CN102586725A - Manufacture method of antenna by means of sputtering - Google Patents
Manufacture method of antenna by means of sputtering Download PDFInfo
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- CN102586725A CN102586725A CN2011100046088A CN201110004608A CN102586725A CN 102586725 A CN102586725 A CN 102586725A CN 2011100046088 A CN2011100046088 A CN 2011100046088A CN 201110004608 A CN201110004608 A CN 201110004608A CN 102586725 A CN102586725 A CN 102586725A
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Abstract
The invention provides a manufacture method of an antenna by means of sputtering, which comprises the following steps of: taking a base plate as bottom-layer base material of a metal coating layer, and plating metal on the base plate in a sputtering way; and carving antenna patterns on the sputtering metal layer according to a planned map by a laser carving machine. Furthermore, the method also can comprise the following steps of: arranging a photomask which is provided with the antenna patterns and is hollow above the base plate; plating the metal above the photomask in a sputtering way, and forming a corresponding metal region on the base plate, i.e. the antenna patterns; in order to improve the size precision of the antenna patterns, trimming the edge of the metal region by means of laser carving; thickening the antenna patterns by means of chemical plating or electric plating; and coating the antenna patterns on the base plate finally. After the antenna made by the method is used, the antenna can be completely sealed on the base plate, the antenna is extremely small in occupied volume, and the laser carving mode is applied, so that the precision of the whole antenna size can be improved. When the antenna is applicable to movable electronic products such as mobile phones, personal digital assistants (PDA) or the like, the antenna is completely combined with a structural part or a housing case, and any space can not be occupied.
Description
Technical field
The invention relates to a kind of method of making antenna, especially a kind of method of using sputter manufacturing antenna.
Background technology
Because Information technology is flourish, has driven the progress of wireless communication technology, mobile telephone becomes the indispensable tool of communications of modern.Therefore, the function of cellular phone demand is also increased day by day.Early stage mobile telephone only is used for linking up message, suitable simple of function.Along with the progress in epoch, many functions such as photograph, online, media entertainment also are incorporated in the mobile telephone.On the other hand.Moulding is seeking change and innovation again and again also, exposes moulding such as being promoted to compact, day line concealing from stiff, huge, Heavy Weight, antenna in early days, to satisfy user's demand.
Because the necessary raising frequency of the electric wave of cableless communication, carrier wave just can be effective multiplex (MUX) and transmit, so must just can carry out these actions by antenna.Therefore antenna is a considerable element in the wireless telecommunications system.Traditional antenna mainly is the antenna of external placed type, as adopts the antenna of spiral helicine (helical) antenna or dipole (dipole) pattern.Just the antenna of these styles is exposed at the outside of casing outward, so be easy to lose.Moreover also make the volume of body increase.The antenna of recent use internally-arranged type slowly replaces traditional external placed type antenna.Especially in mobile phone, PDA, notebook computer, often use built-in antenna.
Traditional built-in antenna mainly is the pattern of paster (patch) antenna.Normally be made up of RF component and matrix fixed support thereof, RF component is metalwork or the flexible printed circuit board or the printed circuit board of definite shape.The antenna of this type uses for some time.At present, the antenna structure of this type composition but exists some problems: at first be that the RF component on the antenna is assembled together both after need machining respectively with its matrix fixed support again.Because its both matching relationship is unstable, cause bigger radio-frequency performance to change sometimes.Especially, in order to satisfy the radio frequency requirement of antenna, or cooperate the support bracket fastened external form of matrix, the RF component of some antenna must demonstrate three-dimensional geometrical shape, and some RF components than complicated shape are difficult to produce.In addition, a kind of platable plastic is expelled on the electroless plating plastics by the aerial radiation shape, carries out the antenna of electroplating technology then for what occur now; Its shortcoming is that material thickness is high; Space hold is bigger, the mould structure relative complex, and the radio-frequency performance adjustment owes flexible.
Summary of the invention
For solving the problems of the technologies described above, the antenna that the inventive method is made can make the complete driving fit of antenna on substrate, and shared volume is minimum, and the mode of application laser sculpture can increase the precision of entire antenna size.When being applied on the mobile electronic products such as mobile phone or PDA when antenna, this antenna combines not occupy any space fully with casing.Compare with the technology of prior art, reduce technologies such as hot melt or ultrasound and reduced process period relatively, and can reduce cost, increase qualification rate.
For achieving the above object, the present invention proposes a kind of method that sputter is made antenna of using, and comprises the following step: get a substrate, as the bottom substrate of metal plating, the mode of metal with sputter is plating on this substrate; On the jet-plating metallization layer, carving antenna pattern with the mode of laser sculpture again, is that this substrate is placed the below of laser engraving machine and carves antenna pattern with laser according to the collection of illustrative plates of being planned.In addition, also can with one have antenna pattern light shield place this substrate top; The part relevant hollow out on light shield wherein with the pattern of antenna; Metal is plating to this light shield top with the mode of sputter; The metal of this sputter will pass this light shield hollow out position, and on this substrate, produce a pair of metal area that should antenna pattern.The antenna pattern metal area that aforementioned use light shield produces; As for the dimensional precision that progresses greatly; Can be again trimming with the mode of the laser sculpture edge with the antenna pattern metal area, is that this substrate is placed the below of laser engraving machine and trims the edge of metal area with laser according to the collection of illustrative plates of being planned.
Description of drawings
Fig. 1 shows that the light shield of first embodiment among the present invention places the synoptic diagram on this substrate.
Fig. 2 shows that the metal of first embodiment among the present invention forms the synoptic diagram of a pair of metal area that should antenna pattern on this substrate.
Fig. 3 shows that the applied chemistry plating of first embodiment among the present invention or galvanized mode thicken this antenna pattern metal area in the synoptic diagram that forms a thickening layer.
Fig. 4 shows that this antenna appearance of first embodiment among the present invention forms the synoptic diagram of a coating layer.
Fig. 5 shows the manufacturing process block diagram of first embodiment among the present invention.
Fig. 6 shows that second embodiment's among the present invention is plating to the base material top to form the synoptic diagram of metal level with metal with the mode of sputter.
Fig. 7 shows that the mode with laser sculpture of second embodiment is carved the synoptic diagram that forms the antenna pattern metal area among the present invention on the jet-plating metallization layer.
Fig. 8 shows that the applied chemistry plating of second embodiment among the present invention or galvanized mode thicken this antenna pattern metal area in the synoptic diagram that forms a thickening layer.
Fig. 9 shows that this antenna appearance of second embodiment among the present invention forms the synoptic diagram of a coating layer.
Figure 10 shows the manufacturing process block diagram of second embodiment among the present invention.
Figure 11 shows an application example figure of the present invention.
[main element nomenclature].
| 10 | Substrate |
| 20 | |
| 30 | |
| 31 | The jet- |
| 35 | Thickening |
| 40 | Coating |
| 50 | |
| 51 | Embed the |
| 52 | Ground connection pin hole |
Embodiment
Please refer to Fig. 1 to Fig. 4, and please refer to the schema of Fig. 5, wherein show the manufacturing process of the first embodiment of the present invention.
Get earlier and put a substrate 10, this substrate 10 can be ceramic substrate, plastic substrate, macromolecule polymeric material or matrix material, as the bottom substrate (step 100) of metal plating.
With one have antenna pattern light shield 20 place on this substrate 10.Wherein, the part corresponding hollow out (step 121) on light shield 20 with the pattern of antenna.As shown in fig. 1.
Metal (being mainly the alloy of nickel, chromium, copper or these metals) is plating to this light shield 20 tops with the mode of sputter.The metal of this sputter will pass this light shield 20 hollow out positions, and on this substrate 10, produce a thin metal layer, and its thickness is about tens nanometer.So this metal forms a pair of metal area 30 (step 122) that should antenna pattern on this substrate 10, as shown in Figure 2.Preferable, it is a casing that sputter has the substrate of this metal area 30, and this metal area is positioned at the inboard of this casing.
Under the situation of high frequency antenna, because relative very short of the wavelength of radiation electric wave,, and require quite high precision so that the size of counter element must be relative is less.So relative, the border of formed each metal area 30 also requires to have quite high precision on substrate 10, so that the precision of the frequency of the electric wave of being launched and energy can reach the requirement on original design.So when the dimensional precision of the metal area 30 that adopts step 122 to produce can't directly reach requiring on original design, then must be further the edge of metal area 30 be trimmed.
Its mode is for trimming with the mode of the laser sculpture edge with metal area 30, is this substrate 10 is placed the below of laser engraving machine and trims the edge (step 123) of metal area 30 with laser according to the collection of illustrative plates of being planned, reaches design and goes up desired precision.
Moreover because the metal level that is plated with sputtering way is quite thin usually, resistance value is bigger, thus can the radiating received-signal strength limited, often be inappropriate for the wave radiation of long distance.Can reach needed quantity of radiant energy so must will increase the thickness of this metal area 30; The multiple applied chemistry plating in the top of this metal area 30 or galvanized mode thickened this metal area 30 form a thickening layer 35, carrying bigger electric current, so can the bigger hertzian wave (step 130) of radiation; The material of thickening layer 35 can be different from metal area 30; And can be the multiwalled metal construction, be generally copper, nickel or gold etc., as shown in Figure 3.
Form a coating layer 40 (mode of spraying paint like use) in this antenna appearance, to coat this antenna on this substrate 10 (step 140), as shown in Figure 4.
Please refer to Fig. 6 to 10, wherein show the second embodiment of the present invention, then represent with the first embodiment components identical in the present embodiment with identical label.The manufacturing process that shows second embodiment among Figure 10.
Get earlier and put a substrate 10, this substrate 10 can be ceramic substrate, plastic substrate, macromolecule polymeric material or matrix material, as the bottom substrate (step 100) of metal plating.
Metal (being mainly the alloy of nickel, chromium, copper or these metals) is plating to base material 10 tops with the mode of sputter, forms metal level 31, its thickness is about tens nanometer (step 111).Person as shown in Figure 6.Mode with laser sculpture is carved on jet-plating metallization layer 31, forms antenna pattern metal area 30 (steps 112).As shown in Figure 7.Preferable, it is a casing that sputter has the substrate of this metal area 30, and this metal area is positioned at the inboard of this casing.
Because the metal level that is plated with sputtering way is quite thin usually, resistance value is bigger, thus can the radiating received-signal strength limited, often be inappropriate for the wave radiation of long distance.Can reach needed quantity of radiant energy so must will increase the thickness of this metal area 30; The multiple applied chemistry plating in the top of this metal area 30 or galvanized mode thickened this metal area 30 form a thickening layer 35, carrying bigger electric current, so can the bigger hertzian wave (step 130) of radiation; The material of thickening layer 35 can be different from metal area 30; And can be the multiwalled metal construction, be generally copper, nickel or gold etc., as shown in Figure 8.
Form a coating layer 40 (mode of spraying paint like use) in this antenna appearance, to coat this antenna (step 140), person as shown in Figure 9 on this substrate 10.
Show among Figure 11 that of the present invention one uses, antenna wherein of the present invention is placed in a plastic rubber case 50 (substrate), has one and embeds a pin 51 and a ground connection pin hole 52; And antenna be sputter and electroless plating or electroplating metal material in plastic rubber case 50 apparent metal material layers, this metallic substance once cut and had formed antenna pattern; Coating layer 40 takes shape in this antenna appearance in addition, to coat antenna on plastic rubber case 50.In the embedding pin hole 51 and ground connection pin hole 52 of plastic rubber case 50, antenna then forms respectively and extends to the embedding pin hole 51 and the ground connection pin hole 52 of plastic rubber case 50 inner faces, and can connect the circuit card in the plastic rubber case 50.
And, can make the complete driving fit of antenna on substrate according to the made antenna of the inventive method, shared volume is minimum, and the mode of application laser sculpture can increase the precision of entire antenna size.When being applied on the mobile electronic products such as mobile phone or PDA when antenna, this antenna combines not occupy any space fully with casing.Compare with the technology of prior art, reduce technologies such as hot melt or ultrasound and reduced process period relatively, and can reduce cost, increase qualification rate.
In sum, the design of consideration of this case hommization quite meets actual demand.Its concrete improvement has defective now, obviously has breakthrough progressive advantage compared to prior art, the enhancement that has effect really, and non-being easy to reached.This case disclosed or was exposed on domestic and the external document and market.Above-listed detailed description is specifying to a possible embodiments of the present invention; Just this embodiment is not in order to limit claim of the present invention; Allly do not break away from the equivalence that skill spirit of the present invention does and implement or change, all should be contained in the claim of this case.
Claims (11)
1. use the method that sputter is made antenna for one kind, it is characterized in that, comprise the following step:
Get a substrate, as the bottom substrate of metal plating;
Light shield with antenna pattern is placed this substrate top; The part corresponding hollow out on light shield wherein with the pattern of antenna;
Metal is plating to this light shield top with the mode of sputter; The metal of this sputter will pass this light shield hollow out position, and on this substrate, form one to metal area that should antenna pattern; And
Trimming with the mode of the laser sculpture edge with the antenna pattern metal area, is the edge that trims the antenna pattern metal area with laser engraving machine according to the antenna collection of illustrative plates of being planned.
2. make the method for antenna according to the application sputter shown in the claim 1, it is characterized in that, also comprise step and be:
Multiple applied chemistry plating in the top of this metal area or galvanized mode are thickened formation one deck to carry the thickening layer of bigger electric current with this metal area.
3. make the method for antenna according to the application sputter shown in the claim 2, it is characterized in that, also comprise step and be: form one deck in this antenna appearance and be coated on the coating layer of this antenna on this substrate.
4. make the method for antenna according to each described application sputter in the claim 1 to 3, it is characterized in that this substrate is ceramic substrate or plastic substrate or macromolecule polymeric material or matrix material.
5. make the method for antenna according to each described application sputter in the claim 1 to 3, it is characterized in that the metal of sputter is the alloy of nickel, chromium, copper or these metals.
6. make the method for antenna according to each described application sputter in the claim 1 to 3, it is characterized in that it is a casing that sputter has the substrate of this metal area, and this metal area is positioned at the inboard of this casing.
7. use the method that sputter is made antenna for one kind, it is characterized in that, comprise the following step:
Get earlier and put a substrate, as the bottom substrate of metal plating;
Metal is plating to the base material top with the mode of sputter, forms the layer of metal layer, on the jet-plating metallization layer, carve, form the antenna pattern metal area with the mode of laser sculpture; And
Multiple applied chemistry plating in the top of this metal area or galvanized mode are thickened formation one deck to carry the thickening layer of bigger electric current with this metal area.
8. application sputter according to claim 7 is made the method for antenna, it is characterized in that, also comprises step and is: form one deck to coat the coating layer of this antenna on this substrate in this antenna appearance.
9. according to the method for claim 7 or 8 described application sputters manufacturing antennas, it is characterized in that this substrate is ceramic substrate or plastic substrate or macromolecule polymeric material or matrix material.
10. according to the method for claim 7 or 8 described application sputters manufacturing antennas, it is characterized in that the metal of sputter is the alloy of nickel, chromium, copper or these metals.
11. the method according to claim 7 or 8 described application sputters manufacturing antennas is characterized in that it is a casing that sputter has the substrate of this metal area, and this metal area is positioned at the inboard of this casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100046088A CN102586725A (en) | 2011-01-11 | 2011-01-11 | Manufacture method of antenna by means of sputtering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100046088A CN102586725A (en) | 2011-01-11 | 2011-01-11 | Manufacture method of antenna by means of sputtering |
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| Publication Number | Publication Date |
|---|---|
| CN102586725A true CN102586725A (en) | 2012-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100046088A Pending CN102586725A (en) | 2011-01-11 | 2011-01-11 | Manufacture method of antenna by means of sputtering |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928756A (en) * | 2014-03-19 | 2014-07-16 | 联想(北京)有限公司 | Electronic device processing method |
| CN103972645A (en) * | 2013-01-28 | 2014-08-06 | 中兴通讯股份有限公司 | Mobile terminal antenna and manufacturing method thereof |
| CN104209516A (en) * | 2014-08-13 | 2014-12-17 | 东莞劲胜精密组件股份有限公司 | Method for forming antenna or circuit on plastic cement casing |
| CN106163163A (en) * | 2015-03-31 | 2016-11-23 | 深圳富泰宏精密工业有限公司 | Housing, the electronic installation applying this housing and preparation method thereof |
| CN108736149A (en) * | 2017-10-14 | 2018-11-02 | 丹阳市遥控天线厂 | A kind of digital TV antenna manufacture craft |
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| CN1520612A (en) * | 1999-02-24 | 2004-08-11 | ��³����ʽ���� | IC element and its mfg. as well as information carrier with mounted IC element and its manufacture |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972645A (en) * | 2013-01-28 | 2014-08-06 | 中兴通讯股份有限公司 | Mobile terminal antenna and manufacturing method thereof |
| CN103928756A (en) * | 2014-03-19 | 2014-07-16 | 联想(北京)有限公司 | Electronic device processing method |
| CN104209516A (en) * | 2014-08-13 | 2014-12-17 | 东莞劲胜精密组件股份有限公司 | Method for forming antenna or circuit on plastic cement casing |
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| CN106163163A (en) * | 2015-03-31 | 2016-11-23 | 深圳富泰宏精密工业有限公司 | Housing, the electronic installation applying this housing and preparation method thereof |
| CN108736149A (en) * | 2017-10-14 | 2018-11-02 | 丹阳市遥控天线厂 | A kind of digital TV antenna manufacture craft |
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| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: QINGDAO LONGBOW PLASTIC MOLD CO.,LTD. Free format text: FORMER OWNER: NEW ZEALAND QINGDAO LONGBOW ELECTRONICS CO., LTD. Effective date: 20130819 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; TO: 266555 QINGDAO, SHANDONG PROVINCE |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20130819 Address after: 266555 No. nine the Great Wall Road, Qingdao economic and Technological Development Zone, Shandong, China Applicant after: Qingdao Longbow Plastic Mold Co.,Ltd. Address before: New Zealand Oakland region with Tucker ray Sun Leijie, Henderson Lixiqi Street No. 14 Applicant before: Qingdao Longbow Electronics Co., Ltd. |
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| C10 | Entry into substantive examination | ||
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Application publication date: 20120718 |