CN102501144A - Positioning device and positioning method of thermal infrared imager for testing drilling and milling temperature of PCBs (printed circuit boards) - Google Patents

Abstract

The invention discloses a positioning device and a positioning method of a thermal infrared imager for testing drilling and milling temperature of PCBs (printed circuit boards). The positioning device comprises fixing brackets, a rotating table and three types of direction racks including an X-direction rack, Y-direction racks and a Z-direction rack. Each of the fixing brackets is connected with any one of the three types of direction racks, the rotating table is fixed onto any one of the three types of direction racks, the direction racks are connected with each other through regulating devices capable of driving the same to move on directions thereof, the direction racks and the fixing brackets are connected mutually through regulating devices capable of driving the same to move on directions thereof, and accordingly the thermal infrared imager is positioned accurately by means of space three-dimensional coordinate positioning and plane angle positioning. The thermal infrared imager is positioned by the three adjustable direction racks accurately, and the positioning device is simple in structure and can be constructed by the simple direction racks only. The angle of a lens of the thermal infrared imager can be adjusted on the plane by the aid of the rotating table, so that the lens of the thermal infrared imager can align to a tool accurately and then temperature of the tool during operation can be tested accurately.

Description

Infrared testing PCB positioning apparatus and a positioning method of drilling Milling Temperature

FIELD

[0001] The present invention relates to the field of machining, more particularly, to a test temperature of PCB milling drill infrared camera positioning device and positioning method.

Background technique

[0002] In manufacturing PCB, although a variety of different pore sizes developed processing technology, but there are still more than 90% of the PCB are formed by cutting. During the cutting process, machine cutting work is converted to heat, in addition to a small amount of cutting heat which escapes into the surrounding medium, the rest of the incoming hot isostatic tool, chip and the PCB, the tool, PCB board and machine tool wear will accelerate the temperature rise , damage to the internal wiring PCB, causing serious or even scrap processing tool breakage PCB material.

[0003] There are many ways of measuring the temperature of cutting, the conventional method, the infrared camera is more prominent. Infrared radiant energy detecting the workpiece (or the tool) surface of the radiating element by a ray scanning mechanism, and converts the radiant energy of each radiating element is an electronic video signal, by processing signals for display as a visible image , two-dimensional radiation heat energy field as shown in FIG representative of the sensed surface, if the surface emissivity of the radiating element is known, by Stephen can - temperature distribution field radiating unit and dynamics determined surface Boltzmann's law. Infrared thermometry is intuitive, simple, non-contact distance can be monitored, etc., having a large surface temperature measured superiority in harsh environments. However, the infrared camera lens must be accurately positioned to detect the tool (or workpiece) in order to obtain a more accurate value of the temperature, if there is an error in the positioning, will affect the accuracy of temperature measurement.

[0004] In the field of processing of PCB, the PCB tooling plurality of micro-carbide cutting tools, different processing parameters, the different sheet metal processing, different from the heat generated during machining carbide PCB cover different micro-tool, machining temperature is too highly likely to cause adverse effects on the machining tool and the PCB, so real-time temperature monitoring of micro-tool will be particularly important for micro-tool, infrared camera positioning and more difficult. Currently, the infrared camera is generally positioned by the tripod, shown in Figure 1, the infrared camera positioning apparatus comprising: a tripod 15, the support frame 15 and the tripod 16 is connected by a hinge, and a support frame 16 is connected by a hinge hanger 17, and the infrared camera 9 is fixed on a rotary table 177 attached to the hanger. And the support frame 16 is elongated in the hanger 17, the position of the infrared camera positioned to achieve 9 more difficult, during the test spindle will move the infrared thermal image occurs by adjusting the angle and height of the support frame 16 and the hanger 17 need only adjust the position of the mobile device, affect the accuracy of the positioning, but also difficult to adjust the height and angle of the two parameters with each other to achieve accurate repeatability.

SUMMARY

[0005] The present invention is one kind of technical problem to be solved is to provide an accurate positioning of the thermal imager test PCB positioning means and the positioning method of drilling milling temperature.

[0006] The object of the milling drill infrared camera temperature test PCB positioning means of the present invention is achieved by the following technical solution: A test drilling infrared camera positioning device PCB milling temperature, comprising: a rotary table and the mount ; said positioning means further comprises a frame to -X, Y and Z to the rack frame to frame three kinds of directions, the direction of the mount bracket is connected to any one of the rotary table is fixed to the frame direction, between the direction of the carrier frame is connected via a direction regulating means in the direction of its movement direction between the rack and the fixed frame. [0007] Preferably, the fixture is fixed to the spindle of the machine under test. Spindle fixation in the fixing plate, so that the entire positioning means can move along with the spindle, in order to avoid frequent adjustments positioning means to reduce the workload, improve efficiency and positioning accuracy.

[0008] Preferably, Y is connected to the frame and the fixed frame. The Y coordinate directions opposite direction only, the direction as described in reference only, and Y is connected to the carrier holder, the holder frame in the Y direction relatively movable in the Y direction.

[0009] Preferably, the Z direction is connected to the Y frame to frame, the X-direction is connected to the frame and the frame Z, the rotary table is fixed to the X frame. The X, Y, Z coordinate directions opposite direction only, the direction as described in reference only, and the Y-Z connected to the frame to frame, so that Z is movable in the Z-direction Y with respect to the carrier frame, while X Z is connected to the frame and the frame, so that the frame with respect to the X-Z-moving into the rack in the X direction, and, by the X and Y-Z frame to frame to contain the frame, so as to achieve three mutually opposing directions of movement contain to achieve the three o'clock position, i.e. the point positioned the rotary table is fixed to the X frame, so that the rotary table can be accurately positioned at the position corresponding to the machine tool.

[0010] Preferably, the positioning means comprises two of said bracket and with the same two directions corresponding to the frame. Two holder positioning means can make the whole structure more stable, to avoid shaking and so on.

[0011] A method of testing as claimed in claim 1, said drill Milling Infrared temperature positioning means, wherein said positioning means comprises only one of said holder, Y to the fixture connected to a frame, Z a frame and connected to said Y, said rotary table is fixed to the X-direction X and a carrier frame connected to the frame and to the Z-direction frame. When frame adjustment direction, the direction of carriage moving in one direction only need to adjust the adjusting means, so that more accurate adjustment, the synchronization.

Accuracy [0012] Preferably, the adjustment means is a micron. Micrometric adjusting means of the adjustment more precise positioning means.

[0013] Preferably, the rotary table is precision graded. Infrared fractionated rotary table so that more accurate adjustment of the lens.

[0014] The purpose of the drill milling temperature infrared camera positioning method of the present invention a test PCB is achieved by the following technical solutions: A method for positioning a drill Milling Temperature infrared camera test, comprising the steps of:

[0015] A: The infrared camera adjusting three dimensional space coordinate positions,

[0016] B: Infrared camera angle adjustment in a plane;

[0017] In the step A, the adjustment of three infrared camera coordinate positions include X, Υ, Ζ three coordinates, the step B, the infrared camera lens angle in a plane through the plane on completion of rotation of the video camera.

[0018] The present invention, since the infrared camera positioned in space achieved by three adjustable frame direction, i.e. to the frame by an X, Y and Z movement of the carrier into the rack are three directions in space, infrared camera so that the machine can accurately corresponds to the position of the bed accurate positioning of the tool, positioned three-point coordinates of positioning mode, accurate, and simple positioning structure in the direction of the carrier simply to architecture, and by a spin table so that the infrared camera lens in the plane of the angle can be adjusted so that the infrared camera lens can be accurately aligned with the tool, whereby the tool can be measured at the temperature of the work accurately.

BRIEF DESCRIPTION

[0019] FIG. 1 is a configuration diagram of a conventional positioning apparatus,

[0020] FIG. 2 is a structural view of a first embodiment of the present invention,

[0021] FIG. 3 is a structural view of a second embodiment of the present invention.

[0022] wherein: a fixing frame; 2, Υ the adjustment means; 3, Υ the knob; 4, Ζ the adjusting device; 5, Ζ the adjusting knob; 6, X to the frame; 7, rotary table; 8 , knob; 9, infrared camera; 10, Z to the frame; 11, X the adjusting means; 12, X the adjusting knob;

413, Y to the frame; 15, tripod; 16, support frame; 17, hanger. Detailed ways

The drawings and the preferred embodiments of the present invention will be further described [0023] below in conjunction.

[0024] The idea of ​​the present invention is positioned by the three-dimensional space coordinates of the formula, in its infrared camera so that the imaging position, and adjustment is achieved by the infrared camera lens at the angle of the insert is positioned on a flat surface, like milling cutter knife head, so as to achieve precise positioning of the imaging object. With this idea, the present invention provides an infrared camera positioning device, the positioning device may include: a holder, and the direction of rotation table frame; holder for fixing the positioning means, such fixation may be in a machine tool spindle fixing plate, so that the positioning means can move along with the spindle of the machine, thus avoiding the frequent adjustments positioning means, of course, may be fixed in a position outside the machine or other machine; comprising the direction of the frame: x to the frame, Y, the direction of various types of frame number may be varied according to the required direction of three kinds of frame to frame and the frame Z, between the direction of frame by the adjusting device to connect and move in this direction, a direction of each turn can rack It can be moved in its direction, to achieve the effect of the spatial positioning of three, one of which direction the frame holder is connected by the adjusting device, that the direction of the fixed frame and can move the entire apparatus is positioned in its direction; is screwed station two remaining fixed in one direction of the frame (i.e., not connected to the holder frame direction), the rotating station may further move in that direction as the direction of its holder. While the infrared camera is fixed to the rotary table, as the rack moves in the directions X, Y, Z three directions, to achieve the position of infrared camera positioned in space, while rotating the rotary table causes the infrared camera rotation in one plane, and then to adjust the action of the camera position, i.e. in the direction of the lens.

The first embodiment [0025] of the present invention shown in FIG. 2 cases, the positioning means comprising: a holder 1, X to the frame 6, Y to frame 13, Z 10 and the rotation table frame 7. In the present embodiment, the two chassis 1 by the positioning means is fixed to the spindle of the machine, so that the positioning means can be movable with spindle positioning means thereby avoiding multiple adjustments, the direction of the carrier frame 13 to the two Y are connected to the chassis 1 by the Y-direction adjusting apparatus 2, so that the two Y frame 13 to be movable in the Y direction; the Z frame to frame 10 is a concave configuration at its opposite ends to the two Y-frame 13 means connected to the regulator through Z 4, and both ends thereof by the concave architecture makes it all together, the adjustment ends are synchronized so that the frame 4 ζ to move smoothly without errors in the Z-direction; X-direction frame 6 is connected to the frame 11 in the Z-conditioning apparatus by the concave X, X term by adjusting the adjustment means to enable X frame 6 is moved in the X direction. Finally, rotating on the X table along with the movement of the X frame, frame to frame X to provide a bent portion for loading the rotating table 7, fixed to the spindle end 9 Infrared spin station. Positioning operation of the positioning device is as follows: First, each adjusting X to the knob 12, Υ the knob 3 and Z-knob 5, the X-direction frame, Y moved to the rack and Z-frame respectively in the direction thereof, so that the infrared camera is positioned in the machine bed at a point corresponding to the tool; then, adjusting knob 8 so that the infrared camera lens 9 is aligned with the tool tip, so as to achieve precise positioning.

[0026] In one embodiment of this embodiment, Y in a vertical frame 13 is bent to shape, and Z can be arranged so that the regulating means to a position in the Z direction is connected to a frame 10 and Z. X provides a folded portion for loading the rotating table 7, so that the rotary table is fixed to the X frame and with sufficient space so that the infrared camera is adjusted to the frame on the ZY plane.

The second [0027] As shown in FIG. 3 of the present embodiment of the invention, the first embodiment except that this embodiment requires only a holder 1, like a Y and a Z-frame 13 rack. The advantage of this design is that, when the frame 10 is only necessary to adjust the frame 13 in the Y-direction adjustment and an adjusting means Z (Y-2 and Z-regulating means regulating means 4), shown in Figure 1, to adjust to Y the need to adjust the position of the frame to the two Y-conditioning apparatus 2, if generated in the adjustment process is not synchronized, the error is likely to cause wear and long adjustment does not cause synchronized adjusting device, so as to lower the precision adjusting means. However, the positioning device shown in Figure 1 also has its two chassis 1, two Y-frame 13 and a female frame 10 and the Z-direction to make it more stable, less prone to loosening of the overall structure.

[0028] In the above two embodiments, the adjustment device used (i.e., X-direction adjusting means 11, Y and Z to the conditioning apparatus 2 to the adjustment means 4) micron accuracy adjustment means, for rotating the stage is classification accuracy the angle adjusting means, high precision adjusting means, so that the positioning of the positioning means to achieve high-precision positioning. With said adjusting means is a screw and a nut, the screw pitch on the order of micrometers, the lead screw is connected via a bevel gear with the regulating button, so that by rotating the knob to drive screw nut movement, thereby driving the carriage movement direction. And said rotating table two adjustment gears is a counter gear and a driven gear engaged with each other is formed.

[0029] Incidentally, in the present invention, the X direction, Y direction, Z direction, X-direction and the frame, Y, Z X, Y into the rack to rack, Z relative coordinates are not limited to coordinate direction shown in the drawings. Above with the specific preferred embodiments of the present invention is further made to the detailed description, specific embodiments of the present invention should not be considered limited to these descriptions. Those of ordinary skill in the art for the present invention, without departing from the spirit of the present invention, can make various simple deduction or replacement, should be deemed to belong to the scope of the present invention.

Claims (11)

A test drilling PCB milling Infrared temperature positioning means, comprising: a bracket and a rotating stage; characterized in that said positioning means further comprises: x to the frame, Y direction and the Z-frame to the three kinds of frame holder, the holder is connected to the frame in any direction, one of said rotary table is fixed to the frame direction, the direction may be in the frame in a direction between the direction of the frame and frame holder and the direction moving the adjusting device is connected.

2. A method of testing as claimed in claim 1 PCB drill according Milling Infrared temperature positioning means, characterized in that the machine tool spindle measured in the fixed plate fixed to the fixture.

A method of testing a PCB according to claim milling drill Infrared temperature positioning means, wherein Y is connected to the frame and said fixed frame.

A method of testing as claimed in claim 3 PCB milling drill infrared camera positioning device temperature claims, wherein Z is connected to the Y frame to frame, to the X-Z direction of the carrier frame and connected to a rotary table is fixed to the X frame.

5. A method of testing as claimed in claim 1 PCB drill according Milling Infrared temperature positioning means, wherein said positioning means comprises two directions of the same bracket and two corresponding thereto frame.

6. A method of testing as claimed in claim 1 PCB drill according to the milling temperature Infrared positioning means, wherein said positioning means comprises only one of said holder, Y to the fixture connected to a frame, Z a frame and connected to said Y, said rotary table is fixed to the X-direction X and a carrier frame connected to the frame and to the Z-direction frame.

7. A method of testing as claimed in claim 1 PCB drill according to the milling temperature Infrared positioning means, wherein said means for adjusting micron accuracy.

8. A method of testing as claimed in claim 7, the PCB milling drill Infrared temperature positioning means, characterized in that the screw means comprises a screw and a nut with the adjustment of the intermeshing.

9. A method of testing as claimed in claim 1 PCB drill according Milling Infrared temperature positioning means, wherein said rotary table is precision graded.

10. A method of testing as claimed in claim 9, the PCB milling drill Infrared temperature positioning means, wherein said adjusting screw comprises a stage gear, and a driven gear meshing with each other with the regulator.

A test drilling PCB milling Infrared temperature positioning method, characterized by comprising the steps of: A: three-dimensional spatial coordinates of the position adjustment infrared camera, infrared camera coordinate positions of three adjusting include X, Y, Z coordinates of three, B: Infrared camera angle adjustment in one plane, infrared imaging camera angles on a plane of rotation of the imaging device on a plane completed.