CN102510657B - Multilayer circuit board and electronic device comprising same - Google Patents
Multilayer circuit board and electronic device comprising same Download PDFInfo
- Publication number
- CN102510657B CN102510657B CN201110294457.4A CN201110294457A CN102510657B CN 102510657 B CN102510657 B CN 102510657B CN 201110294457 A CN201110294457 A CN 201110294457A CN 102510657 B CN102510657 B CN 102510657B
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- metal level
- edges
- circuit board
- electronic component
- boards
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Abstract
The invention relates to a multilayer circuit board and an electronic device comprising the same. The multilayer circuit board comprises a first metal layer which comprises a first signal part, a first electronic component which is arranged in the first signal part, a second metal layer, a first insulating layer which is arranged between the first metal layer and the second metal layer, a first grounding part which is arranged on the side of the first metal layer, and a plate edge metal layer which is arranged on one side wall of the multilayer circuit board, wherein the plate edge metal layer is electrically connected with the first grounding part and is not electrically connected with the first signal part; and the first electronic component is coupled with the first grounding part. According to the invention, the heat generated by the first electronic component can be conducted to the plate edge metal layer through the first grounding part.
Description
[technical field]
The invention relates to a kind of circuit board, particularly about a kind of multilayer circuit board.
[background technology]
Along with the high speed development of electronic technology, all kinds of electronic devices constantly updates to meet the needs of faster processing speed and more information treating capacities.Yet increased functionality does not also mean that the volume of electronic installation also increases, on the contrary, electronic installation more trends towards short and smallization, lightening development, and typical portable electronic equipment such as notebook computer, mobile phone or game machine etc. are not always the case.Thus, electronic installation inner space is subject to great restriction, and the layout designs of actual circuit board is brought to not molehill.
Because the usable area of circuit board is more and more less and area of dissipation is fewer and feweri, if use the function that power consumption is large simultaneously, will make the instantaneous power consumption of circuit board increase and make the temperature of circuit board increase.If without good cooling mechanism, the problem of localized hyperthermia or poor heat radiation will be there is.For example: in the process of charging or while getting online without being tethered to a cable, the heat that electronic component produces can significantly improve the temperature of electronic installation inside via circuit board transmission, and increase the danger while using.
[summary of the invention]
The object of the present invention is to provide a kind of multilayer circuit board, it comprises: the first metal layer, comprises the first signal portion; The first electronic component, is arranged at this first signal portion; The second metal level; The first insulating barrier, is arranged between this first metal layer and this second metal level; The first grounding parts, is arranged at the side of this first metal layer; And edges of boards metal level, be disposed on a sidewall of this multilayer circuit board, this edges of boards metal level and this first grounding parts are electrically connected, and with this first signal portion without electric connection; Wherein, this first electronic component and this first grounding parts couple, so that the heat that this first electronic component produces conducts to this edges of boards metal level via this first grounding parts.
As optional technical scheme, the side of this second metal level and this edges of boards metal level are electrically connected, and whole this second metal level is grounding parts.
As optional technical scheme, described multilayer circuit board more comprises conductive through hole, is electrically connected this first electronic component and this second metal level.
As optional technical scheme, described multilayer circuit board more comprises: the 3rd metal level, and its side is also electrically connected with this edges of boards metal level; And second insulating barrier, be disposed between this second metal level and the 3rd metal level.As further alternative technical scheme, whole the 3rd metal level is grounding parts.As further alternative technical scheme, described multilayer circuit board more comprises conductive through hole, is electrically connected this first electronic component and the 3rd metal level.
As optional technical scheme, described multilayer circuit board more comprises: the 3rd metal level, comprises the second signal portion; The second insulating barrier, is arranged between this second metal level and the 3rd metal level; The second electronic component, is arranged on this second signal portion; The second grounding parts, is arranged at the side of the 3rd metal level, and this second grounding parts is electrically connected this edges of boards metal level, and this edges of boards metal level and this second signal portion are without electric connection; Wherein, this second electronic component and this second grounding parts couple, so that the heat that this second electronic component produces conducts to this edges of boards metal level via this second grounding parts.As further alternative technical scheme, the side of this second metal level is also electrically connected with this edges of boards metal level, and whole this second metal level is grounding parts.As further alternative technical scheme, described multilayer circuit board more comprises conductive through hole, is electrically connected this second electronic component and this second metal level.
The present invention also aims to provide a kind of electronic installation, it comprises above-mentioned a kind of multilayer circuit board.
Compared with prior art, the present invention is electrically connected the set grounding parts of at least one metal level with edges of boards metal level, to promote ground connection property between layers.In addition, electronic component can be arranged on edges of boards region, and the heat of utilizing edges of boards metal level and the set grounding parts of at least one metal level to come conduction electron element to produce, to reach the effect of heat radiation.
[accompanying drawing explanation]
Fig. 1 illustrates the schematic diagram according to the multilayer circuit board of first embodiment of the invention.
Fig. 2 illustrates the schematic diagram according to the multilayer circuit board of second embodiment of the invention.
Fig. 3 illustrates the schematic diagram according to the multilayer circuit board of third embodiment of the invention.
[embodiment]
The multilayer circuit board of the present embodiment, utilizes the metal level in edges of boards region to increase ground connection property between layers.The two layers of above circuit board of take are example, and the exposed copper face in edges of boards region can utilize edges of boards to soak gold (immersion gold) and interconnect, and except increasing ground connection property between layers, more can make up the situation of conductive through hole deficiency.In addition, aspect thermal diffusivity, utilize edges of boards metal level can increase the area of dissipation of circuit board, and large and in the situation that caloric value is higher at power consumption, can significantly reduce the temperature of electronic component peripheral region.Data through experiment are known, having the circuit board of edges of boards metal level for example, does edges of boards in the adjacent domain (being less than 1 centimetre) of heat-generating electronic elements and soaks gold, for the circuit board without edges of boards metal level, under maximum power consumption, measure, can make the temperature of circuit board decline about approximately 10 degree.
Below propose various embodiment and be elaborated, embodiment, in order to as example explanation, is not only the scope in order to limit wish protection of the present invention.
The first embodiment
Please refer to Fig. 1, it illustrates the schematic diagram according to the multilayer circuit board of first embodiment of the invention.Multilayer circuit board 100a comprises the first metal layer 110, the first electronic component 120, the second metal level 130, the first insulating barrier 140, the first grounding parts 150 and edges of boards metal level 160.The first metal layer 110 comprises the first signal portion 112.The first electronic component 120 is arranged at the first signal portion 112.The first insulating barrier 140 is arranged between the first metal layer 110 and the second metal level 130.Edges of boards metal level 160 is disposed on a sidewall of multilayer circuit board 100a.Edges of boards metal level 160 and the first grounding parts 150 are electrically connected, and are electrically connected with the first signal portion 112 nothings.The first electronic component 120 and the first grounding parts 150 couple, so that the heat that the first electronic component 120 produces conducts to edges of boards metal level 160 via the first grounding parts 150.
In the present embodiment, the first grounding parts 150 is arranged at the side of the first metal layer 110.The first electronic component 120 can be electrically connected by a ground connection pin 122 and the first grounding parts 150, and is electrically connected by a signal pin 124 and the first signal portion 112.In addition, whole the second metal level 130 can be as grounding parts.When the second metal level 130 is during as grounding parts, the side of the second metal level 130 and edges of boards metal level 160 are electrically connected, so that the heat that the first electronic component 120 produces conducts to edges of boards metal level 160 via the second metal level 130.
In addition, in Fig. 1, multilayer circuit board 100a more comprises a conductive through hole 142a, in order to be electrically connected the first electronic component 120 and the second metal level 130.Conductive through hole 142a can run through the first insulating barrier 140, to increase ground connection property between layers, and can reach the effect of heat radiation.The present embodiment, except utilizing edges of boards metal level 160 to increase ground connection property between layers, more can make up the situation of conductive through hole 142a deficiency.In addition, aspect thermal diffusivity, utilize edges of boards metal level 160 can increase the area of dissipation of multilayer circuit board 100a, and large and in the situation that caloric value is higher at power consumption, can significantly reduce the temperature of the first electronic component 120 peripheral regions.With respect to utilizing conductive through hole 142a to carry out heat conduction, side due to the more close multilayer circuit board 100a of the first grounding parts 150, transmission path is shorter, and the first grounding parts 150 is complete heat conduction plane, area is large and heat conduction is rapid, and the heat that therefore the first electronic component 120 produces can conduct to edges of boards metal level 160 rapidly.Illustrate further, generally, but unrestricted the present invention, the sectional area ratio edges of boards metal level 160 of conductive through hole 142a is little, therefore, edges of boards metal level 160 thermal conduction effects are good compared with conductive through hole 142a, simultaneously, edges of boards metal level 160 connects the second metal level 130, also can be effectively via the second metal level 130 heat radiations.
The second embodiment
Please refer to Fig. 2, it illustrates the schematic diagram according to the multilayer circuit board of second embodiment of the invention.Multilayer circuit board 100b comprises the first metal layer 110, the first electronic component 120, the second metal level 130, the first insulating barrier 140, the second insulating barrier 144, the 3rd metal level 146, the first grounding parts 150 and edges of boards metal level 160.The first metal layer 110 comprises the first signal portion 112.The first electronic component 120 is arranged at the first signal portion 112.The first insulating barrier 140 is arranged between the first metal layer 110 and the second metal level 130.The second insulating barrier 144 is arranged between the second metal level 130 and the 3rd metal level 146.Edges of boards metal level 160 is disposed on a sidewall of multilayer circuit board 100.Edges of boards metal level 160 and the first grounding parts 150 are electrically connected, and are electrically connected with the first signal portion 112 nothings.The first electronic component 120 and the first grounding parts 150 couple, so that the heat that the first electronic component 120 produces conducts to edges of boards metal level 160 via the first grounding parts 150.
In the present embodiment, the first grounding parts 150 is arranged at the side of the first metal layer 110.The first electronic component 120 can be electrically connected by a ground connection pin 122 and the first grounding parts 150, and is electrically connected by a signal pin 124 and the first signal portion 112.The present embodiment is different from the first embodiment, and whole the 3rd metal level 146 can be as grounding parts.When the 3rd metal level 146 is during as grounding parts, the side of the 3rd metal level 146 and edges of boards metal level 160 are electrically connected, so that the heat that the first electronic component 120 produces conducts to edges of boards metal level 160 via the 3rd metal level 146.
In addition, in Fig. 2, multilayer circuit board 100b more comprises a conductive through hole 142b, in order to be electrically connected the first electronic component 120 and the second metal level 130.In addition, conductive through hole 142b also can be electrically connected at the first electronic component 120 and the 3rd metal level 146.Conductive through hole 142b can run through the first insulating barrier 140 and the second insulating barrier 144, to increase ground connection property between layers, and can reach the effect of heat radiation.The present embodiment, except utilizing edges of boards metal level 160 to increase ground connection property between layers, more can make up the situation of conductive through hole 142b deficiency.In addition, aspect thermal diffusivity, utilize edges of boards metal level 160 can increase the area of dissipation of multilayer circuit board 100b, and large and in the situation that caloric value is higher at power consumption, can significantly reduce the temperature of the first electronic component 120 peripheral regions.With respect to utilizing conductive through hole 142b to carry out heat conduction, side due to the more close multilayer circuit board 100b of the first grounding parts 150, transmission path is shorter, and the first grounding parts 150 is complete heat conduction plane, area is large and heat conduction is rapid, and the heat that therefore the first electronic component 120 produces can conduct to edges of boards metal level 160 rapidly.Illustrate further, generally, but unrestricted the present invention, the sectional area ratio edges of boards metal level 160 of conductive through hole 142b is little, therefore, edges of boards metal level 160 thermal conduction effects are good compared with conductive through hole 142b, simultaneously, edges of boards metal level 160 connects the second metal level 130 and the 3rd metal level 146, also can be effectively via the second metal level 130 and the 3rd metal level 146 heat radiations.
The 3rd embodiment
Please refer to Fig. 3, it illustrates the schematic diagram according to the multilayer circuit board of third embodiment of the invention.Multilayer circuit board 100c comprises the first metal layer 110, the first electronic component 120, the second metal level 130, the first insulating barrier 140, the 3rd metal level 146, the second insulating barrier 144, the second electronic component 170, the first grounding parts 150 and edges of boards metal level 160.The first metal layer 110 comprises one first signal portion 112.The first electronic component 120 is arranged at the first signal portion 112.The first insulating barrier 140 is arranged between the first metal layer 110 and the second metal level 130.The second insulating barrier 144 is arranged between the second metal level 130 and the 3rd metal level 146.Edges of boards metal level 160 is disposed on a sidewall of multilayer circuit board 100c.Edges of boards metal level 160 and the first grounding parts 150 are electrically connected, and are electrically connected with the first signal portion 112 nothings.The first electronic component 120 and the first grounding parts 150 couple, so that the heat that the first electronic component 120 produces conducts to edges of boards metal level 160 via the first grounding parts 150.
The present embodiment is different from the second embodiment, and the 3rd metal level 146 comprises the second signal portion 156.The second electronic component 170 is arranged on the second signal portion 156.The second grounding parts 154 is arranged at the side of the 3rd metal level 146, and the second grounding parts 154 is electrically connected edges of boards metal level 160, and edges of boards metal level 160 and the 156 nothing electric connections of the second signal portion.The second electronic component 170 can be electrically connected by a ground connection pin 172 and the first grounding parts 150, and be electrically connected by a signal pin 174 and the second signal portion 156, so that the heat that the second electronic component 170 produces conducts to edges of boards metal level 160 via the second grounding parts 154.
In the present embodiment, whole the second metal level 130 can be as grounding parts.When the second metal level 130 is during as grounding parts, the side of the second metal level 130 and edges of boards metal level 160 are electrically connected, so that the heat that the first electronic component 120 and the second electronic component 170 produce conducts to contiguous edges of boards metal level 160 via the second metal level 130.
In addition, in Fig. 3, the present embodiment is different from the second embodiment, and multilayer circuit board 100c more comprises another conductive through hole 142c, in order to be electrically connected the second electronic component 170 and the second metal level 130.Conductive through hole 142c can run through the second insulating barrier 144, to increase ground connection property between layers, and can reach the effect of heat radiation.The present embodiment, except utilizing edges of boards metal level 160 to increase ground connection property between layers, more can make up the situation of conductive through hole 142a and 142b deficiency.In addition, aspect thermal diffusivity, utilize edges of boards metal level 160 can increase the area of dissipation of multilayer circuit board 100c, and large and in the situation that caloric value is higher at power consumption, can significantly reduce the temperature of each electronic component 120,170 peripheral regions.With respect to utilizing conductive through hole 142c to carry out heat conduction, side due to the more close multilayer circuit board 100c of the second grounding parts 154, transmission path is shorter, and the second grounding parts 154 is complete heat conduction plane, area is large and heat conduction is rapid, and the heat that therefore the second electronic component 170 produces can conduct to edges of boards metal level 160 rapidly.Illustrate further, generally, but unrestricted the present invention, the sectional area ratio edges of boards metal level 160 of conductive through hole 142c is little, therefore, edges of boards metal level 160 thermal conduction effects are good compared with conductive through hole 142c, simultaneously, edges of boards metal level 160 connects the second metal level 130, also can be effectively via the second metal level 130 heat radiations.
The disclosed multilayer circuit board of the above embodiment of the present invention, is electrically connected the set grounding parts of at least one metal level with edges of boards metal level, to promote ground connection property between layers, and can make up the situation of conductive through hole deficiency.In addition, electronic component can be arranged on edges of boards region, and the heat of utilizing edges of boards metal level and the set grounding parts of at least one metal level to come conduction electron element to produce, to reach the effect of best heat radiation.
Although the present invention discloses as above with embodiment, so it is not in order to limit the present invention, and protection scope of the present invention is when being as the criterion with claims.
Claims (5)
1. a multilayer circuit board, is characterized in that comprising:
The first metal layer, comprises the first signal portion;
The first electronic component, is arranged at this first signal portion;
The second metal level;
The first insulating barrier, is arranged between this first metal layer and this second metal level;
The first grounding parts, is arranged at the side of this first metal layer; And
Edges of boards metal level, is disposed on a sidewall of this multilayer circuit board, and this edges of boards metal level and this first grounding parts are electrically connected, and with this first signal portion without electric connection;
Wherein, this first electronic component and this first grounding parts couple, so that the heat that this first electronic component produces conducts to this edges of boards metal level via this first grounding parts;
The 3rd metal level, comprises the second signal portion;
The second insulating barrier, is arranged between this second metal level and the 3rd metal level;
The second electronic component, is arranged on this second signal portion;
The second grounding parts, is arranged at the side of the 3rd metal level, and this second grounding parts is electrically connected this edges of boards metal level, and this edges of boards metal level and this second signal portion are without electric connection;
Wherein, this second electronic component and this second grounding parts couple, so that the heat that this second electronic component produces conducts to this edges of boards metal level via this second grounding parts.
2. multilayer circuit board as claimed in claim 1, it is characterized in that the side of this second metal level and this edges of boards metal level are electrically connected, and whole this second metal level is grounding parts.
3. multilayer circuit board as claimed in claim 1, is characterized in that more comprising conductive through hole, is electrically connected this first electronic component and this second metal level.
4. multilayer circuit board as claimed in claim 1, is characterized in that more comprising conductive through hole, is electrically connected this second electronic component and this second metal level.
5. an electronic installation, is characterized in that comprising the multilayer circuit board as described in any one in claim 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110294457.4A CN102510657B (en) | 2011-10-08 | 2011-10-08 | Multilayer circuit board and electronic device comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110294457.4A CN102510657B (en) | 2011-10-08 | 2011-10-08 | Multilayer circuit board and electronic device comprising same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102510657A CN102510657A (en) | 2012-06-20 |
| CN102510657B true CN102510657B (en) | 2014-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110294457.4A Expired - Fee Related CN102510657B (en) | 2011-10-08 | 2011-10-08 | Multilayer circuit board and electronic device comprising same |
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| CN (1) | CN102510657B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108848610A (en) * | 2018-08-30 | 2018-11-20 | 歌尔股份有限公司 | A kind of printed circuit board |
| CN110446361A (en) * | 2019-07-24 | 2019-11-12 | 广合科技（广州）有限公司 | A kind of matrix LED car light circuit board and production method |
| CN113946019B (en) * | 2020-07-15 | 2022-11-29 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7069768B2 (en) * | 2004-06-08 | 2006-07-04 | Instrumentarium Corp. | Method and apparatus for eliminating and compensating thermal transients in gas analyzer |
| JP4133394B2 (en) * | 2003-02-05 | 2008-08-13 | 株式会社リコー | Image forming apparatus |
| CN101442886A (en) * | 2007-11-23 | 2009-05-27 | 三星电机株式会社 | Printed circuit board and manufacturing method of the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04133394A (en) * | 1990-09-25 | 1992-05-07 | Matsushita Electric Ind Co Ltd | Multilayer printed circuit board |
| JP4758197B2 (en) * | 2005-10-24 | 2011-08-24 | 京セラ株式会社 | Surface acoustic wave device and communication device |
| ES2363025T3 (en) * | 2006-10-27 | 2011-07-19 | Agie Charmilles Sa | CIRCUIT PLATE UNIT AND PROCEDURE FOR THE PRODUCTION OF THE SAME. |
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2011
- 2011-10-08 CN CN201110294457.4A patent/CN102510657B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4133394B2 (en) * | 2003-02-05 | 2008-08-13 | 株式会社リコー | Image forming apparatus |
| US7069768B2 (en) * | 2004-06-08 | 2006-07-04 | Instrumentarium Corp. | Method and apparatus for eliminating and compensating thermal transients in gas analyzer |
| CN101442886A (en) * | 2007-11-23 | 2009-05-27 | 三星电机株式会社 | Printed circuit board and manufacturing method of the same |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2007-116628A 2007.05.10 |
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| CN102510657A (en) | 2012-06-20 |
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Granted publication date: 20141015 Termination date: 20171008 |