CN102734698A - LED (light-emitting diode) street lamp - Google Patents

LED (light-emitting diode) street lamp Download PDF

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Publication number
CN102734698A
CN102734698A CN2011104076275A CN201110407627A CN102734698A CN 102734698 A CN102734698 A CN 102734698A CN 2011104076275 A CN2011104076275 A CN 2011104076275A CN 201110407627 A CN201110407627 A CN 201110407627A CN 102734698 A CN102734698 A CN 102734698A
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CN
China
Prior art keywords
led
packaging
plate
coating
fixed
Prior art date
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Pending
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CN2011104076275A
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Chinese (zh)
Inventor
于正国
杨佳
牛玥
潘凌怡
徐俊峰
李盼
朱亮
包磊
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ANHUI LADER OPTOELECTRONICS TECHNOLOGY Co Ltd
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ANHUI LADER OPTOELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN2011104076275A priority Critical patent/CN102734698A/en
Publication of CN102734698A publication Critical patent/CN102734698A/en
Pending legal-status Critical Current

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/72Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting

Abstract

The invention relates to a light-weight LED (light-emitting diode) street lamp which is convenient to mount. The LED street lamp comprises a lamp housing, a drive module fixed in the lamp housing, and at least one LED module which is fixed in the lamp housing and driven by the drive module to operate, wherein each LED module comprises a radiator, a lens module fixed on the radiator, and an LED integrated light source which is fixed on the radiator and contained in the lens module; each LED integrated light source comprises a packaging frame, a plurality of LED chips electrically welded in the packaging frame, and a transparent packaging material film which is arranged on the packaging frame and covered on the LED chips; the packaging frame comprises a packaging substrate and an epoxy glass fiber board fixed on the packaging substrate; the packaging substrate comprises a bare copper plate heat pipe and a coating layer arranged on the outer surface of the plate heat pipe; and the coating layer sequentially comprises a bright copper layer, a nickel coating, a silver coating and an anti-oxidation coating from inside to outside; and the LED chips are directly welded on the anti-oxidation coating of the packaging substrate.

Description

A kind of LED street lamp
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED street lamp.
Background technology
The LED lighting engineering reaches its maturity, and the high-power LED light source effect has reached 80 lm/W, and the city street lamp lighting energy saving is transformed into possibility, and the LED street lamp has obtained the extensive concern of various circles of society, and each LED illumination enterprise all drops into a lot of energy research and development LED street lamps.Country " ten thousand in ten cities " is movable simultaneously more makes many cities become the experimental city of LED street lamp, the outstanding pluses and minuses that reflected the LED street lamp.The LED street lamp is current, and to do big advantage be long, the environmental protection of energy-conservation, theoretical life-span, and seem very dazzling the today of all advocating environmental protection in the whole world, obtained the support of government and industry.But it is to be solved that while LED street lamp also has the problem letter of quality and cost aspect.
Existing LED street lamp on the market for solving heat dissipation problem, adopts the led chip of single 1W mostly, through welding, is fixed on the huge die casting aluminium radiator of a volumes.This kind LED street lamp has bigger weight, and weight is very important on road lamp system, because high about 9 meters of street lamp if too heavy danger just increases, especially runs into typhoon, earthquake all possibly produce accident; It is higher that this kind street lamp drives residing environment temperature simultaneously, and there is great influence in the life-span that drives; Use this kind LED street lamp, conventional road lamp needs all replacements, causes the wasting of resources, increases cost.Also be employed in the integrated optical source bottom in addition and use copper coin, make the way of thermal source samming, but the capacity of heat transmission of copper coin is limited, can not derive the heat that light source produces fully, can cause light decay serious, directly influence the life-span of LED street lamp.
Summary of the invention
In view of this, be necessary the LED street lamp that provides a kind of weight lighter, easy for installation.
The present invention realizes like this; A kind of LED street lamp; It comprises lamp housing, is fixed on the driving module in this lamp housing and is fixed at least one the LED module that drives operation in this lamp housing and by this driving module; Each LED module comprises radiator, be fixed on this radiator the lens module and be fixed on this radiator and be housed in the LED integrated optical source in this lens module; Wherein, This LED integrated optical source comprises packaging frame, electrically is welded on some led chips in this packaging frame and be arranged on this packaging frame and cover the transparent encapsulation material film of these some led chips, and this packaging frame comprises base plate for packaging and be fixed on the epoxy glass fiber plate on this base plate for packaging that this base plate for packaging comprises naked copper flat-plate heat pipe and the coating that is arranged on this flat-plate heat pipe outer surface; This coating comprises bright copper layer, nickel coating, silver coating and antioxidation coating from inside to outside successively, and these some led chips directly are welded on the antioxidation coating of this base plate for packaging.
Further improvement as such scheme; This lamp housing comprises upper shell, the lower house that engages with this upper shell and is fixed on the light source location-plate in this lamp housing; Offer some passages on this upper shell, offer the light hole relative with these some passages on this lower house, this light source location-plate is used to install this at least one LED module; This light source location-plate is fastened on this light hole, offers on this light source location-plate to form cross-ventilated some to discharge orifice with these some passages.
Further improvement as such scheme; This driving module comprises and is used to the driving location-plate that drives at least one actuator, terminal box, the water joint of this at least one LED module and be used for fixing this at least one actuator, this terminal box and this water joint that this driving location-plate and this light source location-plate are fixed in this lamp housing side by side.
Further improvement as such scheme; This radiator comprises fixed station; This lens module comprises successively and foldedly to drop on waterproof grommet, lens, waterproof washer and the lens gland on this fixed station, and this waterproof grommet and this lens gland are clamped to these lens and this waterproof washer on this fixed station, and the luminous intensity distribution light type of these lens adopts light chopping design, II class, the perhaps middle luminous intensity distribution that throws of short projection luminous intensity distribution; Its C0 face is designed to symmetrical bat aerofoil profile luminous intensity distribution; The largest light intensity angle is between 60 degree ~ 65 degree, and its C90 face is designed to asymmetric luminous intensity distribution, and the largest light intensity angle is between 15 degree ~ 30 degree.
As the further improvement of such scheme, this epoxy glass fiber plate is fixed on through high temperature resistant bonding glue on the antioxidation coating of this base plate for packaging, and the periphery of this encapsulating material film is fixed on the side of this epoxy glass fiber plate away from this base plate for packaging.
Further improvement as such scheme; This fixed station is to be welded at the bottom of the aluminium on this fin top; This radiator comprises fin, be arranged on the fixed station on this fin and the some heat pipes in this fin of shuttling back and forth; The surface of this fin is the flap form, and this fin offers some passages.
As the further improvement of such scheme, the thickness range of this nickel coating is 0.05 ~ 0.1 μ m.
As the further improvement of such scheme, this silver coating is the fine silver layer, and this antioxidation coating is the alloy layer of silver, and the general thickness scope of this silver coating and this antioxidation coating is 1.0 ~ 1.5 μ m.Preferably, the general thickness of this silver coating and this antioxidation coating is 1.2 μ m.Again preferably, the thickness of this silver coating is not less than 1.0 μ m.
LED street lamp provided by the invention because its flat-plate heat pipe that adopts is handled through multicoating, has higher reflectivity; And can be directly weld led chip having on the base plate for packaging of this flat-plate heat pipe, it is too high fundamentally to solve chip (semiconductor) heat density, the problem that can't heat be derived rapidly; Guarantee the life-span and the performance of led chip, thereby overcome the prejudice that flat-plate heat pipe for a long time can't be applied to the semiconductor packages field, so the LED module can carry out modularization; Can directly use the lamp housing of conventional road lamp; Thereby in light weight, cost is low (need not abandoned original streetlamp housing, only need to change light source; Therefore the integral replacing expense descends significantly), easy for installation; Above the conventional road lamp lamp housing, punch,, can play self-cleaning effect simultaneously in the inner convection environment that forms of lamp housing; Driving is placed apart with radiator, prevents that the temperature of radiator from exerting an influence to driving itself, and is harmless to driving the life-span; The heat that light source produces can be farthest derived in the use of flat-plate heat pipe, guarantees the high brightness of LED street lamp; Special-purpose street lamp lens module is eliminated zebra-stripe, no blackening phenomenon.
Description of drawings
The stereogram of the LED street lamp that Fig. 1 provides for preferred embodiments of the present invention.
Fig. 2 is the three-dimensional exploded view of LED street lamp among Fig. 1.
Fig. 3 is the stereogram of the LED module of LED street lamp among Fig. 1.
Fig. 4 is the three-dimensional exploded view of LED module among Fig. 3.
Fig. 5 is the stereogram of the radiator of LED module among Fig. 4.
Fig. 6 is the exploded view of the LED integrated optical source of LED module among Fig. 4.
Fig. 7 is the stereogram of the packaging frame of LED integrated optical source among Fig. 6.
Fig. 8 is the three-dimensional exploded view of packaging frame among Fig. 7.
Fig. 9 is the part three-dimensional exploded view of packaging frame among Fig. 7.
Figure 10 is the cross-sectional schematic of the base plate for packaging of packaging frame among Fig. 7.
Figure 11 is the light flux variations tendency chart of base plate for packaging under hot and humid condition among Figure 10.
The specific embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Please consult Fig. 1 and Fig. 2 in the lump, the structural representation of the LED street lamp 600 that provides for preferred embodiments of the present invention.LED street lamp 600 comprises lamp housing 610, is fixed on the driving module 620 in the lamp housing 610 and is fixed at least one the LED module 400 that drives operation in the lamp housing 610 and by driving module 620.In this embodiment, LED module 400 is that example is elaborated with two.
Lamp housing 610 comprises upper shell 612, the lower house 614 that engages with upper shell 612 and is fixed on the light source location-plate 616 in the lamp housing 610.Offer some passages 611 on the upper shell 612, offer the light hole 613 relative on the lower house 614 with some passage 611.Light source location-plate 616 is used to install LED module 400; Offer the logical light mouth 617 that the light that supplies LED module 400 passes on the light source location-plate 616, light source location-plate 616 is fastened on the light rays that makes LED module 400 on the light hole 613 and passes logical light mouth 617 and light hole 613.Also offer on the light source location-plate 616 and form cross-ventilated somely, be convenient to the derivation of radiator heat discharge orifice 615 with some passages 611.General streetlamp housing, itself just offers light hole on the lower house of lamp housing, therefore; Can on any traditional street lamp, freely use LED module 400, and not need to change again traditional lamp housing, save mounting cost; Make the client more acceptant, be easy to the popularization in market.
Drive the driving location-plate 627 that module 620 comprises actuator 621, terminal box 623, the water joint 625 that is used for driving LED module 400 and is used for fixing actuator 621, terminal box 623 and water joint 625.Water joint 625 is fixed on the terminal box 623 power line 622 and draws the place.Drive location-plate 627 and light source location-plate 616 fixed interval arranged side by side in lamp housing 610.In this embodiment, the quantity of this actuator 621 is corresponding with the quantity of LED module 400.
During 600 assemblings of LED street lamp: 1. LED module 400 usefulness screws are fixed on the light source location-plate 616, LED module 400 adopts light source module and the special-purpose lens of module that use flat-plate heat pipe; 2. will drive module 620 is fixed on the driving location-plate 627; 3. will drive location-plate 627 and light source location-plate 616 and be fixed on formation LED module 400 in the lamp housing 610; 4. cooperate lamp stand stopper 624 to be fixed on the lamp stand (figure does not show) LED module 400.
Please consult Fig. 3 and Fig. 4 in the lump, LED module 400 comprises radiator 500, be fixed on the radiator 500 lens module 420 and be fixed on the radiator 500 and be housed in the LED integrated optical source 300 in the lens module 420.
Lens module 420 comprises folded successively waterproof grommet 421, lens 423, waterproof washer 425 and the lens gland 427 on the radiator 500 that drop on.Waterproof grommet 421 is clamped to lens 423 and waterproof washer 425 on the radiator 500 with lens gland 427.The luminous intensity distribution light type of lens 423 adopts light chopping design, II class, short projection luminous intensity distribution or middle projection luminous intensity distribution; Its C0 face is designed to symmetrical bat aerofoil profile luminous intensity distribution; The largest light intensity angle is between 60 degree ~ 65 degree, and its C90 face is designed to asymmetric luminous intensity distribution, and the largest light intensity angle is between 15 degree ~ 30 degree.
See also Fig. 5, radiator 500 comprises fin 510, be arranged on the fixed station 520 on the fin 510 and the some heat pipes 530 in fin 510 of shuttling back and forth.
In this embodiment, fixed station 520 is for made of aluminum and be welded at the bottom of the aluminium on fin 510 tops, thereby is easy to the propagation of heat.520 offer some installing holes 511 that size can not wait at the bottom of this aluminium, are convenient to the device that needs heat radiation is installed, like electronic device.520 side is equipped with water joint (figure does not show) at the bottom of this aluminium.520 offer the some passages 513 that supply some heat pipes 530 to pass at the bottom of this aluminium.Lens module 420 cooperates with installing hole 511 through screw and is fixed at the bottom of the aluminium on 520.
The surface of fin 510 is the flap form, increases area of dissipation.Offer (being fin 510) some passages 512 that size can not wait on the heat radiator fin, be convenient to gas flow, take away radiator 500 each position heat as early as possible.Electric wire is by fin 510 side outlets.Also offer the water joint installing hole 515 that is used to install this water joint on the fin 510.
The two ends of each heat pipe 530 are respectively cold junction 531 and hot junction 533; Hot junction 533 is arranged at the bottom of this aluminium between 520 the passage 513 and fin 510; Cold junction 531 shuttles back and forth in fin 510 and extends to outside the fin 510, can through at the bottom of the aluminium 520 and heat pipe 530 jointly heat is imported in the fin 510.
In sum, 520 directly link to each other with fin 510 at the bottom of its aluminium of heat-pipe radiator (being radiator 500), can be with the two-way conduction of heat, and the heat that light source is produced through 520 both actings in conjunction at the bottom of heat pipe 530 and the aluminium imports in the fin 510; Increase water joint in fin 510 and 520 junctions at the bottom of the aluminium simultaneously, can satisfy the requirement of shelter of IP65; From fin 510 side outlets, simple in structure; Be provided with passage 512 on fin 510 surfaces, produce action of turbulent flow, derive the heat in the radiator 500 as early as possible; Fin 510 surfaces are the flap form, increase area of dissipation.
Please consult Fig. 6 and Fig. 7 in the lump, LED integrated optical source 300 comprises packaging frame 200, electrically is welded on some led chips 301 in the packaging frame 300 and be arranged on the packaging frame 200 and cover the transparent encapsulation material film 303 of some led chips 301.
Please consult Fig. 8 and Fig. 9 in the lump, packaging frame 200 comprises base plate for packaging 100 and is fixed on the epoxy glass fiber plate (FR4 plate) 30 on the base plate for packaging 100 that FR4 plate 30 is fixed on the base plate for packaging 100 through high temperature resistant bonding glue.The periphery of encapsulating material film 303 is fixed on the side of FR4 plate 30 away from base plate for packaging 200.In this embodiment, encapsulating material film 303 is a silica gel layer.
FR4 plate 30 comprise first rete 39, and roughly the same second rete 38 of first rete, 39 shapes and be folded in first rete 39 and second rete 38 between the pad 40 that is provided with of two relative spacings.First rete 39 offers first through hole 31 and two second through holes 33 that shape is consistent that run through himself.Each pad 40 roughly is a shape, and an end of two pads 40 extends to the below of two second through holes 33, from two second through holes, 33 interior pads 40 lead-in wire is set and has both can be used as positive electrode or negative electrode use.The middle part of pad 40 partly extends in first through hole 31, with convenient welding led chip.In this embodiment, some led chips 301 are the led chip group of some serial connections, and certainly in other embodiments, led chip 301 also can adopt the mode of parallel connection or hybrid junction.
When welding led chip (figure do not show), directly led chip is welded in first through hole 31, and led chip is electrically connected between two pads 40, at this moment, as long as can make led chip luminous at two second through hole 33 places overlap joint power supplys.
Please combine Figure 10, the coating 20 that base plate for packaging 100 comprises naked copper flat-plate heat pipe 10 and is arranged on flat-plate heat pipe 10 outer surfaces.In coating 20 was wrapped in flat-plate heat pipe 10, coating 20 comprised four-layer structure from inside to outside: ground floor is bright copper layer 21; The second layer is a nickel coating 23; The 3rd layer is silver coating 25; The 4th layer is antioxidation coating 27.Some string led chip groups 301 directly are welded on the antioxidation coating 27 of base plate for packaging 200.The main purpose of the bright copper layer 21 of plating is in order to make flat-plate heat pipe 10 smooth surfaces on the outer surface of flat-plate heat pipe 10, the effect in no wire drawing, husky hole, thus make flat-plate heat pipe 10 integrated stress even.The thickness of bright copper layer 21 is general Bao Yuehao more under situation about achieving the above object.
Nickel coating 23 mainly plays a transition role; On the basis of bright copper layer 21, increase transition zone again; Avoid (between bright copper layer 21 and the silver coating 25) between the different coating under the situation that temperature raises, because the different phenomenons that bright copper layer 21 and silver coating 25 layerings occur of thermal stress.The thickness range of transition zone is 0.05 ~ 0.1 μ m, in this scope is to get over Bao Yuehao.
Silver coating 25 can play the effect that increases reflectivity, and in this embodiment, silver coating 25 is the fine silver layer, and antioxidation coating 27 is the alloy layer of silver, and its alloy is for letting silver produce the material of polyphenoils.Silver coating 25 is 1.0 ~ 1.5 μ m with the optional scope of general thickness of antioxidation coating 27, preferably, is 1.2 μ m.In addition; The thickness of silver coating 25 is got over Bao Yuehao; But its thickness tries not to be lower than 1.0 μ m, and the effect of reaching like this is best, when being 0.8 μ m such as the thickness when silver coating 25; Though also can accept, silver layer blackout phenomenon might appear in the LED lamp use that is welded on the base plate for packaging 100 after 500 hours.The alloy layer of silver is that antioxidation coating 27 must have, and add alloy and can prevent that the fine silver layer from being silver coating 25 oxidations, otherwise silver coating 25 is easy to be oxidized to crineous, and influence reflectivity, welding performance.Satisfying under the condition that silver coating 25 is higher than 1.0 μ m, the alloy layer of silver is got over Bao Yuehao.
The LED integrated optical source (100W) of using base plate for packaging 100 is in hot and humid condition, and promptly humidity is 70%, temperature is in 45 ℃ the environment, to light continuously 1850 hours, and its light decay is merely 2.2%, respond well (seeing also table 1 and Figure 11).In the middle of experiment, have whether the influence of environment temperature, fluorescent material excite fully, a whether influence such as full contact and measure error between heat-conducting cream and substrate, therefore the situation that luminous flux fluctuates up and down can appear, and ± 2% error range is admissible scope.Through common LED integrated optical source is tested under similarity condition, its light decay just was about 14% in 1000 hours, and its light decay had reached 20% in 2000 hours.
Table 1
Hot and humid condition is carried out in hot and humid case; Be to make the environment of chest the inside remain on the temperature and humidity that needs through air current flow; Object that temperature is high if put in; That air-flow will be taken away the heat that this object produces, and the temperature of object is also guaranteed in certain scope.Therefore, in the high temperature and humidity test in this embodiment, base plate for packaging will keep 45 ℃.Hot and humid experiment is confirmed be under mal-condition to the influence of chip, and temperature experiment need carry out under normal temperature (25 ℃ of finger ring border temperature), in this embodiment; Only if specified otherwise is arranged; Otherwise temperature data all is under normal temperature condition, to measure, and the chip influence is under hot and humid condition, to draw, wherein; Normal temperature condition: 25 ℃ of environment temperatures, many groups led chip of 100W light source used 1850 hours continuously; Hot and humid condition: humidity is 70%, temperature is 45 ℃ constant environment, and many groups led chip of 100W light source used 1850 hours continuously.Use the LED integrated optical source of base plate for packaging 100, it is in 1850 hours whole process of continuous use, and temperature remains on 55 ℃ basically, in the scope that general chip can bear.
When base plate for packaging 100 guaranteed that welding led chip high brightness is above that exported, substrate did not morph in high humidity environment, can not influence the luminous flux of led chip.Yet the said structure that draws base plate for packaging 100 is not accomplished in one move; But on the basis of scientific research and combine a large amount of experiments to draw; Need pay creative work; It overcomes the prejudice that flat-plate heat pipe 10 for a long time can't be applied to the semiconductor packages field, and hereinafter is roughly narrated whole R&D process with associative list 2.
1. the technical staff has done the relatively more conventional processing of dusting on flat-plate heat pipe 10, promptly belongs to the powder bed of material at the outer surface metal spraying of flat-plate heat pipe 10, directly welds led chip again.Be 70% in humidity, temperature is to test in 45 ℃ the hot and humid environment, finds that its luminous flux is relatively poor, light efficiency is lower; In the normal temperature condition test, this base plate for packaging is in high temperature (85 ℃) always, the surface oxidation blackout.
2. the outer surface at flat-plate heat pipe 10 is provided with nickel dam, directly welds led chip again.In the thermometric process, find: though compare with dusting to handle, the temperature of this base plate for packaging drops to 78.3 ℃ from 85 ℃, still is in the condition of high temperature.And in hot and humid condition, find: the led chip light decay is serious.
3. the outer surface at flat-plate heat pipe 10 is provided with silver layer, directly welds led chip again.In hot and humid condition, find: above-mentioned two schemes are compared, and the luminous flux originally of this base plate for packaging obviously improves, and stress is all right, and still along with the propelling of service time, the very weak surface oxidation of its anti-aging capability turns black, and luminous flux sharply descends.In the normal temperature condition test, the temperature that this base plate for packaging records is 65.5 ℃.
4. the outer surface at flat-plate heat pipe 10 sets gradually nickel, copper, silver layer, directly welds led chip again.In hot and humid condition, find: part copper and silver-colored layering, surface oxidation blackout.
5. the outer surface at flat-plate heat pipe 10 sets gradually copper, silver layer, directly welds led chip again.In hot and humid condition, find: part copper and silver-colored layering, coating comes off, the surface oxidation blackout.
6. the outer surface at flat-plate heat pipe 10 sets gradually copper, silver, antioxidation coating, directly welds led chip again.In hot and humid condition, find: part copper and silver-colored layering, silver surface are yellowish-brown.
Table 2
Through above-mentioned research, the outer surface at flat-plate heat pipe 10 sets gradually copper, nickel, silver, antioxidation coating at last, yet finds to adopt the fine silver layer more outstanding with the effect that silver-colored alloy layer combines.Scheme of designing at the beginning; The general thickness scope of this silver coating and this antioxidation coating is 0.6 ~ 3 μ m, though can overcome the defective of above six technical schemes, finds; When the general thickness scope of this silver coating and this antioxidation coating was 1.0 ~ 1.5 μ m, it is better that its effect is come.Through test data research constantly, when the general thickness of finding this silver coating and this antioxidation coating was 1.2 μ m, effect also will be got well at last.Find also that in addition the thickness of silver coating 25 is got over Bao Yuehao, but its thickness tries not to be lower than 1.0 μ m; Its effect is better, and like table 1 and shown in Figure 11, not only temperature can reach 55 ℃; It is all low to compare above-mentioned any scheme, and its optical efficiency can keep higher level again.
Therefore, base plate for packaging 100 can improve the reflectivity of substrate as the base plate for packaging of semicon industry; Can directly on this substrate, weld semiconductor; It is too high simultaneously fundamentally to solve the chip heat density, can't the rapid problem that derives of heat be guaranteed the life-span and the performance of chip.
Packaging frame 200 is in when assembling, and the FR4 plate 30 that will be fixed with pad 40 is earlier smeared high temperature resistant bonding glue, when smearing, only spreads upon on the side that FR4 plate 30 has pad 40; The FR4 plate 30 that then will be fixed with pad 40 is fixed on the base plate for packaging 100 through high temperature resistant bonding glue; Afterwards, the led chip of organizing series connection 301 directly is welded on more on the antioxidation coating 27 in first through hole 31 of base plate for packaging 100, and the two ends of the led chip of every group of series connection electrically connect with two pads 40 of FR4 plate 30 respectively; On the led chip 301 of many group series connection, encapsulate one deck encapsulating material film 303 (being silica gel layer) at last; Do not receive ectocine and destruction with the protection chip; This silica gel layer will cover all chips; And the silica gel edge is greater than the frame size of placing chip on the FR4 plate 30, prevents to produce the slit because the chip and the framework temperature difference cause between silica gel and the framework, and air gets into chip is impacted.
That this high temperature resistant bonding glue has is anti-oxidant, moistureproof, cracking resistanceization and characteristic such as high temperature resistant, and we have done following experimental study in order to confirm the high-temperature plastic type, and are as shown in table 3.
Table 3
In view of experimental result, we adopt the one-component binding agent as high temperature resistant bonding glue, then FR4 plate 40 are bonded on the base plate for packaging 100.
In sum; LED integrated optical source 300 has higher reflectivity owing to its flat-plate heat pipe that adopts 10 is handled through multicoating, and can directly on the base plate for packaging with flat-plate heat pipe 10 100, weld led chip 301; It is too high fundamentally to solve chip 301 (semiconductor) heat density; The problem that can't heat be derived rapidly guarantees the life-span and the performance of led chip 301, thereby overcomes the prejudice that flat-plate heat pipe 10 for a long time can't be applied to the semiconductor packages field.Therefore; Epoxy glass fiber plate 30 can directly be fixed on the base plate for packaging 100 with flat-plate heat pipe 10 through high temperature resistant bonding glue; Thereby compare with traditional packaging frame, these base plate for packaging 100 expenses are low, and technology is simple; Can change the shape of epoxy glass fiber plate 30 arbitrarily, also not influence the replacing of base plate for packaging 100 simultaneously.
In sum, LED street lamp provided by the invention is because its flat-plate heat pipe that adopts is handled through multicoating; Have higher reflectivity, and can be directly weld led chip having on the base plate for packaging of this flat-plate heat pipe, it is too high fundamentally to solve chip (semiconductor) heat density; The problem that can't heat be derived rapidly guarantees the life-span and the performance of led chip, thereby overcomes the prejudice that flat-plate heat pipe for a long time can't be applied to the semiconductor packages field; Therefore the LED module can carry out modularization, can directly use the lamp housing of conventional road lamp, thereby in light weight; Cost is low (need not abandon original streetlamp housing; Only need to change light source, so the integral replacing expense descends significantly), easy for installation; Above the conventional road lamp lamp housing, punch,, can play self-cleaning effect simultaneously in the inner convection environment that forms of lamp housing; Driving is placed apart with radiator, prevents that the temperature of radiator from exerting an influence to driving itself, and is harmless to driving the life-span; The heat that light source produces can be farthest derived in the use of flat-plate heat pipe, guarantees the high brightness of LED street lamp; Special-purpose street lamp lens module is eliminated zebra-stripe, no blackening phenomenon.Wherein, The LED module, simple in structure, can be adaptable across LED street lamp, floodlight, Tunnel Lamp and bulkhead lamp capable; Many-sided factors such as heat radiation, optics, light source and protection have been taken into full account in its design process; Can satisfy the requirement of different occasions, can directly use the conventional lamp shell simultaneously, applicability is strong.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. LED street lamp; It comprises lamp housing, is fixed on the driving module in this lamp housing and is fixed at least one the LED module that drives operation in this lamp housing and by this driving module; Each LED module comprises radiator, be fixed on this radiator the lens module and be fixed on this radiator and be housed in the LED integrated optical source in this lens module; It is characterized in that; This LED integrated optical source comprises packaging frame, electrically is welded on some led chips in this packaging frame and be arranged on this packaging frame and cover the transparent encapsulation material film of these some led chips; This packaging frame comprises base plate for packaging and is fixed on the epoxy glass fiber plate on this base plate for packaging; This base plate for packaging comprises naked copper flat-plate heat pipe and the coating that is arranged on this flat-plate heat pipe outer surface, and this coating comprises bright copper layer, nickel coating, silver coating and antioxidation coating from inside to outside successively, and these some led chips directly are welded on the antioxidation coating of this base plate for packaging.
2. LED street lamp as claimed in claim 1; It is characterized in that; This lamp housing comprises upper shell, the lower house that engages with this upper shell and is fixed on the light source location-plate in this lamp housing; Offer some passages on this upper shell, offer the light hole relative with these some passages on this lower house, this light source location-plate is used to install this at least one LED module; This light source location-plate is fastened on this light hole, offers on this light source location-plate to form cross-ventilated some to discharge orifice with these some passages.
3. LED street lamp as claimed in claim 2; It is characterized in that; This driving module comprises and is used to the driving location-plate that drives at least one actuator, terminal box, the water joint of this at least one LED module and be used for fixing this at least one actuator, this terminal box and this water joint that this driving location-plate and this light source location-plate are fixed in this lamp housing side by side.
4. LED street lamp as claimed in claim 1; It is characterized in that this radiator comprises fixed station, this lens module comprises folded successively waterproof grommet, lens, waterproof washer and the lens gland on this fixed station that drop on; This waterproof grommet and this lens gland are clamped to these lens and this waterproof washer on this fixed station; The luminous intensity distribution light type of these lens adopts light chopping design, II class, short projection luminous intensity distribution or middle projection luminous intensity distribution, and its C0 face is designed to symmetrical bat aerofoil profile luminous intensity distribution, and the largest light intensity angle is between 60 degree ~ 65 degree; Its C90 face is designed to asymmetric luminous intensity distribution, and the largest light intensity angle is between 15 degree ~ 30 degree.
5. LED street lamp as claimed in claim 1; It is characterized in that; This epoxy glass fiber plate is fixed on through high temperature resistant bonding glue on the antioxidation coating of this base plate for packaging, and the periphery of this encapsulating material film is fixed on the side of this epoxy glass fiber plate away from this base plate for packaging.
6. LED street lamp as claimed in claim 4; It is characterized in that; This fixed station is to be welded at the bottom of the aluminium on this fin top; This radiator comprises fin, be arranged on the fixed station on this fin and the some heat pipes in this fin of shuttling back and forth, and the surface of this fin is the flap form, and this fin offers some passages.
7. LED street lamp as claimed in claim 1 is characterized in that, the thickness range of this nickel coating is 0.05 ~ 0.1 μ m.
8. LED street lamp as claimed in claim 1 is characterized in that, this silver coating is the fine silver layer, and this antioxidation coating is the alloy layer of silver, and the general thickness scope of this silver coating and this antioxidation coating is 1.0 ~ 1.5 μ m.
9. LED street lamp as claimed in claim 8 is characterized in that, the general thickness of this silver coating and this antioxidation coating is 1.2 μ m.
10. LED street lamp as claimed in claim 9 is characterized in that, the thickness of this silver coating is not less than 1.0 μ m.
CN2011104076275A 2011-12-09 2011-12-09 LED (light-emitting diode) street lamp Pending CN102734698A (en)

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Application Number Priority Date Filing Date Title
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