CN102653707A - Electronic component decontamination fluid - Google Patents

Electronic component decontamination fluid Download PDF

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Publication number
CN102653707A
CN102653707A CN2011100513615A CN201110051361A CN102653707A CN 102653707 A CN102653707 A CN 102653707A CN 2011100513615 A CN2011100513615 A CN 2011100513615A CN 201110051361 A CN201110051361 A CN 201110051361A CN 102653707 A CN102653707 A CN 102653707A
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CN
China
Prior art keywords
electronic component
decontamination liquid
described electronic
rust
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011100513615A
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Chinese (zh)
Inventor
徐旭芬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NINGBO YINZHOU ACOUSTO-OPTIC ELECTRONIC Manufacturing Co Ltd
Original Assignee
NINGBO YINZHOU ACOUSTO-OPTIC ELECTRONIC Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NINGBO YINZHOU ACOUSTO-OPTIC ELECTRONIC Manufacturing Co Ltd filed Critical NINGBO YINZHOU ACOUSTO-OPTIC ELECTRONIC Manufacturing Co Ltd
Priority to CN2011100513615A priority Critical patent/CN102653707A/en
Publication of CN102653707A publication Critical patent/CN102653707A/en
Pending legal-status Critical Current

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Abstract

The invention discloses electronic component decontamination fluid which consists of the following compositions in percentage by weight: 5-8% of a surfactant, 2-4% of an auxiliary solvent, 0.2-0.4% of a corrosion and rust inhibitor, and the balance of deionized water, wherein the surfactant is an ion-non-ionic surfactant, and the auxiliary solvent is a polyol solvent. The detergent provided by the invention can effectively clean metal ions, organic and inorganic impurities and solid particles on the surfaces of electronic materials, and is strong in cleaning force. Drainage can be directly carried out after cleaning without polluting the environment, and the cleaned materials do not rust. The electronic component decontamination fluid is especially beneficial to the decontamination for nonmetal parts such as semiconductor wafers, electronic glass substrates or light-emitting diodes (LCDs).

Description

The electronic component decontamination liquid
Technical field
The present invention particularly partly carries out decontamination to non-metal component in the electronic component about a kind of electronic component scavenging solution.
Background technology
Process for processing at electronic product prepares in the process; Be prepared as example with semiconductor element; Usually need use physics and chemical treatment technologies such as washing technology, mechanochemistry abrasion process; Thereby will form physics and chemical residual on its surface, like metallic impurity, organic and inorganic impurity and solids.These residuals are the outward appearance of impression product not only, more likely can form deleterious harm to follow-up art breading, influences the precision and the life-span of product.Along with the improper raising to accuracy requirement of semiconductor element, removing impurity and stained thing will be its inevitable requirement.Certainly other need the element of optics, electricity effect to be suitable for too to electronic glass and LCD etc. in these requirements.
Simultaneously, this field also requires to need to be suitable for safety and environmental protection to guarantee operator's health of human body to decontamination liquid, forbids the generation of inflammable and explosive harm; Be convenient to preparation, cost is low; After the decontamination hold-time long, and electronic component do not caused the corrosion on the performance; And the follow-up discharging of the decontamination material after using and processing also should be satisfied growing environmental requirement.
Summary of the invention
For solving the problems of the technologies described above, the present invention provides a kind of electronic component decontamination liquid, and its formation component according to weight percent is following: tensio-active agent 5-8%, and secondary solvent 2-4%, anticorrosion, rust-preventive agent 0.2-0.4%, all the other are deionized water; Said tensio-active agent is ion-nonionogenic tenside; Said secondary solvent is the polyalcohols solvent.
Stain remover among the present invention can be to the lip-deep metals ion of electronic material, and organic and inorganic impurity and solids effectively clean, and cleaning force is strong, direct discharge opeing environmentally safe after the cleaning, the not corrosion of material after the cleaning.Particularly help decontamination to non-metallic components such as semiconductor wafer, electronic glass substrate or LCD.
Embodiment
The present invention provides a kind of electronic component decontamination liquid, and its formation component according to weight percent is following: tensio-active agent 5-8%, and secondary solvent 2-4%, anticorrosion, rust-preventive agent 0.2-0.4%, all the other are deionized water; Said tensio-active agent is ion-nonionogenic tenside; Said secondary solvent is the polyalcohols solvent.
As further improvement of the present invention, said anticorrosion, rust-preventive agent is triethanolamine oleate and benzotriazole.Said polyalcohols solvent is that any one or a few mixture of ethanol, terepthaloyl moietie, Ucar 35, USP Kosher, Virahol constitutes.
As further improvement of the present invention, said ion-ionic surfactant pack is drawn together: the mixture of the mixture of anionic surfactant, anionic surfactant and non-ionic surfactant or cats product and nonionogenic tenside.Said AS is a SAS, and nonionogenic tenside is fatty acid methyl ester ethoxylate and/or alkyl polyglycoside.
As improvement and embodiment further of the present invention; A kind of electronic component decontamination liquid is provided, it is characterized in that said clean-out system is made up of following components in weight percent: AS SAS 2-5%, nonionogenic tenside fatty acid methyl ester ethoxylate 1-2% and/or alkyl polyglycoside 2-4%; Anticorrosion, rust-preventive agent triethanolamine oleate 0.1-0.2%, benzotriazole 0.1-0.2%; Any one or a few 2-3% in secondary solvent ethanol, terepthaloyl moietie, Ucar 35, USP Kosher, the Virahol; All the other are deionized water.
Electronic component decontamination liquid provided by the present invention particularly can be widely used in the non-metallic material of electronic component part or the decontamination on the parts.Said non-metallic component comprises: semiconductor wafer, electronic glass substrate or LCD etc. require the planeness and the residual demanding field of electrical components of element after high, the decontamination to clean effect.
Decontamination liquid production technique among the present invention is also corresponding simple, and its process for preparation is following; Add raw material according to the proportioning in the foregoing description, after stirring 45 minutes under 50 ℃ of temperature, leave standstill 60 minutes, be the decontamination liquid of product of the present invention to room temperature.
Simultaneously in process of production, for the ease of transportation, can it be mixed with liquid concentrator, promptly deionized water does not join in process of production, deionized water is added by proportioning in use again and uses.
The present invention uses the said ratio scheme, is solution with water base, is major ingredient with the surface activity liquid; Be added into polyalcohols and make assisted solution, make the more environmental protection of scavenging solution of producing, reduced environmental pollution; Do not endanger operator's health, and cleaning efficiency is high, scavenging period is short; Seepage force is high, not phosphorous hydrochlorate and nitrite in component, and biodegradability is good; Can be to semiconductor wafer, lip-deep metals ion, organic and inorganic impurity and solids such as electronic glass LCD screen clean, and can play antiseptic and rustproof effect to the electronic material after cleaning.
Electronic component decontamination liquid of the present invention uses ion-non-ionic surface active liquid, and ion surface active liquid uses yin, yang ion surface active liquid all can; Is good through experimental study to select the active liquid of cloudy sub-surface for use.As select for use SAS-to stretch alkyl sodium sulfonate; The active liquid of nonionic table can be selected polyoxyethylene-type non-ionic surface active liquid for use, polyvalent alcohol type non-ionic surface active liquid, and the active liquid of other type list face; Select FMEE-fatty acid methyl ester ethoxylate and APG-alkyl polyglycoside for use through experimental study; Assisted solution is selected polyalcohols for use; Add anticorrosionly, rust protection liquid makes the material rust corrosion not after the cleaning; Solution is used deionized water.
Electronic component decontamination liquid of the present invention can reach the cleaning rate more than 99%; It is thus clear that do not have residual, the water-insoluble after the decontamination is less than 0.03%, and its PH is neutral simultaneously; Metal is not had corrosion phenomenon, and the stable long-time no layering down of physical and chemical state, phenomenon such as separate out.Be convenient to the use of extensive safety, compliance with environmental protection requirements.

Claims (8)

1. electronic component decontamination liquid, it is characterized in that: its formation component according to weight percent is following: tensio-active agent 5-8%, secondary solvent 2-4%, anticorrosion, rust-preventive agent 0.2-0.4%, all the other are deionized water;
Said tensio-active agent is ion-nonionogenic tenside;
Said secondary solvent is the polyalcohols solvent.
2. according to the described electronic component decontamination liquid of claim 1, it is characterized in that: said anticorrosion, rust-preventive agent is triethanolamine oleate and benzotriazole.
3. according to the described electronic component decontamination liquid of claim 1, it is characterized in that: said polyalcohols solvent is that any one or a few mixture of ethanol, terepthaloyl moietie, Ucar 35, USP Kosher, Virahol constitutes.
4. according to the described electronic component decontamination liquid of claim 1, it is characterized in that: said ion-ionic surfactant pack is drawn together: the mixture of the mixture of anionic surfactant, anionic surfactant and non-ionic surfactant or cats product and nonionogenic tenside.
5. according to the described electronic component decontamination liquid of claim 4, it is characterized in that: said AS is a SAS, and nonionogenic tenside is fatty acid methyl ester ethoxylate and/or alkyl polyglycoside.
6. according to the described electronic component decontamination liquid of claim 1, it is characterized in that: said clean-out system is made up of following components in weight percent: AS SAS 2-5%, nonionogenic tenside fatty acid methyl ester ethoxylate 1-2% and/or alkyl polyglycoside 2-4%; Anticorrosion, rust-preventive agent triethanolamine oleate 0.1-0.2%, benzotriazole 0.1-0.2%; Any one or a few 2-3% in secondary solvent ethanol, terepthaloyl moietie, Ucar 35, USP Kosher, the Virahol; All the other are deionized water.
7. according to the described electronic component decontamination liquid of claim 1, it is characterized in that: it is applied to the non-metallic material of electronic component part or the decontamination on the parts.
8. according to the described electronic component decontamination liquid of claim 7, it is characterized in that: said non-metallic component comprises: semiconductor wafer, electronic glass substrate or LCD.
CN2011100513615A 2011-03-03 2011-03-03 Electronic component decontamination fluid Pending CN102653707A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011100513615A CN102653707A (en) 2011-03-03 2011-03-03 Electronic component decontamination fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011100513615A CN102653707A (en) 2011-03-03 2011-03-03 Electronic component decontamination fluid

Publications (1)

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CN102653707A true CN102653707A (en) 2012-09-05

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103668264A (en) * 2013-12-19 2014-03-26 湖南金裕化工有限公司 Normal-temperature neutral phosphorus-free degreasant and preparing method
CN104450281A (en) * 2014-11-17 2015-03-25 如皋市大昌电子有限公司 Special cleaning solution for diode
CN105219545A (en) * 2015-10-19 2016-01-06 南京润屹电子科技有限公司 A kind of clean-out system for electronic material and preparation method thereof
CN109207272A (en) * 2018-05-22 2019-01-15 深圳市伯斯特科技有限公司 Chip laser cutting protection liquid and the protection liquid manufacture craft
CN109207287A (en) * 2018-05-22 2019-01-15 深圳市伯斯特科技有限公司 Chip cutting cleaning solution and the cleaning solution manufacture craft
CN112592771A (en) * 2020-12-15 2021-04-02 德锡化学(山东)有限公司 Semiconductor cleaning agent and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101818103A (en) * 2010-05-17 2010-09-01 江西瑞思博化工有限公司 Washing agent for electronic materials

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101818103A (en) * 2010-05-17 2010-09-01 江西瑞思博化工有限公司 Washing agent for electronic materials

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103668264A (en) * 2013-12-19 2014-03-26 湖南金裕化工有限公司 Normal-temperature neutral phosphorus-free degreasant and preparing method
CN103668264B (en) * 2013-12-19 2016-04-06 湖南金裕化工有限公司 Neutral agent of non-phosphate degreasing of normal temperature and preparation method thereof
CN104450281A (en) * 2014-11-17 2015-03-25 如皋市大昌电子有限公司 Special cleaning solution for diode
CN105219545A (en) * 2015-10-19 2016-01-06 南京润屹电子科技有限公司 A kind of clean-out system for electronic material and preparation method thereof
CN109207272A (en) * 2018-05-22 2019-01-15 深圳市伯斯特科技有限公司 Chip laser cutting protection liquid and the protection liquid manufacture craft
CN109207287A (en) * 2018-05-22 2019-01-15 深圳市伯斯特科技有限公司 Chip cutting cleaning solution and the cleaning solution manufacture craft
CN112592771A (en) * 2020-12-15 2021-04-02 德锡化学(山东)有限公司 Semiconductor cleaning agent and preparation method thereof

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Application publication date: 20120905