CN102501144A - Positioning device and positioning method of thermal infrared imager for testing drilling and milling temperature of PCBs (printed circuit boards) - Google Patents
Positioning device and positioning method of thermal infrared imager for testing drilling and milling temperature of PCBs (printed circuit boards) Download PDFInfo
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- CN102501144A CN102501144A CN2011102976575A CN201110297657A CN102501144A CN 102501144 A CN102501144 A CN 102501144A CN 2011102976575 A CN2011102976575 A CN 2011102976575A CN 201110297657 A CN201110297657 A CN 201110297657A CN 102501144 A CN102501144 A CN 102501144A
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- infrared imager
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- 238000003801 milling Methods 0.000 title claims abstract description 22
- 238000005553 drilling Methods 0.000 title abstract 2
- 230000001105 regulatory Effects 0.000 claims abstract description 6
- 230000004807 localization Effects 0.000 claims description 6
- 230000000875 corresponding Effects 0.000 claims description 4
- 239000000725 suspension Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 241000196435 Prunus domestica subsp. insititia Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 230000001360 synchronised Effects 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 238000004861 thermometry Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Abstract
The invention discloses a positioning device and a positioning method of a thermal infrared imager for testing drilling and milling temperature of PCBs (printed circuit boards). The positioning device comprises fixing brackets, a rotating table and three types of direction racks including an X-direction rack, Y-direction racks and a Z-direction rack. Each of the fixing brackets is connected with any one of the three types of direction racks, the rotating table is fixed onto any one of the three types of direction racks, the direction racks are connected with each other through regulating devices capable of driving the same to move on directions thereof, the direction racks and the fixing brackets are connected mutually through regulating devices capable of driving the same to move on directions thereof, and accordingly the thermal infrared imager is positioned accurately by means of space three-dimensional coordinate positioning and plane angle positioning. The thermal infrared imager is positioned by the three adjustable direction racks accurately, and the positioning device is simple in structure and can be constructed by the simple direction racks only. The angle of a lens of the thermal infrared imager can be adjusted on the plane by the aid of the rotating table, so that the lens of the thermal infrared imager can align to a tool accurately and then temperature of the tool during operation can be tested accurately.
Description
Technical field
The present invention relates to the machined field, in particular, relate to a kind of thermal infrared imager positioner and localization method that pcb board bores the milling temperature of testing.
Background technology
In the PCB manufacturing industry, various aperture processing technology though developed, still having the pcb board more than 90% at present is to process through cut.In working angles; The lathe acting converts heat in metal cutting into; These heat in metal cuttings are except that spilling in the surrounding medium on a small quantity, and its waste heat all imports in cutter, smear metal and the pcb board, and cutter, pcb board and lathe temperature rise will speed up tool wear; Damage the PCB internal wiring, when serious even cause that cracking of cutter scraps the pcb board material of processing.
The method of temperature of mensuration cut has a variety of, and is in the existing method, comparatively outstanding with thermal infrared imager.Thermal infrared imager is surveyed the emittance of workpiece (or cutter) surface emissivity unit through optical mechaical scanning mechanism; And convert the emittance of each radiating element into convey electronic video signals; Through signal is handled, show that with the form of visual picture the thermography of demonstration is represented the two-dimensional radiation energy field of measured surface; If the emissivity of radiating element is known, then can obtain the Temperature Distribution field and the dynamic change on radiating element surface through Stefan-Boltzman's law.That the thermal infrared imager thermometry has is directly perceived, easy, can at a distance noncontact monitoring and other advantages, under adverse circumstances, have big superiority during the temperature of measurement object surface.But the camera lens of thermal infrared imager need accurately navigate to detect on the cutter (or workpiece) and just can obtain temperature value more accurately, if in the location, there is error, influence is measured the accuracy of temperature value.
At the PCB manufacture field; Mostly the cutter of processing PCB plate is the carbide alloy min-cutter; It is different that different machining parameters, different machining sheet, different PCB cover plate add the heat that produces man-hour with the carbide alloy min-cutter, adds the man-hour temperature and too highly easily process tool and pcb board are caused adverse effect, so will be particularly important to the monitoring of the real time temperature of min-cutter; For min-cutter, the positioning difficulty of thermal infrared imager is also higher.At present; Thermal infrared imager generally positions through tripod; As shown in Figure 1; The positioner of thermal infrared imager comprises: tripod 15, the bracing frame 16 that is connected through the hinge with tripod 15, and the suspension bracket 17 that is connected through the hinge with bracing frame 16, thermal infrared imager 9 then is fixed on revolving on the platform 7 of linking to each other with suspension bracket 17.The extension of bracing frame 16 and suspension bracket 17 is longer; Locate relatively difficulty through the angle of adjusting bracing frame 16 and suspension bracket 17 and the position of highly realizing thermal infrared imager 9; Machine tool chief axis can be moved in the test process; Thermal infrared imager not only need move the adjustment position, influence locating accuracy, also be difficult to adjustment highly and angle two parameters are cooperatively interacted reach accurate resetting.
Summary of the invention
A kind of technical problem to be solved of the present invention provide a kind of can be pinpoint test PCB bore the thermal infrared imager positioner and the localization method of milling temperature.
The present invention tests the purpose that PCB bores the thermal infrared imager positioner of milling temperature and realizes through following technical scheme: a kind of thermal infrared imager positioner that bores PCB milling temperature of testing comprises: fixed mount and revolve platform; Said positioner also comprises: X to frame, Y to frame and Z to three kinds of direction framves of frame; Any is connected in said fixed mount and the direction frame; The said platform that revolves is fixed on the said direction frame, between the said direction frame and between direction frame and the fixed mount through can direction frame mobile adjusting device on its direction being connected.
Preferably, said fixed mount is fixed on the main shaft of tested lathe.Fixed mount is fixed on the machine tool chief axis fixed head, makes whole positioner to move along with machine tool chief axis, to avoid frequent adjustment positioner, reduces workload, increases work efficiency and positioning accuracy.
Preferably, said Y is connected with fixed mount to frame.Said Y direction is merely relative coordinate direction, and direction described in the literary composition is only for referencial use, and Y links to each other with fixed mount to frame, makes the Y can be relative on the Y direction, moving to frame and fixed mount.
Preferably, said Z is connected to frame with Y to frame, and said X is connected to frame with said Z to frame, and the said platform that revolves is fixed on X on frame.Said X, Y, Z direction are merely relative coordinate direction, and direction described in the literary composition is only for referencial use, and Z links to each other to frame with Y to frame; Z can be moved on the Z direction to frame with respect to Y to frame, and X links to each other to frame with Z to frame simultaneously, makes X can move on directions X to frame with respect to Z to frame; And; X to frame receive Y to frame and Z to the pining down of frame, thereby reach moving that three relative directions check and balance, thereby reach three-point fix; Anchor point promptly revolves platform and then is fixed on X on frame, revolves platform and can be accurately positioned in the cutter opposite position on the lathe thereby make.
Preferably, said positioner comprises two said fixed mounts and two corresponding with it same a kind of direction framves.Two fixed mounts can make whole positioner more be tending towards Stability Analysis of Structures, phenomenon such as avoid occurring rocking.
A kind of thermal infrared imager positioner that bores the milling temperature of testing as claimed in claim 1; It is characterized in that; Said positioner only comprises X that Z that a said fixed mount, Y who links to each other with said fixed mount link to each other to frame to frame, one and said Y links to each other to frame to frame and one and said Z to frame, and the said platform that revolves is fixed on X on frame.When regulating the direction frame, the direction frame on direction moves only need regulate an adjusting device, thereby makes adjusting more accurately, synchronously.
Preferably, the precision of said adjusting device is a micron order.Micron-sized adjusting device makes the adjusting of positioner more accurate.
Preferably, said precision of revolving platform is classification.The platform that revolves of classification makes that the camera lens adjustment of thermal infrared imager is more accurate.
The purpose that a kind of PCB of test of the present invention bores the thermal infrared imager localization method of milling temperature realizes through following technical scheme: a kind of thermal infrared imager localization method that bores the milling temperature of testing may further comprise the steps:
A: regulate three three dimensional space coordinate positions of thermal infrared imager,
B: regulate thermal infrared imager camera lens angle in one plane;
In the said steps A, three coordinate positions regulating thermal infrared imager comprise X, Y, three coordinates of Z respectively, and among the said step B, thermal infrared imager camera lens angle is in the plane accomplished through in one plane rotating this video camera.
The present invention is owing to realize thermal infrared imager location spatially through three kinds of adjustable direction framves; Promptly respectively through X to frame, Y to frame and Z to frame the moving of three directions in the space respectively, thermal infrared imager can accurately be located corresponding to the position of cutter at the lathe head of a bed accurately, its locate mode is the co-ordinate-type three-point fix; The degree of accuracy is high; And location structure is simple, only needs simple direction frame framework to get final product, and makes the camera lens of thermal infrared imager can adjust angle on the plane through revolving platform; Make the camera lens of thermal infrared imager can aim at cutter accurately, thereby can measure the cutter temperature in when work accurately.
Description of drawings
Fig. 1 is the structure diagram of existing positioner,
Fig. 2 is the topology view of the embodiment of the invention one,
Fig. 3 is the topology view of the embodiment of the invention two.
Wherein: 1, fixed mount; 2, Y is to adjusting device; 3, Y is to adjusting knob; 4, Z is to adjusting device; 5, Z is to adjusting knob; 6, X is to frame; 7, revolve platform; 8, knob; 9, thermal infrared imager; 10, Z is to frame; 11, X is to adjusting device; 12, X is to adjusting knob; 13, Y is to frame; 15, tripod; 16, bracing frame; 17, suspension bracket.
The specific embodiment
Below in conjunction with accompanying drawing and preferred embodiment the present invention is described further.
Thinking of the present invention is to locate through the three dimensional space coordinate formula; Make thermal infrared imager be in its camera position; And locate through the plane upper angle and to realize adjusting the cutter head that the thermal infrared imager alignment lens bores cutters such as cutter, milling cutter, thereby reach the purpose of accurate positioning shooting.Through this thinking, the invention provides a kind of positioner of thermal infrared imager, this positioner can comprise: fixed mount, direction frame and revolve platform; Fixed mount is used for this positioner is fixed; As can fixed mount be fixed on the main shaft fixed head of lathe, so that positioner can move along with the main shaft of lathe, thereby avoid frequent adjustment positioner; Certainly, also can be fixed on outside other position of lathe or the lathe; And the direction frame comprises: X to frame, Y to frame and Z to three kinds of direction framves of frame; The quantity of all kinds of direction framves can be set as required; Connect and moving on this direction through adjusting device between the direction frame, and then each direction frame can both be moved on its direction, reach the effect of space three-point fix; Wherein one type of direction frame is connected through adjusting device with fixed mount, fixes so that the direction frame can move on its direction with whole positioner; Revolve platform and then be fixed on wherein a kind of go up in remaining two kinds of direction framves (the direction frame that promptly is not connected) with fixed mount, so revolve platform can be mobile on its direction along with this direction frame.Thermal infrared imager then is fixed on and revolves on the platform; Along with the direction frame moves on X, Y, three directions of Z; Realize the position location of thermal infrared imager in the space; Simultaneously, the rotation of revolving platform is in one plane rotated thermal infrared imager, so reach the adjustment camera position be the effect of lens direction.
Be illustrated in figure 2 as first kind of embodiment of the present invention, this positioner comprises: fixed mount 1, X to frame 6, Y to frame 13, Z is to frame 10 and revolve platform 7.In the present embodiment; Positioner is fixed on the main shaft of lathe through two fixed mounts 1; So that positioner can move and then avoid repeatedly adjusting positioner along with machine tool chief axis; Two Y in the direction frame are connected to adjusting device 2 through Y with fixed mount 1 respectively to frame 13, so that two Y can move on the Y direction to frame 13; Z is a concave structure frame to frame 10; Its two ends connect to adjusting device 4 to frame 13 logical Z respectively at two Y; And the framework of its two ends through spill link up it, and then the adjusting at two ends all is synchronous, thus make Z to frame 4 can be on the Z direction steadily free from error moving; X is connected to frame with the Z of spill to adjusting device 11 through X to 6 on frame, through regulating X item adjusting device, X is moved on directions X to frame 6.At last, revolve platform be fixed on X on frame along with X moves to frame together, X provides a dogleg section to be used for loading to frame to revolve platform 7, it is terminal that 9 of thermal infrared imagers are fixed on the rotating shaft of revolving platform.The positioning action mode of this positioner is following: at first; Regulate respectively X to adjusting knob 12, Y to adjusting knob 3 and Z to adjusting knob 5; Make X on its direction, move respectively to frame to frame and Z, thereby thermal infrared imager is positioned on the point of the lathe head of a bed corresponding to cutter to frame, Y; Then, adjusting knob 8 is so that the cutter head of the alignment lens cutter of thermal infrared imager 9, thereby reaches the effect of accurate location.
In this embodiment one, Y is vertical bending-like to frame 13 so that provide one with Z to position that frame 10 is connected and Z can be arranged on the Z direction to adjusting device.X provides a dogleg section to be used for loading to frame to revolve platform 7, to make that revolving platform is fixed on X on frame, and makes thermal infrared imager on the ZY plane, have enough spaces to adjust.
Be illustrated in figure 3 as second kind of embodiment of the present invention, different with embodiment one is, present embodiment only needs a fixed mount 1, a Y picture frame 13 and a Z to frame.The benefit of this kind design is; Regulate Y to frame 13 with Z during to frame 10, only need regulate an adjusting device (Y to adjusting device 2 and Z to adjusting device 4), as shown in Figure 1; Adjust Y and need adjust two Y to adjusting device 2 to the position of frame; If generation is asynchronous in adjustment process, be easy to cause error and long-time nonsynchronous adjusting can cause the wearing and tearing of adjusting device, to such an extent as to reduce the precision of adjusting device.But positioner shown in Figure 1 also because of it has two fixed mounts 1, two Y make on its overall structure to frame 10 to the Z of a frame 13 and a spill and more tend towards stability, is difficult for taking place loosening.
In above two embodiment; Employed adjusting device (be X to adjusting device 11, Y to adjusting device 2 and Z to adjusting device 4) is the adjusting device of micron order precision; And revolve the angle regulator that platform is an effectiveness of classification; Through high-precision adjusting device, thereby make the location of positioner reach high-precision location.Described adjusting device is the cooperation of screw mandrel and nut, and the spacing on the screw mandrel is a micron order, and screw mandrel is connected with adjusting knob through bevel gear, through rotating adjusting knob screw mandrel drive nut is moved, and moves thereby drive the direction frame.And the said platform that revolves is the gear pair that two adjusting gears and driven gear are meshing with each other and form.
Need to prove that among the present invention, said directions X, Y direction, Z direction and said X are relative coordinate to frame, Y to frame, Z X, Y, Z in frame, are not limited to the coordinate direction shown in the accompanying drawing.Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (11)
1. test the thermal infrared imager positioner that PCB bores the milling temperature for one kind, comprising: fixed mount and revolve platform; It is characterized in that; Said positioner also comprises: X to frame, Y to frame and Z to three kinds of direction framves of frame; Any is connected in said fixed mount and the direction frame; The said platform that revolves is fixed on the said direction frame, between the said direction frame and between direction frame and the fixed mount through can direction frame mobile adjusting device on its direction being connected.
2. a kind of thermal infrared imager positioner that PCB bores the milling temperature of testing as claimed in claim 1 is characterized in that said fixed mount is fixed on the main shaft fixed head of tested lathe.
3. a kind of thermal infrared imager positioner that PCB bores the milling temperature of testing as claimed in claim 1 is characterized in that said Y is connected with fixed mount to frame.
4. a kind of thermal infrared imager positioner that bores PCB milling temperature of testing as claimed in claim 3 is characterized in that said Z is connected to frame with Y to frame, and said X is connected to frame with said Z to frame, and the said platform that revolves is fixed on X on frame.
5. a kind of thermal infrared imager positioner that PCB bores the milling temperature of testing as claimed in claim 1 is characterized in that, said positioner comprises two said fixed mounts and two corresponding with it same a kind of direction framves.
6. a kind of thermal infrared imager positioner that PCB bores the milling temperature of testing as claimed in claim 1; It is characterized in that; Said positioner only comprises X that Z that a said fixed mount, Y who links to each other with said fixed mount link to each other to frame to frame, one and said Y links to each other to frame to frame and one and said Z to frame, and the said platform that revolves is fixed on X on frame.
7. a kind of thermal infrared imager positioner that PCB bores the milling temperature of testing as claimed in claim 1 is characterized in that the precision of said adjusting device is a micron order.
8. a kind of thermal infrared imager positioner that PCB bores the milling temperature of testing as claimed in claim 7 is characterized in that, said adjusting device comprise a screw mandrel and with the intermeshing nut of said screw mandrel.
9. a kind of thermal infrared imager positioner that PCB bores the milling temperature of testing as claimed in claim 1 is characterized in that said precision of revolving platform is classification.
10. a kind of thermal infrared imager positioner that PCB bores the milling temperature of testing as claimed in claim 9 is characterized in that, said revolve platform comprise adjusting gear and with the intermeshing driven gear of said adjusting gear.
11. test the thermal infrared imager localization method that PCB bores the milling temperature for one kind, it is characterized in that, may further comprise the steps:
A: regulate three three dimensional space coordinate positions of thermal infrared imager, three coordinate positions regulating thermal infrared imager comprise X, Y, three coordinates of Z respectively,
B: regulate thermal infrared imager camera lens angle in one plane, thermal infrared imager camera lens angle is in the plane accomplished through in one plane rotating this video camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102976575A CN102501144A (en) | 2011-09-30 | 2011-09-30 | Positioning device and positioning method of thermal infrared imager for testing drilling and milling temperature of PCBs (printed circuit boards) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102976575A CN102501144A (en) | 2011-09-30 | 2011-09-30 | Positioning device and positioning method of thermal infrared imager for testing drilling and milling temperature of PCBs (printed circuit boards) |
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| CN102501144A true CN102501144A (en) | 2012-06-20 |
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| CN2011102976575A Pending CN102501144A (en) | 2011-09-30 | 2011-09-30 | Positioning device and positioning method of thermal infrared imager for testing drilling and milling temperature of PCBs (printed circuit boards) |
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| CN104354076A (en) * | 2014-10-30 | 2015-02-18 | 成都爱斯顿测控技术有限公司 | Machine tool |
| CN104772657A (en) * | 2015-04-10 | 2015-07-15 | 上海交通大学 | Cutting temperature monitoring device and method of side milling process |
| CN105751008A (en) * | 2016-05-05 | 2016-07-13 | 南京航空航天大学 | Method for measuring temperature of polycrystalline diamond cutter for turning titanium based compound material |
| CN105973494A (en) * | 2016-05-05 | 2016-09-28 | 盐城工学院 | Method for measuring temperature of turning titanium matrix composite with coated cutter |
| CN104122472B (en) * | 2014-08-04 | 2017-02-22 | 珠海格力电器股份有限公司 | Detection system and detection method for judging heating uniformity of electric heating tubes |
| CN110076629A (en) * | 2019-04-25 | 2019-08-02 | 武汉企鹅能源数据有限公司 | Tool failure process real-time detection and optimization data analysis system |
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Application publication date: 20120620 |