CN102426075A - Glass ring sensor packaging structure - Google Patents
Glass ring sensor packaging structure Download PDFInfo
- Publication number
- CN102426075A CN102426075A CN2011102532432A CN201110253243A CN102426075A CN 102426075 A CN102426075 A CN 102426075A CN 2011102532432 A CN2011102532432 A CN 2011102532432A CN 201110253243 A CN201110253243 A CN 201110253243A CN 102426075 A CN102426075 A CN 102426075A
- Authority
- CN
- China
- Prior art keywords
- ring
- glass ring
- sensor
- pedestal
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a glass ring sensor packaging structure, which comprises a pedestal for packaging a sensor body, wherein the outer surface of a shell of the sensor pedestal is provided with a ring-cut groove in which a glass ring is arranged; the glass ring is arranged in the ring-cut groove in an embedding mode and is integrally buried in the lower part of the outer surface of the pedestal; the ring-cut groove is in interference fit with the glass ring, so that the glass ring can uniformly release the stress of the pedestal itself; and therefore, the pedestal is not over-shrunk or over-expanded in a cooling or heating process, the state of the sensor body in the pedestal is guaranteed to be stable, and the problem of failure or damage of the sensor body is not caused due to influence of external force.
Description
Technical field
The present invention relates to a kind of pressure sensor structure, specifically glass ring sensor package structure.
Background technology
Sensor is behind high temperature electrostatic encapsulation and sintering; Internal stress during low-temperature working can produce very big influence to the precision of sensor, stability, sensitivity, so the stability that the release of internal stress is pressure when working with the liquid level sensor ultra-low temperature surroundings and the gordian technique of reliability.
Summary of the invention
The purpose of this invention is to provide a kind of glass ring sensor package structure, solve the prior art sensor behind high temperature electrostatic encapsulation and sintering, the problem that the internal stress during low-temperature working discharges.
The objective of the invention is to realize through following technical scheme:
Glass ring sensor package structure comprises the base that is used for the encapsulated sensor body, and the housing outer surface of sensor base is provided with the ring cutting groove; In the ring cutting groove, be provided with glass ring; Said glass ring is embedded to be installed in the said ring cutting groove, and the integral body of said glass ring is embedded in the outside surface bottom of base, and said ring cutting groove and said glass ring are interference fit; So that glass ring can evenly be evacuated the stress of base self; Make the base can excess shrinkage or expansion in the process of catching a cold or being heated, guarantee the in stable condition of sensor body that base is inner, can not receive the influence of external force and cause its malfunctioning or damage problem.
Description of drawings
According to accompanying drawing and embodiment the present invention is done further explain below.
Fig. 1 is the structural drawing of the described beam film of embodiment of the invention combined sensor structure.
Embodiment
As shown in Figure 1; Glass ring sensor package structure of the present invention; Comprise the base 1 that is used for the encapsulated sensor body, the housing outer surface of sensor base 1 is provided with ring cutting groove 3, in ring cutting groove 3, is provided with glass ring 2; Said glass ring 2 embedded being installed in the said ring cutting groove 3; And the integral body of said glass ring 2 is embedded in the outside surface bottom of base 1, can guarantee the structure joint that glass ring 2 can be not outside with base 1 outside surface under the normal state that uses like this, can guarantee that glass ring 2 only is the effect of base itself being played stress evacuating or support; Said ring cutting groove 3 is interference fit with said glass ring 2; So that glass ring 2 can evenly be evacuated the stress of base 1 self; Make the base 1 can excess shrinkage or expansion in the process of catching a cold or being heated; Guarantee the in stable condition of sensor body that base 1 is inner, can not receive the influence of external force and cause its malfunctioning or damage problem.Specifically, in the time of base 1 expanded by heating, glass ring 2 can limit its differential expansion stress; And when base 1 was met cold contraction, glass ring 2 also can play the opposite effect minimum distortion of card base of trying hard to keep, thereby keep-uped pressure the whole stability of sensor.And glass ring itself belongs to and meets cold or preheating is shunk very little or do not had contraction; And glass ring 2 hardness own are higher, can as metal, not produce deformation, and meanwhile; Glass ring itself is an insulativity, has guaranteed that pressure transducer can not receive influences such as electromagnetic wave in the process of using.
Claims (1)
1. glass ring sensor package structure; Comprise the base that is used for the encapsulated sensor body, it is characterized in that the housing outer surface of sensor base is provided with the ring cutting groove; In the ring cutting groove, be provided with glass ring; Said glass ring is embedded to be installed in the said ring cutting groove, and the integral body of said glass ring is embedded in the outside surface bottom of base, and said ring cutting groove and said glass ring are interference fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110253243 CN102426075B (en) | 2011-08-31 | 2011-08-31 | Glass ring sensor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110253243 CN102426075B (en) | 2011-08-31 | 2011-08-31 | Glass ring sensor packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102426075A true CN102426075A (en) | 2012-04-25 |
| CN102426075B CN102426075B (en) | 2013-07-10 |
Family
ID=45960080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110253243 Active CN102426075B (en) | 2011-08-31 | 2011-08-31 | Glass ring sensor packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102426075B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3137219A1 (en) * | 1981-09-18 | 1983-04-07 | Robert Bosch Gmbh, 7000 Stuttgart | Capacitive pressure sensor and method for producing it |
| CN201559899U (en) * | 2009-11-26 | 2010-08-25 | 深圳市通产丽星股份有限公司 | Spring-driven can capable of popping pills out of top surface by pressing |
| CN101832830A (en) * | 2010-03-22 | 2010-09-15 | 西安交通大学 | Flush packaged pressure sensor with high temperature resistance and high frequency response |
| CN202216799U (en) * | 2011-08-31 | 2012-05-09 | 江苏奥力威传感高科股份有限公司 | Packaging structure of glass ring sensor |
-
2011
- 2011-08-31 CN CN 201110253243 patent/CN102426075B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3137219A1 (en) * | 1981-09-18 | 1983-04-07 | Robert Bosch Gmbh, 7000 Stuttgart | Capacitive pressure sensor and method for producing it |
| CN201559899U (en) * | 2009-11-26 | 2010-08-25 | 深圳市通产丽星股份有限公司 | Spring-driven can capable of popping pills out of top surface by pressing |
| CN101832830A (en) * | 2010-03-22 | 2010-09-15 | 西安交通大学 | Flush packaged pressure sensor with high temperature resistance and high frequency response |
| CN202216799U (en) * | 2011-08-31 | 2012-05-09 | 江苏奥力威传感高科股份有限公司 | Packaging structure of glass ring sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102426075B (en) | 2013-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6038584B2 (en) | Semiconductor device stored non-bonded | |
| CN102862947B (en) | A kind of MEMS and wafer-level vacuum encapsulating method thereof | |
| WO2012082510A3 (en) | Probe card stiffener with decoupling | |
| US20180141740A1 (en) | Vacuum heat-insulating container | |
| CN103133700A (en) | Magnetic liquid rotating and sealing device | |
| CN102477984A (en) | Rotary compressor structure with uniform stator and rotor clearance | |
| CN202216799U (en) | Packaging structure of glass ring sensor | |
| EP2796846A3 (en) | Sensor with isolated diaphragm | |
| CN102426075B (en) | Glass ring sensor packaging structure | |
| WO2010083907A3 (en) | Method for producing a magnetic system comprising a pole wheel | |
| CN204231664U (en) | A kind of speaker unit | |
| CN103335108B (en) | A kind of magnetic liquid rotating sealing device | |
| CN204214460U (en) | A kind of pressure resistance type MEMS sensor structure | |
| GB2537628A (en) | Low stress mounting configuration for optical component | |
| CN104132768B (en) | A kind of pressure sensor of the insulation package stress based on Si-Si bonding | |
| CN202707763U (en) | Concentric ring washer | |
| CN204592025U (en) | A kind of high heat-shielding performance shaft sleeve device | |
| CN104819788A (en) | Apparatus having a hermetic seal | |
| CN106430085A (en) | Protection method for MEMS pressure sensor packaging | |
| CN102678564A (en) | Axial double-floating structure of scroll compressor | |
| CN104421607A (en) | Vacuum heat preservation steel cylinder | |
| CN202572807U (en) | Detachable hot sprue special for ultrathin-wall plastic parts | |
| CN105465529A (en) | Spherical compensator for thermal compensation of pipeline | |
| CN202170814U (en) | Double-cylinder type cylinder of steam power device | |
| CN206112061U (en) | V type supports steel band |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |