advantages:
1. thermal conductivity is high: the appearance coating heat-conductive coating of the present invention of the product that will dispel the heat can reach 4%～45% radiating effect; See through heat-conductive coating of the present invention in addition and can rapidly heat energy be delivered to the article that need heating, increase heat efficiency and reach the power saving purpose.
2. suitability is high: cooperate different resins; Have high temperature resistant, corrosion-resistant, anti-weather and self-cleaning; And can various color change etc. function; Can ensure the work-ing life and the end-use performance of product, the form that in addition can process air dry, dry, spray jar, liquid spray, powder spraying in response to various different demands.
In sum; Heat-conductive coating of the present invention sees through the heat conduction powder and is made up of silicon-dioxide, titanium oxide, zirconium silicate and SP 1; And can add subsidiary material aluminium sesquioxide and silit; Cooperate the synthetic resins of suitable proportion,, heat energy is transmitted fast with conduction, convection current and three kinds of modes of radiation to form efficient thermal conduction coating; In addition, the colorant that heat-conductive coating can add in addition setpoint color cooperates the product of various different colour systems, and the product that increases after the coating is attractive in appearance.
The above embodiment that lifts only uses to convenient explanation the present invention is not in a limitative way, not from the present invention's spirit category, be familiar with industry technician various simple and easy distortion and the modification that can do, all must include in the scope of patent protection of the present invention.
Claims (11)
1. heat-conductive coating is characterized in that: comprise:
One heat conduction powder comprises: a silicon-dioxide, and its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; One titanium oxide, its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating; One zirconium silicate, its weight percent accounts for 1%～20% of above-mentioned heat-conductive coating; And boron nitride, its weight percent accounts for 1%～10% of above-mentioned heat-conductive coating; And
One synthetic resins, above-mentioned synthetic resins cooperate the weight percent of mentioned component to be mixed into 100%.
2. heat-conductive coating according to claim 1 is characterized in that: said heat-conductive coating further comprises a dispersion agent, and the weight percent of above-mentioned dispersion agent accounts for 0.5%～5% of above-mentioned heat-conductive coating.
3. heat-conductive coating according to claim 1 is characterized in that: said heat-conductive coating further comprises a skimmer, and the weight percent of above-mentioned skimmer accounts for 0.5%～5% of above-mentioned heat-conductive coating.
4. heat-conductive coating according to claim 1 is characterized in that: said heat-conductive coating more comprises an anti-sedimentation agent, and the weight percent of above-mentioned anti-sedimentation agent accounts for 0.5%～5% of above-mentioned heat-conductive coating.
5. heat-conductive coating according to claim 4 is characterized in that: said anti-sedimentation agent is selected from ZGK 5 and organosilicon is formed.
6. heat-conductive coating according to claim 1; It is characterized in that: the particle diameter of said silicon-dioxide is 10 nanometers to 20 micron; The particle diameter of above-mentioned titanium oxide is 10 nanometers to 20 micron; The particle diameter of above-mentioned zirconium silicate is 10 nanometers to 20 micron, and the particle diameter of above-mentioned SP 1 is 10 nanometers to 10 micron.
7. heat-conductive coating according to claim 1 is characterized in that: said synthetic resins is to be made up of a resin and at least one solvent thorough mixing.
8. heat-conductive coating according to claim 7 is characterized in that: said resin is selected from the wherein a kind of of epoxy resin, polyester, vinyl resin and silicone resin.
9. heat-conductive coating according to claim 1; It is characterized in that: said heat conduction powder further comprises an aluminium sesquioxide and a silit; The weight percent of above-mentioned aluminium sesquioxide accounts for 1%～5% of above-mentioned heat-conductive coating, and the weight percent of above-mentioned silit accounts for 1%～10% of above-mentioned heat-conductive coating.
10. heat-conductive coating according to claim 9 is characterized in that: the particle diameter of said aluminium sesquioxide is 10 nanometers to 10 micron, and the particle diameter of above-mentioned silit is 10 nanometers to 25 micron.
11. heat-conductive coating according to claim 1 is characterized in that: said heat-conductive coating further adds a colorant behind above-mentioned heat conduction powder and synthetic resins thorough mixing.
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