CN102612575A - 用于制造led用蓝宝石单晶基板的蓝宝石单晶、led用蓝宝石单晶基板、发光元件以及它们的制造方法 - Google Patents
用于制造led用蓝宝石单晶基板的蓝宝石单晶、led用蓝宝石单晶基板、发光元件以及它们的制造方法 Download PDFInfo
- Publication number
- CN102612575A CN102612575A CN2010800516547A CN201080051654A CN102612575A CN 102612575 A CN102612575 A CN 102612575A CN 2010800516547 A CN2010800516547 A CN 2010800516547A CN 201080051654 A CN201080051654 A CN 201080051654A CN 102612575 A CN102612575 A CN 102612575A
- Authority
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- China
- Prior art keywords
- sapphire single
- single crystal
- crystal substrate
- led
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 164
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 128
- 239000010980 sapphire Substances 0.000 title claims abstract description 128
- 239000000758 substrate Substances 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000008569 process Effects 0.000 title abstract description 5
- 239000012535 impurity Substances 0.000 claims abstract description 21
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims description 42
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 7
- 210000000438 stratum basale Anatomy 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 4
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 10
- 239000012298 atmosphere Substances 0.000 abstract description 8
- 239000011261 inert gas Substances 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000007858 starting material Substances 0.000 abstract 1
- 239000010936 titanium Substances 0.000 description 39
- 239000002994 raw material Substances 0.000 description 17
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 12
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 11
- 241000269980 Pleuronectidae Species 0.000 description 10
- 238000003475 lamination Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 7
- 238000000227 grinding Methods 0.000 description 7
- 238000004020 luminiscence type Methods 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000001036 glow-discharge mass spectrometry Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000033228 biological regulation Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000010899 nucleation Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000005231 Edge Defined Film Fed Growth Methods 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/20—Aluminium oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
- C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/02—Heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Led Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-269154 | 2009-11-26 | ||
JP2009269154 | 2009-11-26 | ||
PCT/JP2010/070989 WO2011065403A1 (ja) | 2009-11-26 | 2010-11-25 | Led用サファイア単結晶基板を製造するためのサファイア単結晶、led用サファイア単結晶基板、発光素子及びそれらの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102612575A true CN102612575A (zh) | 2012-07-25 |
Family
ID=44066508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010800516547A Pending CN102612575A (zh) | 2009-11-26 | 2010-11-25 | 用于制造led用蓝宝石单晶基板的蓝宝石单晶、led用蓝宝石单晶基板、发光元件以及它们的制造方法 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20120088756A (ja) |
CN (1) | CN102612575A (ja) |
TW (1) | TW201130156A (ja) |
WO (1) | WO2011065403A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104981561A (zh) * | 2013-02-25 | 2015-10-14 | 株式会社德山 | 蓝宝石单晶芯及其制造方法 |
CN107407006A (zh) * | 2015-03-26 | 2017-11-28 | 京瓷株式会社 | 蓝宝石部件、及蓝宝石部件的制造方法 |
CN114341410A (zh) * | 2019-09-11 | 2022-04-12 | 日本碍子株式会社 | 13族元素氮化物结晶层的制造方法及晶种基板 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013098298A (ja) * | 2011-10-31 | 2013-05-20 | Toyoda Gosei Co Ltd | Iii族窒化物半導体発光素子の製造方法 |
JP2013245149A (ja) * | 2012-05-28 | 2013-12-09 | Sumitomo Chemical Co Ltd | サファイア単結晶製造用原料アルミナ及びサファイア単結晶の製造方法 |
EP3438332B1 (en) | 2016-03-30 | 2023-08-30 | Nikon Corporation | Optical component comprising aluminum oxide |
CN106764483B (zh) * | 2016-11-30 | 2018-06-12 | 深圳市耀铭豪智能科技有限公司 | 一种led照明装置的制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63112498A (ja) * | 1986-10-27 | 1988-05-17 | Sumitomo Chem Co Ltd | ベルヌ−イ法単結晶用原料アルミナ粉末 |
CN1343013A (zh) * | 2000-09-13 | 2002-04-03 | 晶元光电股份有限公司 | 白色发光二极管 |
WO2003103062A1 (fr) * | 2002-06-04 | 2003-12-11 | Nitride Semiconductors Co.,Ltd. | Dispositif semi-conducteur a base de nitrure de gallium et son procede de fabrication |
JP2004123467A (ja) * | 2002-10-03 | 2004-04-22 | Shinkosha:Kk | サファイア単結晶およびサファイア単結晶用原料 |
JP2005085888A (ja) * | 2003-09-05 | 2005-03-31 | Kyocera Corp | 半導体素子用単結晶サファイア基板とその製造方法及びこれを用いたGaN系半導体発光素子並びにGaN系半導体白色発光素子 |
JP2008207993A (ja) * | 2007-02-26 | 2008-09-11 | Hitachi Chem Co Ltd | サファイア単結晶の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59152289A (ja) * | 1983-02-16 | 1984-08-30 | Seiko Epson Corp | スタ−ブル−サフアイヤの製造方法 |
JP4908381B2 (ja) * | 2006-12-22 | 2012-04-04 | 昭和電工株式会社 | Iii族窒化物半導体層の製造方法、及びiii族窒化物半導体発光素子、並びにランプ |
-
2010
- 2010-11-25 KR KR1020127013401A patent/KR20120088756A/ko not_active Application Discontinuation
- 2010-11-25 TW TW099140694A patent/TW201130156A/zh unknown
- 2010-11-25 WO PCT/JP2010/070989 patent/WO2011065403A1/ja active Application Filing
- 2010-11-25 CN CN2010800516547A patent/CN102612575A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63112498A (ja) * | 1986-10-27 | 1988-05-17 | Sumitomo Chem Co Ltd | ベルヌ−イ法単結晶用原料アルミナ粉末 |
CN1343013A (zh) * | 2000-09-13 | 2002-04-03 | 晶元光电股份有限公司 | 白色发光二极管 |
WO2003103062A1 (fr) * | 2002-06-04 | 2003-12-11 | Nitride Semiconductors Co.,Ltd. | Dispositif semi-conducteur a base de nitrure de gallium et son procede de fabrication |
JP2004123467A (ja) * | 2002-10-03 | 2004-04-22 | Shinkosha:Kk | サファイア単結晶およびサファイア単結晶用原料 |
JP2005085888A (ja) * | 2003-09-05 | 2005-03-31 | Kyocera Corp | 半導体素子用単結晶サファイア基板とその製造方法及びこれを用いたGaN系半導体発光素子並びにGaN系半導体白色発光素子 |
JP2008207993A (ja) * | 2007-02-26 | 2008-09-11 | Hitachi Chem Co Ltd | サファイア単結晶の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104981561A (zh) * | 2013-02-25 | 2015-10-14 | 株式会社德山 | 蓝宝石单晶芯及其制造方法 |
CN107407006A (zh) * | 2015-03-26 | 2017-11-28 | 京瓷株式会社 | 蓝宝石部件、及蓝宝石部件的制造方法 |
CN114341410A (zh) * | 2019-09-11 | 2022-04-12 | 日本碍子株式会社 | 13族元素氮化物结晶层的制造方法及晶种基板 |
Also Published As
Publication number | Publication date |
---|---|
WO2011065403A1 (ja) | 2011-06-03 |
TW201130156A (en) | 2011-09-01 |
KR20120088756A (ko) | 2012-08-08 |
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