CN102435777A - Silicon microcapacitor type two-dimensional integrated acceleration sensor - Google Patents
Silicon microcapacitor type two-dimensional integrated acceleration sensor Download PDFInfo
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- CN102435777A CN102435777A CN2011103414698A CN201110341469A CN102435777A CN 102435777 A CN102435777 A CN 102435777A CN 2011103414698 A CN2011103414698 A CN 2011103414698A CN 201110341469 A CN201110341469 A CN 201110341469A CN 102435777 A CN102435777 A CN 102435777A
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Abstract
The invention discloses a silicon microcapacitor type two-dimensional integrated acceleration sensor, which comprises a base, an internal inertia mass block, an external inertia mass block, a fixed tooth pivot, fixed comb teeth and movable comb teeth, wherein the internal inertia mass block is hung in an inner bore of the external inertia mass block by four folding beams; a capacitor CAy is formed by left-rear and right-rear fixed comb teeth and corresponding movable comb teeth; a capacitor CBy is formed by left-front and right-front fixed comb teeth and corresponding movable comb teeth; a capacitor CBx is formed by rear-left and front-left fixed comb teeth and corresponding movable comb teeth; and a capacitor CAx is formed by rear-right and front-right fixed comb teeth and corresponding movable comb teeth. An X-direction differential capacitor is formed by the capacitors CBx and CAx and is used for detecting the acceleration in an X direction; a Y-direction differential capacitor is formed by the capacitors CAy and CBy and is used for detecting the acceleration in a Y direction; and the accelerations in the X and the Y directions are respectively sensed by respective capacitor sensitive structures, thus cross interference can be effectively inhibited.
Description
Technical field
The invention belongs to the MEMS sensor technical field, relate in particular to the integrated acceleration transducer of a kind of silicon micro capacitor formula two dimension.
Background technology
At present, the technological comparative maturity of single shaft miniature acceleration sensor.But,, often need detect the acceleration of both direction like attitude of flight vehicle control, missile guidance, battlefield robot etc. in some special application scenarios.Iff adopts early stage array mode, is about to two mutually orthogonal being assembled together of single shaft miniature acceleration sensor, and it is very big that not only sensor performance receives the influence of assembly precision, and has problems such as integrated level is low, volume big, consistance difference.Therefore, two-dimentional integrated miniature acceleration transducer becomes the research focus.
No matter existing two-dimensional integrated miniature acceleration transducer is on same substrate, to make two independently acceleration transducers, still adopts the first detection that realizes the both direction acceleration of single responsive quality, all has the serious problem of cross interference.Therefore, suppressing cross interference is the problem that needs emphasis to solve in the two-dimentional integrated miniature acceleration transducer development.
Summary of the invention
To the key technical problem of two-dimentional integrated miniature acceleration transducer development, the invention provides a kind of integrated acceleration transducer of silicon micro capacitor formula two dimension that can effectively suppress cross interference.
The present invention has adopted following technical scheme: the integrated acceleration transducer of a kind of silicon micro capacitor formula two dimension, comprise substrate, fixed support, xsect for the outer inertial mass of the interior inertial mass of " worker " font, hollow structure, fixed teeth pivot, fixed fingers, movable comb,
X" U " font folded beam of direction main transformer shape,
Y" U " the font folded beam and the backstop of direction main transformer shape;
The endoporus xsect of said outer inertial mass is " worker " font, and substrate is provided with four fixed supports straight up, and four fixed supports are distributed in the Si Jiaochu near outer inertial mass endoporus; About " worker " font endoporus to do
XDirection of principal axis, front and back do
YDirection of principal axis; Be respectively equipped with the edge in four jiaos of places of the endoporus of " worker " font
XDirection of principal axis layout and opening are outside
Y" U " the font folded beam and the edge of direction main transformer shape
YDirection of principal axis layout and opening are inside
X" U " font folded beam of direction main transformer shape;
Four
YOne end of " U " font folded beam of direction main transformer shape is fixed on the fixed support of respective side, and the other end is fixed on the inwall of outer inertial mass, and outer inertial mass is through four
YThe unsettled substrate top that is connected of " U " font folded beam of direction main transformer shape;
Four
XOne end of " U " font folded beam of direction main transformer shape is fixed on the fixed support of respective side, and on the inertial mass, interior inertial mass was through four in the other end was fixed on
XThe unsettled endoporus that is connected the top of substrate and is arranged in outer inertial mass of " U " font folded beam of direction main transformer shape;
Near the inner concave wall of the left and right sides of inertial mass in said edge respectively
YDirection of principal axis respectively is provided with two fixed teeth pivots, and the bottom of the fixed teeth pivot of the left and right sides is fixed in the substrate, the fixed teeth pivot edge of the left and right sides
YDirection of principal axis is laid with several fixed fingers of stretching to the outside; The protruding wall upper edge of the endoporus left and right sides of said outer inertial mass
YDirection of principal axis is laid with several and stretches to inboard movable comb; Insert in the movable comb of respective side from a side respectively near left rear side with near the fixed fingers on the fixed teeth pivot of right lateral side, and constitute capacitor with the movable comb cross-distribution of respective side
C Ay , insert in the movable comb of respective side from opposite side respectively near front left side with near the fixed fingers on the fixed teeth pivot of forward right side, and constitute capacitor with the movable comb cross-distribution of respective side
C By
Near the inwall of both sides before and after the endoporus of said outer inertial mass edge respectively
XDirection of principal axis respectively is provided with two fixed teeth pivots, and the bottom of the fixed teeth pivot of both sides, front and back is fixed in the substrate; The fixed teeth pivot upper edge of both sides, front and back
XDirection of principal axis is laid with several and stretches to inboard fixed fingers, the outer wall upper edge of the both sides, front and back of said interior inertial mass
XDirection of principal axis is laid with several movable comb of stretching to the outside; Insert in the movable comb of respective side from a side respectively near back left side with near the fixed fingers on the fixed teeth pivot in preceding left side, and constitute capacitor with the movable comb cross-distribution of respective side
C Bx Insert in the movable comb of respective side from opposite side respectively near the right side, back with near the fixed fingers on the fixed teeth pivot on preceding right side, and constitute capacitor with the movable comb cross-distribution of respective side
C Ax
As a kind of preferred version of the present invention, the fixed fingers of said movable comb and respective side forms the fixed tooth offset structure.
As another preferred version of the present invention, four jiaos of places of said interior inertial mass are provided with respectively
XThe backstop that direction of principal axis is corresponding with fixed support; Four backstops in said on the inertial mass are respectively near the fixed support of respective side, and and the fixed support of respective side between distance less than the minor increment between the adjacent movable comb of fixed fingers of both sides, front and back with respective side; Four jiaos of places of the endoporus of said outer inertial mass are provided with respectively
YThe backstop that direction of principal axis is corresponding with fixed support; Four backstops on the inner hole wall of said outer inertial mass are respectively near the fixed support of respective side, and and the fixed support of respective side between distance less than the minor increment between the adjacent movable comb of fixed fingers of the left and right sides with respective side.
The integrated acceleration transducer of a kind of silicon micro capacitor formula two dimension provided by the invention compared with prior art, has following advantage:
1, capacitor
C Bx With
C Ax Constitute
XThe differential capacitance of direction is to detect
XThe acceleration of direction, and pass through
XThe stop structure of direction realizes overload protection; Capacitor
C Ay With
C By Constitute
YThe differential capacitance of direction is to detect
YThe acceleration of direction, and pass through
YThe stop structure of direction realizes overload protection;
X,
YThe acceleration of direction by separately sensitive structure institute perception, can effectively suppress cross interference respectively.
2, this sensor is produced on the chip through micromachining technology, and two sensitive structures are ingenious integrated, saves chip area.
3, form differential capacitance with the fixed tooth offset comb structure, can realize high detection sensitivity, and have good manufacturability.
Description of drawings
Fig. 1 is the structural representation of the xsect of the integrated acceleration transducer of silicon micro capacitor formula two dimension;
Fig. 2 does
XThe equivalent electrical illustraton of model of direction;
Fig. 3 does
YThe equivalent electrical illustraton of model of direction.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is done explanation in further detail.
Fig. 1 is the structural representation of the xsect of the integrated acceleration transducer of silicon micro capacitor formula two dimension, and is as shown in the figure.The integrated acceleration transducer of silicon micro capacitor formula two dimension comprise substrate 1, fixed support 2, xsect for the outer inertial mass 4 of the interior inertial mass 3 of " worker " font, hollow structure, fixed teeth pivot 5, fixed fingers 6, movable comb 7,
X" U " font folded beam 8 of direction main transformer shape,
Y" U " font folded beam 9 and the backstop 10 of direction main transformer shape.
Wherein, the endoporus xsect of outer inertial mass 4 is " worker " font, and the top that substrate 1 is provided with four 2, four fixed supports 2 of fixed support straight up is distributed in the Si Jiaochu near outer inertial mass 4 endoporus.About " worker " font endoporus to do
XDirection of principal axis, front and back do
YDirection of principal axis.Be respectively equipped with the edge in four jiaos of places of the endoporus of " worker " font
XDirection of principal axis layout and opening are outside
Y" U " font folded beam 9 and the edge of direction main transformer shape
YDirection of principal axis layout and opening are inside
X" U " font folded beam 8 of direction main transformer shape.Four
YOne end of " U " font folded beam 9 of direction main transformer shape is fixed on the fixed support 2 of respective side, and the other end is fixed on the inwall of outer inertial mass 4, and outer inertial mass 4 is through four
Y" U " font folded beam 9 unsettled substrate 1 tops that are connected of direction main transformer shape.Four
XOne end of " U " font folded beam 8 of direction main transformer shape is fixed on the fixed support 2 of respective side, and on the inertial mass 3, interior inertial mass 3 was through four in the other end was fixed on
X" U " font folded beam 8 unsettled endoporus that are connected the top of substrate 1 and are arranged in outer inertial mass 4 of direction main transformer shape.
Near the inwall of both sides before and after the endoporus of outer inertial mass 4 edge respectively
XDirection of principal axis respectively is provided with two fixed teeth pivots 5 (being two fixed teeth pivots 52,54 of front side, two fixed teeth pivots 51,53 of rear side), and the bottom of the fixed teeth pivot 5 of both sides, front and back is fixed in the substrate 1; Fixed teeth pivot 5 upper edges of both sides, front and back
XDirection of principal axis is laid with several (drawing altogether among Fig. 1 27) and stretches to inboard fixed fingers 6, the outer wall upper edge of the both sides, front and back of interior inertial mass 3
XDirection of principal axis is laid with the movable comb 7 that several (drawing altogether among Fig. 1 27) are stretched to the outside.Insert in the movable comb 7 of respective side from a side (Fig. 1 from the right side) respectively near back left side with near the fixed fingers 6 (among Fig. 1 being 13) on the fixed teeth pivot 5 in preceding left side (being among Fig. 1), and constitute capacitor with movable comb 7 cross-distribution of respective side near the fixed teeth pivot 51 in left side, back with near the fixed teeth pivot 52 in preceding left side
C Bx Insert in the movable comb 7 of respective side from opposite side (Fig. 1 from the left side) respectively near the right side, back with near the fixed fingers 6 (among Fig. 1 being 14) on the fixed teeth pivot 5 on preceding right side (being among Fig. 1), and constitute capacitor with movable comb 7 cross-distribution of respective side near the fixed teeth pivot 53 on right side, back with near the fixed teeth pivot 54 on preceding right side
C Ax Capacitor
C Ax And capacitor
C Bx Constitute
XThe differential capacitance of direction is to detect
XThe acceleration of direction, its equivalent electrical model is as shown in Figure 2.
Near the inner concave wall of the left and right sides of interior inertial mass 3 edge respectively
YDirection of principal axis respectively is provided with two fixed teeth pivots 5 (two the fixed teeth pivots 55,57 promptly, two fixed teeth pivots 56,58 on right side), and the bottom of the fixed teeth pivot 5 of the left and right sides is fixed in the substrate 1, fixed teeth pivot 5 edges of the left and right sides
YDirection of principal axis is laid with the fixed fingers 6 that several (nineteen altogether draws among Fig. 1) are stretched to the outside.The protruding wall upper edge of the endoporus left and right sides of outer inertial mass 4
YDirection of principal axis is laid with several (nineteen altogether draws among Fig. 1) and stretches to inboard movable comb 7.Insert in the movable comb 7 of respective side from a side (Fig. 1 for from the front side) respectively near left rear side with near the fixed fingers 6 (being ten fixed fingers among Fig. 1) on the fixed teeth pivot 5 of right lateral side (being among Fig. 1), and constitute capacitor with movable comb 7 cross-distribution of respective side near the fixed teeth pivot 55 of left rear side with near the fixed teeth pivot 56 of right lateral side
C Ay Insert in the movable comb 7 of respective side from opposite side (Fig. 1 for from rear side) respectively near front left side with near the fixed fingers 6 (being nine fixed fingers among Fig. 1) on the fixed teeth pivot 5 of forward right side (being among Fig. 1), and constitute capacitor with movable comb 7 cross-distribution of respective side near the fixed teeth pivot 57 of front left side with near the fixed teeth pivot 58 of forward right side
C By Capacitor
C Ay And capacitor
C By Constitute
YThe differential capacitance of direction is to detect
YThe acceleration of direction, its equivalent electrical model is as shown in Figure 3.
Four jiaos of places of interior inertial mass 3 are provided with respectively
X The backstop 10 that direction of principal axis and fixed support 2 are corresponding; Four backstops 10 on the interior inertial mass 3 are respectively near the fixed support 2 of respective side; And and the fixed support 2 of respective side between distance less than the minor increment between the adjacent movable comb 7 of fixed fingers 6 of both sides, front and back with respective side; Therefore, four backstops 10 on fixed support 2 and the interior inertial mass 3 have constituted
XThe stop configurations of direction has realized that internal inertial mass 3 (that is movable comb 7) exists
XThe sports limiting of direction can prevent
XDirection is than under the thump
X" U " font folded beam 8 fractures of direction main transformer shape, and avoid causing sensor failure because of movable comb 7 and fixed fingers 6 come in contact.Four jiaos of places of the endoporus of outer inertial mass 4 are provided with respectively
Y The backstop 10 that direction of principal axis and fixed support 2 are corresponding; Four backstops 10 on the inner hole wall of outer inertial mass 4 are respectively near the fixed support 2 of respective side, and and the fixed support 2 of respective side between distance less than the minor increment between the adjacent movable comb 7 of fixed fingers 6 of the left and right sides with respective side.Backstop 11 on fixed support 2 and the outer inertial mass 4 has constituted
YThe stop configurations of direction has realized that external inertial mass 4 (that is movable comb 7) exists
YThe sports limiting of direction can prevent
YDirection is than under the thump
Y" U " font folded beam 9 fractures of direction main transformer shape, and avoid causing sensor failure because of movable comb 7 and fixed fingers 6 come in contact.
In the present embodiment, movable comb 7 forms the fixed tooth offset structure with the fixed fingers 6 of respective side.Form differential capacitance with the fixed tooth offset comb structure, can realize high detection sensitivity, and have good manufacturability.
When interior inertial mass 3 with outside inertial mass 4 receive
XDuring the acceleration of direction, because
Y" U " font folded beam 9 of direction main transformer shape exists
XDirection rigidity is relatively large, and inertial mass 4 is with respect to substrate 1 edge beyond the institute
XThe motion of direction is limited.And
X" U " font folded beam 8 of direction main transformer shape exists
XDirection rigidity little and
YDirection rigidity is relatively large, so interior inertial mass 3 is with respect to substrate 1 edge
XThe direction motion causes
XThe direction capacitor
C Ax And capacitor
C Bx Increase of capacitance, one reduces.Through detecting capacitor
C Ax And capacitor
C Bx Differential capacitance change and can detect
XThe acceleration of direction.
In like manner, when interior inertial mass 3 with outside inertial mass 4 receive
YDuring the acceleration of direction, because
X" U " font folded beam 8 of direction main transformer shape exists
YDirection rigidity is relatively large, so interior inertial mass 3 is with respect to substrate 1 edge
YThe motion of direction is limited.And
Y" U " font folded beam 9 of direction main transformer shape exists
YDirection rigidity little and
XDirection rigidity is relatively large, and inertial mass 4 is with respect to substrate 1 edge beyond the institute
YThe direction motion causes
YThe direction capacitor
C Ay And capacitor
C By Increase of capacitance, one reduces.Through detecting capacitor
C Ay And capacitor
C By Differential capacitance change and can detect
YThe acceleration of direction.
This acceleration transducer is produced on the chip through micromachining technology, the manufacture craft of sensor chip:
With N type (100) twin polishing silicon chip as backing material, based on the integrated acceleration sensor chip of the little condenser type of bulk silicon technological machine silicon two dimension.The main technique step comprises:
(1) two-sided thermal oxide silicon chip;
(2) the HF corrosive liquid is adopted in photoetching, removes the SiO in sensor movable structure zone
2, form corrosion window;
(3) wet etching Si forms the bonding fixed support, and adopts the HF corrosive liquid to remove thermal oxide SiO
2Layer;
(4) employing is peeled off method at making Ti/Pt/Au contact conductor on glass;
(5) silicon-glass electrostatic bonding;
(6) wet method attenuate Si is to the desired structure layer thickness;
(7) evaporation Al, photoetching, corrosion form deep erosion mask;
(8) ICP loses releasing structure deeply.
Explanation is at last; Above embodiment is only unrestricted in order to technical scheme of the present invention to be described; Although with reference to preferred embodiment the present invention is specified, those of ordinary skill in the art should be appreciated that and can make amendment or be equal to replacement technical scheme of the present invention; And not breaking away from the aim and the scope of technical scheme of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (3)
1. the integrated acceleration transducer of silicon micro capacitor formula two dimension is characterized in that: comprise substrate (1), fixed support (2), xsect for the outer inertial mass (4) of the interior inertial mass (3) of " worker " font, hollow structure, fixed teeth pivot (5), fixed fingers (6), movable comb (7),
X" U " font folded beam (8) of direction main transformer shape,
Y" U " font folded beam (9) of direction main transformer shape and backstop (10);
The endoporus xsect of said outer inertial mass (4) is " worker " font, and substrate (1) is provided with four fixed supports (2) straight up, and four fixed supports (2) are distributed in the Si Jiaochu near outer inertial mass (4) endoporus; About " worker " font endoporus to do
XDirection of principal axis, front and back do
YDirection of principal axis; Be respectively equipped with the edge in four jiaos of places of the endoporus of " worker " font
XDirection of principal axis layout and opening are outside
Y" U " font folded beam (9) and the edge of direction main transformer shape
YDirection of principal axis layout and opening are inside
X" U " font folded beam (8) of direction main transformer shape;
Four
YOne end of " U " font folded beam (9) of direction main transformer shape is fixed on the fixed support (2) of respective side, and the other end is fixed on the inwall of outer inertial mass (4), and outer inertial mass (4) is through four
YUnsettled substrate (1) top that is connected of " U " font folded beam (9) of direction main transformer shape;
Four
XOne end of " U " font folded beam (8) of direction main transformer shape is fixed on the fixed support (2) of respective side, and the other end is fixed on the interior inertial mass (3), and interior inertial mass (3) is through four
XThe unsettled endoporus that is connected the top of substrate (1) and is arranged in outer inertial mass (4) of " U " font folded beam (8) of direction main transformer shape;
Near the inner concave wall of the left and right sides of inertial mass (3) in said edge respectively
YDirection of principal axis respectively is provided with two fixed teeth pivots (5), and the bottom of the fixed teeth pivot (5) of the left and right sides is fixed in the substrate (1), fixed teeth pivot (5) edge of the left and right sides
YDirection of principal axis is laid with several fixed fingers (6) of stretching to the outside; The protruding wall upper edge of the endoporus left and right sides of said outer inertial mass (4)
YDirection of principal axis is laid with several and stretches to inboard movable comb (7); Insert in the movable comb (7) of respective side from a side respectively near left rear side with near the fixed fingers (6) on the fixed teeth pivot (5) of right lateral side, and constitute capacitor with movable comb (7) cross-distribution of respective side
C Ay Insert in the movable comb (7) of respective side from opposite side respectively near front left side with near the fixed fingers (6) on the fixed teeth pivot (5) of forward right side, and constitute capacitor with movable comb (7) cross-distribution of respective side
C By
Near the inwall of both sides before and after the endoporus of said outer inertial mass (4) edge respectively
XDirection of principal axis respectively is provided with two fixed teeth pivots (5), and the bottom of the fixed teeth pivot (5) of both sides, front and back is fixed in the substrate (1); Fixed teeth pivot (5) upper edge of both sides, front and back
XDirection of principal axis is laid with several and stretches to inboard fixed fingers (6), the outer wall upper edge of the both sides, front and back of said interior inertial mass (3)
XDirection of principal axis is laid with several movable comb (7) of stretching to the outside; Insert in the movable comb (7) of respective side from a side respectively near back left side with near the fixed fingers (6) on the fixed teeth pivot (5) in preceding left side, and constitute capacitor with movable comb (7) cross-distribution of respective side
C Bx Insert in the movable comb (7) of respective side from opposite side respectively near the right side, back with near the fixed fingers (6) on the fixed teeth pivot (5) on preceding right side, and constitute capacitor with movable comb (7) cross-distribution of respective side
C Ax
2. the integrated acceleration transducer of silicon micro capacitor formula two dimension according to claim 1 is characterized in that: said movable comb (7) forms the fixed tooth offset structure with the fixed fingers (6) of respective side.
3. the integrated acceleration transducer of silicon micro capacitor formula two dimension according to claim 1 and 2, it is characterized in that: four jiaos of places of inertial mass (3) are provided with respectively in said
XThe backstop (10) that direction of principal axis is corresponding with fixed support (2); Four backstops (10) in said on the inertial mass (3) are respectively near the fixed support (2) of respective side, and and the fixed support (2) of respective side between distance less than the minor increment between the adjacent movable comb of fixed fingers (6) (7) of both sides, front and back with respective side; Four jiaos of places of the endoporus of said outer inertial mass (4) are provided with respectively
YThe backstop (10) that direction of principal axis is corresponding with fixed support (2); Four backstops (10) on the inner hole wall of said outer inertial mass (4) are respectively near the fixed support (2) of respective side, and and the fixed support (2) of respective side between distance less than the minor increment between the adjacent movable comb of fixed fingers (6) (7) of the left and right sides with respective side.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110341469 CN102435777B (en) | 2011-11-02 | 2011-11-02 | Silicon microcapacitor type two-dimensional integrated acceleration sensor |
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|---|---|---|---|
| CN 201110341469 CN102435777B (en) | 2011-11-02 | 2011-11-02 | Silicon microcapacitor type two-dimensional integrated acceleration sensor |
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| CN102435777B CN102435777B (en) | 2012-10-31 |
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Cited By (7)
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| CN102897704A (en) * | 2012-10-17 | 2013-01-30 | 东南大学 | Micro-electro-mechanical comb tooth mechanism capable of adjusting tooth gaps by electrostatic force |
| CN103910323A (en) * | 2013-01-09 | 2014-07-09 | 先技股份有限公司 | Micro-electromechanical device |
| CN104297521A (en) * | 2013-07-19 | 2015-01-21 | 中国科学院地质与地球物理研究所 | MEMS high sensitivity transverse acceleration meter and manufacturing technology thereof |
| WO2019154146A1 (en) * | 2018-02-06 | 2019-08-15 | 深迪半导体(上海)有限公司 | Mems accelerometer |
| CN110806498A (en) * | 2019-10-18 | 2020-02-18 | 中国航空工业集团公司西安飞行自动控制研究所 | Comb tooth capacitance type micro-electromechanical accelerometer structure |
| CN112947259A (en) * | 2021-04-07 | 2021-06-11 | 重庆理工大学 | Non-relativistic high-current pulse electron beam single chip microcomputer fine synchronization control method |
| WO2022006910A1 (en) * | 2020-07-10 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Comb tooth structure having initial position offset, and preparation method therefor |
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| US20040187573A1 (en) * | 2003-03-27 | 2004-09-30 | Denso Corporation | Semiconductor dynamic quantity sensor |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102897704A (en) * | 2012-10-17 | 2013-01-30 | 东南大学 | Micro-electro-mechanical comb tooth mechanism capable of adjusting tooth gaps by electrostatic force |
| CN102897704B (en) * | 2012-10-17 | 2015-03-04 | 东南大学 | Micro-electro-mechanical comb tooth mechanism capable of adjusting tooth gaps by electrostatic force |
| CN103910323A (en) * | 2013-01-09 | 2014-07-09 | 先技股份有限公司 | Micro-electromechanical device |
| CN104297521A (en) * | 2013-07-19 | 2015-01-21 | 中国科学院地质与地球物理研究所 | MEMS high sensitivity transverse acceleration meter and manufacturing technology thereof |
| WO2019154146A1 (en) * | 2018-02-06 | 2019-08-15 | 深迪半导体(上海)有限公司 | Mems accelerometer |
| US11105829B2 (en) | 2018-02-06 | 2021-08-31 | Senodia Technologies (Shaoxing) Co., Ltd. | MEMS accelerometer |
| CN110806498A (en) * | 2019-10-18 | 2020-02-18 | 中国航空工业集团公司西安飞行自动控制研究所 | Comb tooth capacitance type micro-electromechanical accelerometer structure |
| WO2022006910A1 (en) * | 2020-07-10 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Comb tooth structure having initial position offset, and preparation method therefor |
| CN112947259A (en) * | 2021-04-07 | 2021-06-11 | 重庆理工大学 | Non-relativistic high-current pulse electron beam single chip microcomputer fine synchronization control method |
| CN112947259B (en) * | 2021-04-07 | 2022-08-02 | 重庆理工大学 | Non-relativistic high-current pulse electron beam single chip microcomputer fine synchronization control method |
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| CN102435777B (en) | 2012-10-31 |
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