CN102549720A - 半导体晶圆加工用粘合片 - Google Patents
半导体晶圆加工用粘合片 Download PDFInfo
- Publication number
- CN102549720A CN102549720A CN2011800039307A CN201180003930A CN102549720A CN 102549720 A CN102549720 A CN 102549720A CN 2011800039307 A CN2011800039307 A CN 2011800039307A CN 201180003930 A CN201180003930 A CN 201180003930A CN 102549720 A CN102549720 A CN 102549720A
- Authority
- CN
- China
- Prior art keywords
- methyl
- adhesive
- acrylic acid
- surfactant
- plasticizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 116
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 116
- 239000004065 semiconductor Substances 0.000 title claims abstract description 50
- 238000012545 processing Methods 0.000 title claims abstract description 39
- 239000004094 surface-active agent Substances 0.000 claims abstract description 39
- 239000004014 plasticizer Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 33
- 229920005601 base polymer Polymers 0.000 claims abstract description 26
- 229920000728 polyester Polymers 0.000 claims abstract description 22
- 239000013078 crystal Substances 0.000 claims description 48
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 17
- 238000007667 floating Methods 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 89
- -1 phthalic acid ester Chemical class 0.000 description 72
- 235000012431 wafers Nutrition 0.000 description 53
- 239000010410 layer Substances 0.000 description 31
- 239000003431 cross linking reagent Substances 0.000 description 29
- 239000000178 monomer Substances 0.000 description 28
- 239000000203 mixture Substances 0.000 description 26
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 23
- 238000000034 method Methods 0.000 description 22
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 21
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 11
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 9
- 239000004698 Polyethylene Substances 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 229920000573 polyethylene Polymers 0.000 description 9
- 229920005862 polyol Polymers 0.000 description 9
- 239000004814 polyurethane Substances 0.000 description 9
- 229920002635 polyurethane Polymers 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- 230000036541 health Effects 0.000 description 8
- 150000003949 imides Chemical class 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 7
- 239000003999 initiator Substances 0.000 description 7
- 239000005056 polyisocyanate Substances 0.000 description 7
- 229920001228 polyisocyanate Polymers 0.000 description 7
- 229920001451 polypropylene glycol Polymers 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 235000011037 adipic acid Nutrition 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 6
- 239000001361 adipic acid Substances 0.000 description 5
- 125000005250 alkyl acrylate group Chemical group 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 5
- 238000012797 qualification Methods 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- 239000005001 laminate film Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- ICFXCSLDPCMWJI-UHFFFAOYSA-N 2,3-dimethylbut-2-enoic acid;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CC(C)=C(C)C(O)=O.CCC(CO)(CO)CO ICFXCSLDPCMWJI-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 229940051250 hexylene glycol Drugs 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 238000012800 visualization Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- YRVXPERZZVUHOE-UHFFFAOYSA-N (1-methyl-2,5-dioxopyrrolidin-3-ylidene)methyl prop-2-enoate Chemical compound CN1C(C(CC1=O)=COC(C=C)=O)=O YRVXPERZZVUHOE-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- DCRYNQTXGUTACA-UHFFFAOYSA-N 1-ethenylpiperazine Chemical compound C=CN1CCNCC1 DCRYNQTXGUTACA-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical class C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- XKLOGZTXHWHGLY-UHFFFAOYSA-N 1-methyl-3-prop-2-enoylpyrrolidine-2,5-dione Chemical class CN1C(C(CC1=O)C(C=C)=O)=O XKLOGZTXHWHGLY-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- DGXAGETVRDOQFP-UHFFFAOYSA-N 2,6-dihydroxybenzaldehyde Chemical compound OC1=CC=CC(O)=C1C=O DGXAGETVRDOQFP-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- MBVGJZDLUQNERS-UHFFFAOYSA-N 2-(trifluoromethyl)-1h-imidazole-4,5-dicarbonitrile Chemical compound FC(F)(F)C1=NC(C#N)=C(C#N)N1 MBVGJZDLUQNERS-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- IJVRPNIWWODHHA-UHFFFAOYSA-N 2-cyanoprop-2-enoic acid Chemical compound OC(=O)C(=C)C#N IJVRPNIWWODHHA-UHFFFAOYSA-N 0.000 description 1
- JSLWEMZSKIWXQB-UHFFFAOYSA-N 2-dodecylthioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC(CCCCCCCCCCCC)=CC=C3SC2=C1 JSLWEMZSKIWXQB-UHFFFAOYSA-N 0.000 description 1
- MZNSQRLUUXWLSB-UHFFFAOYSA-N 2-ethenyl-1h-pyrrole Chemical compound C=CC1=CC=CN1 MZNSQRLUUXWLSB-UHFFFAOYSA-N 0.000 description 1
- ZDHWTWWXCXEGIC-UHFFFAOYSA-N 2-ethenylpyrimidine Chemical compound C=CC1=NC=CC=N1 ZDHWTWWXCXEGIC-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- IQQVCMQJDJSRFU-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO IQQVCMQJDJSRFU-UHFFFAOYSA-N 0.000 description 1
- YJQMXVDKXSQCDI-UHFFFAOYSA-N 2-ethylthioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC(CC)=CC=C3SC2=C1 YJQMXVDKXSQCDI-UHFFFAOYSA-N 0.000 description 1
- GILMNGUTRWPWSY-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(O)COC(=O)C=C GILMNGUTRWPWSY-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- YRNDGUSDBCARGC-UHFFFAOYSA-N 2-methoxyacetophenone Chemical compound COCC(=O)C1=CC=CC=C1 YRNDGUSDBCARGC-UHFFFAOYSA-N 0.000 description 1
- OELQSSWXRGADDE-UHFFFAOYSA-N 2-methylprop-2-eneperoxoic acid Chemical compound CC(=C)C(=O)OO OELQSSWXRGADDE-UHFFFAOYSA-N 0.000 description 1
- HQGFCGSTNFPVQT-UHFFFAOYSA-N 2-methylprop-2-enoic acid 2-(2-sulfanylacetyl)oxyethyl 2-sulfanylacetate Chemical compound CC(=C)C(O)=O.SCC(=O)OCCOC(=O)CS HQGFCGSTNFPVQT-UHFFFAOYSA-N 0.000 description 1
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical class C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 1
- CFZDMXAOSDDDRT-UHFFFAOYSA-N 4-ethenylmorpholine Chemical compound C=CN1CCOCC1 CFZDMXAOSDDDRT-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 208000019901 Anxiety disease Diseases 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- FGKORHFSYSZWHM-UHFFFAOYSA-N CC=1C(=C(C2=CC=CC=C2C1)S(=O)(=O)O)OC(C=C)=O Chemical class CC=1C(=C(C2=CC=CC=C2C1)S(=O)(=O)O)OC(C=C)=O FGKORHFSYSZWHM-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 229920001174 Diethylhydroxylamine Polymers 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- IIGAAOXXRKTFAM-UHFFFAOYSA-N N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C Chemical compound N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C IIGAAOXXRKTFAM-UHFFFAOYSA-N 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical class OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- SSOONFBDIYMPEU-UHFFFAOYSA-N [3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COCC(CO)(CO)COC(=O)C=C SSOONFBDIYMPEU-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001279 adipic acids Chemical class 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 159000000032 aromatic acids Chemical class 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 1
- 238000012661 block copolymerization Methods 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical class CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000000205 computational method Methods 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 150000001934 cyclohexanes Chemical class 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical group CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940043237 diethanolamine Drugs 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- KZNICNPSHKQLFF-UHFFFAOYSA-N dihydromaleimide Natural products O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- XSMJZKTTXZAXHD-UHFFFAOYSA-N ethene;2-methylprop-2-enoic acid Chemical compound C=C.CC(=C)C(O)=O XSMJZKTTXZAXHD-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 229960005082 etohexadiol Drugs 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- MDNFYIAABKQDML-UHFFFAOYSA-N heptyl 2-methylprop-2-enoate Chemical compound CCCCCCCOC(=O)C(C)=C MDNFYIAABKQDML-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000009878 intermolecular interaction Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- OTRIMLCPYJAPPD-UHFFFAOYSA-N methanol prop-2-enoic acid Chemical compound OC.OC.OC(=O)C=C.OC(=O)C=C OTRIMLCPYJAPPD-UHFFFAOYSA-N 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- AUCNMQYOQYTGPE-UHFFFAOYSA-N n-(hydroxymethyl)-n-methylprop-2-enamide Chemical compound OCN(C)C(=O)C=C AUCNMQYOQYTGPE-UHFFFAOYSA-N 0.000 description 1
- OWVWGCVNBQLTDH-UHFFFAOYSA-N n-butyl-n-methylprop-2-enamide Chemical compound CCCCN(C)C(=O)C=C OWVWGCVNBQLTDH-UHFFFAOYSA-N 0.000 description 1
- LFJIAQOELDZMAR-UHFFFAOYSA-N n-methylprop-2-enamide;propane-1-sulfonic acid Chemical compound CNC(=O)C=C.CCCS(O)(=O)=O LFJIAQOELDZMAR-UHFFFAOYSA-N 0.000 description 1
- OPECTNGATDYLSS-UHFFFAOYSA-N naphthalene-2-sulfonyl chloride Chemical compound C1=CC=CC2=CC(S(=O)(=O)Cl)=CC=C21 OPECTNGATDYLSS-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229940117969 neopentyl glycol Drugs 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- FVXBCDWMKCEPCL-UHFFFAOYSA-N nonane-1,1-diol Chemical compound CCCCCCCCC(O)O FVXBCDWMKCEPCL-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- DWCSHJVWTDQUCJ-UHFFFAOYSA-N prop-1-ene;pyrrolidin-2-one Chemical class CC=C.O=C1CCCN1 DWCSHJVWTDQUCJ-UHFFFAOYSA-N 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Abstract
本发明的目的在于,提供一种半导体晶圆加工用粘合片,其在各种环境下的保存稳定性优异、使用后还可以防止对被粘物的污染,另外,贴合在半导体晶圆的电路图案形成面时,对形成电路图案的台阶的随动性优异且经时的浮起量稳定性优异。一种半导体晶圆加工用粘合片,其特征在于,在基材的至少单面备有粘合剂层,所述粘合剂层在基础聚合物中添加有聚酯系的增塑剂及表面活性剂,所述增塑剂及表面活性剂的溶解度参数(SP值)满足如下关系:0.9≤[增塑剂的SP值]/[表面活性剂的SP值]≤1.0。
Description
技术领域
本发明涉及半导体晶圆加工用粘合片。
背景技术
为了使形成IC等电路图案的半导体晶圆其尽可能地薄,对其实施背面磨削处理等加工。在加工半导体晶圆时,为了防止例如,晶圆破损、或者电路图案形成面被磨削屑等污染、损伤,借助自动粘接装置,预先在其电路图案形成面粘接表面保护片。然后,在实施了晶圆的背面磨削等加工之后,其表面保护片被剥离除去,移送至晶圆清洗工序中。另外,在之后的工序中晶圆被单片化,为了对其进行PKG制造工序而使用加工用片。
作为这样的表面保护片或加工用片,通常公知的是,在基材上使用备有粘合剂层的粘合片,在粘合剂层添加有作为增塑剂的邻苯二甲酸二辛酯、邻苯二甲酸二丁酯等邻苯二甲酸酯而成的片。
但是,备有添加有邻苯二甲酸酯的粘合剂层的粘合片在低温、高湿等环境条件下保存时,来自粘合剂成分的污点会在粘合剂层表面析出。其结果,将该粘合片粘接在晶圆上时有时会污染电路图案形成面。
另外,在使用上述表面保护片或加工用片时,对于剥离除去该片后的电路图案形成面等,需要利用丙酮、异丙醇等亲水性有机溶剂进行预清洗,并进一步进行水洗。其结果,存在需要考虑由有机溶剂的使用引起的环境卫生的对策、且清洗效率差这样的问题。
对此,提出了含有聚丙二醇这样的水溶性聚合物作为粘合剂成分的粘合片(例如日本特开平5-335288公报)。
但是,即使是在使用这样的粘合片的情况下,也会由于水溶性聚合物在电路图案形成面等渗出而需要水洗工序,因此没有实现根本性的解决。
另外,2007年6月1日起施行REACH管制法,邻苯二甲酸酯被列为候选的高度关注的物质之一,存在今后制限使用或禁止使用的可能性。
发明内容
发明要解决的问题
本发明是鉴于上述问题而成的,其目的在于,提供一种半导体晶圆加工用粘合片,其在各种环境下的保存稳定性优异、使用后还可以防止对被粘物的污染。
用于解决问题的方案
本发明人等对半导体晶圆加工用粘合片的保存稳定性等进行了深入研究,结果查明了以下(i)及(ii),从而完成了本发明。(i)没有预想到的是,在包含基础聚合物、增塑剂及表面活性剂的粘合剂中,渗出的成分不是增塑剂而仅为表面活性剂成分;(ii)在使用的增塑剂和表面活性剂的组合中,通过使至今未考虑过的SP值的关系在特定范围内,使得即使在包括高温加湿条件的各种环境下保存,也可以不使污点从被粘物侧析出而稳定地保存。
即,本发明的半导体晶圆加工用粘合片的特征在于,在基材的至少单面备有粘合剂层,前述粘合剂层包含基础聚合物、聚酯系的增塑剂及表面活性剂,前述增塑剂及表面活性剂的溶解度参数(SP值)满足如下关系:
0.9≤[增塑剂的SP值]/[表面活性剂的SP值]≤1.0。
在这种半导体晶圆加工用粘合片中,
优选的是,相对于100重量份基础聚合物,含有10~50重量份前述增塑剂。
另外,优选的是,相对于100重量份基础聚合物,添加有1~10重量份前述表面活性剂。
进而,优选的是,前述基础聚合物包含丙烯酸系聚合物。
另外,优选的是,在将满足0.2≤B/A≤5.7关系的、备有膜厚为Aμm的粘合剂层的半导体晶圆加工用粘合片贴合在具有台阶为B μm的晶圆表面时,
从台阶浮起的前述粘合片的初始浮起量d1与24小时后的粘合片的浮起量d2满足如下关系:
(d2/d1)×100≤110(%)。
发明的效果
根据本发明,可以提供在各种环境下具有优异的保存稳定性、使用后还可以防止对被粘物的污染的半导体晶圆加工用粘合片。
附图说明
图1A为用于说明对于本发明的粘合片对台阶的初始浮起量d1的剖面示意图。
图1B为用于说明对于本发明的粘合片对台阶的经时浮起量d2的剖面示意图。
具体实施方式
本发明的半导体晶圆加工用粘合片(以下,有时简称为“粘合片”)备有基材、和至少在基材的单面配置的粘合剂层。粘合剂层至少由包含基础聚合物、和聚酯系的增塑剂、和表面活性剂的粘合剂形成。
(增塑剂)
用于本发明的增塑剂为降低粘合剂对被粘物的粘接力的物质,聚酯系的增塑剂是合适的。增塑剂的种类可以根据所使用的粘合剂而适宜选择,满足后述溶解度参数(SP值)的关系的物质是合适的。
作为增塑剂,优选例如大日本油墨化学工业株式会社制造的W-700等的偏苯三酸系聚酯、J-PLUS Co.,Ltd.制造的D620等己二酸系聚酯、马来酸系聚酯、葵二酸系聚酯、苯甲酸系聚酯、环氧系聚酯、聚醚系聚酯等。它们可以单独使用或组合2种以上使用。
以相对于100重量份基础聚合物为10~50重量份的比例使用增塑剂是合适的,优选为10~30重量份。通过设定为该范围,可以防止剥离时由粘合力过强引起的半导体晶圆等被粘物的破损。另外,可以回避粘合剂层表面的渗出,防止被粘物的污染。
(表面活性剂)
用于本发明的表面活性剂为用于调节对于半导体晶圆的粘合力的成分,虽然非离子系、阳离子系及阴离子系表面活性剂均可使用,但优选使用非离子系表面活性剂。表面活性剂的具体的种类可以根据所使用的粘合剂而适宜选择,优选满足后述SP值的关系的表面活性剂。
作为表面活性剂,可列举出例如烷基硫酸盐(第一工业制药株式会社制造的NEOGEN R等)、烷基磷酸盐(花王株式会社制造的ELECTRONSTRIPPER N等)等阴离子系表面活性剂;脂肪族季铵盐(花王株式会社制造的KOTAMIN 24P等)、芳香族季铵盐(东邦化学工业株式会社制造的KACHINARU HC-100等)等阳离子系表面活性剂;山梨醇酐脂肪酸酯(花王株式会社制造的REODORU SP-L10等)、聚氧化乙烯(第一工业制药株式会社制造NOIGEN EP-120A等)、丙三醇、醚、脂肪酸等非离子系表面活性剂。它们可以单独使用或组合2种以上使用。
以相对于100重量份基础聚合物为1~10重量份的比例使用表面活性剂是合适的,优选为1~5重量份,更优选为1~2重量份。通过设定为该范围,可以回避粘合力的显著降低,维持半导体晶圆图案面的凹凸随动性。
(SP值)
构成上述粘合剂层的增塑剂及表面活性剂的SP值优选满足如下关系:
0.9≤[增塑剂的SP值]/[表面活性剂的SP值]≤1.0。
此处,增塑剂的SP值δp是指利用属于Small式的式(1)估算出的值。另外,表面活性剂的SP值δs是指利用表面活性剂的HLB值估算出的值,例如,是指利用式(2)(引用文献:SP值的基础-应用与计算方法,山本秀树著,P.54~56)所求出的值。
δp[(J/cm3)1/2]=∑F/V (1)
此处,δp为溶解度参数,F为涉及分子间相互作用的常数(表1所示的Small的常数,取决于取代基的种类),V为摩尔体积。
[表1]
δs[(cal/cm3)1/2]=(118.8+6.0)/(54-HLB) (2)
此处,HLB值为将非离子性表面活性剂的亲水基与疏水基的平衡数值化的值,表示非离子性表面活性剂的亲水性程度。HLB值是利用式(3)求出的值。
HLB=(亲水基部分的分子量/表面活性剂的分子量)×100/5 (3)
(粘合剂层)
用于本发明的粘合剂层所含的粘合剂,即,含有上述增塑剂及表面活性剂而成的粘合剂,优选其对于镜面晶圆的粘接力为0.1~1.0N/20mm左右。通过设定为该范围,可以确保半导体晶圆图案面的凹凸随动性、并且可以有效地防止剥离时半导体晶圆的破坏。
另外,粘合剂具有30~90%左右的凝胶率是合适的,优选为30~70%左右。通过具有该范围的凝胶率,可以防止由内聚力不足因起的粘合剂残留,并且可以确保与被粘物的粘合性,可以维持半导体晶圆图案面的凹凸随动性。
此处,粘合剂的凝胶率是指:从带中提取粘合剂,测定提取出的粘合剂的重量(W1),将其浸渍在乙酸乙酯中1周后,测定使溶剂成分干燥而残留的凝胶的重量(W2),利用式(4)算出的值。
凝胶率(%)=(W2/W1)×100 (4)
对于构成粘合剂层的粘合剂的基础聚合物没有特别的限定,可以从构成例如橡胶系粘合剂、丙烯酸系粘合剂、聚酰胺系粘合剂、有机硅系粘合剂、聚酯系粘合剂、聚氨酯系粘合剂等公知的粘合剂的基础聚合物中适宜选择。其中,作为构成丙烯酸系粘合剂的基础聚合物的丙烯酸系聚合物由于耐热性、耐候性等各种特性优异、通过选择构成丙烯酸系聚合物的单体成分的种类等可表现出所希望的特性,因此可以适宜地使用。
作为丙烯酸系粘合剂的基础聚合物的丙烯酸系聚合物以(甲基)丙烯酸烷基酯作为主要单体成分构成。
作为(甲基)丙烯酸烷基酯,可列举出例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸异丁酯、(甲基)丙烯酸仲丁酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸异辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸异壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸异癸酯、(甲基)丙烯酸十一酯、(甲基)丙烯酸十二酯、(甲基)丙烯酸十三酯、(甲基)丙烯酸十四酯、(甲基)丙烯酸十五酯、(甲基)丙烯酸十八酯、(甲基)丙烯酸十九酯、(甲基)丙烯酸二十酯等(甲基)丙烯酸C1-20烷基酯(优选(甲基)丙烯酸C1-12烷基酯、进一步优选(甲基)丙烯酸C1-8烷基酯)等。(甲基)丙烯酸烷基酯可以选择1种或2种以上使用。
以内聚力、耐热性、交联性等的改良为目的,丙烯酸系聚合物根据需要还可以包含可与(甲基)丙烯酸烷基酯共聚的、对应其他单体成分的单元。
作为这样的单体成分,可列举出例如:丙烯酸、甲基丙烯酸、丙烯酸羧乙酯、丙烯酸羧戊酯、衣康酸、马来酸、富马酸、巴豆酸等含羧基单体;(甲基)丙烯酸羟基丁酯、(甲基)丙烯酸羟基己酯、(甲基)丙烯酸羟基辛酯、(甲基)丙烯酸羟基癸酯、(甲基)丙烯酸羟基十二烷酯、甲基丙烯酸(4-羟甲基环己基)甲酯等含羟基单体;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯酰胺-2-甲基丙磺酸、(甲基)丙烯酰胺丙磺酸、(甲基)丙烯酸磺基丙酯、(甲基)丙烯酰氧萘磺酸等含磺酸基单体;2-羟乙基丙烯磷酸等含磷酸基单体、(甲基)丙烯酰胺、N,N-二甲基(甲基)丙烯酰胺、N-丁基(甲基)丙烯酰胺、N-羟甲基(甲基)丙烯酰胺、N-羟甲基丙烷(甲基)丙烯酰胺等(N-取代)酰胺系单体;(甲基)丙烯酸氨基乙酯、(甲基)丙烯酸N,N-二甲氨基乙酯、(甲基)丙烯酸叔丁基氨基乙酯等(甲基)丙烯酸氨基烷基酯系单体;(甲基)丙烯酸烷氧基烷基酯系单体;N-环己基马来酰亚胺、N-异丙基马来酰亚胺、N-十二烷基马来酰亚胺、N-苯基马来酰亚胺等马来酰亚胺系单体;N-甲基衣康酰亚胺、N-乙基衣康酰亚胺、N-丁基衣康酰亚胺、N-辛基衣康酰亚胺、N-2-乙基己基衣康酰亚胺、N-环己基衣康酰亚胺、N-十二烷基衣康酰亚胺等衣康酰亚胺系单体;N-(甲基)丙烯酰氧基亚甲基琥珀酰亚胺、N-(甲基)丙烯酰-6-氧基六亚甲基琥珀酰亚胺、N-(甲基)丙烯酰-8-氧基八亚甲基琥珀酰亚胺等琥珀酰亚胺系单体;乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯烷酮、甲基乙烯基吡咯烷酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌嗪、乙烯基吡嗪、乙烯基吡咯、乙烯基咪唑、乙烯基噁唑、乙烯基吗啉、N-乙烯基羧酰胺类、苯乙烯、α-甲基苯乙烯、N-乙烯基己内酰胺等乙烯基系单体;丙烯腈、甲基丙烯腈等氰基丙烯酸系单体;(甲基)丙烯酸缩水甘油酯等含环氧基丙烯酸系单体;(甲基)丙烯酸聚丙二醇、(甲基)丙烯酸甲氧基乙二醇、(甲基)丙烯酸甲氧基聚丙二醇等二醇系丙烯酸酯单体;(甲基)丙烯酸四氢糠基酯、氟(甲基)丙烯酸酯、有机硅(甲基)丙烯酸酯等具有杂环、卤素原子、硅原子等的丙烯酸酯系单体;己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羟甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、双季戊四醇六(甲基)丙烯酸酯、环氧丙烯酸酯、聚酯丙烯酸酯、聚氨酯丙烯酸酯、二乙烯基苯、丁基二(甲基)丙烯酸酯、己基二(甲基)丙烯酸酯等多官能单体;异戊二烯、二丁二烯、异丁烯等烯烃系单体;乙烯基醚等乙烯基醚系单体等。这些单体成分可以使用1种或2种以上。
丙烯酸系共聚物可以通过将上述(甲基)丙烯酸烷基酯与根据需要的其他单体利用公知适宜的方法聚合来制造。
对丙烯酸系共聚物的分子量等没有特别限定,可以使用例如,重均分子量为10万~200万,优选为15万~100万,进一步优选为30万~100万范围的共聚物。重均分子量例如可以利用凝胶渗透色谱法以聚苯乙烯计换算值的形式测定。
粘合剂可以通过添加能量射线聚合性化合物、或在基础聚合物中导入能量射线聚合性双键等而形成能量射线固化型粘合剂。使用能量射线固化型粘合剂的粘合剂层在照射能量射线前会显示出充分的粘接力,但在照射能量射线后粘接力显著降低,可以不向被粘物施加应力而容易地剥离。其中,作为能量射线,可列举出例如紫外线、电子射线等。
作为能量射线聚合性化合物,可以使用分子中具有2个以上能量射线聚合性碳-碳双键的化合物。作为这样的化合物,可列举出例如多官能丙烯酸系化合物。
作为多官能丙烯酸系化合物,可列举出例如1,4-亚丁基二(甲基)丙烯酸酯、1,5-戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯等直链状脂肪族多元醇的(甲基)丙烯酸酯;环己烷二甲醇二(甲基)丙烯酸酯、三环癸烷二甲醇二丙烯酸酯等具有脂环基的脂肪族多元醇的(甲基)丙烯酸酯;三羟甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯等支链状脂肪族多元醇的(甲基)丙烯酸酯、它们的缩合物(二三羟甲基丙烷四丙烯酸酯、二季戊四醇六丙烯酸酯等)。它们可以单独使用或组合2种以上使用。
作为能量射线聚合性化合物,还可以使用例如聚氨酯丙烯酸系低聚物等多官能丙烯酸系低聚物。
对于聚氨酯丙烯酸系低聚物而言,可使例如二异氰酸酯化合物和多元醇化合物反应所得到的聚氨酯低聚物、与具有羟基的(甲基)丙烯酸烷基酯反应而得到。
作为二异氰酸酯化合物,可列举出例如甲苯二异氰酸酯、二苯基甲烷二异氰酸酯、六亚甲基二异氰酸酯、苯二异氰酸酯、二环己基甲烷二异氰酸酯、二甲苯二异氰酸酯、四甲基二甲苯二异氰酸酯、萘二异氰酸酯、异佛尔酮二异氰酸酯等。
作为多元醇化合物,可列举出:将乙二醇、1,4-丁二醇、1,6-己二醇、二乙二醇、三羟甲基丙烷、二丙二醇、聚乙二醇、聚丙二醇、季戊四醇、二季戊四醇、丙三醇等多元醇类,前述多元醇类与己二酸、癸二酸、壬二酸、马来酸等脂肪族二元酸或对苯二甲酸、间苯二甲酸等芳香族二元酸进行缩合反应而得到的聚酯系多元醇化合物;聚亚乙基醚二醇、聚亚丙基醚二醇、聚四亚甲基醚二醇、聚六亚甲基醚二醇等聚醚系多元醇化合物;聚己内酯二醇、聚丙内酯二醇、聚丁内酯二醇等内酯系多元醇化合物;乙二醇、丙二醇、丁二醇、戊二醇、辛二醇、壬二醇等多元醇与碳酸亚乙酯、碳酸亚丙酯等进行脱醇反应而得到的聚碳酸酯系多元醇化合物。作为含羟基(甲基)丙烯酸烷基酯化合物,可列举出例如,(甲基)丙烯酸2-羟乙酯、(甲基)丙烯酸2-羟丙酯、(甲基)丙烯酸4-羟丁酯、(甲基)丙烯酸6-羟己酯、(甲基)丙烯酸8-羟辛酯、(甲基)丙烯酸10-羟癸酯、(甲基)丙烯酸12-羟基十二烷基酯、(甲基)丙烯酸(4-羟甲基环己基)甲酯等。
相对于100重量份基础聚合物,能量射线聚合性化合物可以在例如5~200重量份,优选为10~100重量份,进一步优选为10~45重量份的范围使用。
作为向基础聚合物中导入能量射线聚合性双键的方法,可列举出例如,制备作为基础聚合物的丙烯酸系聚合物时,使具有羧基、羟基、氨基等反应性官能团的共聚性单体共聚的方法。由此,可以在基础聚合物中导入成为反应基点的官能团,使具有能量射线聚合性碳-碳双键的多官能性单体或者低聚物与借助前述成为反应基点的官能团键合,可以得到在侧链上具有能量射线聚合性碳-碳双键的基础聚合物。
能量射线固化型粘合剂根据需要还可以包含光聚合引发剂。光聚合引发剂通过照射能量射线激发、活化而产生自由基,促进粘合剂层的高效的聚合固化反应。
作为光聚合引发剂,可列举出例如,苯偶姻甲醚、苯偶姻乙醚、苯偶姻异丙醚、苯偶姻异丁基醚等苯偶姻烷基醚系引发剂;二苯甲酮、苯甲酰苯甲酸、3,3’-二甲基-4-甲氧基二苯甲酮、聚乙烯基二苯甲酮等二苯甲酮系引发剂;α-羟基环己基苯基甲酮、4-(2-羟乙氧基)苯基(2-羟基-2-丙基)甲酮、α-羟基-α,α’-二甲基苯乙酮、甲氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基苯乙酮等芳香族酮系引发剂;苄基二甲基缩酮等芳香族缩酮系引发剂;噻吨酮、2-氯噻吨酮、2-甲基噻吨酮、2-乙基噻吨酮、2-异丙基噻吨酮、2-十二烷基噻吨酮、2,4-二氯噻吨酮、2,4-二甲基噻吨酮、2,4-二乙基噻吨酮、2,4-二异丙基噻吨酮等噻吨酮系引发剂、苄类等苄系引发剂、苯偶姻等苯偶姻系引发剂、α-缩酮系化合物(2-甲基-2-羟基苯丙酮等)、芳香族磺酰氯系化合物(2-萘磺酰氯等)、光活性肟化合物(1-苯基-1,1-丙烷二酮-2-(O-乙氧基羰基)肟等)、樟脑醌、卤化酮、酰基氧化膦、酰基亚磷酸酯等。它们可以单独使用或组合2种以上使用。
粘合剂还可以是使用具有羧基等酸性基团的聚合物作为基础聚合物,通过添加中和剂使基础聚合物中的酸性基团的全部或一部份中和,从而付与了亲水性的亲水性粘合剂。亲水性粘合剂通常在被粘物上的粘合剂残留少,另外,即使在产生粘合剂残留的情况下,也可以通过用纯水清洗而容易地除去。
具有酸性基团的聚合物可以通过在制备基础聚合物时将上述含羧基单体等具有酸性基团的单体共聚而得到。
作为中和剂,可列举出例如,一乙胺、一乙醇胺等伯胺、二乙胺、二乙醇胺等仲胺、三乙胺、三乙醇胺、N,N,N’-三甲基乙二胺、N-甲基二乙醇胺、N,N-二乙基羟胺等叔胺等显示碱性的有机胺化合物。
粘合剂根据需要还可以包含交联剂。
作为交联剂,可以使用例如,环氧系交联剂、异氰酸酯系交联剂、三聚氰胺系交联剂、过氧化物系交联剂、金属醇盐系交联剂、金属螯合系交联剂、金属盐系交联剂、碳二亚胺系交联剂、噁唑啉系交联剂、氮丙啶系交联剂、胺系交联剂等交联剂,可适宜使用环氧系交联剂、异氰酸酯系交联剂等。它们可以单独使用或组合2种以上使用。
作为环氧系交联剂,可列举出例如,N,N,N’,N’-四缩水甘油基间二甲苯二胺、二缩水甘油基苯胺、1,3-双(N,N-二缩水甘油基氨甲基)环己烷、1,6-己二醇二缩水甘油醚、新戊二醇二缩水甘油醚、乙二醇二缩水甘油醚、丙二醇二缩水甘油醚、聚乙二醇二缩水甘油醚、聚丙二醇二缩水甘油醚、山梨醇聚缩水甘油醚、丙三醇聚缩水甘油醚、季戊四醇聚缩水甘油醚、聚丙三醇聚缩水甘油醚、山梨醇酐聚缩水甘油醚、三羟甲基丙烷聚缩水甘油醚、己二酸二缩水甘油醚、邻苯二甲酸二缩水甘油醚、三缩水甘油基-三(2-羟乙基)异氰脲酸酯、间苯二酚二缩水甘油醚、双酚-S-二缩水甘油醚、分子内具有2个以上环氧基的环氧树脂等。
作为异氰酸酯系交联剂,可列举出例如,1,2-亚乙基二异氰酸酯、1,4-亚丁基二异氰酸酯、1,6-六亚甲基二异氰酸酯等低级脂肪族多异氰酸酯类;环戊基二异氰酸酯、环己基二异氰酸酯、异佛尔酮二异氰酸酯、氢化甲苯二异氰酸酯、氢化二甲苯二异氰酸酯等脂肪族多异氰酸酯类;2,4-甲苯二异氰酸酯、2,6-甲苯二异氰酸酯、4,4’-二苯基甲烷二异氰酸酯、二甲苯二异氰酸酯等芳香族多异氰酸酯类等。
粘合剂层可以通过利用刮刀涂布法、辊涂法、凹版涂布法、模涂法、逆转涂布法等适宜的方法将上述粘合剂涂布在基材上而形成。另外,还可以在例如表面实施了脱模处理的薄膜等适当的铸造用工序片上形成粘合剂层并将该粘合剂层转印到基材上。
对粘合剂层的厚度没有特别限定,优选为10μm以上(例如10~200μm),进一步优选为15μm以上(例如15~100μm),特别优选为18μm以上(例如18~50μm)。粘合剂层的厚度在上述范围内时,可以减轻基材的应力,提高粘合片的应力松弛率。
粘合剂层的弹性模量优选为1.0×104~1.0×107左右的范围。弹性模量在上述范围时,可以显示出适于作为半导体晶圆的背面磨削加工用粘合片的用途的粘合特性。
使用能量射线固化型粘合剂作为粘合剂时,上述弹性模量为固化前(能量射线照射前)的粘合剂层的弹性模量。
(基材)
作为本发明的粘合片的基材没有特别限定,可以使用例如树脂(塑料)制薄膜。
作为构成树脂制薄膜的树脂,没有特别限定,固化性树脂(热固化性树脂、光固化性树脂等)及热塑性树脂等均可。
具体而言,可列举出低密度聚乙烯、直链状聚乙烯、中密度聚乙烯、高密度聚乙烯、超低密度聚乙烯、无规共聚聚丙烯、嵌段共聚丙烯、均聚聚丙烯、聚丁烯、聚甲基戊烯等聚烯烃、乙烯-乙酸乙烯酯共聚物、离聚物树脂、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸酯(无规、交替)共聚物、乙烯-丁烯共聚物、乙烯-己烯共聚物等聚烯烃系树脂;聚氨酯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯等聚酯系树脂;(甲基)丙烯酸系聚合物、聚苯乙烯、聚碳酸酯、聚酰亚胺、聚酰胺、聚酰胺酰亚胺、聚醚酰亚胺、聚砜、聚醚砜、聚氯乙烯、聚偏二氯乙烯、氟树脂、纤维素树脂及它们的交联物等聚合物。这些材料可以根据需要共混数种使用。
另外,在上述树脂中还可以含有碳酸钙、硅石、云母等无机填料,铁、铅等金属填料,颜料、染料等着色剂等添加物。
作为构成基材的材料,为热塑性弹性体等应力缓和特性大的树脂时,从提高粘合片的应力松弛率的观点考虑是优选的。基材可以是单层薄膜也可以是发挥各树脂的长处的层叠体(多层薄膜)。
作为层叠体,可列举出由中心层、与在中心层的至少单面设置的表面层形成的层叠薄膜。表面层优选在中心层的双面设置,具有表面层/中心层/表面层三层。作为构成中心层及表面层的材料,优选使用例如上述聚烯烃系树脂,或者向其照射了1~80Mrad左右的电子射线或γ射线的物质。
构成各中心层与表面层的材料,优选从这些聚烯烃系树脂中选择热收缩率不同、各层相互缓冲从而抑制基材整体的热收缩率的树脂。作为这样的组合,可列举出例如聚乙烯与聚丙烯的组合,特别优选结晶性聚乙烯与非晶性聚丙烯的组合。将由聚乙烯与聚丙烯形成的层叠体作为基材使用时,从锚固性的观点考虑,优选在与基材的粘合剂层连接侧设置由聚乙烯形成的层。层叠体为在中心层的两侧具有表面层的形态时,优选2个表面层由同一种类的材料构成。
对构成层叠体的各层的厚度之比没有特别限定,优选中心层的厚度大于表面层的厚度。厚度之比例如可列举出一侧的表面层∶中心层=1∶12~3∶5,优选为1∶10~3∶10左右。中心层的双面具有表面层时,一侧的表面层与另一侧的表面层的厚度可以相同,也可以不同。一侧的表面层的厚度与另一侧的表面层的厚度之比可由例如1∶1~1∶5的范围选择,优选2个表面层的厚度相同。其中,可以特别适宜地使用具有表面层∶中心层∶表面层=2∶9∶2左右的厚度比的多层薄膜。
中心层与表面层之间根据需要还可以设有适当的中间层。作为中间层可列举出例如用于提高层间的密合力的粘接层、底涂层等。
对基材的制膜方法没有特别的限定,可列举出例如将颗粒状的树脂熔融,用挤出制膜机薄膜化的方法;利用T型模或吹塑法挤出成型或者利用压延法制造的方法等。
粘合片特别是基材的热收缩率优选为约2%以下。基材的热收缩率很大程度上依赖制造膜工序的温度条件,因此理想的是,选择在制膜工序中不包括拉伸工序的基材。
为了提高基材的上表面、即设置粘合剂层侧的面与粘合剂的密合性,可以实施惯用的表面处理,例如,电晕处理、铬酸处理、臭氧暴露、火焰暴露、高压电击暴露、离子化辐射线处理等基于化学或物理的方法进行的氧化处理等。
基材的厚度可以根据欲得到的粘合片等物性进行调节,可列举出例如30~1000μm,优选为40~800μm,进一步优选为50~500μm,特别优选为100~200μm。
本发明的半导体晶圆加工用粘合片如上所述在基材上形成粘合剂层,粘合剂层根据需要可以通过适宜的隔离膜保护。
另外,半导体晶圆加工用粘合片可以具有卷成滚筒状的形态,也可以具有片状、带状等形态。
本发明的半导体晶圆加工用粘合片可以用作例如:电子部件等各种被粘物的表面保护用片,特别是研磨半导体晶圆时用于保护半导体晶圆的电路面的保护用粘合片(背部片)、切割时的保护和/或加工用片、半导体晶圆加工的各工序中的加工用粘合片等。
例如,在半导体晶圆背面磨削工序中,首先,将本发明的半导体晶圆加工用粘合片的粘合剂层粘附在晶圆表面(图案电路形成面)。该粘附工序使用称作层压机的装置进行。
接着,将晶圆背面利用研磨机等磨削至规定的厚度(例如50~200μm),根据需要进行蚀刻等化学磨削。此时,半导体晶圆加工用粘合片承担固定半导体晶圆的作用和保护半导体晶圆表面(图案电路形成面)防止晶圆表面污染或破损的作用。
晶圆背面磨削工序结束后,将半导体晶圆加工用粘合片由被粘物剥离。
本发明的半导体晶圆加工用粘合片例如贴合在半导体晶圆的电路图案形成面时,对形成的电路图案的台阶的随动性良好,可以实现经时浮起量的稳定性。其结果,可以提高使用时的便利性。
即,确认了在本发明的粘合片中,如图1A及1B所示,将粘合片12的粘合剂层(未图示)的膜厚设为Aμm,将晶圆10表面的台阶11设为Bμm时,其膜厚A与台阶B满足0.2≤B/A≤5.7的关系的情况下,粘合片12从台阶11起的初始浮起量d1(图1A)与24小时后的粘合片的浮起量d2(图1B)满足式(5)。
(d2/d1)×100≤110(%) (5)
另外,优选(d2/d1)×100为109%以下。
以往,作为将半导体晶圆加工用粘合片从被粘物剥离时的粘合力调节成分,使粘合剂层含有表面活性剂,但有时该成分会在粘合剂层表面析出从而污染半导体晶圆的图案面。另外,在半导体晶圆的切割工序中,虽然边将大量的水浇在半导体晶圆上边进行IC的单片化,但此时也同样有来自污点的污染之虞。
但是,本发明的粘合片通过选择特定的增塑剂与表面活性剂的组合而即使在各种环境下保存及使用也可以有效地防止来自粘合剂成分的污点的析出。因此,在背面磨削等半导体晶圆加工后,剥离贴合在半导体晶圆表面的粘合片时,可以防止晶圆表面来自污点的污染,可以在要求半导体晶圆等的洁净度的保管、移送或加工时作为表面保护片适宜地使用。另外,通过清洗工序等的省略或简化等,可以有效地提高生产率。
进而,本发明的粘合片由于未使用邻苯二甲酸酯,因此可以成为考虑到环境方面的粘合片。
实施例
以下,列举实施例对本发明进行更详细说明,但本发明不受这些实施例的任何限制。
(实施例1)
在甲苯中利用溶液聚合法将97重量份丙烯酸丁酯、2重量份甲基丙烯酸甲酯、3重量份丙烯酸共聚,得到重均分子量为55万的丙烯酸系聚合物。在所得到的100重量份丙烯酸系聚合物中混合10重量份作为增塑剂的己二酸系聚酯(大日本油墨株式会社制造;商品名“W-230H”)、1重量份作为粘合力调节成分的非离子系表面活性剂(第一工业制药株式会社制造;商品名“NOIGEN EP-120A”)、0.5重量份环氧系交联剂(三菱瓦斯化学株式会社制造;商品名“TETRAD C”)、3重量份多异氰酸酯系交联剂(日本聚氨酯工业株式会社制造;商品名“CORONATEL”),得到粘合剂组合物A。
利用喷泉模方式,将所得到的粘合剂组合物A涂覆在铸造用工序片(厚度50μm的TORAY株式会社制造的PET薄膜)上,使得干燥后的厚度成为45μm,形成粘合剂层。
作为基材,利用挤出机共挤出制作由聚乙烯/非晶聚丙烯/聚乙烯3层形成的厚度135μm的层叠薄膜A。其中,层叠薄膜A各层的厚度之比为聚乙烯∶非晶丙烯∶聚乙烯=2∶9∶2。
在层叠薄膜A上通过转印层压粘合剂层A,熟化50℃×48小时,得到粘合片A。
(实施例2)
在上述100重量份丙烯酸系聚合物中混合30重量份作为增塑剂的偏苯三酸系聚酯(大日本油墨株式会社制造;商品名“W-705”)、1重量份作为粘合力调节成分的非离子系表面活性剂(第一工业制药株式会社制造;商品名“NOIGEN EP-120A”)、0.5重量份环氧系交联剂(三菱瓦斯化学株式会社制造;商品名“TETRAD C”)、3重量份多异氰酸酯系交联剂(日本聚氨酯工业株式会社制造;商品名“CORONATE L”),得到粘合剂组合物B。
除了使用粘合剂组合物B代替粘合剂组合物A以外,进行与实施例1同样的操作,得到粘合片B。
(实施例3)
在上述100重量份丙烯酸系聚合物中混合50重量份作为增塑剂的苯甲酸系聚酯(大日本油墨株式会社制造;商品名“W-83”)、1重量份作为粘合力调节成分的非离子系表面活性剂(第一工业制药株式会社制造;商品名“NOIGEN EP-120A”)、0.5重量份环氧系交联剂(三菱瓦斯化学株式会社制造;商品名“TETRAD C”)、3重量份多异氰酸酯系交联剂(日本聚氨酯工业株式会社制造;商品名“CORONATE L”),得到粘合剂组合物C。
除了使用粘合剂组合物C代替粘合剂组合物A以外,进行与实施例1同样的操作,得到粘合片C。
(实施例4)
在上述100重量份丙烯酸系聚合物中混合10重量份作为增塑剂的己二酸系聚酯(大日本油墨株式会社制造;商品名“W-230H”)、5重量份作为粘合力调节成分的非离子系表面活性剂(第一工业制药株式会社制造;商品名“NOIGENEP-120A”)、0.5重量份环氧系交联剂(三菱瓦斯化学株式会社制造;商品名“TETRAD C”)、3重量份多异氰酸酯系交联剂(日本聚氨酯工业株式会社制造;商品名“CORONATE L”),得到粘合剂组合物D。
除了使用粘合剂组合物D代替粘合剂组合物A以外,进行与实施例1同样的操作,得到粘合片D。
(实施例5)
在上述100重量份丙烯酸系聚合物中混合10重量份作为增塑剂的己二酸系聚酯(大日本油墨株式会社制造;商品名“W-230H”)、10重量份作为粘合力调节成分的非离子系表面活性剂(第一工业制药株式会社制造;商品名“NOIGENEP-120A”)、0.5重量份环氧系交联剂(三菱瓦斯化学株式会社制造;商品名“TETRAD C”)、3重量份多异氰酸酯系交联剂(日本聚氨酯工业株式会社制造;商品名“CORONATE L”),得到粘合剂组合物E。
除了使用粘合剂组合物E代替粘合剂组合物A以外,进行与实施例1同样的操作,得到粘合片E。
(比较例1)
除了使用30重量份邻苯二甲酸酯(大日本油墨株式会社制造;商品名“DOP”)作为增塑剂以外,进行与实施例1同样的操作,得到粘合片F。
(比较例2)
除了使用10重量份聚醚系聚酯(大日本油墨株式会社制造;商品名“AS-200”)作为增塑剂以外,进行与实施例1同样的操作,得到粘合片G。
(比较例3)
除了使用50重量份聚醚系聚酯(大日本油墨株式会社制造;商品名“AS-200”)作为增塑剂以外,进行与实施例1同样的操作,得到粘合片H。
(试验评价)
对在实施例及比较例中得到的粘合片进行以下的试验评价。其结果示于表2。
[保存稳定性试验]
将在实施例及比较例中得到的粘合片,在0℃及40℃×92%RH的环境中放置30天。之后裁取50×50mm的粘合片作为试验片。使用2kg的橡胶辊,不施加张力而以10cm/秒钟的速度将得到的试验片贴附在4英寸的镜面晶圆表面。粘附后,以300mm/min的速度拉剥试验片,通过目视观察镜面晶圆表面状态。作为观察方法,将试验片贴附面以5×5mm的大小划分,制作总计100个方格,目视观察附着有污点的方格数。
○:在100个中一个污点也未观察到。
△:100个中观察到不足50个的污点。
×:100个中观察到50个以上的污点。
[对镜面晶圆的粘接力]
基于JIS Z-0237,使用镜面晶圆作为被粘物进行测定。
[粘合剂的凝胶率]
从粘合片中采取粘合剂,测定采取的粘合剂的重量(W1),将其浸渍在乙酸乙酯中1周后,干燥溶剂成分,测定残留的凝胶的重量(W2),利用下式算出。
凝胶率(%)=W2×100/W1
[台阶随动性试验]
使用日东精机株式会社制造的DR3000II,以贴合压0.4MPa、贴合速度10mm/秒钟,将在实施例及比较例中得到的粘合片贴合在镜面晶圆上。此时,在镜面晶圆上沿垂直于粘合片的贴合方向贴合53μm厚的带,作为模拟台阶。
贴合粘合片后,使用光学显微镜评价从模拟台阶浮起的带的浮起距离,设为初始台阶浮起量(d1,参照图1A)。进而贴合24小时后,进行同样的评价,测定经时浮起量(d2,参照图1B),利用下式算出从初始浮起量的上升比率。
经时稳定性(%)=(d2/d1)×100
[表2]
(试验例)
除了使粘合剂层的厚度在15~65μm之间变化以外,制作与实施例1同样的粘合片。按照上述台阶随动性试验,使台阶在18~85μm之间变化,对得到的粘合片进行试验。其结果如下表所示。
[表3]
产业上的可利用性
本发明的半导体晶圆加工用粘合片可以作为电子部件等各种被粘物的表面保护用片、切割时的加工用片等被广泛地利用。
Claims (5)
1.一种半导体晶圆加工用粘合片,其特征在于,
在基材的至少单面备有粘合剂层,
所述粘合剂层包含基础聚合物、聚酯系的增塑剂及表面活性剂,
所述增塑剂及表面活性剂的溶解度参数(SP值)满足如下关系:
0.9≤[增塑剂的SP值]/[表面活性剂的SP值]≤1.0。
2.根据权利要求1所述的半导体晶圆加工用粘合片,其中,其是相对于100重量份基础聚合物添加有10~50重量份所述增塑剂而成的。
3.根据权利要求1或2所述的半导体晶圆加工用粘合片,其中,其是相对于100重量份基础聚合物添加有1~10重量份所述表面活性剂而成的。
4.根据权利要求1~3中的任一项所述的半导体晶圆加工用粘合片,其中,所述基础聚合物包含丙烯酸系聚合物。
5.根据权利要求1~4中的任一项所述的半导体晶圆加工用粘合片,其中,在将满足0.2≤B/A≤5.7关系的、备有膜厚为Aμm的粘合剂层的半导体晶圆加工用粘合片贴合在具有台阶为Bμm的晶圆表面时,
从台阶浮起的所述粘合片的初始浮起量d1与24小时后的粘合片的浮起量d2满足如下关系:
(d2/d1)×100≤110(%)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010097273A JP5406110B2 (ja) | 2010-04-20 | 2010-04-20 | 半導体ウエハ加工用粘着シート |
JP2010-097273 | 2010-04-20 | ||
PCT/JP2011/059247 WO2011132595A1 (ja) | 2010-04-20 | 2011-04-14 | 半導体ウエハ加工用粘着シート |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102549720A true CN102549720A (zh) | 2012-07-04 |
Family
ID=44834116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011800039307A Pending CN102549720A (zh) | 2010-04-20 | 2011-04-14 | 半导体晶圆加工用粘合片 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20120114938A1 (zh) |
EP (1) | EP2562795A1 (zh) |
JP (1) | JP5406110B2 (zh) |
KR (1) | KR20120133985A (zh) |
CN (1) | CN102549720A (zh) |
TW (1) | TW201203342A (zh) |
WO (1) | WO2011132595A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105247661A (zh) * | 2013-05-29 | 2016-01-13 | 三井化学东赛璐株式会社 | 半导体晶片保护用膜及半导体装置的制造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5959240B2 (ja) * | 2012-03-12 | 2016-08-02 | 日東電工株式会社 | 粘着シート |
JP5901422B2 (ja) * | 2012-05-15 | 2016-04-13 | 古河電気工業株式会社 | 半導体ウェハのダイシング方法およびこれに用いる半導体加工用ダイシングテープ |
JP5294366B1 (ja) * | 2012-10-18 | 2013-09-18 | 古河電気工業株式会社 | ダイシングテープ |
JP6180139B2 (ja) * | 2013-03-11 | 2017-08-16 | リンテック株式会社 | 保護膜形成用複合シートおよび保護膜形成用フィルム付チップの製造方法 |
EP3088181B1 (en) * | 2013-12-26 | 2018-09-05 | Zeon Corporation | Multilayered film and method for manufacturing same |
PT3572478T (pt) * | 2017-01-20 | 2024-02-06 | Mitsui Chemicals Tohcello Inc | Uso de película adesiva e processo de fabrico de aparelho eletrónico |
JP2023146907A (ja) * | 2022-03-29 | 2023-10-12 | 株式会社レゾナック | 電子部品加工フィルム及び電子部品加工方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050136251A1 (en) * | 2003-12-19 | 2005-06-23 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet |
US20100028588A1 (en) * | 2006-11-04 | 2010-02-04 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8822857D0 (en) * | 1988-09-29 | 1988-11-02 | Patralan Ltd | Pharmaceutical formulations |
JP3208501B2 (ja) | 1992-06-02 | 2001-09-17 | 日東電工株式会社 | 半導体ウエハの保護部材 |
JP3491911B2 (ja) * | 1992-07-29 | 2004-02-03 | リンテック株式会社 | 半導体ウエハ加工用粘着シート |
US5539044A (en) * | 1994-09-02 | 1996-07-23 | Conoco In. | Slurry drag reducer |
MY142246A (en) * | 2003-06-10 | 2010-11-15 | Hitachi Chemical Co Ltd | Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device |
JP4627149B2 (ja) * | 2004-05-10 | 2011-02-09 | 東洋ゴム工業株式会社 | 研磨パッド及び半導体デバイスの製造方法 |
-
2010
- 2010-04-20 JP JP2010097273A patent/JP5406110B2/ja active Active
-
2011
- 2011-04-14 CN CN2011800039307A patent/CN102549720A/zh active Pending
- 2011-04-14 EP EP11771930A patent/EP2562795A1/en not_active Withdrawn
- 2011-04-14 US US13/381,760 patent/US20120114938A1/en not_active Abandoned
- 2011-04-14 KR KR1020117025740A patent/KR20120133985A/ko not_active Application Discontinuation
- 2011-04-14 WO PCT/JP2011/059247 patent/WO2011132595A1/ja active Application Filing
- 2011-04-20 TW TW100113775A patent/TW201203342A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050136251A1 (en) * | 2003-12-19 | 2005-06-23 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet |
US20100028588A1 (en) * | 2006-11-04 | 2010-02-04 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105247661A (zh) * | 2013-05-29 | 2016-01-13 | 三井化学东赛璐株式会社 | 半导体晶片保护用膜及半导体装置的制造方法 |
CN105247661B (zh) * | 2013-05-29 | 2018-09-21 | 三井化学东赛璐株式会社 | 半导体晶片保护用膜及半导体装置的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2011228502A (ja) | 2011-11-10 |
JP5406110B2 (ja) | 2014-02-05 |
WO2011132595A1 (ja) | 2011-10-27 |
US20120114938A1 (en) | 2012-05-10 |
EP2562795A1 (en) | 2013-02-27 |
KR20120133985A (ko) | 2012-12-11 |
TW201203342A (en) | 2012-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102549720A (zh) | 半导体晶圆加工用粘合片 | |
CN103205225B (zh) | 粘合剂用聚合物、粘合剂组合物和热剥离性粘合片 | |
JP6554708B2 (ja) | ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム | |
CN101070454B (zh) | 用于加工半导体晶片或半导体基材的压敏粘着片 | |
CN100334690C (zh) | 半导体晶片表面保护用粘结膜及用该粘结膜的半导体晶片的保护方法 | |
CN103360964B (zh) | 加热剥离型粘合片 | |
KR101817411B1 (ko) | 반도체 웨이퍼 보호용 필름 및 반도체 장치의 제조 방법 | |
CN101121866A (zh) | 用于晶片研磨的抑制翘曲的压敏粘合片 | |
CN101802120B (zh) | 粘附片以及电子元器件的制造方法 | |
CN103502373A (zh) | 粘合带或粘合片 | |
CN104449442A (zh) | 粘合片 | |
CN107112222A (zh) | 晶片固定带、半导体晶片的处理方法和半导体芯片 | |
TWI582208B (zh) | Manufacturing method for adhesive sheet for electronic component processing and semiconductor device | |
JPH07201787A (ja) | ウエハ表面保護シートおよびその利用方法 | |
TW201729276A (zh) | 遮罩一體型表面保護帶 | |
CN112088421A (zh) | 半导体芯片的制造方法 | |
JP2009224375A (ja) | 半導体製造工程用フィルム | |
CN107112230A (zh) | 半导体晶圆加工用粘合带 | |
CN110178203B (zh) | 切割膜基材及切割膜 | |
JP2618491B2 (ja) | 放射線硬化性粘着テープ | |
CN103003232A (zh) | 亚甲基双脂肪酸酰胺组合物、粘合片及其制造方法 | |
JPH06101455B2 (ja) | ウエハ研摩用保護シ−トおよびこのシ−トを用いたウエハ面の研摩方法 | |
JP2005254228A (ja) | 溶剤含有物除去用粘着シート | |
JP7049796B2 (ja) | 粘着性フィルム | |
WO2019235217A1 (ja) | 硬化封止体の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120704 |