CN102798024A - Multicolor-integrated LED (Light Emitting Diode) device - Google Patents

Multicolor-integrated LED (Light Emitting Diode) device Download PDF

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Publication number
CN102798024A
CN102798024A CN2012103245904A CN201210324590A CN102798024A CN 102798024 A CN102798024 A CN 102798024A CN 2012103245904 A CN2012103245904 A CN 2012103245904A CN 201210324590 A CN201210324590 A CN 201210324590A CN 102798024 A CN102798024 A CN 102798024A
Authority
CN
China
Prior art keywords
light emitting
copper seat
positive
led
negative electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012103245904A
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Chinese (zh)
Inventor
肖怀忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Xuhongxin Photoelectric Technology Co Ltd
Original Assignee
Zhongshan Xuhongxin Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhongshan Xuhongxin Photoelectric Technology Co Ltd filed Critical Zhongshan Xuhongxin Photoelectric Technology Co Ltd
Priority to CN2012103245904A priority Critical patent/CN102798024A/en
Publication of CN102798024A publication Critical patent/CN102798024A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses a multicolor-integrated LED (Light Emitting Diode) device comprising a machine body, a copper seat is arranged in the middle of the machine body, the multicolor-integrated LED device is characterized by at least comprising blue, red, yellow, white and green LED light emitting chips are arranged on the copper seat, a welding region is arranged at the periphery of the copper seat, and anode and cathode welding wire chips of the LED light emitting chips are arranged on the welding region; the LED light emitting chips are respectively connected with the respective anode and cathode welding wire chips through gold wires; anode and cathode pins of the LED light emitting chips are arranged at the periphery of the machine body, and the anode and cathode pins of the LED light emitting chips are respectively connected with the corresponding anode and cathode welding wire chips through the gold wires; a bulb cap base is arranged at the periphery of the welding region; and a bulb cap is arranged on the bulb cap base for covering the copper seat and the welding region. The device disclosed by the invention integrates the five colors of blue, red, yellow, white and green or more colors and reasonably matches the colors to guarantee more colors and more brilliant effect so as to generate a colorful light fitting application effect to create a good decoration effect.

Description

A kind of LED matrix of polychrome unification
Technical field
The present invention relates to multi-colored led device technique field, the concrete LED matrix that relates to a kind of polychrome unification.
Background technology
In more and more advocating energy-conservation current social, the LED lamp has caused concern more and more widely with its many advantage and progressively has been applied in the middle of numerous lighting fields.LED is a kind of new type of solid state light source, has advantages such as simple in structure, in light weight, that volume is little, consume energy less, response is fast, shock resistance is good, easy to use, belongs to energy-conservation environmental protection lighting device.Under same intensity of illumination, the power consumption of LED light fixture and life-span thereof all obviously are superior to incandescent lamp, are a kind of light sources of tool development prospect of 21 century.But also there are many deficiencies at present in the LED lamp, and for example, partial L ED lamp is lighted or single bright orange light time at polychrome, and the bright not good situation of situation appears in other look, causes the colour mixture poor effect, has influenced use.
Summary of the invention
The objective of the invention is to solve the colour mixture effect problem that exists in the prior art, a kind of good decoration effect that has is provided, can promote the LED matrix of the polychrome unification of color effect.
The present invention is achieved through following technical scheme:
The LED matrix of polychrome unification; Comprise body, the middle part of said body is provided with the copper seat, and said copper seat is provided with and comprises indigo plant, red, yellow, white, green LED luminescence chip at least; Be provided with the weld zone around the copper seat, the weld zone is provided with the positive and negative electrode bonding wire sheet of each LED luminescence chip; Said LED luminescence chip links to each other through gold thread with separately positive and negative electrode bonding wire sheet respectively; The periphery of said body is provided with the positive and negative electrode pin of said LED luminescence chip, and the positive and negative electrode bonding wire sheet that the positive and negative electrode pin of each LED luminescence chip is corresponding with it respectively links to each other through gold thread; Around the weld zone, be provided with bulb lid pedestal; Bulb lid pedestal is provided with the bulb lid said copper seat and weld zone is hidden.
The positive and negative electrode bonding wire sheet symmetry of said LED luminescence chip is located at the both sides of weld zone.
The positive and negative electrode pin of said LED luminescence chip respectively with their corresponding both sides that are located at said body of positive and negative electrode bonding wire sheet.
Said copper seat is circular, and diameter is equal to or greater than 4.5mm.
Usefulness of the present invention is:
1, apparatus of the present invention collection comprises indigo plant, red, yellow, white, the green five colors or more colors or is one; Reasonably combined, make color more and distincter, make the stage effect of lamp applications more bright and colourful; Good decoration effect is provided, has possessed preferable practicality.
The heat that produces when 2, large diameter copper seat can be worked product is rapidly derived above the radiator, and play an important role the service life that increases product.
3, do not appoint charged current to pass through between chip and the copper seat, accomplish that fully electric heating separates, the strong antistatic behaviour of product is had greatly improved.
4, can realize panchromatic mixed effect, traditional RGB is three-in-one can only realize for seven color mixing, and apparatus of the present invention have increased white light and the such collocation of gold-tinted has realized panchromatic mixing fully, make color abundant more distinct.
Description of drawings
To combine embodiment and accompanying drawing that the present invention is made further detailed description below:
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the upward view of Fig. 1.
The specific embodiment
Like Fig. 1, shown in Figure 2; The LED matrix of polychrome unification; Comprise body 28, the middle part of body 28 is provided with circular copper seat 20, and diameter is equal to or greater than 4.5mm; Copper seat 20 is provided with and comprises indigo plant, red, yellow, white, green LED luminescence chip 25,26,24,23,22; Be provided with weld zone 27 around the copper seat, one side the anodal bonding wire sheet 15,14,13,12,11 that is respectively equipped with indigo plant, red, yellow, white, green LED luminescence chip 25,26,24,23,22 on the weld zone 27, the another side on the weld zone 27 is respectively equipped with the negative pole bonding wire sheet 16,17,18,19,21 of indigo plant, red, yellow, white, green LED luminescence chip 25,26,24,23,22; Each LED luminescence chip 25,26,24,23,22 links to each other through gold thread with separately anodal bonding wire sheet 15,14,13,12,11 respectively, links to each other through gold thread with separately negative pole bonding wire sheet 16,17,18,19,21 respectively simultaneously; One side of body 28 is respectively equipped with the anodal pin 1,2,3,4,5 of LED luminescence chip 25,26,24,23,22; Anodal pin 1,2,3,4,5 links to each other with anodal bonding wire sheet 15,14,13,12, the 11 corresponding gold threads that also pass through respectively; The opposite side of body 28 is provided with the negative pole pin 6,7,8,9,10 of LED luminescence chip 25,26,24,23,22, and negative pole pin 6,7,8,9,10 is corresponding and continuous through gold thread with negative pole bonding wire sheet 16,17,18,19,21 respectively; 27 the bulb that is provided with on every side covers pedestal 29 in the weld zone, and bulb lid pedestal 29 is provided with bulb lid 30 with said copper seat 20 and weld zone 27 coverings.
The quantity of the LED luminescence chip among the present invention is not limited to the five colors, can adopt more color.
Should be appreciated that above-mentioned described specific embodiment only in order to explanation the present invention, and be not used in qualification the present invention.

Claims (4)

1. the LED matrix of polychrome unification; Comprise body; The middle part of said body is provided with the copper seat; It is characterized in that said copper seat is provided with comprises indigo plant, red, yellow, white, green LED luminescence chip at least, is provided with the weld zone around the copper seat, and the weld zone is provided with the positive and negative electrode bonding wire sheet of each LED luminescence chip; Said LED luminescence chip links to each other through gold thread with separately positive and negative electrode bonding wire sheet respectively; The periphery of said body is provided with the positive and negative electrode pin of said LED luminescence chip, and the positive and negative electrode bonding wire sheet that the positive and negative electrode pin of each LED luminescence chip is corresponding with it respectively links to each other through gold thread; Around the weld zone, be provided with bulb lid pedestal; Bulb lid pedestal is provided with the bulb lid said copper seat and weld zone is hidden.
2. the LED matrix of polychrome unification according to claim 1 is characterized in that the positive and negative electrode bonding wire sheet symmetry of said LED luminescence chip is located at the both sides of weld zone.
3. the LED matrix of polychrome according to claim 2 unification, the positive and negative electrode pin that it is characterized in that said LED luminescence chip respectively with their corresponding both sides that are located at said body of positive and negative electrode bonding wire sheet.
4. the LED matrix of polychrome unification according to claim 3 is characterized in that said copper seat for circular, and diameter is equal to or greater than 4.5mm.
CN2012103245904A 2012-09-05 2012-09-05 Multicolor-integrated LED (Light Emitting Diode) device Pending CN102798024A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012103245904A CN102798024A (en) 2012-09-05 2012-09-05 Multicolor-integrated LED (Light Emitting Diode) device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012103245904A CN102798024A (en) 2012-09-05 2012-09-05 Multicolor-integrated LED (Light Emitting Diode) device

Publications (1)

Publication Number Publication Date
CN102798024A true CN102798024A (en) 2012-11-28

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Family Applications (1)

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CN2012103245904A Pending CN102798024A (en) 2012-09-05 2012-09-05 Multicolor-integrated LED (Light Emitting Diode) device

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103883887A (en) * 2012-12-19 2014-06-25 苏州科医世凯半导体技术有限责任公司 LED modules powered by multiple welding legs

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201053637Y (en) * 2007-06-26 2008-04-30 宁波升谱光电半导体有限公司 RGB white light LED device for illumination
KR20080071812A (en) * 2007-01-31 2008-08-05 잘만테크 주식회사 Led assemblely having cooler using a heatpipe
CN202229123U (en) * 2011-09-13 2012-05-23 广州市添鑫光电有限公司 Multicolor syncretism light-emitting diode (LED) device capable of lifting color effects
CN202308021U (en) * 2011-10-24 2012-07-04 深圳市安普光光电科技有限公司 Circuit board type surface mounted light emitting diode
CN202868369U (en) * 2012-09-05 2013-04-10 中山市旭鸿鑫光电科技有限公司 Light-emitting diode (LED) device with unity of multicolor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080071812A (en) * 2007-01-31 2008-08-05 잘만테크 주식회사 Led assemblely having cooler using a heatpipe
CN201053637Y (en) * 2007-06-26 2008-04-30 宁波升谱光电半导体有限公司 RGB white light LED device for illumination
CN202229123U (en) * 2011-09-13 2012-05-23 广州市添鑫光电有限公司 Multicolor syncretism light-emitting diode (LED) device capable of lifting color effects
CN202308021U (en) * 2011-10-24 2012-07-04 深圳市安普光光电科技有限公司 Circuit board type surface mounted light emitting diode
CN202868369U (en) * 2012-09-05 2013-04-10 中山市旭鸿鑫光电科技有限公司 Light-emitting diode (LED) device with unity of multicolor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103883887A (en) * 2012-12-19 2014-06-25 苏州科医世凯半导体技术有限责任公司 LED modules powered by multiple welding legs

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Inventor after: Deng Shengming

Inventor after: Wang Zhuji

Inventor before: Xiao Huaizhong

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: XIAO HUAIZHONG TO: DENG SHENGMING WANG ZHUJI

DD01 Delivery of document by public notice

Addressee: Deng Shengming

Document name: the First Notification of an Office Action

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Application publication date: 20121128