CN102623300A - Apparatus for forming protection film on chip-scale package and formation method thereof - Google Patents
Apparatus for forming protection film on chip-scale package and formation method thereof Download PDFInfo
- Publication number
- CN102623300A CN102623300A CN2011100350124A CN201110035012A CN102623300A CN 102623300 A CN102623300 A CN 102623300A CN 2011100350124 A CN2011100350124 A CN 2011100350124A CN 201110035012 A CN201110035012 A CN 201110035012A CN 102623300 A CN102623300 A CN 102623300A
- Authority
- CN
- China
- Prior art keywords
- chip
- pad pasting
- supporting bracket
- guide bar
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an apparatus for forming a protection film on a chip-scale package and a formation method thereof. The apparatus comprises: a housing element which comprises a housing, at least a guide rod and at least a pressure bar, wherein the pressure bar is engaged with the guide rod so as to facilitate sliding on the guide rod; a chip disc used for supporting a plurality of chips; and a substrate element used for supporting the chip disc and fixing the housing element, wherein the substrate element comprises a substrate, at least a clamp and a support plate, the substrate is used for supporting the support plate and the clamp, the clamp is used for clamping the housing, and the support plate has at least an elastic element for supporting the chip disc; and a transfer film used for supporting a plurality of protection film units so as to attach the plurality of protection film units on the plurality of chips.
Description
Technical field
The invention relates to a kind of wafer-level package, more specific, relate to a kind of method of diaphragm on wafer-level package that form.
Background technology
In the semiconductor element field, the density of element continues to increase, and volume reduces gradually.The demand of the encapsulation of high density components or mutual interconnection technique also increases day by day, to meet above-mentioned situation.The function of die package comprises power distribution, signal distribution, heat radiation, protection and support etc.Because the semiconductor structure trend is complicated; And general conventional art; For example lead encapsulation (lead frame package), soft encapsulation (flex package), rigidity encapsulation (rigid package) technology can't be achieved in the small-sized crystal grain that generation has high density components on the crystal grain.Moreover because the die package technology has close association with development of integrated circuits, so encapsulation technology is increasingly high for the dimensional requirement of electronic component.Based on above-mentioned reason; Encapsulation technology now tends to adopt BGA Package (ball grid array gradually; BGA), cover the geode grid array package (flip chip ball grid array, FC-BGA), chip size packages (chip scale package, technology CSP).
Wafer-level package can perhaps be equivalent to 1/6 of miniaturization encapsulation memory chip area so that chip area and package area are about 1/3 of BGA Package.Therefore, under wafer-level package, equal volume can dispose more IC chip, thereby increases unit capacity.In other words, compare with the ball array encapsulation, the wafer-level package under the same space can promote about three times with storage volume.Wafer-level package not only has the little advantage of volume; Package thickness is thinner simultaneously; Usually its metal substrate only has 0.2mm perhaps littler to the efficiently radiates heat path of radiator; Promoted the reliability of chip after long-time running greatly, and line impedance showing and reduce, the running speed of element also significantly promoted thereupon.
The encapsulation unit of wafer-level package causes the pollution of scratch, static or dust (particles) easily in the process of transporting; Scratch, static or dust pollution can influence its image acquisition quality even electrically lose efficacy, so on the chip of wafer-level package, form a diaphragm to prevent the pollution of dust.Yet, form the method for diaphragm on the chip of traditional wafer-level package, be see through manual mode singly (piece by piece) diaphragm is attached on the chip.This kind method is not easy single diaphragm is aimed at chip exactly, is easy to generate the fraction defective of diaphragm applying processing procedure, and attaches the more time of cost that needs for the diaphragm of the chip of a large amount of wafer-level package.
Therefore, have above-mentioned shortcoming in view of the formation method of traditional protection film on the chip of wafer-level package, the present invention provides a kind of and is superior to method on the chip that known diaphragm is attached at wafer-level package to overcome above-mentioned shortcoming.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of formation diaphragm device on the chip of chip size packages (CSP) and forming method thereof, and it is to utilize the collocation of multiple tool with the attaching efficient of lifting diaphragm and the accuracy of assembling.
Another object of the present invention is to provide the formation method of a kind of diaphragm on chip, it can attach diaphragm on chip easily, makes diaphragm evenly, be attached on the chip exactly.
A purpose more of the present invention is to provide the formation method of a kind of diaphragm on chip, and it can allow diaphragm to put (joining) according to the mode of group to put.
Another purpose of the present invention is exactly in the formation method that provides a kind of diaphragm on chip, utilizes lower cost assembling diaphragm on chip, to save the cost of product.
In sum, according to a viewpoint of the present invention, a kind of device of diaphragm on chip that form proposed; Comprise a cover element; It comprises an outer cover, at least one guide bar and at least one depression bar, and guide bar is disposed at two sides of outer cover, and depression bar is engaged in and is beneficial on the guide bar on guide bar, slide; One chip disk is used to carry a plurality of chips, has a plurality of potholes on it and is beneficial to a plurality of chips and is embedded in wherein; One base component; Be used for supporting chip dish and stationary, housings element; Base component comprises a substrate, at least one anchor clamps and a supporting bracket; Substrate is used to carry supporting bracket and anchor clamps, and anchor clamps are disposed on two sides of substrate and are beneficial to clamp cover element, and supporting bracket has at least one flexible member to be used for the supporting chip dish; And one change pad pasting, is used to carry a plurality of diaphragms unit, is beneficial to a plurality of diaphragms unit is attached on a plurality of chips.
Said apparatus comprises more that a guide bar support is used to support guide bar and two sides that are disposed at outer cover together, and a cushion is placed on the supporting bracket, to support a plurality of chips.
According to another viewpoint of the present invention, the formation method of a kind of diaphragm on chip proposed, it comprises at first provides a supporting bracket, is used to carry a chip disk, with the position of fixed chip dish, configurable a plurality of chips on the chip disk; Then, provide one to change pad pasting, have a plurality of diaphragms unit and be attached on its bottom surface, will change pad pasting and be placed on the cover element; Afterwards, cover element is placed on the supporting bracket, makes a plurality of diaphragms unit that changes on the pad pasting aim at these a plurality of chips on the chip disk; Next, utilize anchor clamps, make a plurality of diaphragms unit be attached at the surface of a plurality of chips to press down cover element; Then, utilize a guide bar, make a depression bar on cover element, move to second end from first end; An end that changes pad pasting is pressed between first depression bar and second depression bar; Utilizing to move changes pad pasting, changes pad pasting and outer cover to separate; At last, remove anchor clamps, and separate cover element and supporting bracket, change a plurality of diaphragms unit on the pad pasting on a plurality of chips to accomplish transfer printing.
The formation method and apparatus of diaphragm of the present invention on chip not only overcomes the shortcoming of prior art, and can effectively increase the efficient and the reliability of the formation method of diaphragm on chip, and can significantly reduce cost.
Description of drawings
Said elements, and further feature of the present invention and advantage, the content through reading execution mode and graphic after, will be more obvious:
Fig. 1 is the sketch map according to the component parts of the boundary belt assembling device that is used for wafer-level package of the present invention.
Fig. 2 is the sketch map according to supporting bracket of the present invention.
Fig. 3 is the sketch map according to chip disk of the present invention.
Fig. 4 is the sketch map according to commentaries on classics pad pasting element of the present invention.
Fig. 5 is that chip disk according to the present invention is placed in the sketch map on the supporting bracket.
Fig. 6 is the sketch map according to commentaries on classics pad pasting contraposition outer cover of the present invention.
Fig. 7 is that cover element according to the present invention is placed in the sketch map on the supporting bracket.
Fig. 8 is the sketch map that the toggle anchor clamps is pressed down cover element according to of the present invention.
Fig. 9 is the sketch map according to promotion of the present invention (moving) depression bar to its other end.
Figure 10 a and Figure 10 b are that commentaries on classics pad pasting according to the present invention is pressed on the sketch map between two depression bars.
Figure 11 is the sketch map that changes pad pasting and outer cover according to separation of the present invention.
Figure 12 a is the sketch map that separates cover element and supporting bracket according to of the present invention with Figure 12 b.
[main element symbol description]
Supporting bracket 101
Cushion 102
Toggle anchor clamps 103
Hole 104b
Spigot 107b, 107c
Depression bar 109,111
Depression bar opening 109a
Change pad pasting 110
Change pad pasting opening 110b, 110c
Embodiment
The present invention will cooperate its preferred embodiment and the diagram of enclosing to be specified in down.Should the person of understanding be the usefulness that all preferred embodiments are merely illustration among the present invention, be not in order to restriction.Therefore the preferred embodiment in literary composition, the present invention also can be widely used among other embodiment.And the present invention is not limited to any embodiment, should be with the claim of enclosing and equivalent fields thereof and decide.
Below, will arrange in pairs or groups with reference to graphic accordingly, specify according to preferred embodiment of the present invention.About the more viewpoints and the advantage of novel concept of the present invention, will propose in following explanation, and make those skilled in the art can understand its content and enforcement according to this.
The present invention provides a kind of apparatus and method of the formation diaphragm on the chip of wafer-level package, and it can be applied to products such as wafer-level package (CSP) chip, silicon wafer perforation (through-silicon via:TSV) chip, band pin pottery chip carrier (ceramic leaded chip carrier:CLCC) or MiniPak switching diode.
As shown in Figure 1, it shows the sketch map according to the component parts of the diaphragm adhering device (protective tape mount apparatus) that is used for wafer-level package of the present invention.This device is merely one embodiment of the invention; Be not in order to restriction the present invention, this device comprises a cover element (housing plate set), base component (base plate set), chip disk (chip tray) 104 and changes pad pasting (transfer tape) 110.It is more accurate that wherein cover element is used to make chip position, and tighten chip PT positional tolerance of (X, Y axle) on the plane.In addition, another function of cover element is used to handle diaphragm transfer program (taping process).Cover element comprises parts such as an outer cover 107, guide bar 108 and guide bar support (guide rod holder) 106, one depression bar (press bar) 109 and one depression bar 111; Wherein outer cover 107 can change its structure to Different products; Outer cover 107 has spigot 107b and 107c is beneficial to contraposition; And a plurality of pothole 107a, and the number of pothole 107a is based on the quantity that tolerant chip is put on the chip disk.Guide bar support 106 is used to support guide bar 108 and disposes (fixing) together in two sides of outer cover 107, and depression bar 109 and depression bar 111 are engaged in guide bar 108 and are beneficial on guide bar 108, slide.The design of guide bar 108 and guide bar support 106 can similar slide rail (rail).Depression bar 109 is used to press changes pad pasting 110, makes diaphragm can accurately be attached to chip surface; And depression bar 111 is before removing commentaries on classics pad pasting 110, is seated on the depression bar 109, and limited chip made chip after removing commentaries on classics pad pasting 110, still be maintained among the chip disk in the degree of freedom of vertical direction (Z axle) during purpose was to remove and changes pad pasting 110.Based on the design of depression bar 109 and depression bar 111, the diaphragm unit can be attached on outer cover 107 surfaces, and removes commentaries on classics pad pasting 110 apace.Base component is used for supporting disk module (tray module) and stationary, housings element accurately, and disk module is for example formed for chip disk 104 and the chip 105 on it.Base component comprises parts such as a substrate 100, at least one pair of toggle anchor clamps (toggle clamp) 103, one supporting bracket (support) 101 and a cushion 102; Wherein supporting bracket 101 is disposed on the substrate 100 and (for example is positioned at central authorities' (heart) zone); And toggle anchor clamps 103 are disposed on two sides of substrate 100; During the transfer of diaphragm unit, can utilize toggle anchor clamps 103 that outer cover 107 is clamped on the supporting bracket 101.Cushion 102; It for example is rubber blanket (rubber) 102; Be positioned on the supporting bracket 101 and (for example be positioned at its central authorities (heart) zone); Have a plurality of lug boss 102a on it corresponding to chip 104 storing positions, and during diaphragm unit attach procedure, support (height) chip 104, and limited chip 104 moves in vertical direction (Z axle).Substrate 100 is used for carrying and assembling supporting bracket 101 and toggle anchor clamps 103.
In addition, structure, purposes and the purpose of above-mentioned (structure) part will narrations in the lump in beneath assemble method.
As shown in Figure 2, it shows the sketch map according to supporting bracket of the present invention.Supporting bracket 101 is used for limited chip dish 104 (please refer to Fig. 1) in X, the position in the Y axle, and design at least one suspention bolt (suspension pin) or flexible member 101a are to be used for supporting chip dish 104 in the supporting bracket, and it is positioned at each corner of supporting bracket 101.According to the operation of outside jacket plates element, and based on the design of suspending bolt 101a in midair, chip disk 104 will make progress and move down smoothly.It should be noted that supporting bracket 101 of the present invention comprises that accommodation space 101b is positioned at central authorities' (heart) zone, for example is supporting bracket cavity 101b, is beneficial to carry rubber blanket 102 and chip disk 104, and the position of fixed chip dish 104.
As shown in Figure 3, it shows the design diagram according to chip disk of the present invention.Chip disk 104 is used for carries chips 105 (please refer to Fig. 1), comprises on it that a plurality of pothole 104a are beneficial to a plurality of chips 105 and are embedded in wherein, and this pothole 104a for example is the trellis pothole, and the degree of depth of pothole 104a can make chip 105 be able to pass on it.The pothole 104a of chip disk 104 is placements of holding (correspondence) chip 105 one to one, and the hole 104b among this pothole 104a is the lug boss 102a (please refer to Fig. 1) corresponding to cushion 102.Chip 105 for example is chip, silicon wafer perforation (TSV) chip, band pin pottery chip carrier (CLCC) or the MiniPak switching diode etc. of wafer-level package.Chip 105 is to be disposed on the chip disk 104 with array way.When chip disk 104 when pressing down, the lug boss 102a of cushion 102 can pass the hole 104b among the pothole 104a of chip disk 104, chip 105 supports that will be arranged in pothole 104a are high.In other words; Comprise at least one perforation (hole) 104b among the pothole 104a of chip disk 104 of the present invention; Press down in the process at chip disk 104; The lug boss 102a of cushion 102 can pass through this at least one perforation 104b, and chip 105 is propped up, and makes the upper surface of chip 105 surfaces near outer cover 107 (please refer to Fig. 1).
As shown in Figure 4, it shows the sketch map according to the structure of commentaries on classics pad pasting element of the present invention.Lift an embodiment; Changeing the pad pasting element is to be made up of two layer of material; Ground floor is that pi rete (polyimide layer) is as changeing pad pasting 110; Be used to carry a plurality of diaphragms unit (protective film unit) 110a, the second layer is that mould release membrance (liner) 110d fits mutually with changeing pad pasting 110, and wherein a plurality of diaphragms unit 110a adheres to or fits in to be changeed between pad pasting 110 and the mould release membrance 110d.Changeing pad pasting 110, is protective tapes 110 for example, has a plurality of diaphragms unit 110a and is attached on its bottom surface.Change in the structure of pad pasting 110, its up and down two ends comprise and change pad pasting opening 110b and 110c, be beneficial to respectively with outer cover 107 on spigot 107b and 107c (please refer to Fig. 1) contraposition with engage, with reference to figure 6.The size of commentaries on classics pad pasting 110 is looked closely the chip matrix size (or pothole 104a size) on the chip disk 104 and is decided, and please refer to Fig. 1.
Under then narrate on the chip method that forms diaphragm.At first, chip disk 104 is placed on the flexible member 101a on the supporting bracket 101, has chip 105 in the chip disk 104 and is positioned over wherein, with reference to figure 5.The chip disk 104 that carries chip 105 is supported on the supporting bracket 101 through flexible member 101a.
Next step changes the pad pasting element for getting a slice, removes mould release membrance 110d, changes pad pasting 110 and a plurality of diaphragms unit 110a attached to it to stay; Afterwards; Changeing pad pasting 110 is placed on the outer cover 107; Change the commentaries on classics pad pasting opening 110b and the 110c (please refer to Fig. 4) of pad pasting 110 through spigot 107b on the outer cover 107 and 107c contraposition; Make outer cover 107 engage one another, be placed on the cover element (comprising outer cover 107) and will have the commentaries on classics pad pasting 110 that a plurality of diaphragms unit 110a is attached on its bottom surface, with reference to figure 6 with changeing pad pasting 110.At this moment, the rough aligning of the pothole 107a on the outer cover 107 changes the diaphragm unit 110a on the pad pasting 110.For example, big or small rough the equating of the size of the pothole 107a on the outer cover 107 and diaphragm unit 110a,, the configuration of a plurality of pothole 107a is corresponding one by one with a plurality of diaphragms unit 110a.
Next, the cover element (comprising outer cover 107) that will engage with commentaries on classics pad pasting 110 is put or is fixed on the supporting bracket 101, with reference to figure 7.Cover element will be supported through chip disk 104 (please refer to Fig. 5).At this moment, change diaphragm unit 110a on the pad pasting 110 aim at slightly with applying chip disk 104 on chip 105.Commentaries on classics pad pasting 110 is disposed at the below of depression bar 109.
Afterwards, press down cover element earlier, promote at least one pair of toggle anchor clamps 103 on the base component again, make diaphragm unit 110a attach and cover the surface of the chip 105 on the chip disk 104, with reference to figure 8 to press down cover element with the rough certain pressure of keeping.
Then, promote (moving) depression bar 109 to its other end along guide bar 108 from an end that is positioned on the outer cover 107, guide bar 108 promptly reaches the other end to the outer cover 107, with reference to figure 9.Be disposed at the below of depression bar 109 based on changeing pad pasting 110, make to suffer damage the diaphragm unit 110a (please refer to Fig. 8) that can not touch the below when promoting (moving) depression bar 109 to avoid diaphragm unit 110a.
Then, lift an end 110d who changes pad pasting 110 and the top that contacts depression bar 109, with reference to figure 9 and Figure 10 a.Then; Depression bar 111 is placed in the top of depression bar 109; The depression bar opening 109a of depression bar spigot 111a (please refer to Fig. 1) the contraposition depression bar 109 through depression bar 111 belows makes depression bar 111 engage one another with depression bar 109, and the end that change pad pasting 110 this moment is between depression bar 109 and depression bar 111; And changeing pad pasting 110 tightly is pressed between depression bar 109 and the depression bar 111, with reference to figure 10b.
Next step changes pad pasting 110 and outer cover 107 for separating.It is to see through pulling to change pad pasting 110, and presses between depression bar 109 and depression bar 111 based on changeing pad pasting 110, so depression bar 109 will move from changeing pad pasting 110 pressings along guide bar 108 together with the pulling of changeing pad pasting 110 with depression bar 111.And when depression bar 109 moves to the other end with depression bar 111 from changeing pad pasting 110 pressings, change pad pasting 110 can remove from outer cover 107, with reference to Figure 11.
At last, remove toggle anchor clamps 103, scheme with reference to figure 12a.And remove whole cover element, to separate cover element and supporting bracket 101, chip 105 this moment (please refer to Fig. 5) is gone up and is accomplished clean diaphragm unit 110a adhesion on it to protect its pollution that avoids powder dust particle, schemes with reference to figure 12b.
It should be noted that moving between above-mentioned (structure) part of the present invention, promote, press down, contraposition, combine and step such as separate and to see through manual or automatic mode and accomplish.
There are many shortcomings in the formation method of traditional type diaphragm on chip; Diaphragm of the present invention is superior to the formation method of traditional type diaphragm on chip in the formation method on the chip, and have the formation method of traditional type diaphragm on chip can't expected effect.
But from diaphragm device on chip of above-mentioned knowledge capital invention and forming method thereof, its characteristic and advantage comprise:
1, utilizes the collocation of multiple tool, therefore can promote the attaching efficient of diaphragm and the accuracy of assembling.
2, utilize tool to attach mode, can attach diaphragm easily on chip, and diaphragm evenly and exactly is attached on the chip.
3, can allow diaphragm to put (joining) and put, and the non-traditional single protective tapes of indivedual storings is on one chip according to the mode of a group.
4, utilize lower cost to attach diaphragm on chip, to save the cost of product.
To those skilled in the art, though the present invention illustrates as above with preferred embodiments, so it is not in order to limit spirit of the present invention.Modification of in not breaking away from spirit of the present invention and scope, being done and similarly configuration all should be included in the claim of enclosing, and this scope should cover all similar modification and similar structures, and should do the broadest annotation.
Claims (10)
1. one kind forms the device of diaphragm on chip, it is characterized in that, comprises:
One cover element comprises an outer cover, at least one guide bar and at least one depression bar, and this guide bar is disposed at two sides of this outer cover, and this depression bar is engaged in and is beneficial on this guide bar on this guide bar, slide;
One chip disk is used to carry a plurality of chips, has a plurality of potholes on it and is beneficial to these a plurality of chips and is embedded in wherein;
One base component; Be used to support this chip disk and fixing this cover element; This base component comprises a substrate, at least one anchor clamps, a cushion and a supporting bracket; This substrate is used to carry this supporting bracket and this anchor clamps, and these anchor clamps are disposed on two sides of this substrate and are beneficial to clamp this outer cover, and this cushion is placed on this supporting bracket to support these a plurality of chips; And
One changes pad pasting, is used to carry a plurality of diaphragms unit, is beneficial to this a plurality of diaphragms unit is needed on these a plurality of chips.
2. the device of formation diaphragm as claimed in claim 1 on chip is characterized in that, comprises more that a guide bar support is used to support this guide bar and two sides that are disposed at this outer cover.
3. the device of formation diaphragm as claimed in claim 1 on chip is characterized in that, this supporting bracket has at least one flexible member to be used to support this chip disk.
4. the device of formation diaphragm as claimed in claim 1 on chip; It is characterized in that; Comprise at least one perforation in this pothole of this chip disk, the lug boss that is beneficial to this cushion is propped up this chip through this at least one perforation, makes the upper surface of this chip surface near this outer cover.
5. one kind forms the method for diaphragm on chip, it is characterized in that, comprises:
One supporting bracket is provided, is used to carry a chip disk, with the position of fixing this chip disk, configurable a plurality of chips on this chip disk;
Provide one to change pad pasting, have a plurality of diaphragms unit and be attached on its bottom surface, should change pad pasting and be placed on the cover element;
This cover element is placed on this supporting bracket, makes this a plurality of diaphragms unit on this commentaries on classics pad pasting aim at these a plurality of chips on this chip disk;
Utilize anchor clamps to press down this cover element, make this a plurality of diaphragms unit be attached at the surface of these a plurality of chips;
Utilize a guide bar, make a depression bar on this cover element, move to second end from first end;
One end of this commentaries on classics pad pasting is pressed between first depression bar and second depression bar;
Utilizing to move to change pad pasting, should change pad pasting and this outer cover to separate;
Remove this anchor clamps, and separate this cover element and this supporting bracket, should change this a plurality of diaphragms unit on pad pasting on these a plurality of chips to accomplish transfer printing.
6. the method for formation diaphragm as claimed in claim 5 on chip is characterized in that, more comprises two sides that provide a guide bar support to be used to support this guide bar and be disposed at this outer cover together.
7. the method for formation diaphragm as claimed in claim 5 on chip is characterized in that, more comprising provides a cushion to be placed on this supporting bracket, to support these a plurality of chips.
8. the method for formation diaphragm as claimed in claim 5 on chip; It is characterized in that; This cover element comprises this outer cover, at least one this guide bar and at least one this first depression bar and this second depression bar; This guide bar is disposed at two sides of this outer cover, and this depression bar is engaged in and is beneficial on this guide bar on this guide bar, slide.
9. the method for formation diaphragm as claimed in claim 5 on chip; It is characterized in that; More comprising provides a base component, is used to support this chip disk and fixing this cover element, and this base component comprises a substrate, at least one anchor clamps and a supporting bracket; This substrate is used to carry this supporting bracket and this anchor clamps, and these anchor clamps are disposed on two sides of this substrate and are beneficial to clamp this outer cover.
10. the method for formation diaphragm as claimed in claim 5 on chip is characterized in that, this supporting bracket has at least one flexible member to be used to support this chip disk.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110035012.4A CN102623300B (en) | 2011-01-28 | 2011-01-28 | Apparatus for forming protection film on chip-scale package and formation method thereof |
| HK13101279.5A HK1174150A1 (en) | 2011-01-28 | 2013-01-30 | Apparatus for forming protection film on chip-scale package and formation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110035012.4A CN102623300B (en) | 2011-01-28 | 2011-01-28 | Apparatus for forming protection film on chip-scale package and formation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102623300A true CN102623300A (en) | 2012-08-01 |
| CN102623300B CN102623300B (en) | 2014-08-20 |
Family
ID=46563148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110035012.4A Active CN102623300B (en) | 2011-01-28 | 2011-01-28 | Apparatus for forming protection film on chip-scale package and formation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102623300B (en) |
| HK (1) | HK1174150A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10275716A (en) * | 1997-03-31 | 1998-10-13 | Taiyo Yuden Co Ltd | Manufacture of chip resistor |
| CN1208946A (en) * | 1997-05-30 | 1999-02-24 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| US20060005911A1 (en) * | 2002-10-28 | 2006-01-12 | Yuichi Kubo | Expanding method and expanding device |
-
2011
- 2011-01-28 CN CN201110035012.4A patent/CN102623300B/en active Active
-
2013
- 2013-01-30 HK HK13101279.5A patent/HK1174150A1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10275716A (en) * | 1997-03-31 | 1998-10-13 | Taiyo Yuden Co Ltd | Manufacture of chip resistor |
| CN1208946A (en) * | 1997-05-30 | 1999-02-24 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| US20060005911A1 (en) * | 2002-10-28 | 2006-01-12 | Yuichi Kubo | Expanding method and expanding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102623300B (en) | 2014-08-20 |
| HK1174150A1 (en) | 2013-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103872028B (en) | The method of semiconductor assemblies, stacked semiconductor devices and manufacture semiconductor assemblies and stacked semiconductor devices | |
| TWI523162B (en) | Chip-scale packaging with protective heat spreader | |
| KR101805477B1 (en) | Low cost package warpage solution | |
| KR101485972B1 (en) | Integrated circuit package system with offset stacked die | |
| US10153179B2 (en) | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | |
| TWI517353B (en) | Assembly component and method for assembling a chip package | |
| KR101746731B1 (en) | Integrated circuit packaging stacking system with redistribution and method of manufacture thereof | |
| US8852986B2 (en) | Integrated circuit package system employing resilient member mold system technology | |
| CN105122445B (en) | Low CTE mediplates without TSV structure and method | |
| US20150187745A1 (en) | Solder pillars for embedding semiconductor die | |
| KR20150114233A (en) | semiconductor package and method of manufacturing the same | |
| CN101765911A (en) | Semiconductor die having a redistribution layer | |
| US20110193243A1 (en) | Unique Package Structure | |
| US8802499B2 (en) | Methods for temporary wafer molding for chip-on-wafer assembly | |
| KR20090030540A (en) | Semiconductor package, apparatus and method for manufacturing the same, and electronic device equipped with the semiconductor package | |
| US20100127372A1 (en) | Semiconductor packages | |
| US20140061890A1 (en) | Semiconductor package and method of manufacturing the same | |
| US20040227223A1 (en) | Semiconductor device, electronic device, electronic apparatus, and methods for manufacturing semiconductor device and electronic device | |
| KR100571512B1 (en) | Transfering method of semiconductor package and system thereof | |
| JP2019186462A (en) | Mold, resin molding apparatus, resin molding method, and conveying tool | |
| CN102543768B (en) | Device and method for forming protective films on chip package | |
| CN102623300B (en) | Apparatus for forming protection film on chip-scale package and formation method thereof | |
| TWI408781B (en) | Apparatus for forming protective tape on chip scale package and method of the same | |
| US9462694B2 (en) | Spacer layer for embedding semiconductor die | |
| KR20180095829A (en) | ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1174150 Country of ref document: HK |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1174150 Country of ref document: HK |