CN102554377B - 一种单晶硅棒外圆切割加工方法和装置 - Google Patents
一种单晶硅棒外圆切割加工方法和装置 Download PDFInfo
- Publication number
- CN102554377B CN102554377B CN201010620832.5A CN201010620832A CN102554377B CN 102554377 B CN102554377 B CN 102554377B CN 201010620832 A CN201010620832 A CN 201010620832A CN 102554377 B CN102554377 B CN 102554377B
- Authority
- CN
- China
- Prior art keywords
- single crystal
- cutting
- silicon single
- machining
- cutting machining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000003754 machining Methods 0.000 title abstract description 13
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title abstract description 9
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 33
- 239000010703 silicon Substances 0.000 claims abstract description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000013078 crystal Substances 0.000 claims abstract description 31
- 239000012224 working solution Substances 0.000 claims abstract description 14
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 6
- 239000011733 molybdenum Substances 0.000 claims abstract description 6
- 229910001182 Mo alloy Inorganic materials 0.000 claims abstract description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- 239000003995 emulsifying agent Substances 0.000 claims description 3
- 235000011187 glycerol Nutrition 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- -1 sodium alkyl sulfate Chemical class 0.000 claims description 3
- 239000011684 sodium molybdate Substances 0.000 claims description 3
- 235000015393 sodium molybdate Nutrition 0.000 claims description 3
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 235000015112 vegetable and seed oil Nutrition 0.000 claims description 3
- 239000008158 vegetable oil Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000009760 electrical discharge machining Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
导电类型 | 掺杂浓度 | 电阻率 |
/ | (1/cm3) | (Ω.cm) |
N型 | 7.8x1016 | 0.1000 |
N型 | 4.5x1018 | 0.0100 |
N型 | 7.4x1019 | 0.0010 |
N型 | 1.7x1019 | 0.0005 |
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010620832.5A CN102554377B (zh) | 2010-12-23 | 2010-12-23 | 一种单晶硅棒外圆切割加工方法和装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010620832.5A CN102554377B (zh) | 2010-12-23 | 2010-12-23 | 一种单晶硅棒外圆切割加工方法和装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102554377A CN102554377A (zh) | 2012-07-11 |
CN102554377B true CN102554377B (zh) | 2014-10-22 |
Family
ID=46401725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010620832.5A Active CN102554377B (zh) | 2010-12-23 | 2010-12-23 | 一种单晶硅棒外圆切割加工方法和装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102554377B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103831495A (zh) * | 2014-03-12 | 2014-06-04 | 安徽理工大学 | 一种棒材线切割小车 |
CN107030910A (zh) * | 2017-05-24 | 2017-08-11 | 西安工业大学 | 一种半导体的切割方法 |
CN110539413A (zh) * | 2019-10-12 | 2019-12-06 | 青岛高测科技股份有限公司 | 一种金刚石单线电火花复合加工方法与装置 |
CN114603728A (zh) * | 2020-12-03 | 2022-06-10 | 天津市环智新能源技术有限公司 | 一种太阳能硅片及其损伤层厚度控制方法 |
CN114054872B (zh) * | 2021-06-01 | 2022-12-02 | 清华大学 | 一种电解加工用的可编程硅电极及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100433376C (zh) * | 2007-08-07 | 2008-11-12 | 南京航空航天大学 | 太阳能硅片的切割制绒一体化加工方法及装置 |
CN100571952C (zh) * | 2008-08-15 | 2009-12-23 | 南京航空航天大学 | 提高电火花线切割加工表面完整性的方法 |
CN101797713B (zh) * | 2010-04-08 | 2011-11-16 | 南京航空航天大学 | 硅片的磨削/电解复合多线切割加工方法 |
-
2010
- 2010-12-23 CN CN201010620832.5A patent/CN102554377B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN102554377A (zh) | 2012-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101797713B (zh) | 硅片的磨削/电解复合多线切割加工方法 | |
CN102554377B (zh) | 一种单晶硅棒外圆切割加工方法和装置 | |
WO2021068583A1 (zh) | 金刚石多线电火花放电切削方法及线切割装置 | |
CN105834533B (zh) | 用于慢走丝电火花切割用的电极丝 | |
CN100433376C (zh) | 太阳能硅片的切割制绒一体化加工方法及装置 | |
CN101138869A (zh) | 单晶硅高效复合切割方法及其切割系统 | |
CN101680106A (zh) | 硅基材的加工方法、基加工品和加工装置 | |
Yu et al. | Improvement of wire electrical discharge machining efficiency in machining polycrystalline silicon with auxiliary-pulse voltage supply | |
CN100571952C (zh) | 提高电火花线切割加工表面完整性的方法 | |
CN103956324A (zh) | 一种具备沟道效应的瞬态电压抑制器芯片的生产工艺 | |
WO2007057948A1 (ja) | ワイヤ放電加工方法、半導体ウエハ製造方法及び太陽電池用セル製造方法 | |
CN105034180B (zh) | SiC单晶片的微弧放电微细切割装置及切割方法 | |
CN105033373A (zh) | SiC单晶片的超声电复合切割装置及切割方法 | |
CN106876262A (zh) | 一种制作高效玻璃钝化芯片工艺 | |
Zhao et al. | Comparison on foil EDM characteristics of single crystal SiC between in deionized water and in EDM oil | |
CN103056730B (zh) | 一种电磨削多线切割进电方法及装置 | |
KR101874519B1 (ko) | 전해방전가공장치 및 이를 이용한 전해방전가공방법 | |
Okamoto et al. | Control of kerf width in multi-wire EDM slicing of semiconductors with circular section | |
CN211074274U (zh) | 金刚石多线电火花放电切削线切割装置 | |
CN111151831B (zh) | 双极性电解放电加工工件的方法及实施装置 | |
CN104607735A (zh) | 一种细长管薄壁群孔无毛刺高效加工装置及方法 | |
CN107030910A (zh) | 一种半导体的切割方法 | |
CN217193123U (zh) | 一种N型导电GaSb晶圆加工系统 | |
CN204736347U (zh) | 一种SiC单晶片微弧放电微细切割设备 | |
CN113843462B (zh) | 一种利用化学镀工艺提高半导体电火花线切割效率的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 100088, 2, Xinjie street, Beijing Applicant after: YOUYAN NEW MATERIAL CO., LTD. Applicant after: Guotai Semiconductor Materials Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Applicant before: GRINM Semiconductor Materials Co., Ltd. Applicant before: Guotai Semiconductor Materials Co., Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: GRINM SEMICONDUCTOR MATERIALS CO., LTD. TO: GRINM ADVANCED MATERIALS CO., LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100088, 2, Xinjie street, Beijing Patentee after: YOUYAN NEW MATERIAL CO., LTD. Patentee after: You Yan Semi Materials Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Patentee before: YOUYAN NEW MATERIAL CO., LTD. Patentee before: Guotai Semiconductor Materials Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GRINM ADVANCED MATERIALS CO., LTD. Effective date: 20150710 Free format text: FORMER OWNER: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Effective date: 20150710 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150710 Address after: 101300 Beijing city Shunyi District Shuanghe Linhe Industrial Development Zone on the south side of the road Patentee after: You Yan Semi Materials Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Patentee before: YOUYAN NEW MATERIAL CO., LTD. Patentee before: You Yan Semi Materials Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee after: Youyan semiconductor silicon materials Co.,Ltd. Address before: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee before: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd. |