CN102573397A - Heat transmission device as well as manufacturing and assembling method and equipment assembly of heat transmission device - Google Patents
Heat transmission device as well as manufacturing and assembling method and equipment assembly of heat transmission device Download PDFInfo
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- CN102573397A CN102573397A CN2010106084125A CN201010608412A CN102573397A CN 102573397 A CN102573397 A CN 102573397A CN 2010106084125 A CN2010106084125 A CN 2010106084125A CN 201010608412 A CN201010608412 A CN 201010608412A CN 102573397 A CN102573397 A CN 102573397A
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- heat
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- heat transfer
- equipment casing
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Abstract
The invention provides a heat transmission device for transmitting heat emitted by an electronic part to an equipment casing. The heat transmission device comprises at least one heat-conduction shell element connected with the electronic part, a heat-conduction plate in thermal connection with the equipment casing and at least two flexible heat transmission elements which are thermally connected between the heat-conduction shell element and the heat-conduction plate. Compared with the prior art, the heat transmission device disclosed by the invention can be easily assembled onto the equipment casing and has the advantages of small occupied space, flexibility in arrangement, suitability for long-distance heat transmission and high heat transmission efficiency. The invention further provides a manufacturing and assembling method of the heat transmission device as well as an equipment assembly provided with the heat transmission device.
Description
Technical field
The present invention relates to a kind of heat transfer apparatus, especially for the heat transfer apparatus of electronic unit, it is used for heat delivered to equipment casing that electronic unit is sent, to cool off this electronic unit.
Background technology
On printed circuit board (PCB), some electronic units for example inductance element, transformer etc. can generate heat in the course of the work, and whole electronic unit and ambient temperature are raise, and are unfavorable for the operate as normal of printed circuit board (PCB).Particularly when printed circuit board (PCB) was encapsulated in the equipment casing, the electronic unit ambient air flowed and is restricted, thereby was difficult to rely on natural cooling to realize the efficiently radiates heat to electronic unit.
Utilize heat-transfer device that heat is delivered to the equipment casing and through the natural cooling of equipment casing is realized that the heat radiation to electronic unit is a kind of practicable solution from electronic unit.From a kind of heat-transfer device known in the state of the art, Fig. 1 shows its plane graph on being assembled into the equipment casing time.As shown in Figure 1, this heat-transfer device 10 comprises the metal accommodation section 11 and installation portion 12 that is integrally formed rigidly, on the basal surface of metal accommodation section, is provided with latch.In use, latch is inserted in the corresponding perforate on the printed circuit board (PCB) 16, thereby the metal accommodation section is fixed on the printed circuit board (PCB), and be used to hold the electronic unit (not shown) that is fixed on the printed circuit board (PCB).Can fill the sealed silicon resin through cast in the space between accommodation section and the electronic unit that held.After the metal accommodation section has been fixed on the printed circuit board (PCB), utilize screw 13 that installation portion is fixed on the equipment casing 14.Usually, between installation portion 12 and equipment casing 14, also can be provided with heat conduction silica gel sheet (SIR) 15, to strengthen from the heat transmission of installation portion to the equipment casing.
In this scheme, the sealed silicon resin all fully contacts with all surface of electronic unit with the metal accommodation section, thus the heat guiding metal accommodation section that can be effectively electronic unit be sent and and then the guiding installation portion, improve radiating efficiency.Yet also there is certain problem in this scheme.
On the one hand, when this heat-transfer device is installed, when an end of its metal accommodation section has been fixed on the motionless printed circuit board (PCB) through latch, be difficult to usually its other end is assembled on the equipment casing well.Particularly the size of heat-transfer device can not suitably be matched with between electronic unit and the equipment casing apart from the time; Between the installation portion of heat-transfer device and/or heat conduction silica gel sheet and equipment casing, usually can there be the gap or the magnitude of interference; In when assembling even can cause installation portion crooked, the lock-screw quite difficulty that also becomes.Its main cause is the scale error of electronic unit and heat-transfer device, the sum of errors assembly error of filling sealed silicon resin; And if the shape of electronic unit is very irregular; For example this electronic unit is spirality inductance element or transformer etc., and then error can be bigger.In order to be illustrated more clearly in this point; The situation that this heat-transfer device is distorted after being assembled on the printed circuit board (PCB) and is out of shape has been shown among Fig. 1; Wherein between heat-transfer device and equipment casing 14, there is bigger wedge gap; Squint in this also feasible position that is used for the hole of mounting screw, thereby lock-screw becomes very difficult or even possibly not realize locking.Obviously, the heat transfer efficiency of heat-transfer device will be reduced.
On the other hand; Under electronic unit is arranged in apart from the situation of equipment casing than the distant positions place; Usually do not recommend to use this heat-transfer device from electronic unit to the heat conduction of equipment casing; Because will have to be provided with large-sized heat-transfer device this moment, this heat-transfer device will take a large amount of expensive real estate, and heat transfer efficiency is not high yet.In addition, in the installation portion of heat-transfer device and the gap between the equipment casing, fill a large amount of thick heat conduction silica gel sheets and also can reduce heat transfer efficiency.
The present invention is intended to overcome above-mentioned deficiency of the prior art.
Summary of the invention
For this reason; The present invention proposes a kind of heat transfer apparatus; It is used to be thermally connected between at least one electronic unit and the equipment casing, so that heat delivered to the equipment casing that electronic unit is sent, this heat transfer apparatus comprises: be used for and hot linked at least one the heat conduction shell element of electronic unit; Be used for and the hot linked heat conduction plate of equipment casing; And the heat transfer element of at least two flexibilities of hot link between heat conduction shell element and heat conduction plate.
Heat transfer apparatus of the present invention utilizes flexible heat transfer element transmission heat between heat conduction shell element and heat conduction plate, has improved flexible arrangement property, can solve packing problem of the prior art effectively.In this heat transfer apparatus, after the heat conduction shell element had been fixed on the printed circuit board (PCB), because the flexibility of heat transfer element, the heat conduction plate that is used to be assembled on the equipment casing still can move on all directions, made that assembling is convenient.Even actual installation position or orientation at the heat conduction shell element exist under the situation of deviation with predetermined installation site or orientation; Flexible heat transfer element also can easily be gone up this deviation of compensation in any direction; Guarantee that the heat conduction plate always can fit tightly on the equipment casing when assembling, be convenient to lock-screw.
This flexible heat transfer element is twisted on preferably can be in any direction, and for example it can be arranged to helical form, corrugated or linearity as required between heat conduction shell element and heat conduction plate, can further improve its Installation Flexibility like this.Compare with the heat-transfer device that big volume is set; Flexible heat transfer element only need take less space; And can also straddle other parts top where necessary, therefore be applicable to that also electronic unit is arranged on apart from the equipment casing than the heat transfer under the situation at distant positions place.Preferably, use heat pipe as heat transfer element.As everyone knows, Heat Transfer of Heat Pipe on Heat Pipe efficient is very high, can the heat conduction shell element be transferred to the heat conduction plate effectively from the heat that electronic unit absorbs.
The present invention provides a kind of apparatus assembly on the other hand, and this apparatus assembly comprises equipment casing, at least one electronic unit and the hot link heat transfer apparatus with aforesaid one or more characteristics between equipment casing and electronic unit.
Further aspect of the present invention provides a kind of method of making heat transfer apparatus; This heat transfer apparatus is used for hot link between at least one electronic unit and equipment casing; So that heat delivered to the equipment casing that electronic unit is sent; This method comprises: the heat transfer element and a heat conduction plate of at least one heat conduction shell element, at least two flexibilities are provided, and with the heat transfer element hot link between heat conduction shell element and heat conduction plate.
According to another aspect of the invention; Provide and be used for the heat transfer apparatus with one or more above-mentioned characteristics is assembled into the method on the equipment casing; This method comprises: make heat conduction shell element and electronic unit hot link and the heat conduction plate is thermally connected on the equipment casing.
Alternatively, heat transfer element can be arranged between heat conduction shell element and the heat conduction plate to straddle other electronic unit above, to be used for the long-distance transmissions of heat.For the further efficiency of thermal transfer of raising system, this method also can be included in the step of cast sealed silicon resin between heat conduction shell element and the electronic unit and/or coated with thermally conductive cream or the step of heat conduction silica gel sheet is set between heat conduction plate and equipment casing.
Description of drawings
Will be from the description of with reference to the accompanying drawings the preferred embodiments of the present invention being carried out obvious other features and advantages of the present invention.In the accompanying drawings:
Fig. 1 shows heat-transfer device according to the prior art plane graph on being assembled into the equipment casing time;
Fig. 2 shows the perspective view of heat transfer apparatus according to a preferred embodiment of the invention; With
Fig. 3 a and Fig. 3 b show two kinds of different arrangements of the heat transfer element in the heat transfer apparatus of the present invention.
Embodiment
The heat delivered that heat transfer apparatus of the present invention can be used for electronic unit is sent is to the equipment casing.This electronic unit can be fixed on the printed circuit board (PCB) usually, and for example as inductance element or transformer etc.The equipment casing can be arranged in the circulation of air situation preferably in the environment, takes away heat with the convection action through air (for example free convection or utilize the forced convertion of thermantidote), thereby electronic unit is cooled off.
Specify the preferred embodiments of the present invention with reference to Fig. 2, Fig. 3 a and Fig. 3 b below.Fig. 2 shows exemplary heat transfer apparatus 20.Heat transfer apparatus 20 comprises heat conduction shell element 21, heat conduction plate 22 and the heat transfer element of hot link between them.This heat transfer element can be the heat pipe as shown in Figure 2 23 that is widely used at present in the electronic product field, perhaps can be for example heat-conducting metal silk or sheet metal of other heat transfer element known in the art.Heat conduction shell element and heat conduction plate can be by any Heat Conduction Material, for example metals, preferably processed by copper or aluminium.
According to the present invention, importantly, the heat transfer element that is arranged between heat conduction shell element and the heat conduction plate has certain flexibility, preferably can go up distortion in any direction.Therefore, after heat conduction shell element 21 has been fixed on the printed circuit board (PCB), can as required heat conduction plate 22 be assembled into the optional position on the equipment casing (not shown).In one embodiment, heat transfer apparatus of the present invention can be arranged such that heat transfer element straddles the top of the other electronic unit in the equipment casing, to be used for the long Distance Transmission of heat.Correspondingly, heat transfer element can be arranged to arbitrary configuration as required between heat conduction shell element 21 and heat conduction plate 22, for example helical form, corrugated, linearity or any other configuration.Fig. 2 shows the linearity arrangement of heat transfer element, and Fig. 3 a and Fig. 3 b show the helical form and the corrugated arrangement of heat transfer element respectively.
In use, heat conduction shell element 21 is used for the electronic unit (not shown) hot link with heating, and this electronic unit is fixed on usually on the printed circuit board (PCB) and with printed circuit board (PCB) and is arranged in the equipment casing.Can heat conduction shell element 21 be fixed on the printed circuit board (PCB) through variety of way.For example, can be provided with a plurality of latches in the bottom of heat conduction shell element 21, through these latches being inserted in the corresponding hole that is arranged on the printed circuit board (PCB), simply mode realizes heat conduction shell element 21 fixing on printed circuit board (PCB).Preferably pour into a mould the sealed silicon resin in the space between heat conduction shell element 21 and electronic unit; Make the sealed silicon resin contact with each relevant surfaces tight seal of heat conduction shell element 21 and electronic unit; Avoid existing any air blanketing, thereby the heat that electronic unit sends can more fully and effectively be conducted to heat conduction shell element 21.
The heat that conducts to heat conduction shell element 21 is further transferred to heat conduction plate 22 via heat pipe 23.This heat conduction plate 22 is also as mounting panel, to be used for that this heat transfer apparatus 20 is assembled into the equipment casing.For this reason, can for example on heat conduction plate 22, offer the installing hole 29 that can supply screw to pass.Certainly, those skilled in the art also can imagine any alternate manner that is used for the heat conduction plate is assembled into the equipment casing.For example can connect the heat conduction plate is assembled into the equipment casing through snap-on spare or form fit.
Preferably, between heat conduction shell element 21 and heat conduction plate 22, be provided with at least two heat pipes.This heat pipe 23 has evaporation ends 25 and condensation end 27.In order to promote from the heat transfer of heat conduction shell element 21 to heat pipe 23, advantageously make the evaporation ends 25 of heat pipe 23 be connected to heat conduction shell element 21 with lap-welded mode, long-pending with the contact surface that increases both.In preferred embodiment shown in Figure 2, heat conduction shell element 21 is provided with surface groove 26, and the evaporation ends 25 of heat pipe 23 for example is welded in this surface groove 26 through the mode of full weld.
Similarly, the relative condensation end 27 of heat pipe 23 is connected with lap-welded mode with heat conduction plate 22, for example surface groove 28 can be set in heat conduction plate 22, the condensation end 27 of heat pipe 23 for example is welded in this surface groove 28 through the mode of full weld.
As known in those skilled in the art, fin be set on the heat conduction plate can significantly strengthen its heat-transfer effect.In preferred embodiment shown in Figure 2, heat conduction plate 22 deviates from the side that the equipment casing installs along laterally having formed a plurality of fins 30 at it, and each fin extends along vertical.Certainly, those skilled in the art also can imagine fin other arrangement on heat conduction plate 22, and for example its edge on the heat conduction plate is horizontal or the incline direction extension all is feasible.Advantageously, when through installing hole 29, fin 30 breaks off apart from installing hole one distance, thereby on heat conduction plate 22, around installing hole 29, forms the non-finned zone.Like this, when being assembled into heat conduction plate 22 on the equipment casing, the non-finned zone around the installing hole provides bigger operating space for assembling tool (for example screwdriver), has improved the easy property of assembling.
In addition, can imagine coated with thermally conductive cream between heat conduction plate and equipment casing, to strengthen the heat transfer between heat conduction plate and equipment casing.Heat-conducting cream can be coated on the surface of heat conduction plate and the contacted heat conduction plate of equipment casing or be coated on the surface of equipment casing.Owing to need between heat conduction plate and equipment casing, not arrange heat conduction silica gel sheet; Can the heat conduction plate directly be fitted on the equipment casing and for example connect through screw during assembling, avoid the uncontrolled slippage of heat conduction silica gel sheet between heat conduction plate and equipment casing to cause assembling difficulty and assembly error.Certainly, it also is feasible using heat conduction silica gel sheet, and is included within the scope of the present invention.
The heat dispersion of heat transfer apparatus of the present invention obviously is superior to the heat dispersion of the heat-transfer device of prior art.Carry out computer simulation to the electronic unit that uses said apparatus respectively; The result shows; Under the situation of the heat-transfer device that uses prior art, the maximum temperature of electronic unit is 110.6 ℃, and under the situation of using heat transfer unit (HTU) of the present invention; The maximum temperature of electronic unit is merely 99.55 ℃, and is low 11.05 ℃ under the situation than the heat-transfer device that uses prior art.
It is obvious that to the technical staff in present technique field, can make different changes and distortion to heat transfer apparatus of the present invention.For example, heat transfer element of the present invention as shown in the figurely has the circular cross-section except may be selected to, and also may be selected to other configuration known in the art, for example has the flat sheet configuration of square-section.Other specific embodiment can obviously obtain through research specification and practice.This specification and embodiment only are exemplary, and the real protection range of the present invention is confirmed through appended claims and by doctrine of equivalents.
Reference numeral:
10 heat-transfer devices
11 accommodation sections
12 installation portions
13 screws
14 equipment casings
15 heat conduction silica gel sheets
16 printed circuit board (PCB)s
20 heat transfer apparatus
21 heat conduction shell elements
22 heat conduction plates
23 heat pipes
The evaporation ends of 25 heat pipes
26 surface grooves
The condensation end of 27 heat pipes
28 surface grooves
29 installing holes
30 fins
Claims (12)
1. heat transfer apparatus; This heat transfer apparatus is used at least one electronic unit of hot link and equipment casing; So that with heat delivered to the equipment casing that electronic unit sends, this heat transfer apparatus comprises: be used for and hot linked at least one the heat conduction shell element of electronic unit; Be used for and the hot linked heat conduction plate of equipment casing; And the heat transfer element of at least two flexibilities of hot link between heat conduction shell element and heat conduction plate.
2. heat transfer apparatus according to claim 1 is characterized in that said heat transfer element is a heat pipe.
3. heat transfer apparatus according to claim 1 is characterized in that said electronic unit is fixed on the printed circuit board (PCB), and this printed circuit board (PCB) is contained in the equipment casing.
4. heat transfer apparatus according to claim 1 is characterized in that, said heat transfer element is arranged to helical form, corrugated or linearity between heat conduction shell element and heat conduction plate.
5. heat transfer apparatus according to claim 1 is characterized in that, is cast with the sealed silicon resin between said heat conduction shell element and the said electronic unit.
6. according to each described heat transfer apparatus among the claim 1-5, it is characterized in that, said heat transfer element and heat conduction shell element and heat conduction plate at least one of them through lap-welded mode hot link.
7. according to each described heat transfer apparatus among the claim 1-5; It is characterized in that; Said heat conduction shell element and heat conduction plate one of them has surface groove at least, the respective end portions of heat transfer element is welded in the said surface groove through the mode of full weld.
8. according to each described heat transfer apparatus among the claim 1-5, it is characterized in that said heat conduction plate has a plurality of fins.
9. according to each described heat transfer apparatus among the claim 1-5, it is characterized in that said heat conduction shell element and heat conduction plate are processed by copper or aluminium.
10. apparatus assembly, this apparatus assembly comprise equipment casing, at least one electronic unit and hot link between equipment casing and electronic unit according to each described heat transfer apparatus among the claim 1-10.
11. make the method for heat transfer apparatus; This heat transfer apparatus is used for hot link between at least one electronic unit and equipment casing; So that with heat delivered to the equipment casing that electronic unit sends, this method comprises: a heat transfer element and a heat conduction plate that at least one heat conduction shell element, at least two flexibilities are provided; And with the heat transfer element hot link between heat conduction shell element and heat conduction plate.
12. method according to claim 11 is characterized in that, this method also is included in coated with thermally conductive cream between heat conduction plate and the equipment casing or the step of heat conduction silica gel sheet is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106084125A CN102573397A (en) | 2010-12-23 | 2010-12-23 | Heat transmission device as well as manufacturing and assembling method and equipment assembly of heat transmission device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106084125A CN102573397A (en) | 2010-12-23 | 2010-12-23 | Heat transmission device as well as manufacturing and assembling method and equipment assembly of heat transmission device |
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| Publication Number | Publication Date |
|---|---|
| CN102573397A true CN102573397A (en) | 2012-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106084125A Pending CN102573397A (en) | 2010-12-23 | 2010-12-23 | Heat transmission device as well as manufacturing and assembling method and equipment assembly of heat transmission device |
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| CN (1) | CN102573397A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112284172A (en) * | 2020-10-29 | 2021-01-29 | 上海卫星装备研究所 | Space radiation radiator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6104611A (en) * | 1995-10-05 | 2000-08-15 | Nortel Networks Corporation | Packaging system for thermally controlling the temperature of electronic equipment |
| CN1293774A (en) * | 1998-03-16 | 2001-05-02 | 李穆炯 | System for cooling device in computer |
| DE19960840A1 (en) * | 1999-12-16 | 2001-07-05 | Siemens Ag | Electronic power circuit with flat heat sink device |
| CN1420557A (en) * | 2001-11-16 | 2003-05-28 | 华泰电子股份有限公司 | Heat radiation plate with embeded tip and package thereof |
| CN2932931Y (en) * | 2006-07-27 | 2007-08-08 | 银欣科技股份有限公司 | Liquid-cooled radiator that radiates heat with casing |
-
2010
- 2010-12-23 CN CN2010106084125A patent/CN102573397A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6104611A (en) * | 1995-10-05 | 2000-08-15 | Nortel Networks Corporation | Packaging system for thermally controlling the temperature of electronic equipment |
| CN1293774A (en) * | 1998-03-16 | 2001-05-02 | 李穆炯 | System for cooling device in computer |
| DE19960840A1 (en) * | 1999-12-16 | 2001-07-05 | Siemens Ag | Electronic power circuit with flat heat sink device |
| CN1420557A (en) * | 2001-11-16 | 2003-05-28 | 华泰电子股份有限公司 | Heat radiation plate with embeded tip and package thereof |
| CN2932931Y (en) * | 2006-07-27 | 2007-08-08 | 银欣科技股份有限公司 | Liquid-cooled radiator that radiates heat with casing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112284172A (en) * | 2020-10-29 | 2021-01-29 | 上海卫星装备研究所 | Space radiation radiator |
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Application publication date: 20120711 |