CN102787332B - Method for electroforming pasting board of silver spraying board - Google Patents

Method for electroforming pasting board of silver spraying board Download PDF

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Publication number
CN102787332B
CN102787332B CN 201210293537 CN201210293537A CN102787332B CN 102787332 B CN102787332 B CN 102787332B CN 201210293537 CN201210293537 CN 201210293537 CN 201210293537 A CN201210293537 A CN 201210293537A CN 102787332 B CN102787332 B CN 102787332B
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board
method
electroforming
pasting
silver
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CN 201210293537
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Chinese (zh)
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CN102787332A (en )
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刘国元
吴德平
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湖北联合天诚防伪技术股份有限公司
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Abstract

本发明涉及一种全息防伪印刷行业的电铸工艺,特别涉及一种喷银板贴板电铸的方法,提供一种降低电阻,提高导电率,降低电铸过程中内应力,提高银板电铸成功率,提高喷银成品合格率的一种喷银板贴板电铸的方法,基材PC板置于矩形板式挂具中央部位,基材PC板四周与挂具边缘之间余有空余板面;保留挂具与基材PC板左右任意一侧空余板面,其余挂具与基材PC板另一侧及上下空余板面之间贴满绝缘胶带密封;带有基材PC板的挂具表面整体喷银后,通过银层导电;带有基材PC板挂具整体侵入电铸槽电铸液内电铸,降低电阻,提高导电率,降低电铸过程内应力,提高银板电铸成功率;优化操作步骤,缩短作业时间;不使用导电银浆;减少导电胶带的使用量。 The present invention relates to a process for electroforming holographic security printing industry, and in particular relates to a method of spraying silver paste board electroformed plate, there is provided a method of reducing resistance, to improve conductivity, the electroforming process to reduce stress and improve silver board power cast, spray method of spraying silver plates of a silver paste finished passing electroformed plate is increased, the base plate in a rectangular plate PC linked to the central portion, than between the edges and four weeks of free base linked to a PC board board; reserved spare linked to any side surface of the plate around the base board PC, linked to the rest of the substrate between the other side of the PC board and the vertical surface of the plate covered with the insulating spare tape seal; with a base PC board linked to a rear surface of the whole silver sprayed through a conductive layer of silver; PC linked to the base plate integrally with invasive electroforming solution within the electroforming tank electroforming, to reduce the resistance, to improve conductivity, the electroforming process to reduce stress and improve the silver plates electroforming power; optimization steps, reducing the time required; without using the conductive silver paste; reduce the amount of the conductive tape.

Description

一种喷银板贴板电铸的方法 A method of spraying silver plates affixed to plate electroformed

技术领域 FIELD

[0001] 本发明涉及一种全息防伪印刷行业的电铸工艺,特别涉及一种喷银板贴板电铸的方法。 [0001] relates to a holographic security printing industry electroforming process of the present invention, particularly to a silver plate affixed discharge plate electroforming method.

背景技术 Background technique

[0002] 我国烟包印刷行业具有技术含量高,工艺复杂的特点,在现有的全息防伪转移印刷生产过程中,采用直接在基材PC板上面喷银;使用电吹风吹干;使用20mm宽的导电胶带在基材四周正反面包边;将用导电胶贴好的基材PC板用绝缘胶带粘贴在电铸金属挂具上固定;再次用导电胶带粘贴基材PC板四周与挂具相连并用以密封挂具空余板面;在基材与导电胶带相连的部位涂上导电银浆,其导电是通过边缘四周的导电胶带实现的,在导电胶带宽二分之一处的外侧四周贴上高温绝缘胶带,只保留喷银后的基材导电;下缸电铸,在电铸的时候,由于导电率低,电阻比较大,电流异常或者过大,使得电铸设备发热严重,负载加大,电铸过程中镍板的内应力加大,即电阻越大内应力越高,非常容易导致银板报废,导致喷银板的成品合格率降低,如何通过一些技术措 [0002] of cigarette packaging printing industry has a high technical content, process complex features, holograms in the conventional production process of transfer printing, direct spraying silver PC board above the substrate; using a hair dryer; 20mm wide use the conductive tape around the substrate reverse sides of bread; electroformed metal paste on the fixed rack with a conductive glue with good insulating tape base PC board; re-taped conductive substrate linked to a PC board and connected to four weeks and for sealing the vacant rack board; coated with silver paste at the site of the substrate and connected to the conductive tape, which is electrically conductive by conductive tape around the edges implemented, affixed outside the four weeks at one-half the bandwidth of the conductive paste high temperature insulation tape, leaving only the conductive substrate after thermal spraying silver; lower cylinder electroforming, in the electroforming time, since the low electrical conductivity, a relatively large resistance, or abnormal current is too large, so that the electroforming apparatus severe fever, increased load , internal stress during electroforming a nickel plate is increased, i.e., the higher the resistance the greater the internal stress is very easily lead to scrap silver plates, resulting in decrease in production yield of the spray silver plates, how a number of technical measures 提高产品合格率、解决电铸设备发热的问题是工程技术人员急待解决的问题。 Improve the rate of qualified products, to solve the problem of heat generation electroforming equipment engineering and technical personnel pressing problem.

发明内容 SUMMARY

[0003] 本发明的目的是在于克服上述现有技术存在的缺陷,提供一种降低电阻,提高导电率,降低电铸过程中的内应力,提高银板电铸成功率,提高喷银成品合格率的一种喷银板贴板电铸的方法。 [0003] The object of the present invention is to solve the problems of the prior art described above, there is provided a method of reducing resistance, to improve conductivity, decrease the internal stress of electroforming process, to improve the power electroforming silver plates, the silver jet improve qualified products the method of electroforming a plate discharge rate of silver plates affixed.

[0004] 本发明的目的是通过以下技术方案来完成: [0004] The object of the present invention is accomplished by the following technical solutions:

[0005] 本发明一种喷银板贴板电铸的方法,其中:其具体步骤是: [0005] The present invention provides a method of spraying silver paste board electroformed plate, wherein: the specific steps are:

[0006] 第一步:基材PC板置于矩形板式挂具中央部位,所述基材PC板四周与所述挂具边缘之间余有空余板面; [0006] The first step: the base plate in a rectangular plate PC linked to the central portion, the substrate and the PC board rack more than four weeks between the edge of a spare board;

[0007] 第二步:保留所述挂具与所述基材PC板之间的左右空余板面,所述左右空余板面的高度与基材PC板高度相等,其余挂具与基材PC板之间的上下空余板面上贴满绝缘胶带密封; [0007] Step: Reserved linked to the right and left vacant between the plate surface of the substrate and the PC board, said spare board about the height of the base is equal to the height of the PC board, the substrate and the remaining rack PC between the upper and lower surfaces of the vacant panel covered with insulating tape to the plate;

[0008] 第三步:带有所述基材PC板的所述挂具表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; [0008] The third step: the substrate having the PC board linked to spray the entire surface of silver, after the sprayed silver, by electroforming a conductive silver layer, an electrically conductive manner to change;

[0009] 第四步:带有所述基材PC板的所述挂具整体侵入电铸槽的电铸液内电铸。 [0009] The fourth step: the substrate having the entire PC board rack invasive electroforming tank electroforming solution within the electroforming.

[0010] 本发明所述的喷银板贴板电铸的方法,其中:所述第二步替换为:仅保留所述挂具与所述基材PC板之间的左右任意一侧空余板面,所述左右任意一侧空余板面的高度与基材PC板高度相等,其余挂具与基材PC板另一侧及上下空余板面之间贴满绝缘胶带密封; [0010] The method of spraying according to the present invention, a silver paste plate electroformed plate, wherein: said second step is replaced with: retaining only the left between the rack and the substrate on either side of the spare board PC board surface, and the left or right side of the spare and the base plate surface height equal to the height of the PC board, between the other side linked with the rest of the base board PC and the vertical surface of the plate covered with the insulating spare sealing tape;

[0011] 本发明所述的喷银板贴板电铸的方法,其中:在保留在基材PC板左右任意一侧的所述挂具空余板面部位上预留设置一条竖向狭窄空余板面,称之为:竖向缝隙,所述竖向缝隙的高度与基材PC板高度相等,所述挂具的其余所述空余部位表面全部贴满绝缘胶带密封。 [0011] The method of spraying according to the present invention, a silver paste plate electroformed plate, wherein: the reservation on the plate surface of retention rack spare parts on either side of the PC board substrate disposed about a vertical plate narrow vacant plane, called: vertical slit, the vertical height of the gap height equal to the base board PC, the remaining portion of the spare linked to all surfaces covered with insulating tape sealing.

[0012] 本发明所述的喷银板贴板电铸的方法,其中:所述第二步替换为:保留在基材PC板左右两侧的所述挂具空余板面部位上分别左右各自设置一条竖向缝隙,所述竖向缝隙的高度与基材PC板高度相等,整个所述挂具其余所述空余部位表面全部贴满绝缘胶带密封。 [0012] The method of spraying according to the present invention, a silver paste plate electroformed plate, wherein: said second step is replaced with: retaining the right and left sides of the base in the PC board rack plate surface portions are left vacant each set a vertical slit, the vertical height of the gap height equal to the base board PC, linked to the rest of the entire surface of all the spare parts covered with insulating tape sealing.

[0013] 本发明所述的喷银板贴板电铸的方法,其中:所述竖向缝隙的宽度为5mm-10mm。 [0013] The method of spraying according to the present invention, a silver paste plate electroformed plate, wherein: said vertical slit width of 5mm-10mm.

[0014] 本发明所述的喷银板贴板电铸的方法,其中:所述挂具是不锈钢挂具。 [0014] The method of spraying according to the present invention, a silver paste plate electroformed plate, wherein: said rack stainless steel rack.

[0015] 本发明所述的喷银板贴板电铸的方法,其中:所述绝缘胶带为高温绝缘胶带。 [0015] The method of spraying according to the present invention, a silver paste plate electroformed plate, wherein: the insulating tape is a high temperature insulation tape.

[0016] 本发明是通过利用银层导电的方式,克服现有技术的通过铝导电胶带并刷银浆的专设接触导电模式进行导电的弊端,提高导电效率。 [0016] The present invention is by using a conductive silver layer manner, by overcoming the prior art drawbacks brush aluminum paste and the conductive tape designed for conductive contact with the conductive patterns, to improve the conductive efficiency.

[0017] 本发明具有如下显著优点: [0017] The present invention has the following significant advantages:

[0018] 与现有技术相比,本发明具有以下优点:降低电阻,提高导电率,降低电铸过程中的内应力,提高银板电铸成功率;优化操作步骤,缩短作业时间;不使用导电银浆;减少导电胶带的使用量;从本发明方法的实际生产应用来看,本发明的喷银板贴板电铸的方法可明显改善在生产中遇到的实际问题,并能显著提高成品率,提高生产效率,在节约能源、降低成本等方面取得了令人满意的效果,本发明方法可保证生产的稳定性和产品的使用性能,并能为公司带来更大的经济效益。 [0018] Compared with the prior art, the present invention has the following advantages: to reduce the resistance, to improve conductivity, decrease the internal stress of electroforming process, to improve the power electroforming silver plates; optimization steps, reducing the time required; not used conductive silver paste; reducing the amount of conductive tape; the practical application of the method of the present invention point of view, the spray method of the present invention attached to a silver plate electroformed plate may significantly improve the practical problems encountered in the production, and can significantly improve yield, improve production efficiency, we achieved satisfactory results in energy conservation, cost reduction, the method of the present invention can ensure the stability and performance of the product produced, and to bring greater economic benefits for the company.

[0019] 附图说明: [0019] BRIEF DESCRIPTION OF DRAWINGS:

[0020] 图1:是本发明的一种喷银板贴板电铸的方法示意图; [0020] FIG. 1: it is a schematic view of a method of electroforming plate discharge plate of the present invention the silver paste;

[0021] 图2:是本发明的另一种喷银板贴板电铸的方法示意图; [0021] FIG 2: is a schematic diagram of a method of another plate electroformed sheet ejection silver paste of the present invention;

[0022] 图3:是本发明的第三种喷银板贴板电铸的方法示意图; [0022] FIG 3: is a schematic diagram of a third method of electroforming plate ejection plate of the present invention, the silver paste;

[0023] 具体实施方式: [0023] DETAILED DESCRIPTION:

[0024] 下面将结合具体实施例和对比例对本发明作详细的介绍: [0024] The following specific embodiments in conjunction with Comparative Examples in detail and description of the present invention:

[0025] 如图1所示,是本发明的喷银板贴板电铸的方法示意图,一种喷银板贴板电铸的方法,其具体步骤是: [0025] As shown in FIG 1, is a schematic view of the method of the present invention is sprayed silver plates electroformed plate affixed a sheet discharge method electroforming silver plates affixed, the specific steps are:

[0026] 在图1中,第一步:基材PC板2置于矩形板式挂具I中央部位,所述基材PC板四周与所述挂具边缘之间余有空余板面3 ; [0026] In FIG. 1, the first step: a rectangular base plate 2 is placed PC board I linked to a central portion of the base board PC more than four weeks between the edges of the surface plate 3 linked to a spare;

[0027] 第二步:保留所述挂具I与所述基材PC板2之间的左右空余侧板面4,所述左右空余侧板面4的高度与基材PC板2高度相等,其余挂具I与基材PC板2之间的上下空余板面3上贴满绝缘胶带6密封; [0027] Step: retaining the side surface of the rack between the right and left vacant to the substrate 2 I PC board 4, the left and right side surface height spare PC board 4 with the substrate 2 of the same height, the upper and lower plate linked to the rest of the vacant area between the substrate and the PC board 2 I covered with an insulating tape 3 upper seal 6;

[0028] 第三步:带有所述基材PC板的所述挂具表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; [0028] The third step: the substrate having the PC board linked to spray the entire surface of silver, after the sprayed silver, by electroforming a conductive silver layer, an electrically conductive manner to change;

[0029] 第四步:带有所述基材PC板的所述挂具整体侵入电铸槽的电铸液内电铸,所述挂具I是不锈钢挂具,所述绝缘胶带6为高温绝缘胶带。 [0029] The fourth step: the substrate having the entire PC board rack invasive electroforming tank electroforming solution within the electroforming, the stainless steel rack I is linked with a high temperature insulating tape 6 Insulation Tape.

[0030] 本发明重点是采用了新的银层导电方式,改变原有通过导电铝胶带和导电银浆的导电方式。 [0030] The focus of the present invention is the use of a new silver layer conductive manner, by changing the original conductivity type conductive aluminum tape and a conductive silver paste.

[0031] 本发明的另外一种喷银板贴板电铸的方法实施例是: Example [0031] Another method of the present invention is sprayed silver plates electroformed plate is attached:

[0032] 如图2所示,第一步:基材PC板2置于矩形板式挂具I中央部位,所述基材PC板2四周与所述挂具I边缘之间余有空余板面3 ; [0032] 2, the first step: a rectangular base plate 2 is placed PC board I linked to a central portion of the base plate 2 PC linked to the remainder four weeks between the edges spare board I 3;

[0033] 第二步是:仅保留所述挂具I与所述基材PC板2之间的左右任意一侧空余侧板面4,所述左右任意一侧空余侧板面4的高度与基材PC板2高度相等,其余挂具I与基材PC板2另一侧及上下空余板面3之间贴满绝缘胶带6密封;在保留在基材PC板2左右任意一侧的所述挂具空余板面部位上预留设置一条竖向狭窄空余板面,称之为:竖向缝隙5,所述竖向缝隙5的高度与基材PC板2高度相等,所述竖向缝隙5的宽度为5mm-10mm,所述挂具I的其余所述空余部位表面全部贴满绝缘胶带6密封; [0033] The second step: to retain only the left rack between I 2 and the substrate on either side of PC board spare side surface 4, the left and right side panels on either side of the spare and the surface height 4 PC board 2 is equal to the height of the base, linked to the rest of the seal 6 and I 2 the other side of the base board PC and the vertical plate surface covered with an insulating tape spare between 3; reservations on either side of the substrate 2 around the PC board linked to said reservation setting an upper surface of the vertical plate narrow spare parts spare board, called: vertical slit 5, the vertical height of the PC board and the slot 5 of the base 2 is equal to the height of the vertical slot 5 is a width of 5mm-10mm, the remaining portion of the spare I linked to all surfaces covered with insulating sealing tape 6;

[0034] 第三步:带有所述基材PC板2的所述挂具I表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; [0034] The third step: the substrate having the PC board 2 is linked to spray the entire surface of silver I, after spraying the silver, the silver layer by electroforming a conductive, an electrically conductive manner to change;

[0035] 第四步:带有所述基材PC板2的所述挂具I整体侵入电铸槽的电铸液内电铸,所述挂具I是不锈钢挂具,所述绝缘胶带6为高温绝缘胶带。 [0035] The fourth step: the substrate having the PC board 2 is integrally linked with invasive I electroforming solution within the electroforming tank electroforming, a stainless steel rack I is linked with the insulating tape 6 high temperature insulation tape.

[0036] 此实施例为本发明最常用的一种实施方式,也是最佳的一种实施方式。 [0036] The most common embodiment of this embodiment to one embodiment of the present invention, an embodiment is preferred.

[0037] 实施例三: [0037] Example III:

[0038] 如图3所示,在图3中,第一步:基材PC板2置于矩形板式挂具I中央部位,所述基材PC板2四周与所述挂具I边缘之间余有空余板面3 ; [0038] 3, in FIG. 3, the first step: a rectangular base plate 2 is placed PC board I linked to a central portion of the base plate 2 PC linked to four weeks between the edge of the I I have spare board 3;

[0039] 第二步:保留所述挂具I与所述基材PC板2之间的左右空余侧板面4,所述左右空余侧板面4的高度与基材PC板2高度相等,其余挂具I与基材PC板2之间的上下空余板面3上贴满绝缘胶带6密封;保留在基材PC板2左右两侧的所述挂具I空余板面部位上分别左右各自设置一条竖向缝隙5,所述竖向缝隙5的高度与基材PC板2高度相等,所述竖向缝隙5的宽度为5mm-10mm,整个所述挂具I其余所述空余部位表面全部贴满绝缘胶带6密封; [0039] Step: retaining the side surface of the rack between the right and left vacant to the substrate 2 I PC board 4, the left and right side surface height spare PC board 4 with the substrate 2 of the same height, linked to the rest covered between the substrate 2 and the PC board I spare vertical board 6 on the third insulating tape seal; retention rack 2 in the left and right sides of the right and left sides on the base board PC board portion each spare I 5 a vertical slit is provided, the vertical height of the PC board and the slot 5 of the substrate 2 equal in height, the vertical width of the slit 5 is 5mm-10mm, the entire remainder of the spare I linked to all parts of the surface 6 covered with insulation tape seal;

[0040] 第三步:带有所述基材PC板2的所述挂具I表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; [0040] The third step: the substrate having the PC board 2 is linked to spray the entire surface of silver I, after spraying the silver, the silver layer by electroforming a conductive, an electrically conductive manner to change;

[0041] 第四步:带有所述基材PC板2的所述挂具I整体侵入电铸槽的电铸液内电铸,所述挂具I是不锈钢挂具,所述绝缘胶带6为高温绝缘胶带。 [0041] The fourth step: the substrate having the PC board 2 is integrally linked with invasive I electroforming solution within the electroforming tank electroforming, a stainless steel rack I is linked with the insulating tape 6 high temperature insulation tape.

[0042] 本实施例三用于当基材PC板2较大的时候,即大号喷银板可以在左右两侧各自设置一条竖向缝隙5,加大导电量;而对于中号喷银板在左右任意一侧就可以满足要求。 [0042] The present third embodiment is used when the base plate 2 when the larger PC, i.e. large ejection silver plates may each be a vertical slit 5 provided on the sides, to increase the amount of conductivity; for silver spray No. the right and left side plates to meet the requirements.

[0043] 本发明所述的电铸方法为公知的电铸方法,仅是贴板的方法不同,最根本的是导电模式的改变,采用的是喷银后利用新喷银层的特性,实现银层导电完成电铸。 [0043] The electroforming method according to the present invention are well known in the electroforming method, the only difference is a method paste board, the most fundamental is to change the conductive pattern, using the silver spray using a new jet silver layer properties to achieve electroforming the conductive layer of silver is completed.

[0044] 本发明的喷银板贴板电铸方法降低了电铸过程中的电阻,提高电铸作业导电率,降低电铸过程中的内应力,提高银板电铸成功率;优化操作步骤,缩短作业时间;不使用导电银浆;减少导电胶带的使用量;从本发明方法的实际生产应用来看,本发明的喷银板贴板电铸的方法可明显改善在生产中遇到的实际问题,并能显著提高成品率,提高生产效率,在节约能源、降低成本等方面取得了令人满意的效果,本发明方法可保证生产的稳定性和产品的使用性能,并能为公司带来更大的经济效益。 [0044] The ejection plate of the invention attached to a silver plate electroforming method reduces the resistance in the electroforming process, to improve the electrical conductivity of the casting operation, reduce stress in the electroforming process, to improve the power electroforming silver plates; Optimization Procedure , working time is shortened; without using the conductive silver paste; reducing the amount of conductive tape; the practical application of the method of the present invention point of view, the spray method of the present invention attached to a silver plate electroformed plate may encounter significant improvement in production practical problems, and can significantly improve the yield, improve production efficiency, achieved satisfactory results in energy conservation, cost reduction, the method of the present invention can ensure the stability and performance of the product produced, and to the company with to greater economic benefits.

Claims (7)

  1. 1.一种喷银板贴板电铸的方法,其特征在于:其具体步骤是: 第一步:基材PC板(2)置于矩形板式挂具(I)中央部位,所述基材PC板(2)四周与所述挂具(I)边缘之间余有空余板面(3); 第二步:保留所述挂具与所述基材PC板(2)之间的左右空余侧板面(4),所述左右空余侧板面(4)的高度与基材PC板(2)高度相等,挂具(I)与基材PC板(2)之间的上下空余板面(3)上贴满绝缘胶带(6)密封; 第三步:带有所述基材PC板(2)的所述挂具(I)表面整体喷银,在喷银之后,电铸通过银层导电,改变导电的方式; 第四步:带有所述基材PC板(2)的所述挂具(I)整体侵入电铸槽的电铸液内电铸。 1. A method of spraying silver paste board electroformed plate, wherein: the specific steps: Step: PC base board (2) was placed in a rectangular plate linked to (I) a central portion, of the substrate PC board (2) linked to the remainder four weeks between (I) a spare edge plate surface (3); second step: retention linked to the right and left vacant between the PC board and the substrate (2) upper and lower spare board (4), the left and right side plates spare surface (4) of the base plate and the height of the PC board surface (2) of equal height, linked to (I) to PC board substrate (2) between (3) covered with an insulating tape (6) on the seal; the third step: the PC board having said substrate (2) is linked to (I) silver spray the entire surface, after the spraying of silver, silver by electroforming a conductive layer, an electrically conductive manner to change; fourth step: the PC board having said substrate (2) is linked to (I) the overall intrusion groove electroforming electroforming solution within the electroforming.
  2. 2.根据权利要求1所述的喷银板贴板电铸的方法,其特征在于:所述第二步是:仅保留所述挂具(I)与所述基材PC板(2)之间的左右任意一侧空余侧板面(4),所述左右任意一侧空余侧板面(4)的高度与基材PC板(2)高度相等,挂具与基材PC板(2)另一侧及上下空余板面(3)之间贴满绝缘胶带(6)密封。 The silver spray plate according to claim 1 electroforming method paste board, wherein: said second step is: reserved only linked to the (I) and the PC board substrate (2) of between the right and left side of the spare plate surface (4), the left and right side panels on either side of the vacant surface (4) the height of the PC board substrate (2) of equal height, and the substrate PC board rack (2) covered with insulating tape (6) between the seal (3) and the other side of the upper and lower spare board.
  3. 3.根据权利要求2所述的喷银板贴板电铸的方法,其特征在于:在保留在基材PC板(2)左右任意一侧的所述挂具(I)空余侧板面(4)部位上预留设置一条竖向狭窄空余板面,称之为:竖向缝隙(5),所述竖向缝隙(5)的高度与基材PC板(2)高度相等,所述挂具Cl)的其余所述空余部位表面全部贴满绝缘胶带(6)密封。 3. The method of spraying according to two silver plates electroformed plate as claimed in claim, wherein: the spare side surface of the PC board to retain the substrate on either side of (2) linked to the left and right (I) ( 4) set a vertical narrow reserve spare parts on the board, called: vertical slits (5), said vertical slot (5) the height of the PC board and the substrate (2) is equal to the height of the hanging the remaining vacant portion having Cl) covered the entire surface of the insulating tape (6) sealed.
  4. 4.根据权利要求1所述的喷银板贴板电铸的方法,其特征在于:所述第二步:保留在基材PC板(2)左右两侧的所述挂具(I)空余侧板面(4)部位上分别左右各自设置一条竖向缝隙(5),所述竖向缝隙(5)的高度与基材PC板(2)高度相等,整个所述挂具(I)其余所述空余部位表面全部贴满绝缘胶带(6)密封。 4. The method of casting jet silver plates board according to claim 1, wherein: said second step: the retention in the PC board substrate (2) is linked to the left and right sides of (I) the vacant side surface (4) are each disposed on a left portion of each vertical slit (5), said vertical slot (5) the height of the PC board and the substrate (2) of equal height, the entire rack (I) to rest all spare parts of the surface covered with the insulating tape (6) sealed.
  5. 5.根据权利要求3或者4所述的喷银板贴板电铸的方法,其特征在于:所述竖向缝隙(5)的宽度为5mm-10mm。 5. Spray silver plates 3 or 4, wherein the method according to claim electroforming paste board, wherein: the width of the vertical slot (5) is 5mm-10mm.
  6. 6.根据权利要求1所述的喷银板贴板电铸的方法,其特征在于:所述挂具(I)是不锈钢挂具。 6. The method of spraying silver plates according to an electroformed plate as claimed in claim, characterized in that: said rack (I) is a stainless steel rack.
  7. 7.根据权利要求1所述的喷银板贴板电铸的方法,其特征在于:所述绝缘胶带(6)为高温绝缘胶带。 7. The method of casting jet silver plates board according to claim 1, wherein: said insulating tape (6) is a high temperature insulation tape.
CN 201210293537 2012-08-17 2012-08-17 Method for electroforming pasting board of silver spraying board CN102787332B (en)

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CN1995470A (en) * 2006-12-15 2007-07-11 七二国际股份有限公司 Process for preparing porous foam metal material
CN101223304A (en) * 2005-07-12 2008-07-16 西门子公司 Electrode arrangement and method for the electrochemical coating of a workpiece surface
CN101634018A (en) * 2008-07-27 2010-01-27 比亚迪股份有限公司 Selective chemical plating method for plastic base material

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Publication number Priority date Publication date Assignee Title
US6632335B2 (en) * 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1188519A (en) * 1996-04-01 1998-07-22 声音和信息载体股份有限公司索诺布累斯生产公司 Galvanic deposition cell with substrate holder
CN101223304A (en) * 2005-07-12 2008-07-16 西门子公司 Electrode arrangement and method for the electrochemical coating of a workpiece surface
CN1995470A (en) * 2006-12-15 2007-07-11 七二国际股份有限公司 Process for preparing porous foam metal material
CN101634018A (en) * 2008-07-27 2010-01-27 比亚迪股份有限公司 Selective chemical plating method for plastic base material

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