CN102585438B - 密封用环氧树脂组合物和电子部件装置 - Google Patents

密封用环氧树脂组合物和电子部件装置 Download PDF

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Publication number
CN102585438B
CN102585438B CN201110451570.9A CN201110451570A CN102585438B CN 102585438 B CN102585438 B CN 102585438B CN 201110451570 A CN201110451570 A CN 201110451570A CN 102585438 B CN102585438 B CN 102585438B
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China
Prior art keywords
epoxy resin
mass
formula
resin composition
substituted
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CN201110451570.9A
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English (en)
Chinese (zh)
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CN102585438A (zh
Inventor
田中贤治
滨田光祥
古泽文夫
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Lishennoco Co ltd
Resonac Corp
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Hitachi Chemical Co Ltd
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Priority to CN201610404757.6A priority Critical patent/CN106085316B/zh
Publication of CN102585438A publication Critical patent/CN102585438A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201110451570.9A 2011-01-06 2011-12-29 密封用环氧树脂组合物和电子部件装置 Active CN102585438B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610404757.6A CN106085316B (zh) 2011-01-06 2011-12-29 密封用环氧树脂组合物和电子部件装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011001130A JP5630652B2 (ja) 2011-01-06 2011-01-06 封止用エポキシ樹脂成形材料および電子部品装置
JP2011-001130 2011-01-06

Related Child Applications (1)

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CN201610404757.6A Division CN106085316B (zh) 2011-01-06 2011-12-29 密封用环氧树脂组合物和电子部件装置

Publications (2)

Publication Number Publication Date
CN102585438A CN102585438A (zh) 2012-07-18
CN102585438B true CN102585438B (zh) 2016-07-06

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CN201610404757.6A Active CN106085316B (zh) 2011-01-06 2011-12-29 密封用环氧树脂组合物和电子部件装置
CN201110451570.9A Active CN102585438B (zh) 2011-01-06 2011-12-29 密封用环氧树脂组合物和电子部件装置

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Country Status (5)

Country Link
JP (1) JP5630652B2 (ja)
KR (2) KR101924233B1 (ja)
CN (2) CN106085316B (ja)
MY (1) MY161129A (ja)
TW (2) TWI589617B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5768023B2 (ja) 2012-08-29 2015-08-26 日東電工株式会社 電子部品封止用熱硬化性樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
JP6550336B2 (ja) 2012-10-26 2019-07-24 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 接着剤組成物
JP6263835B2 (ja) * 2012-12-13 2018-01-24 日立化成株式会社 熱硬化性樹脂成形材料及び電子部品装置
JP6246050B2 (ja) * 2014-04-14 2017-12-13 オリンパス株式会社 樹脂組成物、超音波振動子用バッキング材、超音波振動子及び超音波内視鏡
WO2016174757A1 (ja) * 2015-04-30 2016-11-03 住友ベークライト株式会社 封止用樹脂組成物及び電子部品装置
CN115785621A (zh) * 2017-03-31 2023-03-14 日立化成株式会社 密封用环氧树脂组合物和电子部件装置
JP6500947B2 (ja) * 2017-08-10 2019-04-17 日清紡ケミカル株式会社 一液型接着剤及び燃料電池セパレータ
WO2019131096A1 (ja) * 2017-12-28 2019-07-04 日立化成株式会社 ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置
KR20200103756A (ko) * 2017-12-28 2020-09-02 히타치가세이가부시끼가이샤 볼 그리드 어레이 패키지 밀봉용 에폭시 수지 조성물, 에폭시 수지 경화물 및 전자 부품 장치
NL2021145B1 (en) * 2018-06-18 2020-01-06 Besi Netherlands Bv Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
WO2020066856A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7272368B2 (ja) * 2018-09-27 2023-05-12 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7279333B2 (ja) * 2018-10-17 2023-05-23 株式会社レゾナック 硬化性樹脂組成物用添加剤、硬化性樹脂組成物及び電子部品装置
WO2022210384A1 (ja) * 2021-03-31 2022-10-06 住友ベークライト株式会社 封止用樹脂組成物およびこれを用いた電子装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985701B2 (ja) * 1995-01-27 1999-12-06 松下電工株式会社 液状エポキシ樹脂組成物
JP2003286395A (ja) * 2002-03-28 2003-10-10 Sumitomo Bakelite Co Ltd 難燃性エポキシ樹脂組成物およびそれを用いた半導体封止材料並びに半導体装置
JP2005089607A (ja) * 2003-09-17 2005-04-07 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
CN102341430B (zh) * 2009-03-11 2013-11-06 日本曹达株式会社 环氧树脂组合物、固化剂及固化促进剂
JP5546914B2 (ja) * 2009-03-19 2014-07-09 日本曹達株式会社 新規な包接錯体、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物

Also Published As

Publication number Publication date
CN102585438A (zh) 2012-07-18
CN106085316B (zh) 2020-03-13
KR102013533B1 (ko) 2019-08-22
CN106085316A (zh) 2016-11-09
KR20120080128A (ko) 2012-07-16
TW201241029A (en) 2012-10-16
JP5630652B2 (ja) 2014-11-26
KR101924233B1 (ko) 2018-11-30
MY161129A (en) 2017-04-14
KR20180131517A (ko) 2018-12-10
JP2012140566A (ja) 2012-07-26
TW201619230A (zh) 2016-06-01
TWI589617B (zh) 2017-07-01
TWI554538B (zh) 2016-10-21

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Address after: Tokyo, Japan

Patentee after: HITACHI CHEMICAL Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: HITACHI CHEMICAL Co.,Ltd.

Address after: Tokyo, Japan

Patentee after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: HITACHI CHEMICAL Co.,Ltd.

CP01 Change in the name or title of a patent holder