CN102437072A - Method and system for scanning and scheduling wafer defects - Google Patents
Method and system for scanning and scheduling wafer defects Download PDFInfo
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- CN102437072A CN102437072A CN2011103862815A CN201110386281A CN102437072A CN 102437072 A CN102437072 A CN 102437072A CN 2011103862815 A CN2011103862815 A CN 2011103862815A CN 201110386281 A CN201110386281 A CN 201110386281A CN 102437072 A CN102437072 A CN 102437072A
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Abstract
The invention discloses a method and a system for scanning and scheduling wafer defects, and belongs to the field of semiconductor manufacturing. The method comprises the following steps of: determining the operation time of a production machine group and the wafer production capacity during the operation time; determining the scanning production capacity and the casual inspection rate of a defect scanning site; and scheduling wafers and performing wafer defect scanning according to the operation time, the wafer production capacity, the scanning production capacity and the casual inspection rate. The system comprises a first determining module, a second determining module and a scheduling module. According to the technical scheme provided by the invention, goods pileup and cross region sale can be avoided, and the scanning production capacity of the defect scanning site can be reasonably used; therefore, the speed of the production flow of the wafers is ensured, the production cycle of the wafers is shortened, and the balance between the scanning production capacity and the wafer quality is achieved.
Description
Technical field
The present invention relates to field of semiconductor manufacture, particularly a kind of wafer defect method for scanning and system.
Background technology
Along with the IC-components size is constantly dwindled, the complexity of technical process improves constantly, and defective scanning becomes particularly important in a whole process of production link, also is the crucial system that the emphasis difficult point is concentrated.At present; The production time of various production boards (Process EQ) is all more and more faster; In order to reduce the production board that breaks down to the harmful effect of on-line wafer and reduce influence time; Further improve the wafer yield, online defective scanning with in time find the root of defect problem, and carry out fast processing and just seem extremely important.
The heap goods of defective scanning website is very general with jumping goods phenomenon on the wafer manufacture line at present; A large amount of heap goods and jumping goods have influenced the speed of entire wafer production procedure; Assurance to the wafer quality has bad influence, therefore, estimates for the load of defective scanning website and just to seem particularly important.
Summary of the invention
The heap goods and the generation of jumping the goods phenomenon of defective scanning website guarantee the speed of wafer manufacture flow process and the quality of wafer on the wafer manufacture line, the invention provides a kind of method and system of wafer defect scan schedule, and technical scheme is following:
A kind of method of wafer defect scan schedule comprises:
Confirm to produce the activity duration of board group and the wafer production capacity in the said activity duration;
Confirm the scanning production capacity and the sampling observation rate of defective scanning website;
Dispatch said wafer to carry out wafer defect scanning according to said activity duration, said wafer production capacity, said scanning production capacity and said sampling observation rate.
A kind of system of wafer defect scan schedule comprises:
First determination module is used for confirming to produce the activity duration of board group and the wafer production capacity in the said activity duration;
Second determination module is used for confirming that defective scans the scanning production capacity of website;
Scheduler module is used for dispatching said wafer to carry out wafer defect scanning according to said activity duration, said wafer production capacity, said scanning production capacity and said sampling observation rate.
Technical scheme of the present invention is through confirming to produce the activity duration of board group and the wafer production capacity in this activity duration; And the scanning production capacity and the sampling observation rate of binding deficient scanning website; The future load of the website of analyzing defect scanning in advance, and then the scheduling wafer can reasonably utilize the scanning production capacity of defective scanning website to carry out the defective scanning of wafer; Heap goods and the generation of jumping the goods phenomenon on the wafer manufacture line have been avoided; Guarantee the speed of the production procedure of wafer, shortened the production cycle of wafer, reached the scanning production capacity of defective scanning website and the doulbe-sides' victory effect of wafer quality.
With reference to the explanation of accompanying drawing to the application embodiment, above-mentioned and other purpose of the application, feature and advantage will be more obvious through following.
Description of drawings
Fig. 1 is the flow chart according to the method for wafer defect scan schedule of the present invention;
Shown in Figure 2 for producing the sketch map of production capacity in the board group job time;
The sketch map that scans the scanning production capacity of website for defective shown in Figure 3;
Shown in Figure 4 is structure chart according to the system of wafer defect scan schedule of the present invention.
Embodiment
Describe specific embodiment of the present invention in detail below in conjunction with accompanying drawing.Should be noted that the embodiments described herein only is used to illustrate, be not limited to the present invention.
The invention provides a kind of method of wafer defect scan schedule, as shown in Figure 1, comprising: step
Further; Step 103 comprises: when wafer production capacity during greater than the number of wafers of defective scanning website in the activity duration interscan; Heighten scanning production capacity and/or turn down the sampling observation rate, and according to the scanning production capacity of heightening and/or the sampling observation rate scheduling wafer turned down to carry out wafer defect scanning.Wherein, this scanning production capacity of heightening is the maximum scan production capacity.
Further; Step 103 comprises: when wafer production capacity during less than the number of wafers of defective scanning website in the activity duration interscan; Turn down scanning production capacity and/or heighten the sampling observation rate, and according to the scanning production capacity of turning down and/or the sampling observation rate scheduling wafer heightened to carry out wafer defect scanning.Wherein, this sampling observation rate of heightening is maximum sampling observation rate.
Situation below in conjunction with concrete is described in detail the present invention.
First kind of situation:
As shown in Figure 2; Producing board production capacity hourly is 1 batch of wafer; Production board of the same type has 5, produces board for these 5 and is called production board group A, and the per hour production capacity of then producing board group A is 5 batches/hour; The production capacity of estimating of current production board group A is 20 batches of wafers, just means that also within these 4 hours, will have 20 batches of wafers may get into defective scanning website carries out defective scanning.Usually, every batch of wafer has 25 wafers, it will be appreciated by persons skilled in the art that the quantity that needs defective scanning of every batch of wafer can be adjusted as required, and protection scope of the present invention is not limited to this.Need to prove that just need for example about producing board group A, protection scope of the present invention is not limited to this.
The defective scanning machine per hour scans 2 batches of wafers, and the defective scanning machine of homotype has 2, and these 2 defective scanning machines are called defective scanning website A, and then the maximum scan production capacity of this defective scanning website A is 4 batches/hour, and is as shown in Figure 3.Need to prove that the quantity of the defective scanning machine that defective scanning website comprises is not limited to this numerical value, those skilled in the art can carry out different settings according to actual needs.Current wafer one in pending defective scannings such as defective scanning website A has 8 batches.The sampling observation rate of defective scanning website A is 100%, and this just means that defective scanning website A will inspect whole 20 batches of wafers of producing board group A production by random samples in ensuing 4 hours, and these 20 batches of wafers can carry out defective scanning website A with 5 batches/frequency hourly.Need to prove that usually, general defective scanning website A can inspect 2 wafers by random samples from every batch of wafer, but those skilled in the art can need the quantity of the wafer of sampling observation based on the actual conditions adjustment.For convenience, the quantity of the wafer that will at every turn inspect by random samples of the present invention is scaled batch being unit.At this moment, defective scanning website A carries out the generation that defective scanning has heap goods situation to wafer, and is as shown in table 1:
| Scanning is accomplished | At present etc. to be scanned | It is to be scanned newly to enter the station a little etc. | Scanning website total load | |
| 1 hour | 4 | 4 | 5 | 9 |
| 2 hours | 4 | 5 | 5 | 10 |
| 3 hours | 4 | 6 | 5 | 11 |
| 4 hours | 4 | 7 | 5 | 12 |
Table 1
Can find out that from table 1 after 4 hours, the total load of defective scanning website A is 12 batches of wafers, thereby causes the generation of heap goods situation.At this moment; System can be adjusted into 60% by 100% with the sampling observation rate that defective scans website A; Being defective scanning website A produces 12 batches of wafers that board group A produces next will inspecting by random samples in 4 hours; And these 12 batches of wafers can get into defective scanning website A with 3 batches/frequency hourly and carry out defective scanning, and are as shown in table 2:
| Scanning is accomplished | At present etc. to be scanned | It is to be scanned newly to enter the station a little etc. | Scanning website total load | |
| 1 hour | 4 | 4 | 3 | 7 |
| 2 hours | 4 | 3 | 3 | 6 |
| 3 hours | 4 | 2 | 3 | 5 |
| 4 hours | 4 | 1 | 3 | 4 |
Table 2
From table 2, can go out, after 4 hours, total load amount and the maximum scan production capacity of defective scanning website A are consistent.That is to say that in these 4 hours, the utilization rate of defective scanning website A obtains maximum using, and does not cause the phenomenon of heap goods.
Second situation:
In addition; The activity duration of supposing to produce board group A is identical with first kind of situation with the production production capacity, and the current wafer that scans in pending defectives such as defective scanning website A is 8 batches, defective scan website A maximum scan production capacity be 4 batches/per hour; And the scanning production capacity of current running be 2 batches/per hour; The sampling observation rate is 60%, promptly next in 4 hours defective scanning website A will inspect by random samples and produce 12 batches of wafers that board group A produces, and these 12 batches of wafers can get into defective scanning website A with 3 batches/frequency hourly; Defective scanning this moment website A carries out defective scanning, and is as shown in table 3:
| Scanning is accomplished | At present etc. to be scanned | It is to be scanned newly to enter the station a little etc. | Scanning website total load | |
| 1 hour | 2 | 6 | 3 | 9 |
| 2 hours | 2 | 7 | 3 | 10 |
| 3 hours | 2 | 8 | 3 | 11 |
| 4 hours | 2 | 9 | 3 | 12 |
Table 3
Can find out that from table 3 after 4 hours, the total load of defective scanning website A is 12 batches of wafers, thereby causes the generation of heap goods situation.At this moment, the scanning production capacity that system can scan website A with defective from 2 batches/per hour be adjusted into 4 batches/per hour (being the maximum scan production capacity), the sampling observation rate remains unchanged.Defective scanning website A carries out wafer defect scanning with the maximum scan production capacity then, and is as shown in table 4:
Table 4
From table 4, can go out, after 4 hours, total load amount and the maximum scan production capacity of defective scanning website A are consistent.That is to say, in these 4 hours, the utilization rate maximum using of defective scanning website A, and do not cause the phenomenon of piling goods.
The third situation:
The activity duration of supposing production board group is identical with first kind of situation with the production production capacity; Current wafer in pending defective scannings such as defective scanning website A is 7 batches; Defective scanning website A maximum scan production capacity be 4 batches/per hour, and the scanning production capacity of current running be 2 batches/per hour, the sampling observation rate is 60%; Promptly next in 4 hours defective scanning website A will inspect by random samples and produce 12 batches of wafers that board group A produces; These 12 batches of wafers can get into defective scanning website A with 3 batches/frequency hourly, and defective scanning this moment website A carries out defective scanning, and is as shown in table 5:
| Scanning is accomplished | At present etc. to be scanned | It is to be scanned newly to enter the station a little etc. | Scanning website total load | |
| 1 hour | 2 | 5 | 3 | 8 |
| 2 hours | 2 | 6 | 3 | 9 |
| 3 hours | 2 | 7 | 3 | 10 |
| 4 hours | 2 | 8 | 3 | 11 |
Table 5
Can find out that from table 5 after 4 hours, the total load of current defective scanning website A is 11 batches of wafers, thereby causes the generation of heap goods situation.At this moment; The scanning production capacity that system can scan website A with defective from 2 batches/per hour be adjusted into 3 batches/per hour; The sampling observation rate is adjusted into 40% by 60%; Promptly will inspect by random samples and produce 8 batches of wafers that board group A produces, and these 8 batches of wafers can get into defective scanning website A with 2 batches/frequency hourly and carry out defective scanning at 4 hours defectives scanning website A next, as shown in table 6:
| Scanning is accomplished | At present etc. to be scanned | It is to be scanned newly to enter the station a little etc. | Scanning website total load | |
| 1 hour | 3 | 4 | 2 | 6 |
| 2 hours | 3 | 3 | 2 | 5 |
| 3 hours | 3 | 2 | 2 | 4 |
| 4 hours | 3 | 1 | 2 | 3 |
Table 6
Can find out that from table 6 after 4 hours, the total load amount of defective scanning website A and the scanning production capacity of current running are consistent.That is to say, in these 4 hours, the utilization rate maximum using of defective scanning website A, and do not cause the phenomenon of piling goods.
The 4th kind of situation:
The activity duration of supposing to produce board group A is identical with first situation with the production production capacity, the maximum scan production capacity that defective scans website A be 6 batches/per hour, the wafer one that pending defective such as current scans has 12 batches.And the sampling observation rate of defective scanning website A is 40%, and this just means that defective scanning website A will inspect 8 batches of wafers producing board group A production by random samples in ensuing 4 hours, and these 8 batches of wafers can get into defective scanning website A with 2 batches/frequency hourly.Because the scanning production capacity of the current running of defective scanning website A is the maximum scan production capacity, can cause the scanning production capacity of defective scanning website A idle, as shown in table 7 like this:
| Scanning is accomplished | At present etc. to be scanned | It is to be scanned newly to enter the station a little etc. | Scanning website total load | |
| 1 hour | 6 | 6 | 2 | 8 |
| 2 hours | 6 | 2 | 2 | 4 |
| 3 hours | 4 | 0 | 2 | 2 |
| 4 hours | 2 | 0 | 2 | 2 |
Table 7
From table 7, can go out, from the 3rd hour, the scanning production capacity of defective scanning website A occurred idle.At this moment; System can be adjusted into 80% by 40% with the sampling observation rate that defective scans website A; Then next defective scanning website A will inspect 16 batches of wafers producing board group A production in 4 hours by random samples; And these 16 batches of wafers will get into defective scanning website A with 4 batches/frequency hourly and carry out defective scanning, and are as shown in table 8:
| Scanning is accomplished | At present etc. to be scanned | It is to be scanned newly to enter the station a little etc. | Scanning website total load | |
| 1 hour | 6 | 6 | 4 | 10 |
| 2 hours | 6 | 4 | 4 | 8 |
| 3 hours | 6 | 2 | 4 | 6 |
| 4 hours | 6 | 0 | 4 | 4 |
Table 8
Can find out that from table 8 in preceding 4 hours, the production capacity of defective scanning website A is at utmost utilized.At the 5th hour; Because the wafer of pending defective scanning such as current has only 4 batches; Have follow-up wafer need carry out defective scanning if produce board group A, then can adjust automatically, to have scanned 4 batches of last wafers to the scanning production capacity that defective scans website A.
The 5th situation
Different with the 4th situation is, when the idle situation of production capacity appearred in defective scanning website A, system can not adjust the sampling observation rate, and the scanning production capacity that just defective is scanned website A from 6 batches/per hour be adjusted into 4 batches/per hour, other conditions remain unchanged.At this moment, defective scanning website A carries out defective scanning, and is as shown in table 9:
| Scanning is accomplished | At present etc. to be scanned | It is to be scanned newly to enter the station a little etc. | Scanning website total load | |
| 1 hour | 4 | 8 | 2 | 10 |
| 2 hours | 4 | 6 | 2 | 8 |
| 3 hours | 4 | 4 | 2 | 6 |
| 4 hours | 4 | 2 | 2 | 4 |
Table 9
Can find out that from table 9 at the 5th hour, current total load and the current scanning production capacity of defective scanning website were consistent, are all 4 batches, therefore, in preceding 4 hours, the scanning production capacity that defective scans website A is fully used.
The 6th situation
Different with the 5th kind of situation is; System also can adjust the scanning production capacity and the sampling observation rate of defective scanning website simultaneously, the scanning production capacity that for example defective is scanned website A from 4 batches/per hour be adjusted into 5 batches/per hour, the sampling observation rate is adjusted into 65% from 40%; Promptly next 4 hours; Defective scanning website A can inspect by random samples and produce 13 batches of wafers that board group A produces, and these 13 batches of wafers frequency of entering into defective scanning website A be preceding 3 hours be 3 batches/per hour, the 4th hour is 4 batches.At this moment, defective scanning website A carries out defective scanning, and is as shown in table 10:
| Scanning is accomplished | At present etc. to be scanned | It is to be scanned newly to enter the station a little etc. | Scanning website total load | |
| 1 hour | 5 | 7 | 3 | 10 |
| 2 hours | 5 | 5 | 3 | 8 |
| 3 hours | 5 | 3 | 3 | 6 |
| 4 hours | 5 | 1 | 4 | 5 |
Table 10
Can find out that from table 10 at the 5th hour, the total load of defective scanning website A and the scanning production capacity of current running were consistent.In preceding 4 hours, the scanning production capacity of the current running of defective scanning website A is fully used.
The present invention also provides a kind of system of wafer defect scan schedule, and is as shown in Figure 4, comprising:
First determination module is used for confirming to produce the activity duration of board group and the wafer production capacity in the activity duration;
Second determination module is used for confirming that defective scans the scanning production capacity and the sampling observation rate of website;
Scheduler module, be used for based on this activity duration, this wafer production capacity, this scanning production capacity and should sampling observation rate scheduling wafer to carry out wafer defect scanning.
Further; Scheduler module; Specifically be used for heightening the scanning production capacity and/or turning down the sampling observation rate when wafer production capacity during greater than the number of wafers of defective scanning website in this activity duration interscan, and according to the scanning production capacity of heightening and/or the sampling observation rate scheduling wafer turned down to carry out wafer defect scanning.Wherein, this scanning production capacity of heightening is the maximum scan production capacity.
Further; Scheduler module; Specifically be used for turning down the scanning production capacity and/or heightening the sampling observation rate when wafer production capacity during less than the number of wafers of defective scanning website in this activity duration interscan, and according to the scanning production capacity of turning down and/or the sampling observation rate scheduling wafer heightened to carry out wafer defect scanning.Wherein, the sampling observation rate of heightening is maximum sampling observation rate.
Need to prove that system provided by the invention is applicable to the method for above-mentioned wafer defect scan schedule.
Technical scheme of the present invention is through confirming to produce the activity duration of board group and the wafer production capacity in this activity duration; And the scanning production capacity and the sampling observation rate of binding deficient scanning website; The future load of the website of analyzing defect scanning in advance, and then the scheduling wafer can reasonably utilize the scanning production capacity of defective scanning website to carry out the defective scanning of wafer; Heap goods and the generation of jumping the goods phenomenon on the wafer manufacture line have been avoided; Guarantee the speed of the production procedure of wafer, shortened the production cycle of wafer, reached the doulbe-sides' victory effect of defective scanning movement spot scan production capacity and wafer quality.
Though described the application with reference to exemplary embodiments, should be appreciated that used term is explanation and exemplary and nonrestrictive term.Because the application's practical implementation and do not break away from the spirit or the essence of invention in a variety of forms; So be to be understood that; The foregoing description is not limited to any aforesaid details; And should in enclose spirit that claim limited and scope, explain widely, therefore fall into whole variations and remodeling in claim or its equivalent scope and all should be the claim of enclosing and contain.
Claims (10)
1. the method for a wafer defect scan schedule is characterized in that, comprising:
Confirm to produce the activity duration of board group and the wafer production capacity in the said activity duration;
Confirm the scanning production capacity and the sampling observation rate of defective scanning website;
Dispatch said wafer to carry out wafer defect scanning according to said activity duration, said wafer production capacity, said scanning production capacity and said sampling observation rate.
2. method according to claim 1 is characterized in that, dispatches said wafer according to said activity duration, said wafer production capacity, said scanning production capacity and said sampling observation rate and comprises with the step of carrying out wafer defect scanning:
When said wafer production capacity during greater than the number of wafers of said defective scanning website in said activity duration interscan; Heighten said scanning production capacity and/or turn down said sampling observation rate, and dispatch said wafer to carry out wafer defect scanning according to said scanning production capacity of heightening and/or the said sampling observation rate of turning down.
3. method according to claim 2 is characterized in that, the said scanning production capacity of heightening is the maximum scan production capacity.
4. method according to claim 1 is characterized in that, dispatches said wafer according to said activity duration, said wafer production capacity, said scanning production capacity and said sampling observation rate and comprises with the step of carrying out wafer defect scanning:
When said wafer production capacity during less than the number of wafers of said defective scanning website in said activity duration interscan; Turn down said scanning production capacity and/or heighten said sampling observation rate, and dispatch said wafer to carry out wafer defect scanning according to said scanning production capacity of turning down and/or the said sampling observation rate of heightening.
5. based on the described method of claim 4, it is characterized in that the said sampling observation rate of heightening is maximum sampling observation rate.
6. the system of a wafer defect scan schedule is characterized in that, comprising:
First determination module is used for confirming to produce the activity duration of board group and the wafer production capacity in the said activity duration;
Second determination module is used for confirming that defective scans the scanning production capacity of website;
Scheduler module is used for dispatching said wafer to carry out wafer defect scanning according to said activity duration, said wafer production capacity, said scanning production capacity and said sampling observation rate.
7. system according to claim 6; It is characterized in that; Said scheduler module; Specifically be used for heightening said scanning production capacity and/or turning down said sampling observation rate, and dispatch said wafer to carry out wafer defect scanning according to said scanning production capacity of heightening and/or the said sampling observation rate of turning down when said wafer production capacity during greater than the number of wafers of said defective scanning website in said activity duration interscan.
8. system according to claim 7 is characterized in that, the said scanning production capacity of heightening is the maximum scan production capacity.
9. system according to claim 6; It is characterized in that; Said scheduler module; Specifically be used for turning down said scanning production capacity and/or heightening said sampling observation rate, and dispatch said wafer to carry out wafer defect scanning according to said scanning production capacity of turning down and/or the said sampling observation rate of heightening when said wafer production capacity during less than the number of wafers of said defective scanning website in said activity duration interscan.
10. based on the described system of claim 9, it is characterized in that the said sampling observation rate of heightening is maximum sampling observation rate.
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| CN2011103862815A CN102437072A (en) | 2011-11-28 | 2011-11-28 | Method and system for scanning and scheduling wafer defects |
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| CN2011103862815A CN102437072A (en) | 2011-11-28 | 2011-11-28 | Method and system for scanning and scheduling wafer defects |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103681402A (en) * | 2013-11-29 | 2014-03-26 | 上海华力微电子有限公司 | Automatic skip-stop detection system |
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| CN101872714A (en) * | 2009-04-24 | 2010-10-27 | 中芯国际集成电路制造(上海)有限公司 | On-line detection method and system for wafer |
| CN102024725A (en) * | 2009-09-11 | 2011-04-20 | 中芯国际集成电路制造(上海)有限公司 | Detection method and system in semiconductor process |
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| CN1729560A (en) * | 2002-12-18 | 2006-02-01 | 先进微装置公司 | Dynamic adaptive sampling rate for model prediction |
| CN101872714A (en) * | 2009-04-24 | 2010-10-27 | 中芯国际集成电路制造(上海)有限公司 | On-line detection method and system for wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103681402A (en) * | 2013-11-29 | 2014-03-26 | 上海华力微电子有限公司 | Automatic skip-stop detection system |
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