CN102623196B - Rubber conductive particle and preparation method thereof - Google Patents
Rubber conductive particle and preparation method thereof Download PDFInfo
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- CN102623196B CN102623196B CN201110027418.8A CN201110027418A CN102623196B CN 102623196 B CN102623196 B CN 102623196B CN 201110027418 A CN201110027418 A CN 201110027418A CN 102623196 B CN102623196 B CN 102623196B
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Abstract
The invention provides a rubber conductive particle, comprising a rubber base material and metal plated film on the surface of the particle. The metal plated film can comprise one layer or a plurality of layers, and has a total thickness of 0.05mum to 1mm. The rubber conductive particle has a cylindrical shape or a platform shape, has a cross section of a circular shape, an elliptical shape, or a polygon shape, and has a cross section diameter of 1mm to 10mm. The preparation method of the rubber conductive particle comprises: first preparing a rubber sheet material with moulding, injecting, extruding, or calendering methods; then plating the metal plated film on the surface of the rubber sheet material by employing plating technique; and carrying out punching, shearing or laser cutting on the sheet material to obtain the rubber conductive particle. The rubber conductive particle of the invention is characterized by good conductivity of metal coating, thin thickness of the coating, reduction of raw material consumption, low manufacturing cost, and no pollution basically, and can be used as a conduction contact component of a push-button circuit board.
Description
Technical field
The present invention relates to and the matching used electric conductor of button, refer in particular to a kind of rubber conductive particle that plates conduction surface layer on rubber substrate and preparation method thereof.
Background technology
The button manufacturings such as mobile phone, phone, calculator need to be prepared button substrate conductive rubber products, a kind of method be by metal sheet and rubber combined after be die-cut into roundlet grain, this method is difficult for making metal layer thickness goods as thin as a wafer.
At frosting, carrying out metal-coated membrane, to have the gloss of metal, is a kind of common technical products, not only has the remaining harmful chemical substance of stability that has pair electric conductivity in waste liquid generation but also galvanization coating in the electroplating process of this method.The product that carries out metal-coated membrane at rubber surface is rarer.
Number of patent application is that the specification of CN03139640.2 discloses a kind of slim contact panel, described panel is wherein PET or PI or Nylon or Kapton material, and described high resistance conductive film is thin metal film or the carbon paste of surface adhesion submicron metal and the mixture film of synthetic resin.Base material is plastics, lacks elasticity; And this conducting film is film, be generally still thicker than coating, cost is higher.
Number of patent application is the button module that the specification of CN200920301126.7 discloses a kind of mobile device, comprise that one is installed in the base on mobile device body, one is arranged at the flexible circuit board on described base, one is covered on described flexible circuit board and can controls the conductive metal film that flexible circuit board produces electrical signals, one is placed in the rubber layer on conducting metal mould, and a key layer that is pasted on described rubber layer surface.Its complex structure, cost is high, and failure rate is high.
Summary of the invention
Goal of the invention: overcome traditional higher defect of button electric conductor cost, provide that a kind of conductive layer thickness is thin, the rubber conductive particle of low cost of manufacture.
Technical scheme: rubber conductive particle of the present invention, the conducting contact element as circuit board, contains rubber substrate, and rubber substrate upper surface has metal coating; The gross thickness of metal coating is 0.05 μ m to 1mm, and metal coating adopts chemical vapour deposition (CVD) or physical vapour deposition (PVD), metal thermal spraying, electroless-plating or electroplating technology to plate; Rubber conductive particle is column or platform shape, and cross section is circle, ellipse, polygon or other shape, and the external diameter of a circle of cross section or cross section is 1mm to 10mm.
In the present invention, described metal coating can adopt vacuum vapor plating, vacuum sputtering coating or vacuum ion plating process to plate.
The material of described metal coating is copper, aluminium, tin, indium, zinc, titanium, nickel, chromium, cobalt, tungsten, manganese, magnesium, zirconium, silver, gold, platinum, palladium or iron, or the alloy of above-mentioned metal, or the compound of above-mentioned metal.
The material of described metal coating is preferred stainless steel, brass, titanium nitride or indium tin oxide (ITO).
Described metal coating is plated in rubber substrate upper surface, or is plated in rubber substrate upper surface and rubber substrate lower surface, and the metal coating of the same face is one deck, two-layer or multilayer, and the metal coating material of coplanar, different layers is not same or different.
The material of described rubber substrate is natural rubber, acrylonitrile-butadiene rubber, ethylene-propylene rubber, butadiene-styrene rubber, butadiene rubber, butyl rubber, acrylonitrile-butadiene rubber, polyurethane rubber, silicon rubber or fluorubber; In rubber substrate, contain pigment, filler, age resister, flexibilizer, plasticizer, antistatic agent, crosslinking agent or coupling agent; In rubber substrate or also contain conductive black, metal dust or broken-staple metal fibre.
The surface of described rubber substrate is smooth, or pitted skin, or pertusate, or there is geometrical pattern arbitrarily.Described rubber substrate upper surface is through preliminary treatment, pretreated method comprises plasma treatment, corona treatment, radiation treatment, chemical etching, physical etch, spraying priming paint, spraying coupling agent, polishing or blasting treatment, to strengthen the adhesion with the coat of metal.
Between described rubber substrate and metal coating, can add polymer film layer as transition zone, to increase the bonding strength of metal coating, thin polymer film adopts adhesive to be connected with rubber substrate, and the thickness of polymer film layer is 0.0125mm to 0.25mm.
Another object of the present invention: the preparation method that a kind of described rubber conductive particle is provided.
The technical scheme of this object: comprise following technical process in its preparation method:
1) adopt mold pressing, inject, extrude or the mode of calendering formation makes the sheet material of rubber substrate;
2) at rubber substrate upper surface, adopt the mode of chemical vapour deposition (CVD) or physical vapour deposition (PVD) to plate metal film plating layer;
3) sheet material of rubber substrate that is coated with metal-plated rete is die-cut, shear or be laser-cut into little column or platform shape particle that diameter is 1mm to 10mm.
Beneficial effect:
1) in metal coating of the present invention, the purity of metal is very high, in coating, hardly containing objectionable impurities, does not affect the stability of coating conduction, is particularly conducive to improve the conductive stability energy of coating under wet heat condition.
2) thickness of conductive layer is easy to regulating and controlling, is easy to detect online thickness and composition.
3) thickness of metal coating can be far smaller than the thickness of sheet metal, saves material; And the preparation cost of thin metal foil is more expensive, metal-coated membrane combination process is simple, saves processing cost.
4) combination of metal coating and rubber substrate is tightr, and basic tight, in conjunction with firm.
5) emission seldom, essentially no three wastes public hazards.
6) of many uses, the little round shaped grain of the rubber of this conduction, as the conducting contact element of circuit board, be can be used as to the substrate parts of the button of mobile phone, cordless telephone, landline telephone, calculator, automobile or other consumption electronic products.
Accompanying drawing explanation
Accompanying drawing is a structural representation of the present invention;
In figure: 1, metal coating; 2, rubber substrate upper surface; 3, rubber substrate; 4, rubber substrate lower surface;
Embodiment
Adopt article construction as shown in drawings, select respectively following raw material and technique to realize the present invention.
Embodiment mono-:
Adopt the mode of mold pressing to make polyurethane rubber base material 3 sheet materials, in coating machine, with argon plasma, clean its rubber substrate upper surface 2, then, in the mode of vacuum sputtering coating, on the rubber substrate upper surface 2 of this sheet material, sputter a layer thickness is 1 layer of the 316 stainless steel metal plated film of 5 μ m.By this polyurethane sheet that deposits 1 layer of stainless steel metal plated film, punching out diameter is the columniform granule of 3mm.Circuit board conducting contact element using the granule of this surface conductance as substrate, rubber substrate lower surface 4, with to be printed on digital silicon rubber compound, can be prepared the button on mobile phone.The preparation cost of this conductive particle is lower.
Embodiment bis-:
Adopt the mode of extrusion molding to make butyl rubber base material 3 sheet materials, in butyl rubber base material 3, contain pigment, filler, age resister, flexibilizer, plasticizer, antistatic agent, crosslinking agent or coupling agent; With the rubber substrate upper surface 2 of the clean butyl rubber of corona treatment, then, first, in the mode of vacuum vapor plating, on this rubber substrate upper surface 2, plate the copper film that a layer thickness is 10 μ m, then with vacuum ion plating process, plate the golden film of 1 μ m thickness.By this rubber substrate 3 sheet materials that have double layer of metal plated film 1, shearing out diameter is the polygonal granule of 6mm.Circuit board conducting contact element using the granule of this surface conductance as substrate, rubber substrate lower surface 4, with to be printed on digital silicon rubber compound, can be prepared the button on cordless telephone.The thickness of the conductive layer of this conductive particle is easy to regulating and controlling, is easy to detect online thickness and composition.
Embodiment tri-:
Adopt the mode of calendering formation to make silicon rubber base material 3 sheet materials, in silicon rubber base material 3, contain pigment, filler, age resister, flexibilizer, plasticizer, antistatic agent, crosslinking agent or coupling agent; Its rubber substrate upper surface 2 has the geometrical pattern of strip, with spraying coupling agent treatment silicon rubber base material upper surface 2, then, the first mode with metal thermal spraying, on the rubber substrate upper surface of this sheet material, plating a layer thickness is the aluminium film of 0.05mm, then with electroless-plating coating process, plates the nickel film of 0.01mm thickness.By this rubber substrate 3 sheet materials that have double layer of metal plated film 1, laser cutting goes out the oval-shaped granule that diameter is 10mm.Circuit board conducting contact element using the granule of this surface conductance as substrate, rubber substrate lower surface 4, with to be printed on alphabetical silicon rubber compound, can be prepared the button of computer.The preparation process of this conductive particle is eco-friendly, substantially there is no the generation of the three wastes.
Claims (3)
1. a rubber conductive particle, the conducting contact element as circuit board, is characterized in that: contain rubber substrate (3), rubber substrate upper surface (2) contains metal coating (1); The gross thickness of metal coating (1) is 0.05 μ m to 1mm, and metal coating (1) adopts metal thermal spraying technique to plate; Rubber conductive particle is column or platform shape, and cross section is circle, ellipse or polygon, and the external diameter of a circle of cross section or cross section is 1mm to 10mm;
The material of metal coating (1) is titanium nitride or indium tin oxide;
Metal coating (1) is interrupted;
The material of rubber substrate (3) is natural rubber, acrylonitrile-butadiene rubber, ethylene-propylene rubber, butadiene-styrene rubber, butadiene rubber, butyl rubber, acrylonitrile-butadiene rubber, polyurethane rubber, silicon rubber or fluorubber; Rubber substrate contains pigment, filler, age resister, flexibilizer, plasticizer, antistatic agent, crosslinking agent or coupling agent in (3); Rubber substrate also contains conductive black, metal dust or broken-staple metal fibre in (3);
Circuit board conducting contact element using described rubber conductive particle as substrate, rubber substrate lower surface (4), with to be printed on digital silicon rubber compound, can be prepared the button on cordless telephone.
2. rubber conductive particle according to claim 1, is characterized in that: the surface of rubber substrate (3) is pertusate; Rubber substrate upper surface (2) is through preliminary treatment, and pretreated method comprises that chemical etching or physical etch process, to strengthen the adhesion with the coat of metal.
3. rubber conductive particle according to claim 1, is characterized in that: between rubber substrate (3) and metal coating (1), add polymer film layer as transition zone, the thickness of polymer film layer is 0.0125mm to 0.25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110027418.8A CN102623196B (en) | 2011-01-26 | 2011-01-26 | Rubber conductive particle and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110027418.8A CN102623196B (en) | 2011-01-26 | 2011-01-26 | Rubber conductive particle and preparation method thereof |
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| CN102623196A CN102623196A (en) | 2012-08-01 |
| CN102623196B true CN102623196B (en) | 2014-11-26 |
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| CN201110027418.8A Active CN102623196B (en) | 2011-01-26 | 2011-01-26 | Rubber conductive particle and preparation method thereof |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097306B (en) * | 2014-05-06 | 2018-03-27 | 惠州同发宝微控科技有限公司 | Switch contact of resistance to high current and preparation method thereof |
| CN104103433B (en) * | 2014-07-21 | 2016-02-17 | 南通万德科技有限公司 | Switch contact of a kind of arc ablation resistance and preparation method thereof |
| CN104658773A (en) * | 2015-02-02 | 2015-05-27 | 柳州市二和汽车零部件有限公司 | Rubber on-off key |
| CN104900427A (en) * | 2015-05-19 | 2015-09-09 | 东莞万德电子制品有限公司 | Anti-dust and anti-poor conduction novel conductive granule and manufacturing method thereof |
| CN105543815B (en) * | 2015-12-30 | 2021-12-28 | 吉安创德精密电子有限公司 | Method for improving conductive performance of conductive rubber |
| US11851754B2 (en) | 2017-09-28 | 2023-12-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Sealing article comprising metal coating, method of making and method of using the same |
| CN109206914A (en) * | 2018-10-25 | 2019-01-15 | 浙江久运车辆部件有限公司 | A kind of low temperature resistant silica gel and chlorinated butyl rubber intermingling material and preparation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1294398A (en) * | 1999-10-26 | 2001-05-09 | 松下电器产业株式会社 | Push-button switch |
| CN101171654A (en) * | 2005-05-06 | 2008-04-30 | Aba科技 | Electrically conducting contact and method for production thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714454A (en) * | 1993-06-23 | 1995-01-17 | Noriyoshi Shoda | Contact of switch |
| JPH07288054A (en) * | 1994-04-19 | 1995-10-31 | San Aroo Kk | Metal contact for rubber key and its manufacture |
| JP4145208B2 (en) * | 2003-06-26 | 2008-09-03 | 信越ポリマー株式会社 | Contact member and manufacturing method thereof |
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2011
- 2011-01-26 CN CN201110027418.8A patent/CN102623196B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1294398A (en) * | 1999-10-26 | 2001-05-09 | 松下电器产业株式会社 | Push-button switch |
| CN101171654A (en) * | 2005-05-06 | 2008-04-30 | Aba科技 | Electrically conducting contact and method for production thereof |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2005-19227A 2005.01.20 * |
| JP特开平7-14454A 1995.01.17 * |
| JP特开平7-288054A 1995.10.31 * |
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