CN102585778A - High-temperature resistant radiating material and preparation method thereof - Google Patents
High-temperature resistant radiating material and preparation method thereof Download PDFInfo
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- CN102585778A CN102585778A CN2011104502022A CN201110450202A CN102585778A CN 102585778 A CN102585778 A CN 102585778A CN 2011104502022 A CN2011104502022 A CN 2011104502022A CN 201110450202 A CN201110450202 A CN 201110450202A CN 102585778 A CN102585778 A CN 102585778A
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Abstract
The invention relates to a high-temperature resistant radiating material and a preparation method thereof. The preparation method comprises the following steps: adding methyl silicone oil and zinc oxide into a reactor, carrying out primary stirring, adding alumina and aluminum hydroxide after the methyl silicone oil and the zinc oxide are stirred uniformly, carrying out secondary stirring and first vacuumizing in sequence, adding gas phase silica, carrying out tertiary stirring, and then carrying out secondary vacuumizing so as to obtain the high-temperature resistant radiating material. The high-temperature resistant radiating material is paste filled between an electronic component and a radiator. Due to the matching of the raw materials by weight part, the product prepared according to the method can be used at 250 DEG C, and the heat conductivity can reach 1.5 W/m.k.
Description
Technical field
The present invention relates to a kind of high temperature resistant heat sink material and preparation method thereof, belong to the heat sink material field.
Background technology
Along with the widespread usage of high-power electronic component, heat radiation more and more becomes the important factor that influences product life.These elements constantly gather heat in long-time use, if can not the heat that produce in time be derived, with the life-span that shortens these devices greatly, and then influence life-span of product.Paste heat sink material wettability is good, and thermal resistance is little, and good heat dissipation effect is easy to use, increasing being applied in heater members and the radiating element.
Common thermal grease use temperature is 200 ℃, some products in use, the temperature of generation is very high, what have can reach 250 ℃ even higher.In this case, common thermal grease begins dry, and thermal resistance rises very fast, and final radiating effect is very poor, causes electronic component to lose efficacy at last.
Summary of the invention
Technical problem to be solved by this invention provides a kind of high temperature resistant paste heat sink material between electronic package and the scatterer and preparation method thereof of filling.
The technical scheme that the present invention solves the problems of the technologies described above is following:
A kind of high temperature resistant heat sink material comprises the raw material of following parts by weight: 100 parts of methyl-silicone oils, 450～900 parts in zinc oxide, 100～300 parts in aluminum oxide, 50～100 parts in white lake, 5～15 parts of aerosils.
The invention has the beneficial effects as follows: high temperature resistant heat sink material of the present invention is a kind of high temperature resistant paste heat sink material of filling between electronic package and the scatterer.Through the collocation of the parts by weight between the raw material, products obtained therefrom can use down at 250 ℃, and thermal conductivity can reach 1.5W/mk.
On the basis of technique scheme, the present invention can also do following improvement.
Further, the viscosity of said methyl-silicone oil is 1000～1500mPas.
Further, the particle diameter of said zinc oxide is 10～13 microns.
Further, 3～5 microns of the particle diameters of said aluminum oxide.
Another technical scheme that the present invention solves the problems of the technologies described above is following:
A kind of preparation method of high temperature resistant heat sink material may further comprise the steps: methyl-silicone oil, zinc oxide are joined carry out the stirring first time in the reactor drum, after stirring; Add aluminum oxide and white lake, carry out the second time and stir, vacuumize first then; Add aerosil again; Stir for the third time, vacuumize once more then, promptly obtain said high temperature resistant heat sink material;
Wherein, said methyl-silicone oil, zinc oxide, aluminum oxide, the ratio of weight and number of white lake and aerosil are 100:450～900:100～300:50～100:5～15.
Further, the churning time that stir the said first time is 1.5～2.5 hours, and mixing speed is 400～600rpm.
Further, the churning time that stir the said second time is 0.5～1.5 hour, and mixing speed is 600～800rpm.
Further, the said time that vacuumizes first is 15～45 minutes, and vacuum tightness is less than-0.09Mpa.
Further, the said churning time that stirs for the third time is 15～45 minutes, and mixing speed is 600～1000rpm.
Further, the said time that vacuumizes once more is 20～45 minutes, and vacuum tightness is less than-0.09Mpa.
Description of drawings
Fig. 1 is the thermogravimetric analysis graphic representation of the high temperature resistant heat sink material of the present invention.
Embodiment
Below principle of the present invention and characteristic are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Embodiment 1
Pressing methyl-silicone oil weight 100 calculates for unit
100 parts of methyl-silicone oils, zinc oxide are joined in the stirring tank for 450 parts and stirred 1.5 hours; Rotating speed is 400rpm, and the back that stirs adds 100 parts in aluminum oxide, 50 parts in white lake, and rotating speed is 600rpm; Stir and vacuumized 15 minutes after 0.5 hour, vacuum tightness is less than-0.09Mpa.After returning to normal pressure, add aerosil and stirred 15 minutes for 15 parts, rotating speed is 600rpm, vacuumizes, and vacuum tightness after 20 minutes, promptly obtains said paste heat sink material less than-0.09Mpa.
Measuring thermal conductivity according to ASTM D5470 is 1.0W/mk.
Embodiment 2
Pressing methyl-silicone oil weight 100 calculates for unit
100 parts of methyl-silicone oils, zinc oxide are joined in the stirring tank for 750 parts and stirred 2 hours; Rotating speed is 500rpm, and the back that stirs adds 200 parts in aluminum oxide, 80 parts in white lake, and rotating speed is 700rpm; Stir and vacuumized 30 minutes after 1 hour, vacuum tightness is less than-0.09Mpa.After returning to normal pressure, add aerosil and stirred 30 minutes for 10 parts, rotating speed is 900rpm, vacuumizes, and vacuum tightness after 30 minutes, obtains the paste heat sink material less than-0.09Mpa.
Measuring thermal conductivity according to ASTM D5470 is 1.3W/mk.
Embodiment 3
Pressing methyl-silicone oil weight 100 calculates for unit
100 parts of methyl-silicone oils, zinc oxide are joined in the stirring tank for 900 parts and stirred 2.5 hours; Rotating speed is 600rpm, and the back that stirs adds 300 parts in aluminum oxide, 100 parts in white lake, and rotating speed is 800rpm; Stir and vacuumized 45 minutes after 1.5 hours, vacuum tightness is less than-0.09Mpa.After returning to normal pressure, add aerosil and stirred 45 minutes for 5 parts, rotating speed is 1000rpm, vacuumizes, and vacuum tightness is less than-0.09Mpa, after 45 minutes; Obtain the paste heat sink material.
Measuring thermal conductivity according to ASTM D5470 is 1.5W/mk.
Come resistance toheat such as Fig. 1 of analysis of material with thermogravimetric analysis (TGA) curve of embodiment 1.As can be seen from the figure this heat sink material does not have thermal weight loss at 200～250 ℃, and the illustrative material heatproof reaches 250 ℃.Embodiment 2 with 3 with embodiment 1 material proportion different just, and because of the filler deal increases, heat resistance is better than embodiment 1.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a high temperature resistant heat sink material is characterized in that, comprises the raw material of following parts by weight: 100 parts of methyl-silicone oils, 450～900 parts in zinc oxide, 100～300 parts in aluminum oxide, 50～100 parts in white lake, 5～15 parts of aerosils.
2. high temperature resistant heat sink material according to claim 1 is characterized in that, the viscosity of said methyl-silicone oil is 1000～1500mPas.
3. high temperature resistant heat sink material according to claim 1 is characterized in that, the particle diameter of said zinc oxide is 10～13 microns.
4. high temperature resistant heat sink material according to claim 1 is characterized in that, 3～5 microns of the particle diameters of said aluminum oxide.
5. the preparation method of a high temperature resistant heat sink material is characterized in that, may further comprise the steps: methyl-silicone oil, zinc oxide are joined carry out the stirring first time in the reactor drum; After stirring, add aluminum oxide and white lake, carry out the second time and stir; Vacuumize first then, add aerosil again, stir for the third time; Vacuumize once more then, promptly obtain said high temperature resistant heat sink material;
Wherein, said methyl-silicone oil, zinc oxide, aluminum oxide, the ratio of weight and number of white lake and aerosil are 100:450～900:100～300:50～100:5～15.
6. preparation method according to claim 5 is characterized in that, the churning time that stir the said first time is 1.5～2.5 hours, and mixing speed is 400～600rpm.
7. preparation method according to claim 5 is characterized in that, the churning time that stir the said second time is 0.5～1.5 hour, and mixing speed is 600～800rpm.
8. preparation method according to claim 5 is characterized in that, the said time that vacuumizes first is 15～45 minutes, and vacuum tightness is less than-0.09Mpa.
9. preparation method according to claim 5 is characterized in that, the said churning time that stirs for the third time is 15～45 minutes, and mixing speed is 600～1000rpm.
10. preparation method according to claim 5 is characterized in that, the said time that vacuumizes once more is 20～45 minutes, and vacuum tightness is less than-0.09Mpa.
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| CN2011104502022A CN102585778A (en) | 2011-12-29 | 2011-12-29 | High-temperature resistant radiating material and preparation method thereof |
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| CN2011104502022A CN102585778A (en) | 2011-12-29 | 2011-12-29 | High-temperature resistant radiating material and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105111743A (en) * | 2015-09-16 | 2015-12-02 | 赵孝连 | Heat-conducting medium as well as application of heat-conducting medium in lithium battery pack and method for manufacturing heat-conducting medium |
| CN107722946A (en) * | 2017-11-06 | 2018-02-23 | 方文成 | A kind of Heat Conduction Material and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101932684A (en) * | 2008-01-30 | 2010-12-29 | 道康宁东丽株式会社 | Thermally conductive silicone grease composition |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101932684A (en) * | 2008-01-30 | 2010-12-29 | 道康宁东丽株式会社 | Thermally conductive silicone grease composition |
Non-Patent Citations (1)
| Title |
|---|
| 王健石等: "《电子设备热设计速查手册》", 31 October 2008 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105111743A (en) * | 2015-09-16 | 2015-12-02 | 赵孝连 | Heat-conducting medium as well as application of heat-conducting medium in lithium battery pack and method for manufacturing heat-conducting medium |
| CN107722946A (en) * | 2017-11-06 | 2018-02-23 | 方文成 | A kind of Heat Conduction Material and preparation method thereof |
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Application publication date: 20120718 |