CN102655188A - Optical mechanical module and manufacture method thereof - Google Patents

Optical mechanical module and manufacture method thereof Download PDF

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Publication number
CN102655188A
CN102655188A CN2011101092971A CN201110109297A CN102655188A CN 102655188 A CN102655188 A CN 102655188A CN 2011101092971 A CN2011101092971 A CN 2011101092971A CN 201110109297 A CN201110109297 A CN 201110109297A CN 102655188 A CN102655188 A CN 102655188A
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CN
China
Prior art keywords
light
emitting diode
engine module
bare engine
electrode
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Application number
CN2011101092971A
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Chinese (zh)
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CN102655188B (en
Inventor
李佳恩
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Lextar Electronics Corp
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Lextar Electronics Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector

Abstract

The invention provides an optical mechanical module and a manufacture method thereof, the optical mechanical module comprises a carrying substrate; a light emitting diode provided with a light-emitting surface and a back surface, wherein the back surface of the light emitting diode is fixed on the carrying substrate: and a first electrode disposed between the light emitting diode and the carrying substrate and connected to the back surface of the light emitting diode, wherein the area of one overlapping of the first electrode and the back surface is 50%-100% that of the back surface; and a first lead layer and a second lead layer compliably formed on the carrying substrate and respectively electrically connected to the first electrode and the light-emitting surface.

Description

Bare engine module and preparation method thereof
Technical field
The present invention relates to a kind of bare engine module and preparation method thereof, particularly a kind of bare engine module and preparation method thereof.
Background technology
Existing bare engine module technology can be fixed to above-mentioned encapsulation unit on the sheet material (also can be described as radiating block (heat-sinking slug)) with circuit binding and heat dissipation characteristics earlier with forming encapsulation unit in luminescence component (for example light-emitting diode (LED)) Chip Packaging to the package support with secondary optics characteristic (lead frame) usually afterwards again.Yet above-mentioned existing bare engine module can cause many shortcomings.One of shortcoming is the main heating source of bare engine module for the luminescence component of existing bare engine module; The heat that it produced must then see through package support or heat radiation again via module board; Therefore; The heat radiation form of luminescence component belongs to the indirect type heat radiation, and can't be directly that the dissipation of heat that assembly produced is extremely extraneous.Particularly in the application of high power ray machine module, the optical activity of luminescence component and useful life can not decay because of the radiating efficiency of encapsulating structure is good.
In addition, the luminescence component chip in the existing bare engine module, must wait for that the luminescence component wafer is accomplished technology and isolated a plurality of luminescence component chips after, measuring light electrical characteristics and pick out and meet a specific light electrical characteristics specification luminescence component chip and can use.Yet the performance of bare engine module can't effectively estimated and design to above-mentioned existing technology.In addition, the shortcoming that the luminescence component chip that does not meet specific light electrical characteristics specification that remains can cause the technology cost to descend.
In this technical field, a kind of bare engine module of needs and preparation method thereof is arranged, the problem that it can avoid prior art to produce.
Summary of the invention
In view of this, one embodiment of the invention provide a kind of manufacture method of bare engine module, and the manufacture method of above-mentioned bare engine module comprises provides several LED test structures, and wherein each more above-mentioned LED test structure comprises a growth substrate; One light-emitting diode is laminated, is positioned on the above-mentioned growth substrate; One first electrode is arranged on the laminated first surface of above-mentioned light-emitting diode, the overlapping area of wherein above-mentioned first electrode and above-mentioned first surface be above-mentioned first surface area 50% to 100% between; And one second electrode, be arranged on the laminated second surface of above-mentioned light-emitting diode; The more above-mentioned LED test structure that will meet a specific light electrical characteristics specification is picked out and is fixed on the bearing substrate; It is laminated to remove the above-mentioned growth substrate of each select more above-mentioned LED test structure, above-mentioned second electrode and the above-mentioned light-emitting diode of part, to form several light-emitting diodes; And form several conductor layer No.1s and several second conductor layers; Wherein more above-mentioned conductor layer No.1 is electrically connected to more above-mentioned first electrode of more above-mentioned light-emitting diode respectively, and wherein more above-mentioned second conductor layer is electrically connected to the light-emitting area of more above-mentioned light-emitting diode respectively.
Another embodiment of the present invention provides a kind of bare engine module, and above-mentioned bare engine module comprises a bearing substrate; One light-emitting diode; It has a light-emitting area and a back side; Wherein the above-mentioned back side of above-mentioned light-emitting diode is fixed on the above-mentioned bearing substrate: and one first electrode; Be arranged between above-mentioned light-emitting diode and the above-mentioned bearing substrate, and be connected to the above-mentioned back side of above-mentioned light-emitting diode, an overlapping area at wherein above-mentioned first electrode and the above-mentioned back side be above-mentioned first surface area 50% to 100% between; And a conductor layer No.1 and one second conductor layer, compliance is formed on the above-mentioned bearing substrate, and is electrically connected to above-mentioned first electrode and above-mentioned light-emitting area respectively.
Description of drawings
Fig. 1~5 are the process section of the bare engine module of the embodiment of the invention.
Reference numeral:
200: test board;
202: the growth substrate;
204,204a: light-emitting diode is laminated;
206: the first electrodes;
207: first surface;
208,212: metal level;
209: second surface;
210: the second electrodes;
211,221,222: sidewall;
214: bearing substrate;
216: groove;
218: insulating barrier;
220: the bottom surface;
223: the back side;
224: conductor layer No.1;
226: the second conductor layers;
228: light-emitting area;
230: fluorescence coating;
232: encapsulating material;
250,250a: LED test structure;
260: light-emitting diode;
A1, A2: area;
500: bare engine module.
Embodiment
Below specify and be accompanied by the example of graphic explanation with each embodiment, as reference frame of the present invention.In accompanying drawing or specification description, similar or identical part is all used identical figure number.And in graphic, the shape of embodiment or thickness can enlarge, and to simplify or convenient the sign.Moreover; The part of each assembly will be it should be noted that the assembly that does not show or describe among the figure to describe explanation respectively in the accompanying drawing; The form of being known for affiliated technical field those of ordinary skill; In addition, certain embodiments is merely and discloses the ad hoc fashion that the present invention uses, and it is not in order to limit the present invention.
Fig. 1~5 are the process section of the bare engine module of the embodiment of the invention.The manufacture method of the bare engine module of the embodiment of the invention is in luminescence component chip technology step, to pick out especially to meet a specific light electrical characteristics specification luminescence component, can effectively estimate and design the performance of bare engine module.In addition, the luminescence component of picking out has by one directly that circuit links and the bearing substrate of heat dissipation characteristics is done direct heat conduction, can prolong the optical activity and the life-span of luminescence component.As shown in Figure 1, at first, the LED test structure 250 of several separation is provided.In an embodiment of the present invention, the electrode setting of LED test structure 250 is the usefulness of convenience as the step of follow-up measuring light electrical characteristics, and it is the structure during the chip technology, is not to be a final structure (meaning is a light-emitting diode chip for backlight unit).In an embodiment of the present invention, each LED test structure 250 can comprise a growth substrate 202.In an embodiment of the present invention, the material of growth substrate 202 can comprise semi-conducting material or sapphire (sapphire).One light-emitting diode is laminated 204, is positioned on the growth substrate 202.In an embodiment of the present invention, can be provided with a resilient coating (figure does not show) between growth substrate 202 and the light-emitting diode laminated 204.In an embodiment of the present invention; Light-emitting diode laminated 204 can be by having the semiconductor layer formation that p type-n type connects face (pn junction); It comprises a p type semiconductor layer and a n type semiconductor layer (figure does not show) of at least two electric connections; And the light emitting semiconductor layer between p type semiconductor layer and the n type semiconductor layer (figure does not show), the semiconductor layer that is used for light-emitting diode laminated 204 can comprise gallium nitride (GaN), indium gallium nitride materials such as (GaInN).In the present embodiment, the n type semiconductor layer of light-emitting diode laminated 204 and p type semiconductor layer are along the direction storehouse perpendicular to growth substrate 202 surfaces.It should be noted that; In an embodiment of the present invention; For the photoelectric characteristic that makes LED test structure 250 is easy to measure; Be design to make light-emitting diode laminated 204 first surface 207 that exposes the n type semiconductor layer and a second surface 209 that exposes the p type semiconductor layer all be the same side and both coplines not that are positioned at light-emitting diode laminated 204, and light-emitting diode laminated 204 is to have a sidewall 211 that connects first surface 207 and second surface 209.
As shown in Figure 1; Each LED test structure 250 also comprises one first electrode 206 and one second electrode 210; On the first surface 207 that is arranged at light-emitting diode laminated 204 respectively and the second surface 209, wherein first electrode 206 can be provided as electrical contact that the subsequent optical electrical characteristics measure and can be as one of electrode of light-emitting diode chip for backlight unit final structure.Second electrode 210 that it should be noted that LED test structure 250 only provides the electrical contact of measuring as the subsequent optical electrical characteristics, but is not one of electrode as the light-emitting diode chip for backlight unit final structure.It should be noted that; In an embodiment of the present invention; For the photoelectric characteristic that makes LED test structure 250 is easy to measure (meaning promptly makes the photoelectric characteristic measuring instrument be easy to electrically contacts with LED test structure 250 and do not need accurate alignment procedures), be design the overlapping area A1 that makes first electrode 206 and first surface 207 be designed to first surface area A 2 50% to 100% between.In addition, each LED test structure 250 also comprises a metal level 208, is positioned on the first surface 207 of LED test structure 250, and covers first electrode 206.The area that first electrode 206 that metal level 208 can more increase LED test structure 250 and photoelectric characteristic measuring instrument electrically contact.
Then, as shown in Figure 1 again, several LED test structures 250 are arranged on the test board 200, to measure the photoelectric characteristic of each LED test structure 250.In an embodiment of the present invention, test board 200 can be for example one of adhesive tape insulation board.The electrode of LED test structure 250 as shown in Figure 1 be provided with the set-up mode of position and test structure can be in luminescence component chip technology step the photoelectric characteristic of a plurality of LED test structures 250 of one-shot measurement; Can effectively estimate and design the performance of bare engine module, need not wait until that accomplishing chip technology just learns above-mentioned photoelectric characteristic.In an embodiment of the present invention, the LED test structure 250a that is not inconsistent unification specific light electrical characteristics specification can carry out follow-up chip technology, thereby can save the technology cost.
Through after the above-mentioned photoelectric characteristic measuring process, then, please refer to Fig. 2, pick out the LED test structure 250a that meets a specific light electrical characteristics specification and be fixed on the bearing substrate 214.In an embodiment of the present invention, bearing substrate 214 has a groove 216, so that LED test structure 250a is arranged at wherein.In an embodiment of the present invention, bearing substrate 214 can comprise semiconductor substrate or metal oxide substrate, for example silicon substrate or aluminium nitride substrate etc.As shown in Figure 2, first electrode 206 of each LED test structure 250a is to be connected to bearing substrate 214 by a metal level 212.
Then, please refer to Fig. 3, it shows the formation step of light-emitting diode 260.As shown in Figure 3; Can carry out a laser cutting technique; Sidewall 211 along the light-emitting diode laminated 204 of each LED test structure 250a removes part growth substrate 202, part light-emitting diode laminated 204 and second electrode 210, to form the laminated 204a of light-emitting diode.Then, carry out an etch process, remove the growth substrate 202 of each LED test structure 250a, to form several light-emitting diodes 260.As shown in Figure 3, through after the above-mentioned technology, be the light-emitting area 228 that exposes each light-emitting diode 260.
Then, please refer to Fig. 4, it shows the formation step of the conductor layer of light-emitting diode 260.As shown in Figure 4; Can carry out a depositing operation and a Patternized technique in regular turn; Compliance is in part bearing substrate 214, comprises on the back side 223 and the sidewall 221 and the part light-emitting diode 260 of bottom surface 220, sidewall 222, bearing substrate 214 of groove 216 forming an insulating barrier 218.As shown in Figure 4, insulating barrier 218 is the part bottom surfaces 220 and part side 222 that coat this groove, and extends to the part back side 223 of bearing substrate 214.In an embodiment of the present invention, depositing operation can comprise chemical vapour deposition technique (CVD), physical vaporous deposition (PVD), sputtering method, print process, spraying process (spray coating) or method of spin coating, and Patternized technique can comprise little shadow and etch process.In embodiments of the present invention; Insulating barrier 218 is to use so that the conductor layer of follow-up formation can not produce short circuits with light-emitting diode 260 or bearing substrate 214, and the material of insulating barrier 218 can comprise epoxy resin, Polyimide, resin, silica, metal oxide or silicon nitride.
Afterwards; Please again with reference to figure 4; Modes such as plating capable of using (electric plating) or chemical vapor deposition (CVD); On insulating barrier 218, form several conductor layer No.1s 224 and several second conductor layers 226, wherein the conductor layer No.1 224 and second conductor layer 226 are the semiconductor layers in order to the different conduction-types that is electrically connected to light-emitting diode laminated 204 respectively.As shown in Figure 4; Conductor layer No.1 224 is a back side 223 that is arranged at bearing substrate 214; It can be electrically connected to first electrode 206 of light-emitting diode 260 by the via that passes bearing substrate 214 (figure does not show), metal level 208 and 212; And second conductor layer, 226 compliances are arranged at a sidewall 222 of groove 216 and the sidewall that a bottom surface 220 extends to bearing substrate 214 221 and the back side 223, with the light-emitting area 228 that is electrically connected to light-emitting diode 260.As shown in Figure 4, second conductor layer 226 is to utilize insulating barrier 218 and other part of bearing substrate 214 and light-emitting diode 260 to separate.
Then, please refer to Fig. 5, it shows the formation step of fluorescence coating 230 and encapsulating material 232.Coating capable of using (coating) mode forms a fluorescence coating 230 respectively on the light-emitting area 228 of each light-emitting diode 260.In an embodiment of the present invention, fluorescence coating 230 can be epoxy resin (epoxy) layer or the silicone layer that contains fluorescent material, maybe can be to be entirely the phosphor powder layer that fluorescent material constitutes, and the fluorescent material that is used in fluorescence coating 230 can comprise phosphorus fluorescent material.
Afterwards, please again with reference to figure 5, depositional mode capable of using forms an encapsulating material 232 in the groove 216 of bearing substrate 214, and covers fluorescence coating 230, light-emitting diode 260 and second conductor layer 226.In an embodiment of the present invention, encapsulating material 232 can comprise epoxy resin, Polyimide or resin.Through after the above-mentioned technology, be the bare engine module 500 of accomplishing the embodiment of the invention.
Provide a kind of bare engine module and preparation method thereof in the embodiment of the invention.The manufacture method of the bare engine module of the embodiment of the invention is in luminescence component chip technology step, to make especially to be convenient to the photoelectric characteristic measuring instrument and to be easy to electrical electrodes in contact design; Thereby do not need accurate alignment procedures can measure luminescence component, and can in luminescence component chip technology step, promptly pick out the luminescence component that meets a specific light electrical characteristics specification and be made into bare engine module again.Therefore, the performance of bare engine module can effectively estimated and design to the bare engine module processing step of the embodiment of the invention, with the reliability of lifting bare engine module, and can save the technology cost.In addition, be to have circuit simultaneously to link and heat dissipation characteristics with the luminescence component setting bearing substrate on it that goes out for you to choose, thereby package support of above-mentioned bearing substrate instead prior art (lead frame) and radiating block.When bare engine module was operated, the heat that luminescence component produced can directly be directed at bare engine module via bearing substrate and not need the package support of the existing bare engine module of process more outward, thereby heat conduction speed can greatly promote.Because the distance in embodiment of the invention luminescence component to the bare engine module outside therefore can be extremely extraneous with the thermal conductance of luminescence component chip generation rapidly less than existing bare engine module, thereby can prolong the optical activity and the life-span of luminescence component.
Though the present invention discloses as above with embodiment, so it is not in order to limiting the present invention, and any those of ordinary skill in the art when can doing a little change and retouching, and does not break away from the spirit and scope of the present invention.

Claims (17)

1. the manufacture method of a bare engine module comprises the following steps:
Several LED test structures are provided, and wherein each said LED test structure comprises:
One growth substrate;
One light-emitting diode is laminated, is positioned on this growth substrate;
One first electrode is arranged on the laminated first surface of this light-emitting diode, wherein the overlapping area of this first electrode and this first surface be this first surface area 50% to 100% between; And
One second electrode is arranged on the laminated second surface of this light-emitting diode;
The said LED test structure that will meet a specific light electrical characteristics specification is picked out and is fixed on the bearing substrate;
This growth substrate, this second electrode and this light-emitting diode of part of removing each select said LED test structure are laminated, to form several light-emitting diodes; And
Form several conductor layer No.1s and several second conductor layers, wherein said conductor layer No.1 is electrically connected to said first electrode of said light-emitting diode respectively, and wherein said second conductor layer is electrically connected to the light-emitting area of said light-emitting diode respectively.
2. the manufacture method of bare engine module according to claim 1 also comprises said LED test structure is arranged on the test board, to measure the photoelectric characteristic of said LED test structure respectively.
3. the manufacture method of bare engine module according to claim 1, said first electrode of wherein said light-emitting diode is connected to this bearing substrate.
4. the manufacture method of bare engine module according to claim 1, the preceding compliance that also comprises that forms said first and second conductor layers forms an insulating barrier on this bearing substrate and said light-emitting diode.
5. the manufacture method of bare engine module according to claim 1 also comprises:
On the said light-emitting area of said light-emitting diode, form a fluorescence coating;
Form an encapsulating material, cover this fluorescence coating, said light-emitting diode and said second conductor layer.
6. the manufacture method of bare engine module according to claim 1; Wherein laminated this first surface of this light-emitting diode of each said LED test structure and this second surface all are positioned at the same side of each said LED test structure, and both coplines not.
7. the manufacture method of bare engine module according to claim 6, wherein this light-emitting diode of each said LED test structure is laminated has a sidewall that connects this first surface and this second surface.
8. the manufacture method of bare engine module according to claim 7 wherein forms several light-emitting diodes and also comprises:
Carry out a laser cutting technique, removing part along this laminated sidewall of each said light-emitting diode should the growth substrate, the part light-emitting diode is laminated and this second electrode; And
Carry out an etch process, remove this growth substrate of each said LED test structure.
9. the manufacture method of bare engine module according to claim 1, wherein this bearing substrate has a groove, and wherein said light-emitting diode is to be arranged in this groove.
10. the manufacture method of bare engine module according to claim 9; Wherein this conductor layer No.1 is arranged at a back side of this bearing substrate, and wherein this second conductor layer compliance is arranged at a sidewall of this groove and this back side that a bottom surface extends to this bearing substrate.
11. the manufacture method of bare engine module according to claim 1, wherein each said LED test structure also comprises a metal level, is positioned on this first surface of this LED test structure, and covers this first electrode.
12. a bare engine module comprises:
One bearing substrate;
One light-emitting diode, it has a light-emitting area and a back side, and wherein this back side of this light-emitting diode is fixed on this bearing substrate: and
One first electrode is arranged between this light-emitting diode and this bearing substrate, and is connected to this back side of this light-emitting diode, wherein an overlapping area at this first electrode and this back side be this back side area 50% to 100% between; And
One conductor layer No.1 and one second conductor layer, compliance is formed on this bearing substrate, and is electrically connected to this first electrode and this light-emitting area respectively.
13. bare engine module according to claim 12, wherein this bearing substrate has a groove, and wherein light-emitting diode is to be arranged in this groove.
14. bare engine module according to claim 13 also comprises an insulating barrier, coats a bottom surface and a side of this groove.
15. bare engine module according to claim 14; Wherein this conductor layer No.1 is positioned on this insulating barrier with this second conductor layer; And wherein this conductor layer No.1 is arranged at a back side of this bearing substrate, and wherein this second conductor layer compliance is arranged at this sidewall of this groove and this back side that this bottom extends to this bearing substrate.
16. bare engine module according to claim 12 also comprises a metal level, is arranged between this first electrode and this bearing substrate.
17. bare engine module according to claim 12 also comprises:
One fluorescence coating is arranged on this light-emitting area of this light-emitting diode; And
One encapsulating material covers this fluorescence coating, this light-emitting diode and this second conductor layer.
CN201110109297.1A 2011-03-01 2011-04-25 Bare engine module and preparation method thereof Active CN102655188B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100106612A TWI442496B (en) 2011-03-01 2011-03-01 Light engine and method for manufacturing the same
TW100106612 2011-03-01

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CN102655188A true CN102655188A (en) 2012-09-05
CN102655188B CN102655188B (en) 2015-11-25

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060284208A1 (en) * 2005-06-15 2006-12-21 Kang Jong H Light emitting diode device using electrically conductive interconnection section
US20090026472A1 (en) * 2006-07-27 2009-01-29 Stanley Electric Co., Ltd. Silicon LED package having horn and contact edge with (111) planes
US20090261375A1 (en) * 2008-04-22 2009-10-22 Silicon Base Development Inc. Package-base structure of luminescent diode and fabricating process thereof
CN101567411A (en) * 2009-05-26 2009-10-28 晶科电子(广州)有限公司 Flip-chip integrated encapsulation structure of LED and method thereof
CN101937961A (en) * 2009-06-29 2011-01-05 普罗科技有限公司 Method for manufacturing a light-emitting diode by using a secondary-adhesion substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060284208A1 (en) * 2005-06-15 2006-12-21 Kang Jong H Light emitting diode device using electrically conductive interconnection section
US20090026472A1 (en) * 2006-07-27 2009-01-29 Stanley Electric Co., Ltd. Silicon LED package having horn and contact edge with (111) planes
US20090261375A1 (en) * 2008-04-22 2009-10-22 Silicon Base Development Inc. Package-base structure of luminescent diode and fabricating process thereof
CN101567411A (en) * 2009-05-26 2009-10-28 晶科电子(广州)有限公司 Flip-chip integrated encapsulation structure of LED and method thereof
CN101937961A (en) * 2009-06-29 2011-01-05 普罗科技有限公司 Method for manufacturing a light-emitting diode by using a secondary-adhesion substrate

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CN102655188B (en) 2015-11-25
TWI442496B (en) 2014-06-21
TW201237977A (en) 2012-09-16

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