CN102727252A - Ultrasonic probe and ultrasonic probe manufacturing method - Google Patents
Ultrasonic probe and ultrasonic probe manufacturing method Download PDFInfo
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- CN102727252A CN102727252A CN2012101144665A CN201210114466A CN102727252A CN 102727252 A CN102727252 A CN 102727252A CN 2012101144665 A CN2012101144665 A CN 2012101144665A CN 201210114466 A CN201210114466 A CN 201210114466A CN 102727252 A CN102727252 A CN 102727252A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B10/00—Other methods or instruments for diagnosis, e.g. instruments for taking a cell sample, for biopsy, for vaccination diagnosis; Sex determination; Ovulation-period determination; Throat striking implements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N7/00—Ultrasound therapy
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
Abstract
The invention provides an ultrasonic probe and an ultrasonic probe manufacturing method. The ultrasonic probe includes a transducer element, a backing material, and a buffer layer. The transducer element (1) vibrates to transmit and receive an ultrasonic wave. The buffer layer (5) is provided on the back side of the transducer element (1). The backing material (6) is provided on the back side of the buffer layer (5) and damps an ultrasonic wave from the transducer element (1). The buffer layer (5) has a Poisson ratio larger than that of the backing material (6).
Description
The application is the basis with application that file an application, that japanese patent application No. is 2011-073244 on March 29th, 2011, and requires its priority, and the latter's entirety is incorporated this paper into through reference.
Technical field
The present invention relates to the manufacturing approach of ultrasound probe and ultrasound probe.
Background technology
Ultrasound probe has and is used for send receiving hyperacoustic piezoelectric vibrator.The unmatched acoustic matching layer of the acoustic impedance that relaxes piezoelectric vibrator and organism is set on the front of piezoelectric vibrator (face of the organism contact surface side of ultrasound probe), goes up overleaf, be provided with and make back side part from the ultrasonic attenuation of piezoelectric vibrator.Piezoelectric vibrator carries out mechanical vibration when sending the reception ultrasound wave.Because this vibration, back side part also carries out mechanical vibration.The mechanical vibration of back side part are paid noise to the sound characteristics of ultrasound probe, and sound characteristics is worsened.
Patent documentation 1: the special public clear 53-25390 communique of Japan
Summary of the invention
The object of the present invention is to provide a kind of ultrasound probe and the manufacturing approach of ultrasound probe of sound characteristics deterioration of the vibration that prevents to follow oscillator.
The ultrasound probe of this embodiment is characterised in that to possess: oscillator, vibrate in order to carry out hyperacoustic transmission to receive; Cushion is arranged at the rear side of above-mentioned oscillator; And back side part, be arranged at the rear side of above-mentioned cushion, make ultrasonic attenuation from above-mentioned oscillator; Above-mentioned cushion has than the big Poisson's ratio of above-mentioned back side part.
The invention effect
Can prevent to follow the sound characteristics deterioration of the vibration of oscillator.
Description of drawings
Fig. 1 is the figure of the general structure of the ultrasound probe of this embodiment of expression.
Fig. 2 is the result's of the acoustic simulation of the ultrasound probe of the existing structure of expression figure.
Fig. 3 is the result's of the acoustic simulation of the ultrasound probe of this embodiment of expression figure.
Fig. 4 is the figure of the typical process of the manufacturing process of the ultrasound probe of the embodiment 1 of this embodiment of expression.
Fig. 5 is the figure that is used for the step SA1 of key diagram 4.
Fig. 6 is the figure that is used for the step SA2 of key diagram 4.
Fig. 7 is the figure that is used for the step SA3 of key diagram 4.
Fig. 8 is the figure that is used for the step SA4 of key diagram 4.
Fig. 9 is the figure that is used for the step SA5 of key diagram 4.
Figure 10 is the figure of the typical process of the manufacturing process of the ultrasound probe of the embodiment 2 of this embodiment of expression.
Figure 11 is the figure that is used to explain the step SB 1 of Figure 10.
Figure 12 is the figure that is used to explain the step SB2 of Figure 10.
Figure 13 is the figure that is used to explain the step SB3 of Figure 10.
Figure 14 is the figure that is used to explain the step SB4 of Figure 10.
Figure 15 is the figure that is used to explain the step SB5 of Figure 10.
Figure 16 is the figure that is used to explain the step SB6 of Figure 10.
Figure 17 is the figure of the general structure of the ultrasound probe of expression variation 1.
Figure 18 is the figure of the general structure of the ultrasound probe of expression variation 2.
Description of symbols
1 transducer part; 2 the 1st acoustic matching layers; 3 the 2nd acoustic matching layers; 4 acoustic lens; 5 cushions; 6 back side parts.
The specific embodiment
The ultrasound probe of this embodiment has oscillator, back side part and cushion.Oscillator vibrates in order to send the reception ultrasound wave.Cushion is arranged at the rear side of oscillator.Back side part is arranged at the rear side of cushion, makes the ultrasonic attenuation from oscillator.Cushion has the Poisson's ratio bigger than back side part.
With reference to the accompanying drawings, the ultrasound probe of this embodiment and the manufacturing approach of ultrasound probe are described.
Fig. 1 is the figure of the general structure of the ultrasound probe of this embodiment of expression.That kind as shown in Figure 1, ultrasound probe have the hyperacoustic transducer part 1 of the reception of transmission.On the front of transducer part 1 (face of organism contact surface 4s side), the 1st acoustic matching layer 2 is set.In the front of the 1st acoustic matching layer 2, the 2nd acoustic matching layer 3 is set.In the front of the 2nd acoustic matching layer, acoustic lens 4 is set.On the back side of transducer part 1 (face of a side opposite), cushion 5 is set with organism contact surface 4s.At the back side of cushion 5, back side part 6 is set.Back side part 6, cushion 5, transducer part the 1, the 1st acoustic matching layer the 2, the 2nd acoustic matching layer 3 are defined as thickness direction with the stacked direction of acoustic lens 4 here.
The 1st acoustic matching layer 2 and the 2nd acoustic matching layer 3 are set, so that relax not matching of acoustic impedance between transducer part 1 and the organism.The 1st acoustic matching layer 2 and the 2nd acoustic matching layer 3 form according to the mode of the acoustic impedance between the acoustic impedance of acoustic impedance that has transducer part 1 respectively and organism.In addition, the 1st acoustic matching layer 2 forms according to the mode with the acoustic impedance that is higher than the 2nd acoustic matching layer 3.In addition, the acoustic impedance of organism is roughly 1.5Mray1.In addition, the 1st acoustic matching layer 2 has a plurality of the 1st acoustic matching elements (not shown in Fig. 1) that are arranged as 1 dimension or 2 dimension shapes.Equally, the 2nd acoustic matching layer 3 has a plurality of the 2nd acoustic matching elements (not shown in Fig. 1) that are arranged as 1 dimension or 2 dimension shapes.In addition, the acoustic matching layer that comprises in the ultrasound probe of this embodiment is not limited only to the 1st acoustic matching layer 2 and the 2nd acoustic matching layer 3 these 2 layers.The ultrasound probe of this embodiment also can have 1 acoustic matching layer, also can have the acoustic matching layer more than 3.
Back side part 6 is set, so that make the sonic vibration decay of transducer part 1.In other words, back side part 6 makes from the ultrasonic attenuation of transducer part 1 part 6 directions radiation along the back side.In addition, back side part 6 plays a role as the structure keeper of transducer part 1.Specifically, be under the situation of linear probe at ultrasound probe, back side part 6 is set; So that linearly shape keeps a plurality of piezoelectric vibrators; At ultrasound probe is under the situation of convex probe, and back side part 6 is set, so that be a plurality of piezoelectric vibrators of circular-arc maintenance with certain curvature.The material of back side part 6 adopts the elastomeric material of polybutadiene, chlorobutadiene etc.Back side part 6 forms according to the mode of the acoustic impedance with unwanted resonance that the acoustic matching of not producing causes.As typical way, back side part 6 forms according to the mode of the acoustic impedance with 2～7Mray1.
Be elaborated in the face of cushion 5 down.
As existing structure, do not having under the situation of cushion, the mechanical vibration of piezoelectric vibrator propagate into back side part, and back side part carries out mechanical vibration.Through the mechanical vibration of back side part, the sound characteristics deterioration of ultrasound probe.In addition, as existing structure, do not having under the situation of cushion, the mechanical vibration of certain piezoelectric vibrator propagate into the piezoelectric vibrator of adjacency via having inflexible back side part.Same because the mechanical vibration of the piezoelectric vibrator of adjacency are chaotic from hyperacoustic sound field of ultrasound probe radiation, the sound characteristics deterioration of ultrasound probe.
As above-mentioned, back side part 6 is set, so that keep the geometric configuration of transducer part the 1, the 1st acoustic matching layer 2 and the 2nd acoustic matching layer 3, thereby prevent the confusion of hyperacoustic sound field.In addition, back side part 6 need have ultrasonic attenuation performance and the acoustic impedance that is used to prevent unwanted resonance.Back side part 6 is that substrate forms with the rubber parts, still, in many cases, in order to satisfy the restriction of this ultrasonic attenuation performance and acoustic impedance, sneaks into various additives.Consequently, the Poisson's ratio of back side part 6 is less, promptly, the rigidity of back side part 6 is high.
In order to improve attenuating, the Poisson's ratio of cushion 5 is high more good more.Be made up of resin piece or rubber parts if consider back side part 6, cushion 5 forms as base part with silicone, urethanes or other resin piece etc., and then the Poisson's ratio of cushion 5 for example also can be designed to more than 0.4.In addition, the Poisson's ratio of the cushion 5 of this embodiment is not limited to more than 0.4.If obtain the attenuating that cushion 5 brings, then the Poisson's ratio of cushion 5 also can be less than 0.4.
As above-mentioned, back side part 6 is set, so that make from the ultrasonic attenuation of the direction radiation of transducer part 1 part 6 along the back side.Ultrasound wave has the physical property by the discontinuity surface reflection of acoustic impedance.In this embodiment, between transducer part 1 and back side part 6, cushion 5 is set.Under the acoustic impedance condition of different of cushion 5 and back side part 6, through the boundary face reflection supersonic wave of cushion 5 and back side part 6.By ultrasound wave through cushion 5 reflection, chaotic from hyperacoustic sound field of the ultrasound probe radiation of this embodiment, the sound characteristics deterioration of the ultrasound probe of this embodiment.
For hyperacoustic reflection of the boundary face that prevents cushion 5 and back side part 6, with good efficiency make ultrasonic propagation from transducer part 1 to the back side part 6, the acoustic impedance of cushion 5 is according to designing with the roughly consistent mode of the acoustic impedance of back side part 6.Specifically, the difference of the acoustic impedance of the acoustic impedance of cushion 5 and back side part 6 be adjusted into more than-20%+below 20%.In fact, make its acoustic impedance, thus, make the acoustic impedance of cushion 5 and back side part 6 roughly consistent near back side part 6 through the acoustic impedance of adjusting cushion 5.In order to realize the method for adjustment of acoustic impedance, for example, in the base part of cushion 5, sneaking into metallic oxide or ceramic material etc. is the fine structure body of the microgranule etc. of material.In addition, the difference of the acoustic impedance of cushion 5 of this embodiment and back side part 6 be not defined as more than-20%+below 20%.If can be with hyperacoustic reflection frequency of the boundary face that reduces cushion 5 and back side part 6 to a certain degree, then the difference of the acoustic impedance of cushion 5 and back side part 6 also can for below-20% or+more than 20%.
Iff is with the purpose that rises to of the attenuating of cushion 5, and then cushion 5 is thick more good more.But, under the unnecessarily thick situation of cushion 5, be used to keep the mechanical rigid of piezoelectric vibrator to reduce, the geometric configuration of piezoelectric vibrator is unstable.Consequently, chaotic from hyperacoustic sound field of ultrasound probe radiation, the sound characteristics deterioration of ultrasound probe.In contrast, under the unnecessarily thin situation of cushion 5, can't suppress the mechanical vibration of piezoelectric vibrator.Consequently, the piezoelectric vibrator to back side part 6 or adjacency is propagated in mechanical vibration, and is still chaotic from hyperacoustic sound field of ultrasound probe radiation.If consider these factors, then about 1/2 of the thickness of cushion 5 hyperacoustic wavelength X that can be designed to send from transducer part 1.In addition, the thickness of the cushion 5 of this embodiment is not limited to about λ/2.If the configuration of the geometry of piezoelectric vibrator is stable, then the thickness of cushion 5 also can be designed to thicker than about λ/2.
Below, with reference to the result of the acoustic impedance of finite element analysis, the ultrasound probe of this embodiment and the difference of the sound characteristics of the ultrasound probe of existing structure are described.Fig. 2 is the result's of the acoustic simulation of the ultrasound probe of the existing structure of expression figure, and Fig. 3 is the result's of the acoustic simulation of the ultrasound probe of this embodiment of expression figure.In the acoustic simulation of the ultrasound probe of existing structure, such shown in Fig. 2 (b), be model with the lit-par-lit structure of back side part, piezoelectric vibrator, the 1st acoustic matching element and the 2nd acoustic matching element, obtain the acoustic impedance of piezoelectric vibrator.In the acoustic simulation of the ultrasound probe of this embodiment, such shown in Fig. 3 (b), be model with the lit-par-lit structure of back side part, cushion, piezoelectric vibrator, the 1st acoustic matching element and the 2nd acoustic matching element, obtain the acoustic impedance of piezoelectric vibrator.In addition, in acoustic simulation, the acoustic impedance of cushion equals the acoustic impedance of back side part, and the thickness setting of cushion is about λ, and the Poisson's ratio of cushion is set at roughly 0.45.
The transverse axis of Fig. 2 (a) and Fig. 3 (a) is defined as frequency f [MHz], the left longitudinal axis is defined as the absolute value Z [Ω] of acoustic impedance, the right longitudinal axis is defined as the phase theta [deg] of acoustic impedance.Solid line is represented the change curve of phase theta relative frequency f, and dotted line is represented the change curve of absolute value Z relative frequency f.In the change curve of Fig. 2 (a), can confirm 3 resonance peaks of piezoelectric vibrator, the 1st acoustic matching layer and the 2nd acoustic matching layer.Resonance peak is defined as the maximum of absolute value Z or phase theta.In addition, in the change curve of Fig. 2 (a), can near 0.4MHz, confirm resonance peak.Near this 0.4MHz resonance peak is that the mechanical vibration because of back side part cause.Sound characteristics is caused the baneful influence as useless noise.On the other hand, in the change curve of Fig. 3 (a), can confirm 3 resonance peaks of piezoelectric vibrator, the 1st acoustic matching layer and the 2nd acoustic matching layer.But in the change curve of Fig. 3 (a), near the unwanted resonance peak the 0.4MHz disappears.Its reason is: through cushion, prevent that the mechanical vibration of piezoelectric vibrator from propagating into the situation of back side part, the mechanical vibration decay of back side part.
Through said structure, in the ultrasound probe of this embodiment, between transducer part 1 and back side part 6, have the cushion 5 of Poisson's ratio greater than back side part 6.Through the geometry configuration of such transducer part 1, cushion 5 and back side part 6, can be by the mechanical vibration of cushion 5 reductions from transducer part 1 part 6 to the back side.In addition, form cushion 5 and back side part 6 according to cushion 5 and the roughly consistent mode of the acoustic impedance of back side part 6.In the case, can reduce hyperacoustic reflection frequency that cushion 5 brings, can make back side part 6 absorb the unwanted ultrasound wave that emits to part 6 sides in the back side from transducer part 1 effectively.Therefore, it is chaotic to reduce the sound field that the unwanted ultrasound wave from transducer part 1 brings, and improves the sound characteristics of ultrasound probe.
Below, be divided into embodiment 1 and the manufacturing approach of the ultrasound probe of this embodiment described with embodiment 2.In embodiment 1 and embodiment 2, the structure of ultrasound probe is different.
[embodiment 1]
In embodiment 1, configuration cushion 5 between electrode is drawn with substrate and back side part 6.For the transmission of carrying out the signal between diagnostic ultrasound equipment main body and the transducer part 1 receives, electrode is set draws and use substrate, have the function of respectively front face side electrode and rear side electrode being drawn to the outside to each passage.Electrode is drawn with substrate and is adopted for example flexible printed circuit wiring plate.
Fig. 4 is the figure of the typical process of the manufacturing process of the ultrasound probe of expression embodiment 1.In addition, infra state bright in, the ultrasound probe that is made as manufacturing be 1 the dimension array type.
That kind as shown in Figure 5 at first, is drawn electrode with substrate 11, oscillator piece the 13, the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17 range upon range of (step SA1).Specifically, draw front, engage oscillator piece 13,, engage the 1st acoustic matching piece 15,, engage the 2nd acoustic matching piece 17 in the front of the 1st acoustic matching piece 15 in the front of oscillator piece 13 with substrate 11 at electrode.Oscillator piece 13 is following structure, wherein, in the front of tabular piezoelectrics 19, forms front electrode 21, goes up overleaf and forms backplate 23.Front electrode 21 forms through following manner with backplate 23, and this mode is: on the two sides of tabular piezoelectrics 19, implement to electroplate or sputter through metals such as gold.The 1st acoustic matching piece 15 is the platy structure thing that the material by the 1st acoustic matching layer 2 forms.The 2nd acoustic matching piece 17 is the platy structure thing that the material by the 2nd acoustic matching layer 3 forms.It is the bonding agent of bonding agent, silicone-based bonding agent etc. that the joint of parts adopts epoxy.The duplexer of below electrode being drawn with substrate 11, oscillator piece the 13, the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17 is called the 1st configured intermediate body.That is, form the 1st configured intermediate body through step SA1.
If carry out step SA1, that kind then as shown in Figure 6, (step SA2) cut to the 1st configured intermediate body 19 in edge wherein 1 direction cutting spacing according to the rules.For example, draw with 11 pairs the 1st configured intermediate bodies 19 of substrate towards electrode from the 2nd acoustic matching layer 3 and cut.Cutting is carried out through for example cutting blade (dicing blade).Through cutting, oscillator piece 13 is divided into a plurality of piezoelectric vibrators 27, the 1st acoustic matching piece 15 is divided into a plurality of the 1st acoustic matching elements 29, the 2nd acoustic matching piece 17 is divided into a plurality of the 2nd acoustic matching elements 31.As above-mentioned, a plurality of piezoelectric vibrators 27 constitute transducer part 1, and a plurality of the 1st acoustic matching elements 29 constitute the 1st acoustic matching layer 2, and a plurality of the 2nd acoustic matching elements 31 constitute the 2nd acoustic matching layer 3.To abbreviate element 33 as by the duplexer that piezoelectric vibrator the 27, the 1st acoustic matching element 29 and the 2nd acoustic matching element 31 constitute here.A plurality of grooves (being called cutting slot below) 35 cutting spacing according to the rules through cutting forms is arranged.When cutting, electrode is drawn with substrate 11 and both can not exclusively be cut apart, and is also divisible.In addition, for the situation that prevents that a plurality of element 33 is messy, electrode is not drawn with substrate 11 and cut apart fully better.
On the other hand, that kind as shown in Figure 7 is through for example above-mentioned bonding agent, with back side part 6 and cushion 5 joints (step SA3) of Poisson's ratio greater than back side part 6.At this moment, in order to reduce not the matching of acoustic impedance between cushion 5 and the back side part 6, in addition, in order to keep the geometry configuration of piezoelectric vibrator 27 well, the thickness of bonding agent for example is suppressed at below the 10 μ m better.Below, the duplexer of cushion 5 and back side part 6 is called the 2nd configured intermediate body 37.That is,, form the 2nd configured intermediate body 37 through step SA3.
If carry out step SA2 and SA3, that kind then as shown in Figure 8 is drawn with the relative mode of substrate 11 and cushion 5 according to electrode, the 1st configured intermediate body 25 and the 2nd configured intermediate body 37 joints (step SA4) that will cut through for example above-mentioned bonding agent.Thus, cushion 5 is arranged at the rear side of a plurality of piezoelectric vibrators 27, and is arranged at the front face side of back side part 6.Below, the duplexer of the 1st configured intermediate body 25 and the 2nd configured intermediate body 37 is called the 1st lit-par-lit structure body 39.That is,, form the 1st lit-par-lit structure body 39 through step SA4.In addition, for intensity raising of realizing transducer part the 1, the 1st acoustic matching layer 2 and the 2nd acoustic matching element 3 etc., also can in cutting slot 35, fill the bonding agent that epoxy is bonding agent or silicone-based bonding agent etc.In addition, in order to suppress to be filled in the thermal expansion of the bonding agent in the cutting slot 35, also can be in this bonding agent the pick-up metal microgranule.
If carry out step SA5, that kind then as shown in Figure 9 is engaged in acoustic lens 4 on the 2nd acoustic matching layer 3 (step SA5) through for example above-mentioned bonding agent.Thus, accomplish ultrasound probe.
According to embodiment 1, can oscillator piece the 13, the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17 be divided into the element shape through 1 time cutting.Thus, with after the embodiment 2 that states compare, embodiment 1 can make ultrasound probe through simple manufacturing process.
In addition, as above-mentioned, the manufacturing process of Fig. 4 is an example, and the manufacturing process of the ultrasound probe of embodiment 1 is not limited to this.For example, after the joint of the 1st configured intermediate body 25 and the 2nd configured intermediate body 39 is not limited to the cutting of the 1st configured intermediate body 25, also can before the cutting of the 1st configured intermediate body 25, carry out.In the case, the duplexer of the 1st configured intermediate body 25 and the 2nd configured intermediate body 39 from the 2nd acoustic matching layer side towards the back side part 6 and being cut.At this moment, from the viewpoint of processability, it is better with back side part 6 not cut cushion 5.Its reason is, for example, owing to cushion 5 softnesses, can't cut the possible of cushion 5 with good precision so have.As other reason, enumerated following main cause: when cutting, cushion 5 bendings, the adhesive strength of reduction piezoelectric vibrator 27 and cushion 5.In addition, if the cutting precision of cushion 5 is good, then also machinable cushion 5 or back side part 6.
In addition, in above-mentioned manufacturing process, cushion 5 engages with back side part 6 with before the 1st configured intermediate body 25 engages in advance.But, also can before cushion 5 and back side part 6 are engaged, on electrode is drawn with the back side of substrate 11, engage cushion 5.In the case, even draw under the situation with substrate 11 at the cutting electrode, if do not cut cushion 5, then through cutting, a plurality of elements 33 can not separate messyly yet.Therefore, the manufacturing transfiguration of ultrasound probe is prone to.
Also have, in above-mentioned manufacturing process, ultrasound probe is 1 dimension array type.But the ultrasound probe of embodiment 1 also can be 2 dimension array types.In the case, the 1st configured intermediate body 25 is a clathrate with the cutting spacing cutting of regulation in step SA2 for example.Through tieing up shapes the 1st configured intermediate body 25 is cut, and oscillator piece the 13, the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17 are cut apart with 2 dimension shapes with 2.Thus, can make the ultrasound probe of 2 dimension array types.
(embodiment 2)
As above-mentioned, in embodiment 1, cushion 5 does not directly contact piezoelectric vibrator 27.Therefore, have from the ultrasound wave of piezoelectric vibrator 27 part 6 and draw situation with the boundary face reflection of substrate 11 and cushion 5 by electrode towards the back side.This can constitute the main cause that makes hyperacoustic sound field deterioration.In embodiment 2, electrode is drawn with substrate 11 and is not disposed between transducer part 1 and the cushion 5, and is arranged at the side of transducer part 1.
Figure 10 is the figure of the typical process of the manufacturing process of the ultrasound probe of expression embodiment 2.In addition, infra state bright in, the ultrasound probe that is made as manufacturing be 1 the dimension array type.
Such, at first that oscillator piece the 13, the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17 is range upon range of shown in 11, electrode is drawn with the engage sides (step SB1) of substrate 41 with oscillator piece 13.Specifically, at first, engage the 1st acoustic matching piece 15,, engage the 2nd acoustic matching piece 17 in the front of the 1st acoustic matching piece 15 in the front of oscillator piece 13.Then, in the side of oscillator piece 13, bonding electrodes is drawn with substrate 41.The joint of each parts is identical with embodiment 1, and for example, adopting epoxy is the bonding agent of bonding agent or silicone-based bonding agent etc.Below, will draw the tectosome that constitutes with substrate 41, oscillator piece the 13, the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17 by electrode and be called the 3rd configured intermediate body 43.That is, form the 3rd configured intermediate body 43 through step SB1.
If carry out step SB1, that kind then shown in figure 12 from the back side to the 3 configured intermediate bodies 43 of oscillator piece 13 midway, is cut spacing according to the rules along 1 direction the 3rd configured intermediate body 43 is cut (step SB2).In step SB2, the 3rd configured intermediate body 43 is cut into the element shape with the mode of not exclusively cutting apart.For example, in Figure 12, be cut to the border of the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17.In the case, form a plurality of piezoelectric vibrators 27, form a plurality of the 1st acoustic matching elements 29 by the 1st acoustic matching piece 15 by oscillator piece 13.As above-mentioned, a plurality of piezoelectric vibrators 27 constitute transducer part 1, and a plurality of the 1st acoustic matching elements 29 constitute the 1st acoustic matching layer 2.But the degree of depth of the cutting slot 45 of this embodiment is not limited to this.If the 3rd configured intermediate body 43 is not cut apart fully, then can cutting slot 45 be formed into any degree of depth yet through cutting.For example, though not shown, also machinable to the border of oscillator piece 13 and the 1st acoustic matching piece 15, oscillator piece 13 midway, the 1st acoustic matching piece 15 midway or the 2nd acoustic matching piece 17 midway.In addition, identical with embodiment 1, cutting is carried out through cutting blade (dicing blade).
On the other hand, that kind shown in figure 13 engages (step SB3) with back side part 6 and Poisson's ratio greater than the cushion 5 of back side part 6 through above-mentioned bonding agent for example.Through step SB3, form the 2nd configured intermediate body 37.In addition, because step SB3 is identical with step SA3, so omit explanation.
If carry out step SB2 and step SB3; That kind then shown in figure 14; The 2nd configured intermediate body 37 and the 3rd configured intermediate body 43 that cut according to cushion 5 and transducer part 1 (in step SB2; Oscillator piece 13 is not by under the situation of cutting fully, with oscillator piece 13) mode that contacts engages (step SB4).Below, the duplexer of the 3rd configured intermediate body 43 and the 2nd configured intermediate body 37 is called the 2nd lit-par-lit structure body 47.
If carry out step SB4, that kind then shown in figure 15 according to the mode that the 3rd configured intermediate body 43 is divided into fully a plurality of elements 33, is cut the 3rd configured intermediate body 43 (step SB5) from the front of the 2nd acoustic matching piece 17.Specifically, according to new cutting slot 49 that forms and cutting slot 45 ways of connecting that in step SB2, form in step SB5, the cutting tip among the step SB5 is located.In addition, through cutting blade (dicing blade) etc. oriented cutting tip is cut.In other words, be connected with cutting slot 45, the 3rd configured intermediate body 43 is cut to cutting slot 45 from the front of the 2nd acoustic matching piece 17 up to cutting slot 49.Thus, oscillator piece the 13, the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17 are divided into a plurality of elements 33.Under the situation of Figure 14, in step SB5, the 2nd acoustic matching piece 17 is cut, form a plurality of the 2nd acoustic matching elements 31 by the 2nd acoustic matching piece 17.As above-mentioned, a plurality of the 2nd acoustic matching elements 31 constitute the 2nd acoustic matching layer 3.In addition, for intensity raising of realizing transducer part the 1, the 1st acoustic matching layer 2 and the 2nd acoustic matching layer 3 etc., also can in cutting slot 45 and 49, fill the bonding agent that epoxy is bonding agent or silicone-based bonding agent etc.In addition, in order to suppress to be filled in the thermal expansion of the bonding agent in cutting slot 45 and 49, also can be in this bonding agent the pick-up metal microgranule.
If carry out step SB5, that kind then shown in figure 16 through above-mentioned bonding agent etc., is engaged in acoustic lens 4 on the 2nd acoustic matching layer 3 (step SB6).Thus, accomplish ultrasound probe.
According to embodiment 2,, cutting process is divided into two stages in order to be divided into the element shape by the 3rd configured intermediate body 43 that oscillator piece the 13, the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17 constitute.This is because following reason.
The ultrasound probe of embodiment 2 has the structure that cushion 5 directly is contacted with transducer part 1.Through cutting at one time the 3rd configured intermediate body 43 is being divided under the situation of element shape; For example; In step SB2, be divided under the situation of a plurality of elements 33, owing to do not have pedestal, so piezoelectric vibrator the 27, the 1st acoustic matching element 29 and the 2nd acoustic matching element 31 become messy.For the situation that prevents that piezoelectric vibrator the 27, the 1st acoustic matching element 29 and the 2nd acoustic matching element 31 from becoming messy, in step SB5, make cushion 5 become pedestal and the 3rd configured intermediate body 43 is cut.But the Poisson's ratio of cushion 5 is big and have a flexibility.Therefore, if make cushion 5 become pedestal the 3rd configured intermediate body 43 is cut, then when cutting, the 3rd configured intermediate body 43 relative cushions 5 are unstable geometrically, the possibility that exists element divisions to carry out well.
According to embodiment 2, such shown in step SB2 and step SB5, cutting process is divided into two stages.That is, in step SB2, the 3rd configured intermediate body 43 is cut to midway, in step SB4, cushion 5 and the 3rd configured intermediate body 43 that cut is engaged, in step SB5, the remaining cutting tip of the 3rd configured intermediate body 43 is cut.Through like this cutting process being divided into two stages, thus, the situation that does not have piezoelectric vibrator the 27, the 1st acoustic matching element 29 and the 2nd acoustic matching element 31 to become messy can be carried out element divisions with good precision.
In addition, in above-mentioned manufacturing process, being made as ultrasound probe is 1 dimension array type.But the ultrasound probe of embodiment 2 also can be 2 dimension array types.In the case, the 3rd configured intermediate thing 43, for example in step SB2, be clathrate according to the rules the cutting spacing and be cut to midway, in step SB5, cut remaining cutting tip.Through cutting the 3rd configured intermediate body 43 with 2 dimension shapes like this, cut apart oscillator piece the 13, the 1st acoustic matching piece 15 and the 2nd acoustic matching piece 17 with 2 dimension shapes.Thus, can make the ultrasound probe of 2 dimension array types.
(variation 1)
In above-mentioned explanation, cushion 5 has one deck structure.But the cushion 5 of this embodiment is not limited to this.Cushion 5 also can have the structure more than 2 layers.Below, the ultrasound probe of variation 1 is described.In addition, in following explanation, pay same labelling, only under the situation of needs, carry out repeat specification for the component parts that has with the roughly the same function of this embodiment.In addition, the cushion 5 of variation 1 has 2 layers of structure as an example.
Figure 17 is the figure of the general structure of the ultrasound probe of expression variation 1.That kind shown in figure 17, cushion 5 have 2 layers of structure that constitute by the 1st layer 51 and the 2nd layers 52.Be arranged at for the 1st layer 51 than the 2nd layer 52 more near the position of transducer part 1.At least 1 layer in the 1st layer 51 and the 2nd layers 52 has the Poisson's ratio greater than back side part, so that make the mechanical vibration decay of transducer part 1.For the extinction efficiency of the mechanical vibration that improve transducer part 1, also can be according to greater than mode cushion 5 being set away from the Poisson's ratio of the layer (the 2nd layer 52) of transducer part 1 near the Poisson's ratio of the layer (the 1st layer 51) of transducer part 1.
Have at cushion 5 under the situation of the structure more than 3 layers, equally also can be according to greater than the mode of the Poisson's ratio of other layer cushion 5 being set near the Poisson's ratio of the layer of transducer part 1.
Like this, according to variation 1, can prevent to follow the deterioration of sound characteristics of the vibration of oscillator.
(variation 2)
In above-mentioned explanation, if cushion 5 is set, then both can between transducer part 1 and cushion 5, other component parts be set in the rear side of transducer part 1, can not be provided with yet.In above-mentioned explanation,, for example enumerated FPC11 as the component parts that is arranged between transducer part 1 and the cushion 5.But the ultrasound probe of this embodiment also can not only be provided with FPC11, and any component parts is set between transducer part 1 and cushion 5.Below, the ultrasound probe of variation 2 is described.In addition, in following explanation, pay same labelling, only under the situation of needs, carry out repeat specification for the component parts that has with the roughly the same function of this embodiment.
Figure 18 is the figure of the general structure of the ultrasound probe of expression variation 2.That kind shown in figure 18 is provided with the 3rd acoustic matching layer 7 between transducer part 1 and cushion 5.The 3rd acoustic matching layer 7 is set, so that relax not matching of acoustic impedance between transducer part 1 and the cushion 5.Have also the rear side of transducer part 1 is radiated hyperacoustic situation.Can make the ultrasound wave of the rear side that emits to transducer part 1 pass to cushion 5 and back side part 6 with good efficiency through the 3rd acoustic matching layer 7.
In addition, the component parts that is arranged between transducer part 1 and the cushion 5 is not limited only to FPC11 or acoustic matching layer 7, also the component parts with any function, structure and composition can be set.
Like this, according to variation 2, can prevent to follow the deterioration of sound characteristics of the vibration of oscillator.
Though some embodiment are described,, these embodiment only by way of example mode provide, and do not mean that scope of the present invention is limited.The embodiment of the novelty of in fact, describing among this paper can also be embodied in various other patterns.In addition, under the situation that does not break away from spirit of the present invention, can make various omissions, replacement and change to each embodiment described herein.Back appending claims and equivalent thereof cover and fall into various forms or the modification within scope of the present invention and the spirit.
Claims (9)
1. ultrasound probe is characterized in that possessing:
Oscillator vibrates in order to carry out hyperacoustic transmission to receive;
Cushion is arranged at the rear side of above-mentioned oscillator; And
Back side part is arranged at the rear side of above-mentioned cushion, makes the ultrasonic attenuation from above-mentioned oscillator; Above-mentioned cushion has than the big Poisson's ratio of above-mentioned back side part.
2. ultrasound probe according to claim 1 is characterized in that,
The Poisson's ratio of above-mentioned cushion is more than 0.4.
3. ultrasound probe according to claim 1 is characterized in that,
The difference of the acoustic impedance of the acoustic impedance of above-mentioned cushion and above-mentioned back side part is more than one 20%+below 20%.
4. ultrasound probe according to claim 1 is characterized in that,
Above-mentioned cushion has from the thickness roughly over half of hyperacoustic wavelength of above-mentioned oscillator transmission.
5. ultrasound probe according to claim 1 is characterized in that,
Above-mentioned cushion is by constituting more than 2 layers.
6. ultrasound probe according to claim 5 is characterized in that,
At least 1 layer in the above-mentioned cushion more than 2 layers has than the big Poisson's ratio of above-mentioned back side part.
7. ultrasound probe according to claim 6 is characterized in that,
Approaching above-mentioned oscillator in the above-mentioned cushion more than 2 layers the layer Poisson's ratio, than in the above-mentioned cushion more than 2 layers away from above-mentioned oscillator the layer Poisson's ratio big.
8. the manufacturing approach of a ultrasound probe is characterized in that, possesses:
Formation has the tectosome of tabular oscillator piece harmony match block;
For above-mentioned tectosome is divided into a plurality of elements, above-mentioned tectosome is cut; And
The mode that cushion is set with the rear side at above-mentioned oscillator piece engages the above-mentioned tectosome that has cut and has flexible above-mentioned cushion.
9. the manufacturing approach of a ultrasound probe is characterized in that, possesses:
Formation has the tectosome of tabular oscillator piece harmony match block;
Above-mentioned tectosome is cut to above-mentioned tectosome midway from the back side of above-mentioned oscillator piece;
The mode that contacts with the back side of above-mentioned oscillator piece with cushion engages the above-mentioned tectosome that has cut and has flexible above-mentioned cushion; And
For above-mentioned tectosome is divided into a plurality of elements,, above-mentioned tectosome that has engaged and cushion are cut from the front of above-mentioned acoustic matching layer with cutting slot and the new cutting slot ways of connecting that forms that in above-mentioned cutting, is formed at above-mentioned tectosome.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011073244A JP2012205726A (en) | 2011-03-29 | 2011-03-29 | Ultrasonic probe and ultrasonic probe manufacturing method |
| JP073244/2011 | 2011-03-29 |
Publications (2)
| Publication Number | Publication Date |
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| CN102727252A true CN102727252A (en) | 2012-10-17 |
| CN102727252B CN102727252B (en) | 2014-12-10 |
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| CN201210114466.5A Active CN102727252B (en) | 2011-03-29 | 2012-03-22 | Ultrasonic probe and ultrasonic probe manufacturing method |
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| US (1) | US20120253199A1 (en) |
| JP (1) | JP2012205726A (en) |
| KR (1) | KR101411232B1 (en) |
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Cited By (1)
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| CN104722469A (en) * | 2015-03-02 | 2015-06-24 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic transducer and manufacturing method thereof |
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| JP2012114713A (en) * | 2010-11-25 | 2012-06-14 | Toshiba Corp | Ultrasonic wave probe |
| KR101394035B1 (en) | 2012-10-09 | 2014-05-09 | 기아자동차 주식회사 | Connecting structure for fender apron |
| KR102293575B1 (en) * | 2014-09-04 | 2021-08-26 | 삼성메디슨 주식회사 | Probe for ultrasonic imaging apparatus and manufacturing method thereof |
| JP6517114B2 (en) * | 2015-08-31 | 2019-05-22 | Ｐ．Ｐａｎｅｌ合同会社 | Plate-like composition and method for producing the same |
| CN105997140A (en) * | 2016-04-18 | 2016-10-12 | 范玉 | Protective device for medical ultrasonic examination |
| KR102490676B1 (en) * | 2021-09-30 | 2023-01-27 | 주식회사 소노티엑스 | Therapy Devices and Methods Using Ultrasound |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102727252B (en) | 2014-12-10 |
| US20120253199A1 (en) | 2012-10-04 |
| KR20120112023A (en) | 2012-10-11 |
| KR101411232B1 (en) | 2014-06-24 |
| JP2012205726A (en) | 2012-10-25 |
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Effective date of registration: 20160805 Address after: Japan Tochigi Patentee after: Toshiba Medical System Co., Ltd. Address before: Tokyo, Japan, Japan Patentee before: Toshiba Corp Patentee before: Toshiba Medical System Co., Ltd. |