CN102620180A - LED (Light-Emitting diode) multi-chip module and manufacturing method thereof - Google Patents

LED (Light-Emitting diode) multi-chip module and manufacturing method thereof Download PDF

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Publication number
CN102620180A
CN102620180A CN2011100285445A CN201110028544A CN102620180A CN 102620180 A CN102620180 A CN 102620180A CN 2011100285445 A CN2011100285445 A CN 2011100285445A CN 201110028544 A CN201110028544 A CN 201110028544A CN 102620180 A CN102620180 A CN 102620180A
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China
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led
cavity
surface
installation framework
copper base
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CN2011100285445A
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Chinese (zh)
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CN102620180B (en
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杨然森
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杨然森
常州市建国电器有限公司
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Priority to CN201110028544.5A priority Critical patent/CN102620180B/en
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Publication of CN102620180B publication Critical patent/CN102620180B/en

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Abstract

The invention provides an LED (Light-Emitting diode) multi-chip module which comprises a copper base plate with a reflecting layer, a mounting frame and a plurality of LED chips, wherein the mounting frame is fixedly arranged on the copper base plate and internally provided with a step-shaped through cavity; the lower cavity section of the step-shaped through cavity is combined with the surface of the middle part of the copper base plate to form a low cavity; the parts, adjacent to two borders, in the mounting frame are respectively provided with an electrode groove; the LED chips are arranged in the lower cavity of the mounting frame in longitudinal and horizontal directions, bound at the partial copper base plate at the bottom of the lower cavity and connected with electrode plates embedded in the mounting frame through gold wires; phosphor powder silica gel is distributed at the peripheries and tops of the LED chips; and the mounting frame is filled with a transparent silica gel layer on the phosphor powder silica gel layer, so that the LED multi-chip module can be seamlessly and tightly adhered to the flat bottom surface of a flat-bottom-surface solid lens. The LED multi-chip module is compact in structure and waterproof and has a protection grade higher than IP67; and a reflecting layer is sprayed on the inner surface of the step-shaped through cavity in the mounting frame and is matched with the reflecting layer on the surface of the copper base plate, so that the optical energy loss of an LED is greatly reduced.

Description

A kind of LED multi-chip modules and preparation method thereof

Technical field

The present invention relates to the light source assembly manufacturing technology that the high-capacity LED street lamp is used, specifically is a kind of LED multi-chip modules and preparation method thereof.This LED multi-chip modules and solid lenticular body tight fit tightly and can constitute the primary source with single lens, can directly form the desired batswing tab rectangle of street lamp standard light field.

Background technology

The luminous intensity distribution of present LED street lamp rectangle light field, no matter be the combination or the modular combination of particle type, the luminous intensity distribution of lens all adopts many lens or many set of lenses to synthesize one lens luminous intensity distribution, what have even only works as light-distribution lens with the lower casing transparent body of light fixture.The same traditional design mode that installs reflector additional of continuing to use of the reflection mode of its lamp light source with conventional lamp; Attempt to promote illumination with the reflex of the reflector of the metal plating of recess in the light fixture upper casing or individual particle formula LED self, reflector does not have much effects illumination is promoted in actual the use.Because its lighting angle of LED lamp is less than 180 degree (about 120 ~ 130 degree angles), adding reflector at its light source back is unnecessary unnecessary design, does not have much effects, and cost is increased.

How undesirable the rectangle light field of employing LED multi-chip module street lamp and the uniformity of illumination be, adopt the mode of three secondary light sources that the uniformity of its rectangle light field and illumination is improved, but the light efficiency loss is very big.With secondary souce, light efficiency is approximately lost between 15~25%, calculates if three secondary light sources light efficiency just only surplus 64% then with median.

Utilize the LED multi-chip modules directly can form the rectangle light field that street lamp needs through the astigmat luminous intensity distribution; But existing LED multi-chip modules all can not fit tightly with solid lenticular body tight; And causing LED multi-chip modules and light-distribution lens to make an appointment with about at least 20% because of intermediate air refraction loss luminous energy, the efficiency of light energy utilization is undesirable.

Summary of the invention

For overcoming the above-mentioned defective that prior art exists; The present invention provides a kind of LED multi-chip modules and preparation method thereof; This LED multi-chip modules and solid lenticular body tight fit tightly and can constitute the primary source with single lens, can directly form the desired batswing tab rectangle of street lamp standard light field.

LED multi-chip modules of the present invention comprises:

One copper base, the surface is coated with reflector layer;

One installs framework; Be fixed on the said copper base; Has big stairstepping cavity suitable for reading in this installation framework; The cavity of resorption section of this stairstepping cavity and the middle part surface of said copper base combine to form lower chambers, offer the electrode trenches of being with outer opening respectively near two frame places in this installation framework, are used for welding, hold the PVC power line; And,

The plurality of LEDs chip, they are vertical, horizontally-arranged is listed in the bottom chamber in the said installation framework, are bound to the part copper substrate at the bottom of this lower chambers, and are connected with the embedded electrode slice of said installation framework with gold thread; Around all led chips and top is distributed with fluorescent powder silica gel, in said installation framework, be full of the transparent silicon glue-line above the fluorescent powder silica gel, so that this LED multi-chip modules can fit tightly with the planar base surface tight of the solid lenticular body of planar base surface.

Wherein, the suitable for reading big stairstepping cavity in the said installation framework comprises cavity of resorption section, lumen section and epicoele section, and a plurality of T-slots are all offered in this lumen section periphery inboard, the inner surface spraying reflector layer of said stairstepping cavity.

The reflector layer of the inner surface of said stairstepping cavity is silver-colored reflector layer, chromium reflector layer etc., forms reflector layer as adopting the spraying of silver powder glue or chromium powder glue.Said copper base light-reflection layer is silver layer or chromium layer, and reflector layer thickness is 0.1 ~ 2um.

A kind of LED multi-chip modules preparation method may further comprise the steps:

The installation framework that a. will have big stairstepping cavity suitable for reading is fixed on the copper base upper surface; Make the cavity of resorption section of this stairstepping cavity and the middle part surface of said copper base combine to form lower chambers, offer the electrode trenches of being with outer opening respectively near two frame places in this installation framework; And,

B. some LEDs chips are vertical, horizontally-arranged is listed in the bottom chamber in the said installation framework; Be bound to the part copper substrate at the bottom of the said lower chambers through elargol or tin cream; Each row led chip is parallel on the two embedded electrode slices of said installation framework after connecting with gold thread again, and in said electrode trenches, welds the PVC power line to the respective electrical pole piece; Around this led chip and the top all fill fluorescent powder silica gel; Then in said installation framework and in the electrode trenches, be full of the transparent silicon glue-line above the fluorescent powder silica gel; So that this LED multi-chip modules can fit tightly with the planar base surface tight of the solid lenticular body of planar base surface; And making this LED multi-chip modules can reach complete waterproof, degree of protection is higher than more than the IP67.

The inner surface spraying reflector layer of the stairstepping cavity in the said installation framework.Distance between the faying face of said transparent silicon glue-line and said fluorescent powder silica gel to the upper surface of said transparent silicon glue-line is 0.1-5mm.Silver-plated reflector layer of said copper base or chromium reflector layer, reflector layer thickness are 0.1 ~ 2um.

LED multi-chip module compact conformation of the present invention, it is installed in the framework has the stairstepping cavity, and the stairstepping cavity inner surface spraying reflector layer in framework is installed cooperates the surperficial reflector layer of copper base, and the LED optical energy loss is significantly reduced.

The transparent silicon glue-line that in framework is installed, forms after the filling transparent silica gel comprises cover part and localization part; Because the lumen section periphery inboard of framework is installed a plurality of T-slots are set; Transparent silica gel forms a plurality of T shape protuberances around getting into and making localization part in these T-slots during the filling transparent silica gel, cooperates and the epicoele section of installation framework and the cover part that electrode trenches combines, and transparent silicon glue-line and installation framework are combined closely; Unlikelyly in hot-cool environment, cause the transparent silicon glue-line to expand with heat and contract with cold and chap; Cause the fracture of chip and gold thread and produce badly, and make the LED multi-chip modules can reach complete waterproof, degree of protection is higher than more than the IP67.

Its transparent silicon glue-line upper surface is the plane; Adopt this LED multi-chip module directly to fit tightly formation LED luminous intensity distribution light source with the solid lenticular body tight of planar base surface; The light that the LED multi-chip modules is sent directly gets into the solid lenticular body of planar base surface and forms the batswing tab rectangle light field that street lamp requires; And the uniformity of brightness is higher than the required value upper limit 40% of standard, light efficiency raising, the light efficiency loss problem of having avoided tradition to take the design of secondary souce or three secondary light sources to cause.

Description of drawings

Fig. 1 is one embodiment of the invention stereogram;

Fig. 2 is the transverse sectional view of Fig. 1 embodiment;

Fig. 3 is that the copper base among Fig. 1 embodiment combines the back stereogram with the installation framework;

Fig. 4 is the LED luminous intensity distribution light source stereogram that the solid lenticular body of Fig. 1 embodiment and planar base surface is formed;

Fig. 5 is Fig. 4 LED luminous intensity distribution light source exploded view;

Fig. 6 is the cutaway view of Fig. 4 LED luminous intensity distribution light source.

The specific embodiment

Below in conjunction with embodiment the present invention is further specified.

With reference to Fig. 1-4, embodiment 1 LED multi-chip modules mainly comprises copper base 1, framework 2 is installed, is arranged at plurality of LEDs chip 3, fluorescent powder silica gel 4 and the transparent silicon glue-line 5 etc. installed in the framework 2.

Copper base 1 surface is coated with reflector layer.Copper base 1 light-reflection layer is silver layer or chromium layer, and reflector layer thickness is 0.1 ~ 2um.Copper base 1 is opened installing hole 11 by the edge.

Framework 2 is installed is comprised the suitable for reading big stairstepping cavity in frame 21 and this frame 21; The stairstepping cavity of installing in the framework 2 comprises cavity of resorption section 22, lumen section 23 and epicoele section 24 3 parts; Be embedded the electrode slice that connects led chip (among the figure for expressing) in two frames of lumen section 23 respectively; The scuncheon of lumen section 23 is all offered a plurality of T-slots 25; Can make transparent silicon glue-line 5 adhesion-tights, unlikelyly in hot-cool environment, cause transparent silicon glue-line 5 to expand with heat and contract with cold and chap, cause the fracture of chip and gold thread and produce bad.Install in the framework 2 and offer the electrode trenches 26 of being with outer opening 27 respectively, be used for welding, hold PVC power line 6 near two frames, 21 places.It is working of plastics that framework 2 is installed, and is embedded electrode slice respectively in two frames of its lumen section 23, and part and PVC power line 6 that this electrode slice exposes in the electrode trenches 26 weld.

Framework 2 is installed is fixed on the copper base 1, the cavity of resorption section 22 of the stairstepping cavity in the framework 2 and the middle part surface of said copper base 1 are installed are combined to form lower chambers.Plurality of LEDs chip 3 is indulged, horizontally-arranged is listed in this bottom chamber in this installation framework 2; And be bound to above the copper base 1 at the bottom of this lower chambers through elargol or tin cream, each row chip of LED is parallel to after with the gold thread series connection again to be installed on embedded described two electrode slices of framework 2.

Be distributed with fluorescent powder silica gel 4 with the top around all led chips 3, send blue light during led chip work, white light is sent in the fluorescence excitation agent, and fluorescent powder silica gel 4 must not be higher than the said cavity of resorption section 22 of installing in the framework 2 and the interface of lumen section 23.Again in framework 2 is installed, be full of the transparent silicon glue-line 5 that the LED multi-chip modules can be fitted tightly with the planar base surface tight of the solid lenticular body of planar base surface above the fluorescent powder silica gel 4; And make transparent silicon glue-line 5 cover outer opening 27 and the epicoele section 24 of said stairstepping cavity and the whole interface of lumen section 23 of electrode trenches 26, PVC power line 6 solder joints, 6 outlets of PVC power line; Preventing that conductor such as water from getting into electrode slice and causing short circuit, and the degree of protection that reaches the encapsulation of light source module reaches more than the IP67.Because being installed, the scuncheon of the lumen section 23 in the framework 2 all offers a plurality of T-slots 25; After filling transparent silicon glue-line 5 on the fluorescent powder silica gel; 5 fillings of transparent silicon glue-line form a plurality of T shape protuberances in these T-slots 25; Can make transparent silicon glue-line 5 adhesion-tights, unlikelyly in hot-cool environment, cause transparent silicon glue-line 5 to expand with heat and contract with cold and chap, cause the fracture of chip and gold thread and produce bad.The upper surface of transparent silicon glue-line 5 is the plane, and transparent silicon glue-line 5 is with that framework 2 tops are installed is flat or slightly exceed below the 0.5mm, with do not overflow framework 2 tops are installed till.Distance between the upper surface of the faying face of transparent silicon glue-line 5 and fluorescent powder silica gel 4 to transparent silicon glue-line 5 is 0.1-5mm.

Like Fig. 2; Transparent silicon glue-line 5 comprises: the cover part of combining closely with the epicoele section 24 and the electrode trenches 26 of stairstepping cavity in the said installation framework 2; The upper surface of this cover part is the plane, is used for fitting tightly with the planar base surface tight of the solid lenticular body of planar base surface; And; With the lumen section 23 of stairstepping cavity in the said installation framework 2 and the localization part that fluorescent powder silica gel layer 4 is combined closely; This localization part extends to form downwards from this cover part lower surface, and periphery has a plurality of T-slots 25 tight a plurality of T shape protuberances that fasten with said lumen section 23 scuncheons.

Stairstepping cavity inner surface spraying reflector layer in framework 2 is installed; Promptly cavity of resorption section 22, lumen section 23, epicoele section 24, cavity of resorption section 22 and the lumen section 23 of stairstepping cavity the interface of interface, lumen section 23 and epicoele section 24 reflector layer is all arranged; Cooperate the reflector layer on copper base 1 surface, the LED optical energy loss is significantly reduced.The reflector layer of the inner surface of stairstepping cavity can be silver-colored reflector layer, chromium reflector layer etc., can adopt the spraying of silver powder glue or chromium powder glue to form reflector layer.

Above-mentioned LED multi-chip modules manufacture craft may further comprise the steps:

The installation framework 2 that a. will have big stairstepping cavity suitable for reading is fixed on copper base 1 upper surface; Make the cavity of resorption section 22 of this stairstepping cavity and the middle part surface of said copper base 1 combine to form lower chambers; Install in the framework 2 and offer the electrode trenches 26 of being with outer opening 27 respectively, be used for welding, hold PVC power line 6 near two frames, 21 places; And,

B. some LEDs chips are 3 vertical, horizontally-arranged is listed in the interior bottom chamber of this installations framework 2; Be bound to the part copper substrate 1 at the bottom of this lower chambers through elargol or tin cream; Each row led chip is installed on the two embedded electrode slices of framework 2 with being parallel to after the gold thread series connection again, and in said electrode trenches 26 in, welds the PVC power line to the respective electrical pole piece; Around led chip 3, all fill fluorescent powder silica gel 4 with the top, then in installation framework 2, be full of transparent silicon glue-line 5 above the fluorescent powder silica gel 4, so that this LED multi-chip modules can fit tightly with the planar base surface tight of the solid lenticular body of planar base surface.

Before framework 2 and copper base 1 combination are installed; The inner surface spraying reflector layer of the stairstepping cavity in framework 2 is installed; Also silver-plated reflector layer of copper base 1 or chromium reflector layer, this stairstepping cavity surface and bottom surface all had reflector layer after both combined like this, and the LED optical energy loss is significantly reduced.

Employing Fig. 1 embodiment LED multi-chip modules and the solid lenticular body of planar base surface can pie graph 4 LED luminous intensity distribution light sources.With reference to Fig. 4-6, this LED luminous intensity distribution light source mainly comprises: the solid lenticular body 7 of planar base surface, and the central area 711 of the planar base surface of the solid lenticular body 7 of planar base surface is as the incident light district territory; Fig. 1 LED multi-chip modules; This LED multi-chip modules is arranged at the solid lenticular body of planar base surface 7 back sides; Because the upper surface of the cover part of its transparent silicon glue-line 5 is the plane; Realized that the surperficial transparent silicon glue-line 5 of this LED multi-chip modules and central area 711 (the being the incident light district territory) tight of the planar base surface of the solid lenticular body 7 of planar base surface fit tightly, the light that this LED multi-chip modules is sent directly gets into the solid lenticular body 7 of said planar base surface and forms the batswing tab rectangle light field that street lamps require; And; Reflectance coating 712; This reflectance coating 712 is covered on the part around the central area 711 of planar base surface of the solid lenticular body 7 of said planar base surface; And be positioned at the place ahead of the led chip 3 of said LED multi-chip modules, be used to reflect part refract light and partial reflection light, to reduce optical energy loss from the solid lenticular body 7 of said planar base surface.

Wherein, The solid lenticular body 7 of planar base surface comprises: a base portion 71; The bottom surface of this base portion 71 is a planar base surface; The central area 711 of this planar base surface is as the incident light district territory, and the part around the central area of this planar base surface is coated with reflectance coating 712, is used to reflect part refract light and the partial reflection light from this solid lenticular body; One projection 72, this projection 72 are positioned on the said base portion 71, and it comprises pars intermedia 722 and two part spheroid portions 721 that are symmetricly set in these pars intermedia 722 two; Two planes of reflection 724,725; These two planes of reflection are symmetricly set in the going up in the middle part of pars intermedia 722 of said projection; Tilt to adjacent part spheroid portion respectively, the refraction sphere that is used for the part light of injecting the solid lenticular body of this planar base surface from the central area of the planar base surface of said base portion is reflexed to adjacent part spheroid portion penetrates; And, two shading planes 724 ', 725 ', these two shading planes lay respectively at the root of said two planes of reflection 724,725.The solid lenticular body 7 of this planar base surface can also be provided with two lateral reflection planes (not shown among Fig. 4,5) in the bilateral symmetry of the pars intermedia 722 of said projection 72, is used to control the degree of depth of rectangle light field.

The shape of said reflectance coating 712 can be Long Circle etc., and there is the opening with the central area shape adaptation of the planar base surface of the solid lenticular body 7 of said planar base surface the centre.Said reflectance coating 712 is metallic reflective coatings such as aluminium film, silverskin, and thickness is 0.001-0.02 mm, and reflectance coating can form through vacuum sputtering technology.

Claims (10)

1. LED multi-chip modules is characterized in that comprising:
One copper base, the surface is coated with reflector layer;
One installs framework; Be fixed on the said copper base; Has big stairstepping cavity suitable for reading in this installation framework; The cavity of resorption section of this stairstepping cavity and the middle part surface of said copper base combine to form lower chambers, offer the electrode trenches of being with outer opening respectively near two frame places in this installation framework, are used for welding, hold the PVC power line; And,
The plurality of LEDs chip, they are vertical, horizontally-arranged is listed in the bottom chamber in the said installation framework, are bound to the part copper substrate at the bottom of this lower chambers, and are connected with the embedded electrode slice of said installation framework with gold thread; Be distributed with fluorescent powder silica gel with the top around all led chips, in the installation framework, be full of the transparent silicon glue-line above the fluorescent powder silica gel, so that this LED multi-chip modules can fit tightly with the planar base surface tight of the solid lenticular body of planar base surface.
2. LED multi-chip modules as claimed in claim 1; It is characterized in that: the suitable for reading big stairstepping cavity in the said installation framework comprises cavity of resorption section, lumen section and epicoele section; A plurality of T-slots are all offered in this lumen section periphery inboard, the inner surface spraying reflector layer of said stairstepping cavity.
3. LED multi-chip modules as claimed in claim 2; It is characterized in that said transparent silicon glue-line comprises: with the epicoele section of stairstepping cavity in the said installation framework and the cover part that electrode trenches is combined closely; The upper surface of this cover part is the plane, is used for fitting tightly with the planar base surface tight of the solid lenticular body of said planar base surface; And; With the lumen section of stairstepping cavity in the said installation framework and the localization part that the fluorescent powder silica gel layer is combined closely; This localization part extends to form downwards from this cover part lower surface, and periphery has the tight a plurality of T shape protuberances that fasten of a plurality of T-slots with said lumen section scuncheon.
4. according to claim 1 or claim 2 LED multi-chip modules, it is characterized in that: the reflector layer of the inner surface of the stairstepping cavity in the said installation framework is silver-colored reflector layer or chromium reflector layer.
5. LED multi-chip modules as claimed in claim 1 is characterized in that: said copper base light-reflection layer is silver layer or chromium layer.
6. LED multi-chip modules as claimed in claim 5 is characterized in that: said copper base surface reflection layer thickness is 0.1 ~ 2um.
7. like claim 1 or 3 described LED multi-chip modules, it is characterized in that: the distance between the faying face of said transparent silicon glue-line and said fluorescent powder silica gel to the upper surface of said transparent silicon glue-line is 0.1-5mm.
8. LED multi-chip modules preparation method may further comprise the steps:
The installation framework that a. will have big stairstepping cavity suitable for reading is fixed on the copper base upper surface; Make the cavity of resorption section of this stairstepping cavity and the middle part surface of said copper base combine to form lower chambers, offer the electrode trenches of being with outer opening respectively near two frame places in this installation framework; And,
B. some LEDs chips are vertical, horizontally-arranged is listed in the bottom chamber in the said installation framework; Be bound to the part copper substrate at the bottom of the said lower chambers through elargol or tin cream; Each row led chip is parallel on the two embedded electrode slices of said installation framework after connecting with gold thread again, and in said electrode trenches, welds the PVC power line to the respective electrical pole piece; Around this led chip and the top all fill fluorescent powder silica gel, then in said installation framework, be full of the transparent silicon glue-line above the fluorescent powder silica gel, so that this LED multi-chip modules can fit tightly with the planar base surface tight of the solid lenticular body of planar base surface.
9. like the said LED multi-chip modules of claim 8 preparation method; It is characterized in that: the inner surface spraying reflector layer of the stairstepping cavity in the said installation framework, the distance between the faying face of said transparent silicon glue-line and said fluorescent powder silica gel to the upper surface of said transparent silicon glue-line is 0.1-5mm.
10. like the said LED multi-chip modules of claim 8 preparation method, it is characterized in that: silver-plated reflector layer of said copper base or chromium reflector layer, reflector layer thickness are 0.1 ~ 2um.
CN201110028544.5A 2011-01-26 2011-01-26 LED (Light-Emitting diode) multi-chip module and manufacturing method thereof CN102620180B (en)

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CN201110028544.5A CN102620180B (en) 2011-01-26 2011-01-26 LED (Light-Emitting diode) multi-chip module and manufacturing method thereof

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Application Number Priority Date Filing Date Title
CN201110028544.5A CN102620180B (en) 2011-01-26 2011-01-26 LED (Light-Emitting diode) multi-chip module and manufacturing method thereof

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CN102620180B CN102620180B (en) 2014-08-20

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101413637A (en) * 2008-11-25 2009-04-22 董丽霞 LED road lamp light source with light distribution
CN101876406A (en) * 2009-12-14 2010-11-03 东莞市光宇新能源科技有限公司 Technique for manufacturing high-power light emitting diode (LED) lamp
CN101916806A (en) * 2010-06-18 2010-12-15 深圳市瑞丰光电子股份有限公司 LED encapsulation method and LED encapsulation structure encapsulated with same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101413637A (en) * 2008-11-25 2009-04-22 董丽霞 LED road lamp light source with light distribution
CN101876406A (en) * 2009-12-14 2010-11-03 东莞市光宇新能源科技有限公司 Technique for manufacturing high-power light emitting diode (LED) lamp
CN101916806A (en) * 2010-06-18 2010-12-15 深圳市瑞丰光电子股份有限公司 LED encapsulation method and LED encapsulation structure encapsulated with same

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