CN102787332B - Method for electroforming pasting board of silver spraying board - Google Patents

Method for electroforming pasting board of silver spraying board Download PDF

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Publication number
CN102787332B
CN102787332B CN 201210293537 CN201210293537A CN102787332B CN 102787332 B CN102787332 B CN 102787332B CN 201210293537 CN201210293537 CN 201210293537 CN 201210293537 A CN201210293537 A CN 201210293537A CN 102787332 B CN102787332 B CN 102787332B
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board
electroforming
pc board
silver
plate
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CN 201210293537
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CN102787332A (en )
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刘国元
吴德平
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湖北联合天诚防伪技术股份有限公司
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Abstract

本发明涉及一种全息防伪印刷行业的电铸工艺,特别涉及一种喷银板贴板电铸的方法,提供一种降低电阻,提高导电率,降低电铸过程中内应力,提高银板电铸成功率,提高喷银成品合格率的一种喷银板贴板电铸的方法,基材PC板置于矩形板式挂具中央部位,基材PC板四周与挂具边缘之间余有空余板面;保留挂具与基材PC板左右任意一侧空余板面,其余挂具与基材PC板另一侧及上下空余板面之间贴满绝缘胶带密封;带有基材PC板的挂具表面整体喷银后,通过银层导电;带有基材PC板挂具整体侵入电铸槽电铸液内电铸,降低电阻,提高导电率,降低电铸过程内应力,提高银板电铸成功率;优化操作步骤,缩短作业时间;不使用导电银浆;减少导电胶带的使用量。 The present invention relates to an electroforming process to a holographic security printing industry, and particularly relates to a method of spraying silver plates affixed to plate electroforming, there is provided a method of reducing resistance, to improve conductivity, decrease the electroforming process stress and improve the silver board cast power, a method of spraying silver plates silver spray rate of qualified products paste plate electroformed increase, the base PC board disposed rectangular plate linked to the central portion, than between the edges of free base PC board four weeks and linked to a board; retention linked to either side of the spare plate surface around the base PC board, the remaining rack between the other side of the base PC board and the vertical spare board and covered with insulation tape seal; with a base PC board after linked to the entire surface silver spray, through the silver layer conductive; rack with a base PC board integrally invasive electroforming tank electroforming lIQUID electroforming, to reduce the resistance, to improve conductivity, decrease the electroforming process stress and improve the silver plates electroforming power; optimization steps, reducing the time required; without using the conductive silver paste; reduce the amount of the conductive tape.

Description

一种喷银板贴板电铸的方法 A method of spraying silver plates affixed to plate electroformed

技术领域 FIELD

[0001] 本发明涉及一种全息防伪印刷行业的电铸工艺,特别涉及一种喷银板贴板电铸的方法。 [0001] relates to a holographic security printing industry, the present invention electroforming process, particularly to a silver spray plate affixed to plate electroforming method.

背景技术 Background technique

[0002] 我国烟包印刷行业具有技术含量高,工艺复杂的特点,在现有的全息防伪转移印刷生产过程中,采用直接在基材PC板上面喷银;使用电吹风吹干;使用20mm宽的导电胶带在基材四周正反面包边;将用导电胶贴好的基材PC板用绝缘胶带粘贴在电铸金属挂具上固定;再次用导电胶带粘贴基材PC板四周与挂具相连并用以密封挂具空余板面;在基材与导电胶带相连的部位涂上导电银浆,其导电是通过边缘四周的导电胶带实现的,在导电胶带宽二分之一处的外侧四周贴上高温绝缘胶带,只保留喷银后的基材导电;下缸电铸,在电铸的时候,由于导电率低,电阻比较大,电流异常或者过大,使得电铸设备发热严重,负载加大,电铸过程中镍板的内应力加大,即电阻越大内应力越高,非常容易导致银板报废,导致喷银板的成品合格率降低,如何通过一些技术措 [0002] of cigarette packaging printing industry has a high-tech, complex process characteristics, the conventional holographic security transfer printing production process by direct spraying silver base PC board thereon; using a hair dryer; using 20mm wide the conductive tape around the substrate reverse sides of bread; paste the electroforming a metal rack on the fixing conductive glue good substrate PC board with an insulating tape; re-conductive taped substrate PC board four weeks and linked to a connected and to seal the rack spare board; coated with silver paste at a portion connected to the substrate and the conductive adhesive tape which electrically conductive by conductive tape around the edges implemented, affixed outside the four weeks of the conductive paste bandwidth is one-half high temperature insulation tape, leaving only the base conductivity after silver spray; lower cylinder electroforming, at the time of electroforming, since the low electrical conductivity, the resistance is relatively large, abnormal current or too large, so that the electroforming apparatus severe fever, load increase , internal stress electroforming process of nickel plate to increase, i.e., the higher the resistance the greater the internal stress is very prone to silver plates scrapped, leading to decrease in production yield of silver spray plate, how a number of technical measures 提高产品合格率、解决电铸设备发热的问题是工程技术人员急待解决的问题。 Improve the rate of qualified products, to solve the problem of heat generation electroforming equipment engineering and technical personnel pressing problem.

发明内容 SUMMARY

[0003] 本发明的目的是在于克服上述现有技术存在的缺陷,提供一种降低电阻,提高导电率,降低电铸过程中的内应力,提高银板电铸成功率,提高喷银成品合格率的一种喷银板贴板电铸的方法。 [0003] The object of the present invention is to solve the problems of the above prior art, there is provided a method of reducing resistance, to improve conductivity, decrease the internal stress of electroforming process, to improve the silver plates electroforming power, improving the discharging silver qualified products method plate electroforming a silver spray plate of the paste.

[0004] 本发明的目的是通过以下技术方案来完成: [0004] The object of the present invention is accomplished by the following technical solutions:

[0005] 本发明一种喷银板贴板电铸的方法,其中:其具体步骤是: [0005] The method of present invention provides a silver spray plate affixed to plate electroforming, wherein: the specific steps are:

[0006] 第一步:基材PC板置于矩形板式挂具中央部位,所述基材PC板四周与所述挂具边缘之间余有空余板面; [0006] The first step: the base PC board disposed rectangular plate linked to a central portion of said base PC board four weeks with the rack over between the edge of a spare board;

[0007] 第二步:保留所述挂具与所述基材PC板之间的左右空余板面,所述左右空余板面的高度与基材PC板高度相等,其余挂具与基材PC板之间的上下空余板面上贴满绝缘胶带密封; [0007] Step: retaining the rack left vacant board between the PC board to the substrate, the left and right spare board height of the base PC board of equal height, the remaining linked to the substrate PC between the upper and lower surfaces of the vacant panel covered with insulating tape to the plate;

[0008] 第三步:带有所述基材PC板的所述挂具表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; [0008] The third step: the with of the substrate PC board linked to the entire surface silver spray after spraying the silver electroformed by silver layer conductive changed electrically conductive manner;

[0009] 第四步:带有所述基材PC板的所述挂具整体侵入电铸槽的电铸液内电铸。 [0009] Step Four: the with of the substrate PC board rack integrally invasive electroforming tank electroforming internal liquid electroforming.

[0010] 本发明所述的喷银板贴板电铸的方法,其中:所述第二步替换为:仅保留所述挂具与所述基材PC板之间的左右任意一侧空余板面,所述左右任意一侧空余板面的高度与基材PC板高度相等,其余挂具与基材PC板另一侧及上下空余板面之间贴满绝缘胶带密封; [0010] The method of spraying silver plates according to the present invention affixed to plate electroforming, wherein: said second step is replaced with: retaining only the left between the rack and the substrate PC board on either side of the spare board surface, and the left or right side of the spare board height of the base PC board of equal height, the remaining rack between the other side of the base PC board and the vertical spare board and covered with insulation tape seal;

[0011] 本发明所述的喷银板贴板电铸的方法,其中:在保留在基材PC板左右任意一侧的所述挂具空余板面部位上预留设置一条竖向狭窄空余板面,称之为:竖向缝隙,所述竖向缝隙的高度与基材PC板高度相等,所述挂具的其余所述空余部位表面全部贴满绝缘胶带密封。 [0011] The method of spraying silver plates according to the present invention affixed to plate electroforming, wherein: the reservation in the reservation rack spare plate surface portion of said either side of the left and right base PC board disposed a vertical narrow vacant board plane, called: vertical slits, said vertical slit height of the base PC board of equal height, the rest of the vacant portion of the hanging tool surface all covered with insulating tape sealing.

[0012] 本发明所述的喷银板贴板电铸的方法,其中:所述第二步替换为:保留在基材PC板左右两侧的所述挂具空余板面部位上分别左右各自设置一条竖向缝隙,所述竖向缝隙的高度与基材PC板高度相等,整个所述挂具其余所述空余部位表面全部贴满绝缘胶带密封。 [0012] The method of spraying silver plates according to the present invention affixed to plate electroforming, wherein: said second step is replaced with: retaining the sides around the base PC board rack on the spare board portion respectively about their provided a vertical slot, said vertical slot height of the base PC board of equal height, the entire linked to the rest of the spare parts of the surface of all covered with insulating tape sealing.

[0013] 本发明所述的喷银板贴板电铸的方法,其中:所述竖向缝隙的宽度为5mm-10mm。 [0013] The method of spraying silver plates according to the present invention affixed to plate electroforming, wherein: the vertical width of the gap is 5mm-10mm.

[0014] 本发明所述的喷银板贴板电铸的方法,其中:所述挂具是不锈钢挂具。 [0014] The method of spraying silver plates according to the present invention affixed to plate electroforming, wherein: said rack is a stainless steel rack.

[0015] 本发明所述的喷银板贴板电铸的方法,其中:所述绝缘胶带为高温绝缘胶带。 [0015] The method of spraying silver plates according to the present invention affixed to plate electroforming, wherein: the insulating tape is a high temperature insulation tape.

[0016] 本发明是通过利用银层导电的方式,克服现有技术的通过铝导电胶带并刷银浆的专设接触导电模式进行导电的弊端,提高导电效率。 [0016] The present invention is electrically conductive by using a silver layer embodiment, prior art are overcome by an aluminum conductive tape and brush drawbacks paste designed for contact with the conductive pattern for conductive, to improve the conductivity efficiency.

[0017] 本发明具有如下显著优点: [0017] The present invention has the following significant advantages:

[0018] 与现有技术相比,本发明具有以下优点:降低电阻,提高导电率,降低电铸过程中的内应力,提高银板电铸成功率;优化操作步骤,缩短作业时间;不使用导电银浆;减少导电胶带的使用量;从本发明方法的实际生产应用来看,本发明的喷银板贴板电铸的方法可明显改善在生产中遇到的实际问题,并能显著提高成品率,提高生产效率,在节约能源、降低成本等方面取得了令人满意的效果,本发明方法可保证生产的稳定性和产品的使用性能,并能为公司带来更大的经济效益。 [0018] Compared with the prior art, the present invention has the following advantages: to reduce the resistance, to improve conductivity, decrease the internal stress of electroforming process, to improve the silver plates electroformed power; optimization steps, reducing the time required; not used conductive silver paste; reduce the amount of the conductive tape; the practical application of the method according to the invention point of view, the method of spraying silver plates according to the present invention affixed to plate electroformed can significantly improve the practical problems encountered in the production, and can significantly improve yield, improve production efficiency, we achieved satisfactory results in energy conservation, cost reduction, the method of the present invention can guarantee the performance of production stability and product, and to bring greater economic benefits for the company.

[0019] 附图说明: [0019] BRIEF DESCRIPTION OF DRAWINGS:

[0020] 图1:是本发明的一种喷银板贴板电铸的方法示意图; [0020] FIG. 1: the invention is a spray silver plate affixed plate electroforming method schematic;

[0021] 图2:是本发明的另一种喷银板贴板电铸的方法示意图; [0021] FIG 2: is a schematic of a process plate electroformed another silver spray plate of the present invention attached;

[0022] 图3:是本发明的第三种喷银板贴板电铸的方法示意图; [0022] FIG 3: is a schematic view of a method plates electroformed third ejection silver plates according to the present invention attached;

[0023] 具体实施方式: [0023] DETAILED DESCRIPTION:

[0024] 下面将结合具体实施例和对比例对本发明作详细的介绍: [0024] conjunction with the following specific examples and comparative examples in detail description of the present invention:

[0025] 如图1所示,是本发明的喷银板贴板电铸的方法示意图,一种喷银板贴板电铸的方法,其具体步骤是: [0025] As shown in FIG 1, is a schematic of a process jet silver plates according to the present invention affixed to plate electroformed A spray silver plates methods plate electroforming paste, the specific steps are:

[0026] 在图1中,第一步:基材PC板2置于矩形板式挂具I中央部位,所述基材PC板四周与所述挂具边缘之间余有空余板面3 ; [0026] In FIG. 1, the first step: a base PC board 2 is placed a rectangular plate rack I center portion, said base PC board four weeks with the remainder between the edge of a spare board 3 rack;

[0027] 第二步:保留所述挂具I与所述基材PC板2之间的左右空余侧板面4,所述左右空余侧板面4的高度与基材PC板2高度相等,其余挂具I与基材PC板2之间的上下空余板面3上贴满绝缘胶带6密封; [0027] Step: retaining the rack left vacant side surface between the 2 I and the substrate PC board 4, the left and right spare side surface height of the substrate PC board 4 2 equal in height, remaining linked to the upper and lower spare board between 2 I with a base PC board covered with the insulating tape 6 seal 3;

[0028] 第三步:带有所述基材PC板的所述挂具表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; [0028] The third step: the with of the substrate PC board linked to the entire surface silver spray after spraying the silver electroformed by silver layer conductive changed electrically conductive manner;

[0029] 第四步:带有所述基材PC板的所述挂具整体侵入电铸槽的电铸液内电铸,所述挂具I是不锈钢挂具,所述绝缘胶带6为高温绝缘胶带。 [0029] Step Four: the with of the substrate PC board rack integrally invasive electroforming tank electroforming LIQUID electroforming, the rack I stainless steel rack, the insulating tape 6 is a high temperature Insulation Tape.

[0030] 本发明重点是采用了新的银层导电方式,改变原有通过导电铝胶带和导电银浆的导电方式。 [0030] The focus of the present invention is the use of a new silver layer conductive manner, changing the original by conductively conducting aluminum adhesive tape and a conductive silver paste.

[0031] 本发明的另外一种喷银板贴板电铸的方法实施例是: Example [0031] Another method of the present invention is sprayed silver plates electroformed plate is attached:

[0032] 如图2所示,第一步:基材PC板2置于矩形板式挂具I中央部位,所述基材PC板2四周与所述挂具I边缘之间余有空余板面3 ; [0032] 2, the first step: a base PC board 2 is placed a rectangular plate rack I center portion, said base PC board 2 four weeks with the rack over between the edge of the I have spare board 3;

[0033] 第二步是:仅保留所述挂具I与所述基材PC板2之间的左右任意一侧空余侧板面4,所述左右任意一侧空余侧板面4的高度与基材PC板2高度相等,其余挂具I与基材PC板2另一侧及上下空余板面3之间贴满绝缘胶带6密封;在保留在基材PC板2左右任意一侧的所述挂具空余板面部位上预留设置一条竖向狭窄空余板面,称之为:竖向缝隙5,所述竖向缝隙5的高度与基材PC板2高度相等,所述竖向缝隙5的宽度为5mm-10mm,所述挂具I的其余所述空余部位表面全部贴满绝缘胶带6密封; [0033] The second step: to retain only the left rack between I 2 and the substrate on either side of PC board spare side surface 4, the left and right side panels on either side of the spare and the surface height 4 base PC board 2 equal height, 6 seal the remaining rack I and the substrate PC board 2 on the other side and the vertical spare board covered with insulating tape between 3; reservations on either side of about 2 base PC board said rack reservation setting a vertical narrow vacant board on the spare board parts, called: vertical slit 5, the vertical height of the base PC board slot 5 2 of the same height, said vertical slot width 5 is 5mm-10mm, the rest of the vacant portion of the rack I surface all covered with the insulating tape 6 seal;

[0034] 第三步:带有所述基材PC板2的所述挂具I表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; [0034] The third step: the with the substrate PC board 2 is linked to I the entire surface silver spray after spraying the silver electroformed by silver layer conductive changed electrically conductive manner;

[0035] 第四步:带有所述基材PC板2的所述挂具I整体侵入电铸槽的电铸液内电铸,所述挂具I是不锈钢挂具,所述绝缘胶带6为高温绝缘胶带。 [0035] Step Four: the with the substrate PC board 2 is linked with the I whole invasive electroforming tank electroforming LIQUID electroforming, the rack I stainless steel rack, the insulating tape 6 high temperature insulation tape.

[0036] 此实施例为本发明最常用的一种实施方式,也是最佳的一种实施方式。 [0036] The most common embodiment of this embodiment to one embodiment of the present invention, an embodiment is preferred.

[0037] 实施例三: [0037] Example III:

[0038] 如图3所示,在图3中,第一步:基材PC板2置于矩形板式挂具I中央部位,所述基材PC板2四周与所述挂具I边缘之间余有空余板面3 ; [0038] 3, in FIG. 3, the first step: a base PC board 2 is placed a rectangular plate rack I center portion, said base PC board 2 four weeks with the rack between the edge of the I I have spare board 3;

[0039] 第二步:保留所述挂具I与所述基材PC板2之间的左右空余侧板面4,所述左右空余侧板面4的高度与基材PC板2高度相等,其余挂具I与基材PC板2之间的上下空余板面3上贴满绝缘胶带6密封;保留在基材PC板2左右两侧的所述挂具I空余板面部位上分别左右各自设置一条竖向缝隙5,所述竖向缝隙5的高度与基材PC板2高度相等,所述竖向缝隙5的宽度为5mm-10mm,整个所述挂具I其余所述空余部位表面全部贴满绝缘胶带6密封; [0039] Step: retaining the rack left vacant side surface between the 2 I and the substrate PC board 4, the left and right spare side surface height of the substrate PC board 4 2 equal in height, plastered remaining rack between two I and the substrate PC board vertically spare board on the third insulating tape 6 seal; retains linked to the right and left two sides of the substrate PC board right and left sides on the I spare board portion each set a vertical slit 5, the vertical height of the base PC board slot 5 2 of the same height, the width of the slot 5 of the vertical is 5mm-10mm, the entire rack I remainder of the spare parts of the surface of all covered with insulating tape 6 seal;

[0040] 第三步:带有所述基材PC板2的所述挂具I表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; [0040] The third step: the with the substrate PC board 2 is linked to I the entire surface silver spray after spraying the silver electroformed by silver layer conductive changed electrically conductive manner;

[0041] 第四步:带有所述基材PC板2的所述挂具I整体侵入电铸槽的电铸液内电铸,所述挂具I是不锈钢挂具,所述绝缘胶带6为高温绝缘胶带。 [0041] Step Four: the with the substrate PC board 2 is linked with the I whole invasive electroforming tank electroforming LIQUID electroforming, the rack I stainless steel rack, the insulating tape 6 high temperature insulation tape.

[0042] 本实施例三用于当基材PC板2较大的时候,即大号喷银板可以在左右两侧各自设置一条竖向缝隙5,加大导电量;而对于中号喷银板在左右任意一侧就可以满足要求。 [0042] The present third embodiment is used when the substrate PC board 2 when the larger, i.e. large ejection silver plates may each be provided a vertical slit 5 in the right and left sides, to increase the conductivity amount; for medium sprayed silver plate in the right and left side to meet the requirements.

[0043] 本发明所述的电铸方法为公知的电铸方法,仅是贴板的方法不同,最根本的是导电模式的改变,采用的是喷银后利用新喷银层的特性,实现银层导电完成电铸。 [0043] The electroforming method according to the present invention are well known in the electroforming method, the only difference is a method paste board, the most fundamental is to change the conductive pattern, using the silver spray using a new jet silver layer properties to achieve silver layer conductive completed electroforming.

[0044] 本发明的喷银板贴板电铸方法降低了电铸过程中的电阻,提高电铸作业导电率,降低电铸过程中的内应力,提高银板电铸成功率;优化操作步骤,缩短作业时间;不使用导电银浆;减少导电胶带的使用量;从本发明方法的实际生产应用来看,本发明的喷银板贴板电铸的方法可明显改善在生产中遇到的实际问题,并能显著提高成品率,提高生产效率,在节约能源、降低成本等方面取得了令人满意的效果,本发明方法可保证生产的稳定性和产品的使用性能,并能为公司带来更大的经济效益。 [0044] Spray silver plates according to the present invention affixed to plate electroforming method reduces the resistance electroforming process, to improve the casting operation conductivity power, reduce stress electroforming process, to improve the silver plates electroformed power; Optimization Procedure , working time is shortened; without using the conductive silver paste; reduce the amount of the conductive tape; the practical application of the method according to the invention point of view, the method of spraying silver plates according to the present invention affixed to plate electroforming can be significantly improved encountered in the production of practical problems, and can significantly improve the yield, improve production efficiency, achieved satisfactory results in energy conservation, cost reduction, the method of the present invention can guarantee the performance of production stability and product, and can provide the company with to greater economic benefits.

Claims (7)

  1. 1.一种喷银板贴板电铸的方法,其特征在于:其具体步骤是: 第一步:基材PC板(2)置于矩形板式挂具(I)中央部位,所述基材PC板(2)四周与所述挂具(I)边缘之间余有空余板面(3); 第二步:保留所述挂具与所述基材PC板(2)之间的左右空余侧板面(4),所述左右空余侧板面(4)的高度与基材PC板(2)高度相等,挂具(I)与基材PC板(2)之间的上下空余板面(3)上贴满绝缘胶带(6)密封; 第三步:带有所述基材PC板(2)的所述挂具(I)表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; 第四步:带有所述基材PC板(2)的所述挂具(I)整体侵入电铸槽的电铸液内电铸。 1. A method of spraying silver plates affixed to plate electroforming, characterized in that: the specific steps: The first step: the base PC board (2) was placed in a rectangular plate linked to (I) a central portion, of the substrate PC board (2) four weeks with the rack I between (I) the edge of a spare plate surface (3); second step: retaining the rack left vacant between the base PC board (2) upper and lower spare board (4), the left and right spare side surface (4) of the plate plane height and the base PC board (2) of equal height, linked to (I) and the substrate PC board (2) between (3) covered with an insulating tape (6) sealed on; the third step: the with the substrate PC board (2) is linked to (I) the whole surface silver spray after spraying silver electroforming by silver layer conductive changed electrically conductive manner; fourth step: the with the substrate PC board (2) is linked to (I) the overall intrusion electroforming tank electroforming internal liquid electroforming.
  2. 2.根据权利要求1所述的喷银板贴板电铸的方法,其特征在于:所述第二步是:仅保留所述挂具(I)与所述基材PC板(2)之间的左右任意一侧空余侧板面(4),所述左右任意一侧空余侧板面(4)的高度与基材PC板(2)高度相等,挂具与基材PC板(2)另一侧及上下空余板面(3)之间贴满绝缘胶带(6)密封。 The silver spray plate according to claim 1 The method of electroforming paste board, wherein: said second step is: to retain only the rack (I) and the substrate PC board (2) of between the right and left side of the spare plate surface (4), the left or right side of the spare plate surface (4) the height of the base PC board (2) of equal height, linked with the substrate PC board (2) covered with insulating tape (6) a seal (3) on the other side and the vertical spare board.
  3. 3.根据权利要求2所述的喷银板贴板电铸的方法,其特征在于:在保留在基材PC板(2)左右任意一侧的所述挂具(I)空余侧板面(4)部位上预留设置一条竖向狭窄空余板面,称之为:竖向缝隙(5),所述竖向缝隙(5)的高度与基材PC板(2)高度相等,所述挂具Cl)的其余所述空余部位表面全部贴满绝缘胶带(6)密封。 3. The method of spraying silver plates of the two plate electroformed claim, wherein: the spare side surface remain in the base PC board of the either side (2) approximately linked to (I) ( 4) reservation setting a vertical narrow vacant board on the site, known as: vertical slits (5), said vertical slot (5) the height of the base PC board (2) of equal height, said hanging the rest of the vacant portion having Cl) surface all covered with insulating tape (6) sealed.
  4. 4.根据权利要求1所述的喷银板贴板电铸的方法,其特征在于:所述第二步:保留在基材PC板(2)左右两侧的所述挂具(I)空余侧板面(4)部位上分别左右各自设置一条竖向缝隙(5),所述竖向缝隙(5)的高度与基材PC板(2)高度相等,整个所述挂具(I)其余所述空余部位表面全部贴满绝缘胶带(6)密封。 4. The method of casting jet silver plates board according to claim 1, wherein: said second step: the retention in the PC board substrate (2) is linked to the left and right sides of (I) the vacant side surface (4) on a portion of each right and left are each provided a vertical slit (5), said vertical slot (5) the height of the base PC board (2) of equal height, the entire rack (I) to rest the spare parts of the surface of all covered with insulating tape (6) sealed.
  5. 5.根据权利要求3或者4所述的喷银板贴板电铸的方法,其特征在于:所述竖向缝隙(5)的宽度为5mm-10mm。 5. Spray silver plates 3 or 4, wherein the method according to claim electroforming paste board, wherein: the width of the vertical slot (5) is 5mm-10mm.
  6. 6.根据权利要求1所述的喷银板贴板电铸的方法,其特征在于:所述挂具(I)是不锈钢挂具。 6. The method of spraying silver plates according to a plate electroformed claim, wherein: said rack (I) is a stainless steel rack.
  7. 7.根据权利要求1所述的喷银板贴板电铸的方法,其特征在于:所述绝缘胶带(6)为高温绝缘胶带。 7. The method of casting jet silver plates according to a board claim, wherein: said insulating tape (6) is a high temperature insulation tape.
CN 201210293537 2012-08-17 2012-08-17 Method for electroforming pasting board of silver spraying board CN102787332B (en)

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CN1995470A (en) * 2006-12-15 2007-07-11 七二国际股份有限公司 Process for preparing porous foam metal material
CN101223304A (en) * 2005-07-12 2008-07-16 西门子公司 Electrode arrangement and method for the electrochemical coating of a workpiece surface
CN101634018A (en) * 2008-07-27 2010-01-27 比亚迪股份有限公司 Selective chemical plating method for plastic base material

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US6632335B2 (en) * 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1188519A (en) * 1996-04-01 1998-07-22 声音和信息载体股份有限公司索诺布累斯生产公司 Galvanic deposition cell with substrate holder
CN101223304A (en) * 2005-07-12 2008-07-16 西门子公司 Electrode arrangement and method for the electrochemical coating of a workpiece surface
CN1995470A (en) * 2006-12-15 2007-07-11 七二国际股份有限公司 Process for preparing porous foam metal material
CN101634018A (en) * 2008-07-27 2010-01-27 比亚迪股份有限公司 Selective chemical plating method for plastic base material

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