CN102465248B - Protective cover and surface treatment method thereof - Google Patents

Protective cover and surface treatment method thereof Download PDF

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Publication number
CN102465248B
CN102465248B CN 201010546461 CN201010546461A CN102465248B CN 102465248 B CN102465248 B CN 102465248B CN 201010546461 CN201010546461 CN 201010546461 CN 201010546461 A CN201010546461 A CN 201010546461A CN 102465248 B CN102465248 B CN 102465248B
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protective
cover
surface
treatment
method
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CN 201010546461
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CN102465248A (en )
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朱春明
高华伟
罗明新
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无锡华润上华半导体有限公司
无锡华润上华科技有限公司
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Abstract

本发明涉及一种防护罩的表面处理方法,包括成型防护罩步骤,还包括用铝材料对防护罩表面进行熔射处理的步骤。 The present invention relates to a method for processing a surface of the shield, the shield comprising forming step, further comprising a protective cover on the surface of aluminum material spraying step process. 本发明还涉及一种用于半导体金属等离子沉积的防护罩,该防护罩的表面均匀覆盖铝材料层。 The present invention further relates to a semiconductor metal plasma deposition shield for the shield layer surface is uniformly covered with an aluminum material. 上述防护罩的表面处理方法和使用该方法处理后的防护罩,在防护罩表面熔射一层铝材,增强了防护罩的吸附能力,且因为铝能承受较大的温差变化,因此能大大降低防护罩表面的金属薄膜脱落至圆片上的几率,改善了产品的良率,提高了生产效率。 The surface treatment method using the above-described shield and after the guard processing method, spray a layer of aluminum on the surface of the shield, to enhance the adsorption capacity of the shield, and because aluminum can withstand greater temperature changes, it is possible to greatly reducing the metal thin film surface of the shield to the probability of falling on the wafer, improved product yield, improve the production efficiency.

Description

防护罩的表面处理方法及防护罩 The surface treatment method of the shield and shield

【技术领域】 TECHNICAL FIELD

[0001] 本发明涉及半导体工艺,尤其涉及一种防护罩的表面处理方法,还涉及一种用于半导体金属等离子沉积的防护罩。 [0001] The present invention relates to semiconductor processing, in particular, relates to a method for surface treatment of the shield, the shield further relates to a method for plasma deposition of a metal semiconductor.

【背景技术】 【Background technique】

[0002] 在使用金属等离子体(IMP)淀积金属(或合金)薄膜,例如氮化钛的过程中,不仅会淀积到圆片(wafer)上,也会淀积到机台腔体(chamber)的内表面。 [0002] In a metal plasma (IMP) deposition of a metal (or alloy) film, for example, titanium nitride process, not only deposited onto the wafer (the wafer), the machine will be deposited into the cavity ( Chamber inner surface) of the. 因此厂商在设计机台时就配备了一些零件(parts),例如防护罩,来保护腔体的内表面。 Therefore manufacturers in the design of the machine is equipped with parts on (Parts), e.g. protective cover to protect the inner surfaces of the cavity. 这样氮化钛(或其他金属、合金)就只会淀积到圆片和防护罩的表面,只需隔一段时间将防护罩拆下清洗就可循环使用。 Such titanium nitride (or other metal alloys) is deposited only on the surface of the wafer and the guard, the guard intervals removed simply wash cycle can be used.

[0003] 为了防止沉积到防护罩的金属或合金脱落,传统技术是对防护罩表面进行喷砂处理,通过增加防护罩表面的粗糙度,以增强防护罩表面与金属(或合金)薄膜之间的黏附性。 [0003] In order to prevent the deposition shield off a metal or alloy, the conventional technique is to shield the surface blasting, by increasing the surface roughness of the protective cover to enhance the surface of the shield metal (or alloy) film between the the adhesion.

[0004] 然而对于一些金属或合金来说(例如氮化钛),其特性受温度影响较大,若温度变化较大或较频繁,则传统的防护罩仍会不足以黏附住氮化钛,造成防护罩表面氮化钛颗粒掉落在圆片上,引起圆片良率的降低。 [0004] However, for some metals or alloys (e.g., titanium nitride), which is affected by temperature characteristic, if the temperature change larger or more frequently, the conventional hood stay still insufficient adhesion of titanium nitride, shield surface resulting titanium nitride particles falling on the wafer, causing the wafer to reduce yield.

【发明内容】 [SUMMARY]

[0005] 基于此,有必要提供一种能够增强防护罩的吸附能力的防护罩的表面处理方法。 [0005] Based on this, it is necessary to provide a surface treatment method capable of enhancing the adsorption capacity of the protective cover of the shield.

[0006] 一种防护罩的表面处理方法,包括成型防护罩步骤,还包括用铝材料对防护罩表面进行熔射处理的步骤。 [0006] The surface treatment method of the shield, the shield comprising forming step, further comprising an aluminum shield material spraying the surface treatment step. ` `

[0007] 优选的,经过所述熔射处理步骤后,所述防护罩表面的粗糙度为120微米至150微米。 [0007] Preferably, after spraying said post-processing step, the roughness of the surface of shield 120 micrometers to 150 micrometers.

[0008] 优选的,在所述对防护罩进行熔射处理的步骤后还包括对防护罩进行喷砂处理的步骤。 [0008] Preferably, after the step of the guard process for spraying the shield further comprises the step of sandblasting.

[0009] 优选的,在所述对防护罩进行喷砂处理的步骤后,还包括对防护罩进行清洗处理的步骤。 [0009] Preferably, after said step of blasting the shield and the shield further comprises the step of cleaning process.

[0010] 优选的,所述熔射处理的步骤前还包括预喷砂的步骤。 [0010] Preferably, before the step of processing further comprises the step of spraying a pre-blasting.

[0011] 优选的,所述铝材料的粒径小于200微米。 [0011] Preferably, the particle size of the aluminum material is less than 200 microns.

[0012] 优选的,表面处理完成后的所述防护罩的表面的粗糙度为40微米至70微米。 [0012] Preferably, the surface roughness of the shield surface treatment after completion of 40 microns to 70 microns.

[0013] 还有必要提供一种吸附能力强的用于半导体金属等离子沉积的防护罩。 [0013] necessary to provide a strong adsorption capacity for a semiconductor plasma deposition of a metal shield.

[0014] 一种用于半导体金属等离子沉积的防护罩,所述防护罩的表面均匀覆盖铝材料层。 [0014] A semiconductor plasma deposition of a metal shield, said shield covering a surface of a uniform layer of an aluminum material.

[0015] 优选的,所述防护罩表面的铝材料层通过喷砂工艺达到预定粗糙度。 [0015] Preferably, the protective layer of the aluminum material surface of the cover reaches a predetermined roughness by sandblasting process.

[0016] 优选的,所述防护罩表面的铝材料层的粗糙度为40微米至70微米。 [0016] Preferably, the roughness of the protective cover layer of an aluminum material surface is 40 microns to 70 microns.

[0017] 上述防护罩的表面处理方法和使用该方法处理后的用于半导体金属等离子沉积的防护罩,在防护罩表面熔射一层铝材,由于铝材料有较好的粘附性,增强了防护罩的吸附能力,且因为铝能承受较大的温差变化,因此能大大降低防护罩表面的金属薄膜脱落至圆片上的几率,改善了产品的良率,提高了生产效率。 [0017] The surface treatment method using the above-described shield and a metal shield for a semiconductor plasma deposition method after the treatment, the surface of the spray shield layer of aluminum, since aluminum has a good adhesion, enhanced the adsorption capacity of the shield, and because aluminum can withstand greater temperature changes, it is possible to greatly reduce the chance of the metallic thin film shield to fall on the wafer surface, improving the product yield, improve the production efficiency.

【附图说明】 BRIEF DESCRIPTION

[0018] 图1是一个实施例中防护罩的表面处理方法的流程图; [0018] FIG. 1 is a flowchart showing a surface processing method according to one embodiment of the shield;

[0019] 图2是铝粉末熔射到防护罩的表面后的示意图。 [0019] FIG. 2 is a schematic view of the surface of the molten aluminum powder incident shield. 【具体实施方式】 【detailed description】

[0020] 为使本发明的目的、特征和优点能够更为明显易懂,下面结合附图对本发明的具体实施方式做详细的说明。 [0020] For purposes of the present invention, features and advantages are more apparent from the following drawings in conjunction with a detailed description of specific embodiments of the present invention.

[0021] 一种防护罩的表面处理方法,包括成型防护罩步骤,还包括用铝材料对防护罩表面进行熔射处理的步骤:用铝材料对防护罩进行熔射处理。 [0021] The surface treatment method of the shield, the shield comprising forming step, further comprising a protective cover on the surface of aluminum material spraying step process: the shield material for aluminum spraying process. 将熔融状态的铝粉末熔射(溅射)到防护罩的表面,使铝材在防护罩的表面均匀沉积,形成均匀覆盖的铝材料层。 Aluminum powder spraying molten state (sputtering) to shield the surface of the aluminum material uniformly deposited on the surface of the shield, an aluminum material layer having a uniform coverage.

[0022] 图1是一个实施例中防护罩的表面处理方法的流程图,包括下列步骤: [0022] FIG. 1 is a flowchart showing a surface processing method of one embodiment embodiment of the shield, comprising the steps of:

[0023] S110,用铝材料对防护罩进行熔射处理。 [0023] S110, the shield material for aluminum spraying process. 可以采用火焰粉末熔射,将熔融状态的铝粉末熔射到防护罩的表面,使铝材在防护罩的表面均匀沉积,形成均匀覆盖的铝材料层。 Powder flame spraying may be employed, the melt strikes the shield surface of the aluminum powder in a molten state, so that uniform deposition of aluminum in the shield surface, an aluminum material layer having a uniform coverage.

[0024] 在本实施例中,铝粉末的粒径小于200微米,使用的铝材料纯度应大于99.99%,熔射时是将防护罩置于密闭腔室内进行熔射,腔室的温度通过控制电流的大小进行调节。 [0024] In the present embodiment, the particle size of the aluminum powder is less than 200 microns, the aluminum material used should be greater than 99.99% purity, when the spray shield is placed in a closed chamber for spraying, by controlling the temperature of the chamber magnitude of the current is adjusted. 由于瞬时电流可能过大,熔射时腔室温度可能会瞬间过高,待电流稳定后腔室温度应控制在120~150摄氏度之间。 Since the transient current may be too large, when the spraying chamber temperature may momentarily excessively high current to be stable after the chamber temperature should be controlled between 120 to 150 degrees Celsius.

[0025] 在本实施例中,SllO步骤后防护罩表面的粗糙度应控制在120微米~150微米之间。 [0025] In the present embodiment, the surface roughness of the rear protective cover SllO step should be controlled between 120 microns and 150 microns. 粗糙度是指:铝粉末溅镀到防护罩上时,铝粉末的峰尖和谷底的高度差,如图2所示,其单位为微米。 Roughness refers to: sputtering an aluminum powder to the protective cover, the height difference between the peak top and bottom of the aluminum powder, shown in Figure 2, in units of microns. 若粗糙度太高,铝材易从防护罩表面脱落,若粗糙度太低,则吸附的效果不佳。 If the roughness is too high, poor shedding from the shield of aluminum surface, if the roughness is too low, the adsorption effect.

[0026] S120,对防护罩进行喷砂处理。 [0026] S120, the shield of sandblasting. 将砂材高速喷射到防护罩表面,使表面整洁,然后吹净防护罩表面的多余砂材,吹净可以使用气枪。 The high velocity jet of sand material to shield surface, clean the surface, and then blowing excess material net sand shield surface, blowing air gun may be used.

[0027] S130,对防护罩进行清洗处理,清洗处理后的粗糙度可以达到40微米~70微米。 [0027] S130, the shield of the cleaning process, the cleaning process may roughness of 40 microns to 70 microns.

[0028] 还可以在对防护罩进行熔射处理之前,先进行清洁处理。 [0028] may also be carried out prior to the spraying process the shield, the first cleaning process. 首先使用相应溶液对防护罩进行浸泡,以去除防护罩上粘附的金属(或合金)薄膜,在对防护罩进行水洗,去除前述溶液,最后对防护罩进行干燥处理。 First, using the corresponding solution to soak the shield, adhered to remove protective cast metal (or alloy) film, the protective cover of water washing, the solution is removed, the shield finally dried. 清洁处理完成后,还可以对防护罩表面进行预喷砂处理:将砂材高速喷射到防护罩表面,使表面粗糙。 After the cleaning process is completed, the shield can also be of the surface of the pre blasting: The high velocity jet of sand material to shield the surface, to roughen the surface.

[0029] 本发明还提供一种使用上述方法处理后的用于半导体金属等离子沉积的防护罩,该防护罩进行处理后表面均匀覆盖铝材料层。 After [0029] The present invention also provides a protective cover for a semiconductor using metal plasma deposition process after the above-described methods, the treated surface of the protective cover covering the aluminum material layer uniform. 在优选的实施例中,所述防护罩表面的铝材料层通过喷砂工艺达到预定粗糙度,防护罩的表面的粗糙度为40微米~70微米。 In a preferred embodiment, the protective layer of the aluminum material surface of the cover reaches a predetermined roughness by sandblasting process, the roughness of the shield surface is 40 microns to 70 microns.

[0030] 上述防护罩的表面处理方法和使用该方法处理后的防护罩,在防护罩表面熔射一层铝材,由于铝材料有较好的粘附性,增强了防护罩的吸附能力,且因为铝能承受较大的温差变化,因此能大大降低防护罩表面的金属薄膜(例如氮化钛)脱落至圆片上的几率,改善了广品的良率,提闻了生广效率。 [0030] The surface treatment method using the above-described shield and after the guard processing method, spraying the surface of the shield layer of aluminum, since aluminum has a good adhesion, enhancing the adsorption capacity of the shield, since aluminum and can withstand greater temperature changes, it is possible to greatly reduce the surface of the metallic thin film shield (e.g., titanium nitride), the probability to fall on the wafer, to improve the yield of a wide article, mention smell Shengguang efficiency.

[0031] 以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。 [0031] Expression of the above-described embodiments are only several embodiments of the present invention, and detailed description thereof is more specific, but can not therefore be understood as limiting the scope of the present invention. 应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。 It should be noted that those of ordinary skill in the art, without departing from the spirit of the present invention, can make various changes and modifications, which fall within the protection scope of the present invention. 因此,本发明专利的保`护范围应以所附权利要求为准。 Thus, the protection scope of the patent protection of the present 'invention, the appended claims should prevail.

Claims (1)

  1. 1.一种防护罩的表面处理方法,包括成型防护罩步骤,其特征在于,还包括用铝材料对防护罩表面进行熔射处理的步骤,所述熔射处理的步骤前还包括预喷砂的步骤;经过所述熔射处理步骤后,所述防护罩表面的粗糙度为120微米至150微米;在所述对防护罩进行熔射处理的步骤后还包括对防护罩进行喷砂处理的步骤;在所述对防护罩进行喷砂处理的步骤后还包括对防护罩进行清洗处理的步骤;所述铝材料的粒径小于200微米,铝材料纯度大于99.99%,表面处理完成后的所述防`护罩的表面的粗糙度为40微米至70微米。 1. A method for surface treatment of the shield, the shield comprising a step of forming, characterized by further comprising a protective cover on the surface of aluminum material for thermal spraying process step, prior to said step of melt shot blasting pre-treatment further comprises step; process after the spraying step, the surface roughness of the shield 120 to 150 microns; shroud after said step of spraying process further comprises a shield sandblasting step; shroud after said step of processing further comprises the step of blast cleaning process is performed on the protective cover; particle size of the aluminum material is less than 200 microns, greater than 99.99% purity of the aluminum material, the surface treatment is completed after `said shield against surface roughness of 40 microns to 70 microns.
CN 201010546461 2010-11-16 2010-11-16 Protective cover and surface treatment method thereof CN102465248B (en)

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CN1609259A (en) 2003-10-22 2005-04-27 应用材料公司 Cleaning and refurbishing chamber components having metal coatings
CN1904124A (en) 2005-07-29 2007-01-31 波克股份有限公司 Method and apparatus for the application of twin wire arc spray coatings
CN201012933Y (en) 2007-01-23 2008-01-30 上海贺利氏工业技术材料有限公司 Aluminium cover for magnetron sputtering film-plating

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Publication number Priority date Publication date Assignee Title
US7579067B2 (en) * 2004-11-24 2009-08-25 Applied Materials, Inc. Process chamber component with layered coating and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1609259A (en) 2003-10-22 2005-04-27 应用材料公司 Cleaning and refurbishing chamber components having metal coatings
CN1904124A (en) 2005-07-29 2007-01-31 波克股份有限公司 Method and apparatus for the application of twin wire arc spray coatings
CN201012933Y (en) 2007-01-23 2008-01-30 上海贺利氏工业技术材料有限公司 Aluminium cover for magnetron sputtering film-plating

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