CN102463412A - Method for adjusting laser processing parameters and laser machining machine for adjusting parameters automatically - Google Patents
Method for adjusting laser processing parameters and laser machining machine for adjusting parameters automatically Download PDFInfo
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Abstract
The invention relates to a method for adjusting laser processing parameters. The method is used for adjusting a plurality of laser parameters of Q switch laser and comprises the following steps of: acquiring the range of candidate numbers of the laser parameters by experiments, wherein the laser parameters comprise the depth of focal length, Q switch frequency and laser power; acquiring the optimum parameter number combination which meets the quality requirement of processing by the experiments in a combination of an upper limit value, a lower limit value and an intermediate value within the range of the candidate numbers of the laser parameters; updating the range of the candidate numbers of the laser parameters by a bisection method according to the optimum parameter number combination; and repeating the previous step until space between the intermediate value and the upper limit value and the lower limit value within the range of the candidate numbers of the laser parameters accords with the minimum settable resolution ratio of the laser parameters. In addition, a method for adjusting a plurality of laser parameters of pulse laser and a laser machining machine for adjusting the parameters automatically are also provided.
Description
Technical field
The present invention is relevant for a kind of parameter adjusting process, particularly a kind of laser process parameter adjusting process.
Background technology
Laser line processing procedure is widely used in the line cutting of solar battery sheet (Solar cell), Silicon Wafer (Wafer), semi-conducting material and ceramic material.The advantage that replaces the cutting of conventional knives wheel with laser line processing procedure is only need cut the surface, need pass through the action of edging and cleaning again after the cutting of omission break bar, and improves the shortcoming that is prone to the generation fragment with the break bar cutting.But it possibly cause the cutting surface burned black or surperficial because of the cracked prominent round phenomenon (Hillock) that the melting material is squeezed into the ridge shape of pressure.Therefore, the laser parameters of choice provides the important key of good cutting surface quality.
The mechanism of laser equipment is complicated, so the parameter of its processing procedure is various, such as: laser power, laser focal length, laser rate travel, laser trigger frequency, Q-switch frequency etc.In order to cater to the different product demand, need each parameter is adjusted, to find out best parameter combinations.Yet the parameter kind is numerous, and can influence each other usually multiple combination of generation and experiment test between parameter.Moreover, also have and analyze the difficulty that is difficult for.Therefore, need have the expert of tool laser adjustment experience on production line, directly to adjust to process results usually, test influences processing procedure efficient and labor intensive repeatedly.
Therefore, need a kind of different laser processing procedure and different product quality requirements that be directed against, carry out efficient analytical method, make up, and produce the product of best in quality in order to finding out optimal parameter fast.
Summary of the invention
In view of this, main purpose of the present invention is to propose about laser process parameter adjusting process, in order to find out suitable parameter fast to satisfy laser crudy demand.
The present invention proposes a kind of laser process parameter adjusting process, and a plurality of laser parameters in order to adjustment Q-switch laser comprise the following step: obtain the candidate values scope of laser parameter with experiment, the laser parameter comprises depth of focus, Q-switch frequency and laser power; In the combination of the bound numerical value of the candidate values scope of laser parameter and median, obtain the optimal parameter combinations of values that meets the processing procedure quality requirement with experiment; According to the optimal parameter combinations of values, upgrade the candidate values scope of laser parameter with dichotomy; And repeat last step and set resolution ratio until the I that the spacing of median to the bound numerical value of the candidate values scope of laser parameter meets the laser parameter.In view of the above, can obtain the optimal setting numerical value of laser parameter.
Preferably; Obtain the step of the candidate values scope of laser parameter with experiment; Comprise: fixedly laser power and Q-switch frequency are the median of suitable number range; Obtain the candidate values scope that depth of focus meets the processing procedure quality with experiment,, then reduce laser power and experimentize again if all be not inconsistent the processing procedure quality; The fixed focal length degree of depth is the median of candidate values scope, and fixedly laser power is the median of suitable number range, tests out the candidate values scope that the Q-switch frequency meets the processing procedure quality, if all be not inconsistent the processing procedure quality, then reduce laser power and experimentizes; Reaching the fixed focal length degree of depth and Q-switch frequency is the median of candidate values scope, tests out the candidate values scope that laser power meets the processing procedure quality, if all be not inconsistent the processing procedure quality, then reduce the Q-switch frequency and experimentizes.
Preferably, in the combination of the bound numerical value of the candidate values scope of laser parameter and median, the step that obtains the optimal parameter combinations of values that meets the processing procedure quality requirement with experiment can adopt grey correlation method to carry out.
Preferably, whether the optimal parameter combinations of values meets the processing procedure quality is to judge with a plurality of characteristic parameters, and whether evenly whether prominent circle size, the line of cut that characteristic parameter comprises cutting live width, heat affected area size, cut edge cut off to reach line of cut.
The present invention also proposes a kind of laser process parameter adjusting process, and a plurality of laser parameters in order to adjustment pulsed laser comprise the following step: obtain the candidate values scope of laser parameter with experiment, the laser parameter comprises depth of focus and laser power; In the combination of the bound numerical value of the candidate values scope of laser parameter and median, obtain the optimal parameter combinations of values that meets the processing procedure quality requirement with experiment; According to the optimal parameter combinations of values, upgrade the candidate values scope of laser parameter with dichotomy; And repeat last step and set resolution ratio until the I that the spacing of median to the bound numerical value of the candidate values scope of laser parameter meets the laser parameter.In view of the above, can obtain the optimal setting numerical value of laser parameter.
Preferably, obtain the step of the candidate values scope of laser parameter, comprise: fixing frequency and the laser movement velocity of triggering with experiment; Fixedly laser power is obtained the candidate values scope that depth of focus meets the processing procedure quality with experiment; And the fixed focal length degree of depth is the median of candidate values scope; The adjustment laser power is to reaching minimum removal ability; And be set at the median of the candidate values scope of laser power, set the bound numerical value that resolution ratio is expanded as the candidate values scope of laser power with the I of laser power.
Preferably, in the combination of the bound numerical value of the candidate values scope of laser parameter and median, the step that obtains the optimal parameter combinations of values that meets the processing procedure quality requirement with experiment can adopt grey correlation method to carry out.
Preferably, whether the optimal parameter combinations of values meets the processing procedure quality is to judge with a plurality of characteristic parameters, and whether evenly whether prominent circle size, the line of cut that characteristic parameter comprises cutting live width, heat affected area size, cut edge cut off to reach line of cut.
Preferably; After repeating I that the spacing of last step until median to the bound numerical value of the candidate values scope of laser parameter meet the laser parameter and setting the step of resolution ratio; More comprise: feedback in real time laser machining coordinate and laser triggered time in the laser processing procedure, be toggled to the time delay of emission with the compensation laser.
Secondary objective of the present invention is the laser process parameter adjusting process of application of aforementioned, makes the YAG Laser Processing Equipment for Surface Treatment YAG platform carry out parameter optimization automatically.
The present invention proposes a kind of YAG Laser Processing Equipment for Surface Treatment YAG platform of Automatic parameter adjustment, comprises: processing platform, carry a workpiece; Laser devices is sent laser light and is processed workpiece; A plurality of sensing apparatus, a plurality of characteristic parameters of sensing workpiece after processing; And CCU, control processing platform, laser devices and a plurality of sensing apparatus, and the processing procedure quality requirement of reception external setting-up, CCU comprises: motion-control module, in order to relative motion between control laser devices and processing platform; The laser control module is in order to triggered time and a plurality of laser parameter of control laser devices; And automatic adjustment module, according to characteristic parameter, proofread and correct the laser parameter with aforesaid laser process parameter adjusting process.
Relevant preferred embodiment of the present invention and effect thereof, cooperate now graphic explanation as after.
Description of drawings
Fig. 1 is the laser process parameter adjusting process flow chart of first embodiment of the invention.
Fig. 2 is the laser process parameter adjusting process flow chart of second embodiment of the invention.
Fig. 3 is the YAG Laser Processing Equipment for Surface Treatment YAG platform block schematic diagram of third embodiment of the invention.
The primary clustering symbol description
S11～S14, S21～S25: step
3: the YAG Laser Processing Equipment for Surface Treatment YAG platform
31: processing platform
32: laser devices
321: laser light
331: coaxial vision module
332: surface profiler
333: height measuring instrument
334: four-point probe measures appearance
335: the micro-appearance of phase place
34: CCU
341: motion-control module
342: the laser control module
343: automatic adjustment module
4: workpiece
The specific embodiment
Below enumerate specific embodiment specifying content of the present invention, and with graphic as aid illustration.The symbol of mentioning in the explanation is with reference to diagrammatical symbol.
The kind of laser can be divided into two kinds of laser (Continuous Wave laser, CW laser) and pulsed laser (Pulsed laser) according to variable power.And pulsed laser can be subdivided into general pulsed laser, Q-switch laser and locked mode laser (Mode-lock laser), and its burst length is about 10 respectively
-3To 10
-6Second, several are to hundreds of 10
-9Second and 10
-12To 10
-15Second.In this, first embodiment of the invention is to be used for the vector pattern processing procedure, refers to that especially carrying out vector with the Q-switch laser moves processing; Second embodiment of the invention is to be used for discrete point motor pattern processing procedure, refers to especially carry out dot matrix motion processing with general pulsed laser.Following examples are to be cut into example with counter plate to describe.
Please, be the laser process parameter adjusting process flow chart of first embodiment of the invention with reference to shown in Figure 1.A kind of laser process parameter adjusting process, a plurality of laser parameters in order to adjustment Q-switch laser comprise the following step:
Step S11: obtain the candidate values scope of laser parameter with experiment, the laser parameter comprises depth of focus, Q-switch frequency and laser power.
In this, allly have the knack of this area person and should understand, before method of the present invention is carried out, should carry out the YAG Laser Processing Equipment for Surface Treatment YAG platform in advance and proofread and correct, to confirm the feasibility of laser processing.For example: the affirmation processing platform is level, understanding laser depth of focus (Depth of focus, DOF) scope.Step S11 more comprises the following step:
Step S111: fixedly laser power and Q-switch frequency are the median of suitable number range, and obtain the candidate values scope that depth of focus meets the processing procedure quality with experiment, if all be not inconsistent the processing procedure quality, then reduce laser power and experimentize.
In this, be immobilisation factor with laser power and Q-switch frequency, the conversion depth of focus experimentizes.If processing result does not meet the processing procedure quality, then adjust depth of focus again, and then obtain effective depth of focus scope.Yet, because of laser power little than the Q-switch frequency for the influence of crudy.So, then reduce laser power and experimentize again, until finding the depth of focus scope that meets the processing procedure quality if fail to find the depth of focus scope that meets the processing procedure quality.
Step S112: the fixed focal length degree of depth is the median of candidate values scope; Fixedly laser power is the median of suitable number range; Test out the Q-switch frequency and meet the candidate values scope of processing procedure quality,, then reduce laser power and experimentize again if all be not inconsistent the processing procedure quality.
In this, as step S111, be immobilisation factor but change with depth of focus and laser power, conversion Q-switch frequency experimentizes.Because of step S111 has found suitable depth of focus scope, therefore the depth of focus of this step is set at the median of candidate values scope.
If processing result does not meet the processing procedure quality, then adjust the Q-switch frequency again, and then obtain effective Q-switch frequency range.Yet, because of laser power little than depth of focus for the influence of crudy.So, then reduce laser power and experimentize again, until finding the Q-switch frequency range that meets the processing procedure quality if fail to find the Q-switch frequency range that meets the processing procedure quality.
Step S113: the fixed focal length degree of depth and Q-switch frequency are the median of candidate values scope, test out the candidate values scope that laser power meets the processing procedure quality, if all be not inconsistent the processing procedure quality, then reduce the Q-switch frequency and experimentize.
In this, as step S112, be immobilisation factor but change with depth of focus and Q-switch frequency, the conversion laser power experimentizes.Because of step S111 and step S112 have found suitable depth of focus scope and Q-switch frequency range, therefore depth of focus scope and the Q-switch frequency setting with this step is the median of candidate values scope.
If processing result does not meet the processing procedure quality, then adjust laser power again, and then obtain effective laser power scope.Yet, because of the Q-switch frequency little than depth of focus for the influence of crudy.So, then reduce the Q-switch frequency and experimentize again, until finding the laser power scope that meets the processing procedure quality if fail to find the laser power scope that meets the processing procedure quality.
Step S12: in the combination of the bound numerical value of the candidate values scope of laser parameter and median, obtain an optimal parameter combinations of values that meets the processing procedure quality requirement with experiment.
In this, test out the candidate values scope of laser parameter by step S111 to step S113, can get the bound numerical value and the median of candidate values scope.Continuous and, find out the best combination of crudy, (Grey Relational Analysis GRA) carries out particularly can to adopt grey correlation method.For example: the following optimal parameter combinations of values that is limited to of the median of the upper limit of depth of focus, Q-switch frequency and laser power.
Step S13:, upgrade the candidate values scope of laser parameter with dichotomy according to the optimal parameter combinations of values.
In this, be positioned at the trend of candidate values scope according to the optimal parameter combinations of values, the candidate values scope is dwindled half the with dichotomy.For example: the optimal parameter of depth of focus is the upper limit of its candidate values scope, then the candidate values scope is reduced into the first half of candidate values scope.
Step S14: repeat last step and set resolution ratio until the I that the spacing of median to the bound numerical value of the candidate values scope of laser parameter meets the laser parameter.
In this, according to the minimum resolution of the laser capable setting parameter of laser board, as the halt that repeats dichotomy.In view of the above, can obtain the optimal setting numerical value of depth of focus, Q-switch frequency and laser power.
Above-mentioned about judging whether the optimal parameter combinations of values meets the foundation of processing procedure quality, is to judge with a plurality of characteristic parameters.Characteristic parameter comprises cutting live width, heat affected area, and (Heat-affectedzone, HAZ) whether evenly whether prominent circle size, the line of cut of size, cut edge cut off and reach line of cut.Decide by actual processing procedure quality requirement in fact.In this, said processing can be cutting, melts etching, boring or annealing (Annealing).Therefore haveing the knack of the characteristic parameter that this area person will be understood that above-mentioned judgement processing procedure quality is not as limit.
Please, be the laser process parameter adjusting process flow chart of second embodiment of the invention with reference to shown in Figure 2.A kind of laser process parameter adjusting process, a plurality of laser parameters in order to adjustment pulsed laser comprise the following step:
Step S21: obtain the candidate values scope of laser parameter with experiment, the laser parameter comprises depth of focus and laser power.In this, step S21 more comprises the following step:
Step S211: fixing frequency and the laser movement velocity of triggering.
In this, laser movement velocity indication is the speed of related movement of laser light and processing platform, can be the movement velocity of processing platform or the movement velocity of laser devices, and the workpiece that processing platform carries is processed.According to hot spot Duplication (overlap ratio) and laser live width, can determine laser to trigger frequency and laser movement velocity.For example: live width, Duplication with 20 μ m are 50%, if movement velocity is 500mm/s, need the triggering frequency of 50kHz approximately.
Step S212: fixing laser power, obtain the candidate values scope that depth of focus meets the processing procedure quality with experiment.
In this, because of depth of focus is big for the influence of crudy than laser power, so preferentially find out the candidate values scope of depth of focus.In this, be immobilisation factor with the laser power, the conversion depth of focus experimentizes.If processing result does not meet the processing procedure quality, then adjust depth of focus again, and then obtain effective depth of focus scope.
Step S213: the fixed focal length degree of depth is the median of candidate values scope; Adjust this laser power to reaching minimum removal ability; And be set at the median of the candidate values scope of laser power, set the bound numerical value that resolution ratio is expanded as the candidate values scope of laser power with the I of laser power.
In this, be immobilisation factor with the depth of focus, and be set at the median of candidate values scope that the conversion laser power experimentizes.When laser reaches the minimum removal ability of removing material, this laser power is set at the median of candidate values scope.Continuous and minimum resolution that can set with laser power is expanded as the bound numerical value of candidate values scope from the median of candidate values scope, carries out in order to subsequent step.
Step S22: in the combination of the bound numerical value of the candidate values scope of laser parameter and median, obtain an optimal parameter combinations of values that meets the processing procedure quality requirement with experiment.
In this, test out the candidate values scope of laser parameter by step S211 to step S213, can get the bound numerical value and the median of candidate values scope.Continuous and, find out the best combination of crudy, particularly can adopt grey correlation method to carry out.For example: the upper limit of depth of focus and the median of laser power are the optimal parameter combinations of values.
Step S23:, upgrade the candidate values scope of laser parameter with dichotomy according to the optimal parameter combinations of values.
In this, be positioned at the trend of candidate values scope according to the optimal parameter combinations of values, the candidate values scope is dwindled half the with dichotomy.For example: the optimal parameter of depth of focus is the upper limit of its candidate values scope, then the candidate values scope is reduced into the first half of candidate values scope.
Step S24: repeat last step and set resolution ratio until the I that the spacing of median to the bound numerical value of the candidate values scope of laser parameter meets the laser parameter.
In this, according to the minimum resolution of the laser capable setting parameter of laser board, as the halt that repeats dichotomy.In view of the above, can obtain the optimal setting numerical value of depth of focus and laser power.
For laser is triggered and the laser synchronized movement, more comprise behind the step S24:
Step S25: feedback a laser machining coordinate and a laser triggered time in real time in the laser processing procedure, be toggled to the time delay of emission with the compensation laser.
In this, the X coordinate and the Y coordinate of the corresponding processing platform of back coupling laser, and the time of back coupling laser triggering are as the usefulness of real-time correction.When making laser and processing platform relative motion according to this, laser hot spot position sign closes expection, avoids not being inconsistent because of the laser trigger delay makes actual Working position and expection Working position, and causes the Duplication of laser hot spot inhomogeneous.In this, can see through the relative motion of proofreading and correct laser triggered time or adjustment laser and processing platform and reach.
Above-mentioned about judging whether the optimal parameter combinations of values meets the foundation of processing procedure quality, is to judge with a plurality of characteristic parameters.Whether evenly whether prominent circle size, the line of cut that characteristic parameter comprises cutting live width, heat affected area size, cut edge cut off to reach line of cut.Decide by actual processing procedure quality requirement in fact.In this, though the first order of the present invention second embodiment describes with panel cutting, the present invention is not as limit, and said processing can be cutting, melts etching, boring or annealing (Annealing).Therefore haveing the knack of the characteristic parameter that this area person will be understood that above-mentioned judgement processing procedure quality is not as limit.
See also shown in Figure 3ly, be the YAG Laser Processing Equipment for Surface Treatment YAG platform block schematic diagram of third embodiment of the invention.A kind of YAG Laser Processing Equipment for Surface Treatment YAG platform 3 of Automatic parameter adjustment comprises processing platform 31, laser devices 32, a plurality of sensing apparatus and CCU 34.Wherein, a plurality of sensing apparatus are selected from the group of coaxial vision module (Coaxial vision sensor) 331, surface profiler (Laser profiling sensor) 332, height measuring instrument 333, four-point probe measurement appearance (Four-pointprobe) 334, the micro-appearance 335 of phase place and composition thereof.
In this, judge the step that meets the processing procedure quality among aforementioned first and second embodiment, can see through a plurality of sensing apparatus in fact and obtain a plurality of characteristic parameters and input to automatic adjustment module 343.Automatically adjustment module 343 further according to the processing procedure quality requirement of outside input, is compared each characteristic parameter, and judges whether processing meets the processing procedure quality; Continuous and, notice laser control module 342 is carried out the adjustment of laser parameter.
And adjustment module 343 receives the triggered time of X, Y coordinate and the laser devices 32 of processing platform 31 automatically, and when laser triggers and the information of the Working position of correspondence to obtain.And then can carry out like abovementioned steps S25, be toggled to the time delay of emission by laser control module 342 compensation lasers, and adjust the laser triggered time, so that laser processing can be synchronized with processing platform 31 motions; Perhaps, the motion control parameter of adjustment processing platform 31 is carried out synchronously.
Particularly, processing platform 31 supplies to have more a test section the processing district that workpiece 4 processes except that having, and carries out the laser parameter for the laser process parameter adjusting process that utilizes aforementioned first and second embodiment in advance and selects.Behind the optimal setting numerical value of chosen laser parameter, process in the processing district.Add man-hour, can see through height measuring instrument 333 and the micro-appearance 335 fast detecting workpieces of phase place 4 surfaces, use fine setting laser parameter to meet the processing procedure quality.
In sum, the laser process parameter adjusting process that sees through the present invention's proposition can carry out the adjustment of laser process parameter systematically, and makes the converted products accord with expectation.And the YAG Laser Processing Equipment for Surface Treatment YAG platform that is proposed by the present invention cooperates aforementioned laser process parameter adjusting process, can reach the effect that laser board Automatic parameter is proofreaied and correct.
Though technology contents of the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Anyly have the knack of this art; Not breaking away from spirit of the present invention a little change and the retouching done, all should be covered by in the category of the present invention, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (10)
1. laser process parameter adjusting process, in order to a plurality of laser parameters of adjustment Q-switch laser, this adjusting process comprises the following step:
Obtain the candidate values scope of those laser parameters with experiment, those laser parameters comprise a depth of focus, a Q-switch frequency and a laser power;
In the combination of the bound numerical value of the candidate values scope of those laser parameters and median, obtain an optimal parameter combinations of values that meets the processing procedure quality requirement with experiment;
According to this optimal parameter combinations of values, upgrade the candidate values scope of those laser parameters with dichotomy; And
Repeat last step and set resolution ratio until the I that the spacing of median to the bound numerical value of the candidate values scope of those laser parameters meets those laser parameters.
2. laser process parameter adjusting process as claimed in claim 1 is characterized in that: obtain the step of the candidate values scope of those laser parameters with experiment, comprise:
The median that fixing this laser power and this Q-switch frequency are suitable number range obtains the candidate values scope that this depth of focus meets the processing procedure quality with experiment, if all be not inconsistent the processing procedure quality, then reduce this laser power and experimentizes;
Fixing this depth of focus is the median of candidate values scope; Fixing this laser power is the median of suitable number range; Test out this Q-switch frequency and meet the candidate values scope of processing procedure quality,, then reduce this laser power and experimentize again if all be not inconsistent the processing procedure quality; And
The median that fixing this depth of focus and this Q-switch frequency are the candidate values scope is tested out the candidate values scope that this laser power meets the processing procedure quality, if all be not inconsistent the processing procedure quality, then reduce this Q-switch frequency and experimentizes.
3. laser process parameter adjusting process as claimed in claim 1; It is characterized in that: in the combination of the bound numerical value of the candidate values scope of those laser parameters and median, the step that obtains an optimal parameter combinations of values that meets the processing procedure quality requirement with experiment can adopt grey correlation method to carry out.
4. laser process parameter adjusting process as claimed in claim 1; It is characterized in that: whether this optimal parameter combinations of values meets the processing procedure quality is to judge with a plurality of characteristic parameters, and whether evenly whether prominent circle size, the line of cut that those characteristic parameters comprise cutting live width, heat affected area size, cut edge cut off to reach line of cut.
5. laser process parameter adjusting process, in order to a plurality of laser parameters of adjustment pulsed laser, this adjusting process comprises the following step:
Obtain the candidate values scope of those laser parameters with experiment, those laser parameters comprise a depth of focus and a laser power;
In the combination of the bound numerical value of the candidate values scope of those laser parameters and median, obtain an optimal parameter combinations of values that meets the processing procedure quality requirement with experiment;
According to this optimal parameter combinations of values, upgrade the candidate values scope of those laser parameters with dichotomy; And
Repeat last step and set resolution ratio until the I that the spacing of median to the bound numerical value of the candidate values scope of those laser parameters meets those laser parameters.
6. laser process parameter adjusting process as claimed in claim 5 is characterized in that: obtain the step of the candidate values scope of those laser parameters with experiment, comprise:
Fixing one triggers a frequency and a laser movement velocity;
Fixing this laser power is obtained the candidate values scope that this depth of focus meets the processing procedure quality with experiment; And
Fixing this depth of focus is the median of candidate values scope; Adjust this laser power to reaching minimum removal ability; And be set at the median of the candidate values scope of this laser power, set the bound numerical value that resolution ratio is expanded as the candidate values scope of this laser power with the I of this laser power.
7. laser process parameter adjusting process as claimed in claim 5; It is characterized in that: in the combination of the bound numerical value of the candidate values scope of those laser parameters and median, the step that obtains an optimal parameter combinations of values that meets the processing procedure quality requirement with experiment can adopt grey correlation method to carry out.
8. laser process parameter adjusting process as claimed in claim 5; It is characterized in that: whether this optimal parameter combinations of values meets the processing procedure quality is to judge with a plurality of characteristic parameters, and whether evenly whether prominent circle size, the line of cut that those characteristic parameters comprise cutting live width, heat affected area size, cut edge cut off to reach line of cut.
9. laser process parameter adjusting process as claimed in claim 5 is characterized in that: more comprise after I that the spacing of last step until median to the bound numerical value of the candidate values scope of those laser parameters meet those laser parameters is set the step of resolution ratio in repeating:
Feedback a laser machining coordinate and a laser triggered time in real time in the laser processing procedure, be toggled to the time delay of emission with the compensation laser.
10. the YAG Laser Processing Equipment for Surface Treatment YAG platform of an Automatic parameter adjustment comprises:
One processing platform carries a workpiece;
One laser devices is sent a laser light and is processed this workpiece;
A plurality of sensing apparatus, a plurality of characteristic parameters of this workpiece of sensing after processing; And
One CCU is controlled this processing platform, this laser devices and those sensing apparatus, and receives the processing procedure quality requirement of external setting-up, and this CCU comprises:
One motion-control module is in order to control relative motion between this laser devices and this processing platform;
One laser control module is in order to triggered time and a plurality of laser parameter of controlling this laser devices; And
One automatic adjustment module is according to those characteristic parameters, to proofread and correct those laser parameters like each described laser process parameter adjusting process in the claim 1 to 9.
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| US20210252647A1 (en) * | 2020-02-17 | 2021-08-19 | Nps Co.,Ltd. | Laser processing system and method |
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| CN109128518A (en) * | 2018-08-22 | 2019-01-04 | 北京铂阳顶荣光伏科技有限公司 | The evaluating method of laser scribing machine and its technological ability |
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