CN102419514A - Photocurable resin composition and cured product thereof - Google Patents
Photocurable resin composition and cured product thereof Download PDFInfo
- Publication number
- CN102419514A CN102419514A CN2011102884060A CN201110288406A CN102419514A CN 102419514 A CN102419514 A CN 102419514A CN 2011102884060 A CN2011102884060 A CN 2011102884060A CN 201110288406 A CN201110288406 A CN 201110288406A CN 102419514 A CN102419514 A CN 102419514A
- Authority
- CN
- China
- Prior art keywords
- photocurable resin
- resin composition
- circuit board
- printed circuit
- carboxylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 50
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 32
- 239000000203 mixture Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 23
- 229910052736 halogen Inorganic materials 0.000 claims description 15
- 150000002367 halogens Chemical class 0.000 claims description 15
- 239000001060 yellow colorant Substances 0.000 claims description 11
- 239000000038 blue colorant Substances 0.000 claims description 10
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 claims description 9
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 6
- 150000004056 anthraquinones Chemical class 0.000 claims description 6
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 claims description 5
- MYONAGGJKCJOBT-UHFFFAOYSA-N benzimidazol-2-one Chemical compound C1=CC=CC2=NC(=O)N=C21 MYONAGGJKCJOBT-UHFFFAOYSA-N 0.000 claims description 3
- NYGZLYXAPMMJTE-UHFFFAOYSA-M metanil yellow Chemical group [Na+].[O-]S(=O)(=O)C1=CC=CC(N=NC=2C=CC(NC=3C=CC=CC=3)=CC=2)=C1 NYGZLYXAPMMJTE-UHFFFAOYSA-M 0.000 claims description 3
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 claims description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 239000003513 alkali Substances 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 abstract description 2
- 239000003999 initiator Substances 0.000 abstract 1
- 239000001062 red colorant Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 43
- 229920000647 polyepoxide Polymers 0.000 description 43
- -1 phthalocyanine compound Chemical class 0.000 description 42
- 239000000049 pigment Substances 0.000 description 39
- 239000000126 substance Substances 0.000 description 35
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 26
- 238000000034 method Methods 0.000 description 17
- 239000004593 Epoxy Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 239000003086 colorant Substances 0.000 description 14
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 11
- 238000001035 drying Methods 0.000 description 11
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 229920003319 Araldite® Polymers 0.000 description 9
- 239000005864 Sulphur Substances 0.000 description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 9
- 238000013007 heat curing Methods 0.000 description 9
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 8
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 8
- 239000002966 varnish Substances 0.000 description 8
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 230000008595 infiltration Effects 0.000 description 5
- 238000001764 infiltration Methods 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 238000000016 photochemical curing Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- 229910001507 metal halide Inorganic materials 0.000 description 4
- 150000005309 metal halides Chemical class 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000001029 thermal curing Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229940106691 bisphenol a Drugs 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 125000003566 oxetanyl group Chemical group 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 150000003553 thiiranes Chemical class 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- OAMHTTBNEJBIKA-UHFFFAOYSA-N 2,2,2-trichloro-1-phenylethanone Chemical compound ClC(Cl)(Cl)C(=O)C1=CC=CC=C1 OAMHTTBNEJBIKA-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 239000012675 alcoholic extract Substances 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 150000001896 cresols Chemical class 0.000 description 2
- 150000004294 cyclic thioethers Chemical class 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000002921 oxetanes Chemical class 0.000 description 2
- WKGDNXBDNLZSKC-UHFFFAOYSA-N oxido(phenyl)phosphanium Chemical compound O=[PH2]c1ccccc1 WKGDNXBDNLZSKC-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- VMHYWKBKHMYRNF-UHFFFAOYSA-N (2-chlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC=C1C(=O)C1=CC=CC=C1 VMHYWKBKHMYRNF-UHFFFAOYSA-N 0.000 description 1
- VCJWMECOBCXFOF-UHFFFAOYSA-N (3-ethyloxetan-3-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(CC)COC1 VCJWMECOBCXFOF-UHFFFAOYSA-N 0.000 description 1
- AQQRHHUDOXGLAC-UHFFFAOYSA-N (3-methyloxetan-3-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C)COC1 AQQRHHUDOXGLAC-UHFFFAOYSA-N 0.000 description 1
- NPENBPVOAXERED-UHFFFAOYSA-N (4-benzoylphenyl)-phenylmethanone Chemical class C=1C=C(C(=O)C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 NPENBPVOAXERED-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VDOIZUWXKARYAM-UHFFFAOYSA-N 1,3,5-triazinane-2,4,6-trione;1,3,5-triazine Chemical compound C1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 VDOIZUWXKARYAM-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- XOGPDSATLSAZEK-UHFFFAOYSA-N 2-Aminoanthraquinone Chemical class C1=CC=C2C(=O)C3=CC(N)=CC=C3C(=O)C2=C1 XOGPDSATLSAZEK-UHFFFAOYSA-N 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- FWTBRYBHCBCJEQ-UHFFFAOYSA-N 4-[(4-phenyldiazenylnaphthalen-1-yl)diazenyl]phenol Chemical compound C1=CC(O)=CC=C1N=NC(C1=CC=CC=C11)=CC=C1N=NC1=CC=CC=C1 FWTBRYBHCBCJEQ-UHFFFAOYSA-N 0.000 description 1
- XCKGFJPFEHHHQA-UHFFFAOYSA-N 5-methyl-2-phenyl-4-phenyldiazenyl-4h-pyrazol-3-one Chemical compound CC1=NN(C=2C=CC=CC=2)C(=O)C1N=NC1=CC=CC=C1 XCKGFJPFEHHHQA-UHFFFAOYSA-N 0.000 description 1
- XHLKOHSAWQPOFO-UHFFFAOYSA-N 5-phenyl-1h-imidazole Chemical compound N1C=NC=C1C1=CC=CC=C1 XHLKOHSAWQPOFO-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical group C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 1
- 208000035126 Facies Diseases 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical class SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- 241001597008 Nomeidae Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 206010034960 Photophobia Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N Resorcinol Natural products OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- MJNIWUJSIGSWKK-UHFFFAOYSA-N Riboflavine 2',3',4',5'-tetrabutanoate Chemical compound CCCC(=O)OCC(OC(=O)CCC)C(OC(=O)CCC)C(OC(=O)CCC)CN1C2=CC(C)=C(C)C=C2N=C2C1=NC(=O)NC2=O MJNIWUJSIGSWKK-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- REUQOSNMSWLNPD-UHFFFAOYSA-N [2-(diethylamino)phenyl]-phenylmethanone Chemical compound CCN(CC)C1=CC=CC=C1C(=O)C1=CC=CC=C1 REUQOSNMSWLNPD-UHFFFAOYSA-N 0.000 description 1
- RVWADWOERKNWRY-UHFFFAOYSA-N [2-(dimethylamino)phenyl]-phenylmethanone Chemical compound CN(C)C1=CC=CC=C1C(=O)C1=CC=CC=C1 RVWADWOERKNWRY-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- RDURTRDFNKIFKC-UHFFFAOYSA-N acetic acid;1-butoxypropan-2-ol Chemical class CC(O)=O.CCCCOCC(C)O RDURTRDFNKIFKC-UHFFFAOYSA-N 0.000 description 1
- JTMHCLKNFXDYMG-UHFFFAOYSA-N acetic acid;1-ethoxypropan-2-ol Chemical class CC(O)=O.CCOCC(C)O JTMHCLKNFXDYMG-UHFFFAOYSA-N 0.000 description 1
- JIMPAYYJPMENLQ-UHFFFAOYSA-N acetic acid;2-(2-methoxypropoxy)propan-1-ol Chemical class CC(O)=O.COC(C)COC(C)CO JIMPAYYJPMENLQ-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- PQVXXMYLCJGDSU-UHFFFAOYSA-N benzene-1,2,3-triol ethane Chemical compound CC.OC=1C(=C(C=CC1)O)O PQVXXMYLCJGDSU-UHFFFAOYSA-N 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N benzoic acid ethyl ester Natural products CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 229960003328 benzoyl peroxide Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- RJUIDDKTATZJFE-UHFFFAOYSA-N but-2-enoyl chloride Chemical compound CC=CC(Cl)=O RJUIDDKTATZJFE-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- VTJUKNSKBAOEHE-UHFFFAOYSA-N calixarene Chemical compound COC(=O)COC1=C(CC=2C(=C(CC=3C(=C(C4)C=C(C=3)C(C)(C)C)OCC(=O)OC)C=C(C=2)C(C)(C)C)OCC(=O)OC)C=C(C(C)(C)C)C=C1CC1=C(OCC(=O)OC)C4=CC(C(C)(C)C)=C1 VTJUKNSKBAOEHE-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ONTQJDKFANPPKK-UHFFFAOYSA-L chembl3185981 Chemical compound [Na+].[Na+].CC1=CC(C)=C(S([O-])(=O)=O)C=C1N=NC1=CC(S([O-])(=O)=O)=C(C=CC=C2)C2=C1O ONTQJDKFANPPKK-UHFFFAOYSA-L 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- WZWSOGGTVQXXSN-UHFFFAOYSA-N cyclohexanone;toluene Chemical compound CC1=CC=CC=C1.O=C1CCCCC1 WZWSOGGTVQXXSN-UHFFFAOYSA-N 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- YXOGSLZKOVPUMH-UHFFFAOYSA-N ethene;phenol Chemical compound C=C.OC1=CC=CC=C1 YXOGSLZKOVPUMH-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000001469 hydantoins Chemical class 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- KBHMHROOFHVLBA-UHFFFAOYSA-N metamfepramone Chemical compound CN(C)C(C)C(=O)C1=CC=CC=C1 KBHMHROOFHVLBA-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000002896 organic halogen compounds Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 235000011182 sodium carbonates Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 229950004616 tribromoethanol Drugs 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
To provide a colored photocurable resin composition capable of forming a solder resist layer excellent in property of hiding defective appearance of a copper circuit attributed to tarnish by oxidation. The photocurable resin composition can be developed with a dilute alkali solution and comprises: (A) a carboxylic acid-containing resin; (B) a photopolymerization initiator; c a compound having two or more ethylenically unsaturated groups per molecule; and (D) a red colorant.
Description
The application be that on 05 08th, 2008, application number are 200810081857.5 the applying date, denomination of invention divides an application for the application of " Photocurable resin composition and solidfied material thereof, dry film, printed circuit board (PCB) ".
Technical field
The present invention relates to not contain the painted Photocurable resin composition of halogen-containing phthalocyanine green.Say in further detail, The present invention be more particularly directed to the disguised excellent solder mask that can provide the oxidation that utilizes copper circuit to cause variable color, the painted Photocurable resin composition that does not contain halogen-containing phthalocyanine green.
Background technology
Usually, solder resist forms in order to protect copper circuit.Its role is to, can't see by the variable color of the heat of copper circuit, variable color that moisture causes, electricity, such aspects such as flaw, pollution on the copper circuit.
Solder resist is applied on the glass epoxide base material that is formed with copper circuit, forms image through exposure, forms this overlay film pattern through development, heat curing.Owing on base material, be formed with copper circuit, therefore, under the situation to its coating solder resist or lamination solder resist, its resist film thickness is thick on the base material, thin on copper circuit, thinner in the part at the edge of copper circuit.
In the different situation of the thickness of such solder resist, be difficult to from covering copper circuit in appearance.Therefore, in solder resist, cooperate colorant usually, thicken, be difficult for variable color of seeing copper circuit etc. through making its concentration.
From reducing the viewpoint of carrying capacity of environment; Replace chlorination phthalocyanine green in the nearest solder resist as the colorant of existing green; Use the solder resist do not have the phthalocyanine blue of halogen atom and form green with the yellow colorants that does not have halogen atom to be popularized (for example, with reference to patent documentation 1).
In addition, for from clearly being halogen in appearance, can use phthalocyanine blue separately, also can be used as blue solder resist and use.
Yet; From following explanation; Can be clear and definite: compare with the green that forms by phthalocyanine green, the green solder resist that forms by solder resist, blue colorant and the yellow colorants of blueness disguised weak, less than the function of giving full play to as the colorant of the bad phenomenon that is difficult to see outward appearance.
Promptly, present solder resist is to form image, finally implement heat curing and handle through photocuring.The treatment temperature of this moment is generally 150 ℃ and descended about 30～60 minutes, but according to substrate manufacturer, temperature, time are fixing.Its result: under the situation that particularly treatment temperature is high, the processing time is long, there is the problem of the variable color that the oxidation of the copper circuit on can not hidden substrate causes in the solder resist of disguised bad blueness.Further confirm by the inventor, even use the blue colorant of halogen and the green solder resist of yellow colorants to have this problem too, a little less than phthalocyanine green disguise.
In addition, implementing on the substrate under the situation of marking ink, after the curing of solder resist, further typographic(al) mark and heat curing, so the variable color of copper circuit is quickened, apparent problem becomes more deep.
The warpage of the substrate that further produces when revising the heat curing of solder resist exists the substrate integral body situation with heat of exerting pressure, and this moment, the variable color of same copper circuit was quickened.
In the variable color of such copper circuit, the worst phenomenon is: though on identical copper circuit also only at the state of the edge of circuit (part of resist attenuation) variable color.Under such situation, when inspection, installation base plate, owing to do not calibrate with the inspection data, bad even non-defective unit also becomes.On the other hand, though see on the variable color copper circuit equably can with the situation of other parts identifications under do not produce such unfavorable condition.
Such condition of poor is former to be in the news, and particularly used replacing phthalocyanine green under the situation (colorant non-halogen) of the colorants such as phthalocyanine blue with halogen atom and became remarkable.
Patent documentation 1: TOHKEMY 2000-7974 communique (claims, prior art)
Summary of the invention
Invent problem to be solved
Therefore, the object of the present invention is to provide painted Photocurable resin composition, it can form the disguised excellent solder mask that the oxidation by copper circuit is caused variable color etc.
The method that is used to deal with problems
The inventor etc. are through further investigation; The result finds: through using the painted Photocurable resin composition of red stain as colorant at least; Can remove the concealed the problems referred to above in the existing solder resist of the colorant that uses halogen; And then can be through using the red stain of halogen, realization reduces the content of halogen in the solder mask and does not make disguised deterioration, thereby has accomplished the present invention.
That is, the present invention is a Photocurable resin composition, and it can develop and contain compound (C) and the red stain (D) that has 2 above ethylenically unsaturated groups in carboxy resin (A), Photoepolymerizationinitiater initiater (B), the molecule through alkaline aqueous solution.
In the form of above-mentioned Photocurable resin composition of the present invention, except that red stain (D), can contain blue colorant (E1) (for example, phthalocyanine blue) and/or yellow colorants (E2), its tone can be blueness, green, purple or orange.
In addition, in the form of Photocurable resin composition of the present invention, red stain (D) is any one red stain in not halogen-containing and the azo group.
In addition, in the form of Photocurable resin composition of the present invention, it further contains Thermocurable composition (F).
In addition, in the form of Photocurable resin composition of the present invention, it is applied on the copper and is used.
In addition, other forms of the present invention are the photo-curable dry film, and it is applied to above-mentioned Photocurable resin composition on the carrier film, and are dry and obtain.
In addition, other forms of the present invention be above-mentioned Photocurable resin composition blueness, green, purple or orange solidfied material.
In addition, other forms of the present invention be above-mentioned dry film blueness, green, purple or orange solidfied material.
In addition, other forms of the present invention are for to be formed with the printed circuit board (PCB) that has the solder mask that is formed by above-mentioned solidfied material on the substrate of copper circuit.
The invention effect
Through the present invention, disguised excellent blueness, green, purple or the orange painted solder mask of the variable color that the oxidation by copper circuit is caused can be provided.Particularly as blue solder resist replace having disguised problem general blue solder resist and effectively.In addition, the halogen gas generation extremely low, when filming burning of the content of halogen by the resulting solder mask of the present invention significantly reduces.
Description of drawings
Fig. 1 is the figure of expression Mang Saier hue circle.
Embodiment
Below, the present invention is carried out detailed explanation.
As above-mentioned; Photocurable resin composition of the present invention is characterized in that, replaces existing halogen-containing phthalocyanine green and uses red stain (D) as colorant at least; In the form of Photocurable resin composition; Except that red stain (D), also contain blue colorant (E1) and/or yellow colorants (E2), its tone can be blueness, green, purple or orange.
Therefore, at first, describe for colorant of the present invention.In the present invention, colorant can use known colorant commonly used, can be any in pigment, dyestuff, the pigment.But reduce and, preferably do not contain halogen the viewpoint of the influence of human body from carrying capacity of environment.
As red stain (D); Monoazo system, bisdiazo system, azo lake system, benzimidazolone Xi 、 perylene system, pyrrolopyrrole diketone system, condensation azo system, anthraquinone system, quinacridone etc. are arranged; Specifically, can enumerate out the chromaticity index (C.I. that has as following; The distribution of The Society of Dyers and Colourists company) compound of sequence number.
-monoazo system: paratonere 1,2,3,4,5,6,8,9,12,14,15,16,17,21,22,23,31,32,112,114,146,147,151,170,184,187,188,193,210,245,253,258,266,267,268,269;
-bisdiazo system: pigment red 37,38,41;
-monoazo color lake: pigment red 4 8:1,48:2,48:3,48:4,49:1,49:2,50:1,52:1,52:2,53:1,53:2,57:1,58:4,63:1,63:2,64:1,68;
-benzimidazolone system: paratonere 171,175,176,185,208;
-perylenes system: solvent of red 135,179; Pigment red 123,149,166,178,179,190,194,224;
-pyrrolopyrrole diketone system: paratonere 254,255,264,270,272;
-condensation azo system: paratonere 220,144,166,214,220,221,242;
-anthraquinone system: paratonere 168; 177,216; Solvent red 149,150,52,207;
-quinacridone: pigment red 122,202,206,207,209.
Not special the qualification, but be fit to the red stain that use does not contain azo group from the viewpoint of security innocuousness.
As blue colorant (E1), phthalocyanine system, anthraquinone system are arranged, pigment system is the compound that is classified as pigment (Pigment), specifically, can enumerate out the compound of the chromaticity index sequence number that has as following.
-pigment system: pigment blue 15,15:1,15:2,15:3,15:4,15:6,16,60;
-dyestuff system: solvent blue 35,63,68,70,83,87,94,97,122,136,67,70.
Except above-mentioned, can also use metal to replace and perhaps not have substituted phthalocyanine compound.
As yellow colorants (E2), monoazo system, bisdiazo system, condensation azo system, benzimidazolone system, isoindolinone system, anthraquinone system etc. are arranged, specifically, can enumerate out the compound of the chromaticity index sequence number that has as following.
-anthraquinone system: solvent yellow 16 3, pigment yellow 24,108,193,147,199,202;
-isoindolinone system: pigment yellow 110,109,139,179,185;
-condensation azo system: pigment yellow 93,94,95,128,155,166,180;
-benzimidazolone system: pigment Yellow 12 0,151,154,156,175,181;
-monoazo system: pigment yellow 1,2,3,4,5,6,9,10,12,61,62,62:1,65,73,74,75,97,100,104,105,111,116,167,168,169,182,183;
-bisdiazo system: pigment Yellow 12,13,14,16,17,55,63,81,83,87,126,127,152,170,172,174,176,188,198.
Not special the qualification, from the viewpoint of security innocuousness, suitable use does not contain the yellow colorants of azo group.
Among the present invention, the fit rate of red stain and blue colorant and/or yellow colorants can be by the desired tone of the solder mask that resulting Photocurable resin composition, its curing overlay film form, specifically by deciding demonstrating blueness, green, purple or orange sufficient ratio.
Among the present invention, the blueness that Photocurable resin composition, its curing overlay film of the present invention was, green, purple and orange being meant: have under the with the naked eye observed situation of observer it is identified as the tone of blueness, green, purple and orange degree.Specifically; Be meant by the method for JISZ8721 defined measure the expression Photocurable resin composition with and during the outward appearance tone of curing overlay film, (juridical person Japan color research institute edits new 2 Munsell system day of Essential colour watch series true qualities and grinds the distribution of cause Co., Ltd. at the Mang Saier hue circle; With reference to Fig. 1) on; Belong to hue range from 5BG to not enough 3P (blueness), from 9Y to not enough 5BG (green), from 3P to not enough 7RP (purple), from 9R to not enough 7YR (orange); And be preferably have the above less than of chroma 1 16, lightness is 1 above less than 9, more preferably the above less than of chroma 2 15, lightness are 2 above less thaies 9.
Concrete cooperation ratio receives the kind of employed colorant, other the influence of kind of adjuvant etc.; Therefore must not make sweeping generalizations; Mass ratio is red stain (D): blue colorant (E1): yellow colorants (E2)=1: 0～50: 0～50 but usually.In addition, painted fully in order to carry out, preferably cooperate as the total amount of red stain (D), blue colorant (E1) and yellow colorants (E2) with the ratio of 0.05～3.0 quality % of total composition.
Among the present invention; Except above-mentioned colorant; Can also add colorants such as the purple that is used to adjust tone, orange, dark brown, black; Specifically, can enumerate out pigment violet 19,23,29,32,36,38,42, solvent violet 13,36, C.I. pigment orange 1, C.I. pigment orange 5, C.I. pigment orange 13, C.I. pigment orange 14, C.I. pigment orange 16, C.I. pigment orange 17, C.I. pigment orange 24, C.I. pigment orange 34, C.I. pigment orange 36, C.I. pigment orange 38, C.I. pigment orange 40, C.I. pigment orange 43, C.I. pigment orange 46, C.I. pigment orange 49, C.I. pigment orange 51, C.I. pigment orange 61, C.I. pigment orange 63, C.I. pigment orange 64, C.I. pigment orange 71, C.I. pigment orange 73, C.I. bistre 23, C.I. bistre 25; C.I. pigment black 1, C.I. pigment black 7 etc.
Then, describe for containing carboxylic acid resin (A).
Contain carboxylic acid resin (A) as Photocurable resin composition of the present invention comprises, can use the resin compound known commonly used that contains carboxylic acid in the molecule.Further from photo-curable, anti-development property aspect, what more preferably have ethylenical unsaturated double bonds in the molecule contains carboxylic acid photoresist (A ').
Specifically, can enumerate out the following resin of enumerating.
(1) in addition the compound with unsaturated double-bond obtains through unsaturated carboxylic acids such as copolymerization (methyl) acrylic acid and more than a kind contain the carboxyl acid copolymer resin,
(2) through (methyl) glycidyl acrylate, (methyl) acrylic acid 3; 4-epoxycyclohexyl methyl esters etc. has compound, (methyl) acryloyl chloride of epoxy radicals and unsaturated double-bond etc.; Ethylenically unsaturated group is added to unsaturated carboxylic acids such as (methyl) acrylic acid as side chain and more than a kind in addition the multipolymer of compound with unsaturated double-bond, obtain thus contain the carboxylic acid photoresist,
(3) make (methyl) glycidyl acrylate, (methyl) acrylic acid 3; 4-epoxycyclohexyl methyl esters etc. has the multipolymer of the compound of epoxy radicals and unsaturated double-bond and the compound with unsaturated double-bond in addition; With the reaction of unsaturated carboxylic acid such as (methyl) acrylic acid, with secondary hydroxyl that is generated and multi-anhydride react and the photonasty that obtains contain the carboxyl acid copolymer resin,
(4) compound that makes multipolymer that maleic anhydride etc. has the acid anhydrides of unsaturated double-bond and in addition a compound with unsaturated double-bond and (methyl) acrylic acid 2-hydroxyl ethyl ester etc. have hydroxyl and unsaturated double-bond react and obtain contain the carboxylic acid photoresist,
(5) make the reaction of multi-group epoxy compound and unsaturated monocarboxylic, with the hydroxyl that is generated and saturated or unsaturated multi-anhydride react and obtain contain the carboxylic acid photoresist,
(6) make the reaction of hydroxyl polymer-containing such as polyvinyl alcohol derivative and saturated or unsaturated multi-anhydride after, with the compound that has epoxy radicals and unsaturated double-bond in the carboxylic acid that is generated and a part react and the photoresist of the hydroxyl that obtains and carboxylic acid,
(7) make have in multi-group epoxy compound, unsaturated monocarboxylic and a part at least 1 alcoholic extract hydroxyl group and with the reaction product of the compound of 1 reactive group beyond the alcoholic extract hydroxyl group of epoxy reaction, obtain with saturated or unsaturated multi-anhydride reaction contain the carboxylic acid photoresist,
(8) make the reaction of the polyfunctional group oxetane compound that has at least two oxetanes rings in a part and unsaturated monocarboxylic, and primary hydroxyl in the modification oxetane resin of gained is reacted with saturated or unsaturated multi-anhydride and obtain contain the carboxylic acid photoresist and
(9) make polyfunctional epoxy resin and unsaturated monocarboxylic the reaction after; Obtain containing the carboxylic acid resin with the multi-anhydride reaction; Again this is contained the compound reaction that has 1 oxirane ring and 1 above ethylenically unsaturated group in carboxylic acid resin and the molecule and obtain contain carboxylic acid photoresist etc., but be not limited to these.
In the middle of these illustrations preferably above-mentioned (2), (5), (7) contain the carboxylic acid resin, particularly from photo-curable, cured coating film characteristic aspect, preferably above-mentioned (9) contain the carboxylic acid photoresist.
In addition, in this manual, (methyl) acrylic ester is meant the term of general name acrylic ester, methacrylate and their potpourri, and other similarly show too.
The carboxylic acid resin (A) that contains of above-mentioned that kind has a large amount of free carboxyls at the side chain of trunk polymer, thereby can develop through alkaline aqueous solution.
In addition, the above-mentioned carboxylic acid resin's of containing (A) acid number is preferably the scope of 40～200mgKOH/g, the scope of 45～120mgKOH/g more preferably.When containing carboxylic acid resin's acid number deficiency 40mgKOH/g, alkali develops difficult, on the other hand; When surpassing 200mgKOH/g, developer solution causes the dissolving aggravation of exposure portion, thereby line is thinner than required; According to circumstances; Exposure portion and unexposed are developed the liquid dissolving as broad as longly and peel off, and are difficult to describe normal corrosion-resisting pattern, so not preferred.
In addition, the above-mentioned weight-average molecular weight that contains carboxylic acid resin (A) is different because of resin matrix, is generally 2000～150000, further is preferably 5000～100000 scope.During weight-average molecular weight less than 2000, the dry to touch degradation, the moisture-proof variation of filming after the exposure, generation film minimizing when developing, resolution is very poor.On the other hand, weight-average molecular weight surpasses at 150000 o'clock, the remarkable variation of development property, storage-stable variation.
The fit rate that contains carboxylic acid resin (A) like this is preferably 20～60 quality %, 30～50 quality % more preferably in whole compositions.Under the situation about lacking than above-mentioned scope, coating strength reduces, so not preferred.On the other hand, under the situation of Duoing than above-mentioned scope, viscosity uprises, or reduction such as coating, so not preferred.
Then, describe for Photoepolymerizationinitiater initiater (B).
As Photoepolymerizationinitiater initiater (B); For example can enumerate out; Acetophenone, 2; 2-dimethoxy-2-phenyl acetophenone, 2; 2-diethoxy-2-phenyl acetophenone, to dimethylamino propiophenone, dichloroacetophenone, trichloroacetophenone, to tert-butyl group trichloroacetophenone, 1-hydroxycyclohexylphenylketone, 2-methyl isophthalic acid-[4-(methyl mercapto) phenyl]-2-morpholino propane-1-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholino phenyl)-butanone-1, N, acetophenones such as N-dimethylamino benzoylformaldoxime; Benzophenone, methyldiphenyl ketone, 2-chlorobenzophenone, 4; 4 '-dichloro benzophenone, 4; 4 '-two dimethylamino benzophenone, 4,4 '-two diethylamino benzophenone, Michler's keton, 4-benzoyl-4 '-benzophenones such as methyldiphenyl thioether; Benzil; Benzoin ethers such as benzoin, benzoin methylether, benzoin ethyl ether, benzoin iso-propylether, benzoin isobutyl ether; Ketal classes such as acetophenone dimethyl ketal, benzyl dimethyl ketal; Thioxanthones, 2-clopenthixal ketone, 2,4-dimethyl thioxanthones, 2,4-diethyl thioxanthone, 2, thioxanthene ketones such as 4-diisopropyl thioxanthones; 2-methylanthraquinone, 2-EAQ, 2-tert-butyl group anthraquinone, 1-chloroanthraquinone, 2-amino anthraquinones, 2, anthraquinone classes such as 3-diphenyl anthraquinone; Organic peroxide such as benzoyl peroxide, cumene peroxide; 2,4, mercaptan compounds such as 5-triarylimidazoles dipolymer, hibon, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole; 2,4,6-three-s-triazine, 2,2, organic halogen compounds such as 2-ethobrom, trisbromomethyl benzene sulfone; 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, two (2,4, the 6-trimethylbenzoyl) phenyl phosphine oxide etc.These compounds can use separately, in addition, and use more than 2 kinds also capable of being combined.
In addition; Above-mentioned Photoepolymerizationinitiater initiater (B) can use with the combination more than a kind or 2 kinds of following light sensitizer; Like N; N-dimethylamino benzoic acid ethyl ester, N; Two luxuriant titanium classes, 2-(acetoxyl group iminomethyl) thioxanthene-9-one, { 1-[4-(thiophenyl)-2-(O-benzoyl oximes)] } 1 such as tertiary amines such as N-dimethylamino benzoic acid isopentyl ester, amyl group-4-dimethylaminobenzoic acid ester, triethylamine, triethanolamine, two (η 5-cyclopentadienyl groups)-two (2,6-two fluoro-3-(1H-pyrroles-1-yl) phenyl) titanium, 2-acetyl caproyl, 1-[9-ethyl-6-(2-methyl benzoyl)-9H-carbazole-3-yl]-oxime ester classes such as 1-(O-acetyl oxime) ethyl ketone.
The preferred compositions of aforementioned lights polymerization initiator (B) is that (4-morpholinyl phenyl)-the 1-butanone (for example for 2-benzyl-2-dimethylamino-1-; Ciba Specialty Chemicals K.K. system, IRGACURE 369:IRGACURE are registered trademarks) and the combination, 2 of two (η 5-cyclopentadienyl group)-two (2,6-two fluoro-3-(1H-pyrrole radicals-1-yl) phenyl) titanium (for example, Ciba Specialty Chemicals K.K. system, IRGACURE 784); 4; The combination or 2 of 6-trimethylbenzoyl diphenyl phosphine oxide (for example, BASF system LucirinTPO) and 2-(acetoxyl group iminomethyl) thioxanthene-9-one (for example, Ciba Specialty Chemicals K.K. system, CGI-325); 4; 6-trimethylbenzoyl diphenyl phosphine oxide (for example, BASF system LucirinTPO) and two (2,4; The 6-trimethylbenzoyl)-combination of phenyl phosphine oxide (for example, Ciba Specialty Chemicals K.K. system, IRGACURE 819) etc.
In addition, the OK range of the use amount of above-mentioned such Photoepolymerizationinitiater initiater (B) is preferably 1～30 mass parts, the ratio of 5～25 mass parts more preferably for contain carboxylic acid resin (A) with respect to 100 mass parts.Under the few situation of the above-mentioned scope of cooperation ratio of Photoepolymerizationinitiater initiater, the photo-curable of resultant composition is bad.On the other hand, under the situation of Duoing than above-mentioned scope, the bad characteristic of resulting cured coating film, in addition, the storage stability of composition is bad, so not preferred.
Then, describe for the compound that has 2 above ethylenically unsaturated groups in the molecule (C).
The compound (C) that has 2 above ethylenically unsaturated groups in the used molecule of Photocurable resin composition of the present invention is described below: the photocuring through the active energy beam irradiation does not dissolve the aforementioned carboxylic acid resin of containing (A), or helps to make the aforementioned carboxylic acid resin of containing (A) in alkaline aqueous solution, not dissolve in alkaline aqueous solution.As such compound, can enumerate out the diacrylate class of glycol such as monoethylene glycol, methoxyl TEG, polyglycol, propylene glycol; The multicomponent methacrylate class of polyvalent alcohols such as hexanediol, trimethylolpropane, pentaerythrite, dipentaerythritol, tris(2-hydroxy ethyl)isocyanurate or these ethylene oxide adduct or propylene oxide adduct etc.; The multicomponent methacrylate class of the ethylene oxide adduct of acrylic acid benzene oxygen ester, bisphenol a diacrylate and these phenols or propylene oxide adduct etc.; The multicomponent methacrylate class of glycidol ethers such as glycerin diglycidyl ether, T 55, trihydroxymethylpropanyltri diglycidyl ether, triglycidyl group isocyanuric acid ester; And the melamine acrylic ester and/or with corresponding each methyl acrylic ester of aforesaid propylene acid esters etc.
Further, can enumerate the Epocryl of polyfunctional epoxy resins such as making the cresols phenolic resin varnish type epoxy resin and acrylic acid reaction; Further make epoxy polyurethane acrylate compounds that half urethane compound (the half urethane compound) reaction of the diisocyanate such as crylic acid hydroxy ester such as hydroxyl and pentaerythritol triacrylate and isophorone diisocyanate of this Epocryl obtains etc.Such epoxy acrylate is that resin can improve photo-curable and dry to touch property can not reduce.
The fit rate that has the compound (C) of 2 above ethylenically unsaturated groups in such molecule is 5～100 mass parts, the ratio of 1～70 mass parts more preferably with respect to the aforementioned carboxylic acid resin of containing of 100 mass parts (A).Under the situation of aforementioned use level less than 5 mass parts, photo-curable reduces, and develops through the postradiation alkali of active energy beam, is difficult to form pattern, so not preferred.On the other hand, surpass under the situation of 100 mass parts, to the dissolubility of alkaline aqueous solution reduce, filming becomes fragile, so not preferred.
Then, describe for Thermocurable composition (F).
In order to give thermotolerance, can in Photocurable resin composition of the present invention, add Thermocurable composition (F).Be preferably the Thermocurable composition (F) of the ring-type ether that in molecule, has more than 2 and/or cyclic thioether base (below, abbreviate ring-type (sulphur) ether as) especially.
The Thermocurable composition (F) that has 2 above ring-types (sulphur) ether in such molecule in molecule, have the ring-type ether of 3,4 or 5 yuan of rings more than 2 or in the cyclic thioether base any or have the compound of 2 kinds of groups; For example can enumerate out: in molecule, have at least 2 above epoxy radicals compound, be multi-group epoxy compound (F-1); In molecule, have at least 2 above oxetanyls compound, be polyfunctional group oxetane compound (F-2), in molecule, have the thioether group more than 2 compound, be episulfide resin (F-3) etc.
Aforementioned multi-group epoxy compound (F-1), for example can enumerate out: EPICLON840, EPICLON 850, EPICLON 1050, EPICLON 2055, Dongdu of the EPIKOTE 828 of japan epoxy resin corporate system, EPIKOTE 834, EPIKOTE1001, EPIKOTE 1004, big Japanese ink chemical industrial company system changes into (any all is a trade name) bisphenol A type epoxy resins such as the A.E.R.330, A.E.R.331, A.E.R.661, A.E.R.664 of SUMI-EPOXY ESA-011, ESA-014, ELA-115, ELA-128, industrial group of the Asahi Chemical Industry system of ARALDITE6071, ARALDITE 6084, ARALDITE GY250, ARALDITE GY260, the Sumitomo Chemical Co. Ltd.'s system of the D.E.R.317 of the EPOTOTOYD-011 of corporate system, YD-013, YD-127, YD-128, Dow Chemical Company system, D.E.R.331, D.E.R.661, D.E.R.664, Ciba Specialty Chemicals Corporation; The EPIKOTE YL903 of japan epoxy resin corporate system; The EPICLON152 of big Japanese ink chemical industrial company system; EPICLON165; Dongdu changes into the EPOTOTO YDB-400 of corporate system; YDB-500; The D.E.R.542 of Dow Chemical Company system; The ARALDITE 8011 of Ciba Specialty Chemicals Corporation system; The SUMI-EPOXYESB-400 of Sumitomo Chemical Co. Ltd.'s system; ESB-700; The A.E.R.711 of industrial group of Asahi Chemical Industry system; A.E.R.714 etc. (any all is a trade name) brominated epoxy resin; The EPIKOTE 152 of japan epoxy resin corporate system; EPIKOTE 154; The D.E.N.431 of Dow Chemical Company system; D.E.N.438; The EPICLON N-730 of big Japanese ink chemical industrial company system; EPICLON N-770; EPICLON N-865; Dongdu changes into the EPOTOTO YDCN-701 of corporate system; YDCN-704; The ARALDITE ECN1235 of Ciba Specialty Chemicals Corporation system; ARALDITE ECN1273; ARALDITE ECN1299; ARALDITE XPY307; The EPPN-201 of Japan's chemical drug corporate system; EOCN-1025; EOCN-1020; EOCN-104S; RE-306; The SUMI-EPOXY ESCN-195X of Sumitomo Chemical Co. Ltd.'s system; ESCN-220; The A.E.R.ECN-235 of industrial group of Asahi Chemical Industry system; ECN-299 etc. (any all is a trade name) phenolic resin varnish type epoxy resin; EPICLON830, japan epoxy resin corporate system EPIKOTE 807, Dongdu of big Japanese ink chemical industrial company system changes into EPOTOTOYDF-170, YDF-175, the YDF-2004 of corporate system, (any all is a trade name) bisphenol f type epoxy resins such as ARALDITE XPY306 of Ciba Specialty Chemicals Corporation system; Dongdu changes into EPOTOTOST-2004, ST-2007, the ST-3000 bisphenol-A epoxy resins such as (trade names) of corporate system; The ARALDITE MY720 of the EPOTOTO YH-434 that the EPIKOTE 604 of japan epoxy resin corporate system, Dongdu change into corporate system, Ciba Specialty Chemicals Corporation system, (any all is a trade name) glycidyl group amine type epoxy resin such as SUMI-EPOXY ELM-120 of Sumitomo Chemical Co. Ltd.'s system; The ARALDITE CY-350 hydantoins type epoxy resin such as (trade names) of Ciba Specialty Chemicals Corporation system; DAICEL CHEMICAL INDUSTRIES, (any all is a trade name) alicyclic epoxy resins such as the ARALDITE CY175 of the SEROKISIDE 2021 of LTD. system, Ciba Specialty Chemicals Corporation system, CY179; (any all is a trade name) trihydroxy benzene methylmethane type epoxy resin such as the T.E.N. of the YL-933 of japan epoxy resin corporate system, Dow Chemical Company system, EPPN-501, EPPN-502; The YL-6056 of japan epoxy resin corporate system, YX-4000, YL-6121 di-cresols types such as (any all are a trade name) perhaps join phenol-type epoxy resin or these potpourri; The EXA-1514 bisphenol-s epoxy resins such as (trade names) of Japan chemical drug corporate system EBPS-200, the system EPX-30 of Asahi Electro-Chemical Co. Ltd, big Japanese ink chemical industrial company system; The EPIKOTE 157S bisphenol-A phenolic varnish type epoxy resin such as (trade names) of japan epoxy resin corporate system; (any all is a trade name) four phenylol ethane type epoxy resin such as ARALDITE163 of the EPIKOTE YL-931 of japan epoxy resin corporate system, Ciba Specialty Chemicals Corporation system; (any all is a trade name) hetero ring type epoxy resin such as TEPIC of the ARALDITE PT810 of Ciba Specialty Chemicals Corporation system, daily output chemical industrial company system; O-phthalic acid diglycidyl ester resins such as the system BLEMMER DGT of Nof Corp.; Dongdu changes into four diglycidyl xylenols ethane resin such as corporate system ZX-1063; Chemical company of Nippon Steel system ESN-190, ESN-360, the big system HP-4032 of Japanese ink chemical industrial company, EXA-4750, EXA-4700 etc. contain naphthyl epoxy resin; The epoxy resin of the big system HP-7200 of Japanese ink chemical industrial company, HP-7200H etc. with bicyclopentadiene skeleton; GMA copolymerization such as the system CP-50S of Nof Corp., CP-50M are epoxy resin; The copolymerization epoxy resin of further cyclohexyl maleimide and GMA; Epoxide modified polybutadiene rubber derivant (for example, DAICEL CHEMIC AL INDUSTRIES, LTD. system PB-3600 etc.), CTBN modified epoxy (for example, Dongdu changes into the YR-102, YR-450 of corporate system etc.) etc. are not limited to these.These epoxy resin can separately or make up more than 2 kinds and use.Preferred especially phenolic resin varnish type epoxy resin, hetero ring type epoxy resin, bisphenol A type epoxy resin or these potpourri in the middle of these.
As aforementioned polyfunctional group oxetane compound (F-2); Can enumerate out two [(3-methyl-3-oxetanes ylmethoxy) methyl] ethers, two [(3-ethyl-3-oxetanes ylmethoxy) methyl] ether, 1; Two [(3-methyl-3-oxetanes ylmethoxy) methyl] benzene, 1 of 4-, gather the etherate etc. that (para hydroxybenzene ethene), cardo type bisphenols, calixarene kind, resorcinol calixarenes (calixresorcinarene) type or silsesquioxane (silsesquioxane) wait the resin formation with hydroxyl at two [(3-ethyl-3-oxetanes ylmethoxy) methyl] benzene of 4-, (3-methyl-3-oxetanyl) methacrylate, (3-ethyl-3-oxetanyl) methacrylate, methacrylic acid (3-methyl-3-oxetanyl) methyl esters, methacrylic acid (3-ethyl-3-oxetanyl) methyl esters, these polyfunctional group oxetanes classes such as oligomer or multipolymer, oxetanes alcohol and novolac resin.Also can enumerate the unsaturated monomer of providing the oxetanes ring and multipolymer of alkyl (methyl) acrylic ester etc. in addition.
As the compound (F-3) that in aforementioned molecule, has 2 above ring-types (sulphur) ether, can enumerate out bisphenol A-type episulfide resin YL7000 of japan epoxy resin corporate system for example etc.In addition, also available same synthetic method, and the oxygen atom of the epoxy radicals of use phenolic resin varnish type epoxy resin is replaced as the episulfide resin of sulphur atom etc.
The fit rate of Thermocurable composition (F) that has 2 above ring-types (sulphur) ether in the aforementioned molecule is with respect to the aforementioned carboxylic acid resin's of containing of 1 equivalent (A) carboxyl, is preferably the scope of 0.6～2.5 equivalent, the scope of 0.8～2.0 equivalent more preferably.The fit rate of Thermocurable composition (F) that has 2 above ring-types (sulphur) ether in the molecule is under the situation of less than 0.6, and residual on the solder resist film have reductions such as carboxyl, thermotolerance, alkali resistance, electrical insulating property, so not preferred.On the other hand, surpass under the situation of 2.5 equivalents, low-molecular-weight ring-type (sulphur) ether is residual on dry coating, and so reductions such as the intensity of filming thus are not preferred.
In the light-cured resin of the present invention, use under the situation of the Thermocurable composition (F) that has 2 above ring-types (sulphur) ether in the above-mentioned molecule, preferably contain thermal curing catalyst (G).As such thermal curing catalyst (G), for example can enumerate out: the imdazole derivatives of imidazoles, glyoxal ethyline, 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole etc.; Dicyandiamide, benzyl dimethyl amine, 4-(dimethylamino)-N, N-dimethyl benzyl amine, 4-methoxyl-N, N-dimethyl benzyl amine, 4-methyl-N, hydrazine compounds such as amines such as N-dimethyl benzyl amine, adipic dihydrazide, sebacic dihydrazide; Phosphorus compounds such as triphenylphosphine etc.; In addition; As commercially available material; For example can enumerate out 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, 2P4MHZ (any all is the trade name of imidazole compound), SAN-APRO that four countries change into industrial group's system, U-CAT3503N of Ltd. system, U-CAT3502T (any all is the trade name of the block isocyanate compound of dimethyl amine), DBU, DBN, U-CATSA102, U-CAT5002 (any all be two ring type amidine compounds with and salt) etc.Be not specially limited in these, so long as the thermal curing catalyst of epoxy resin, oxetane compound, or can promote epoxy radicals and/or oxetanyl and carboxyl reaction just passable, can be separately or mixing use more than 2 kinds.In addition; Can use guanamine, methyl guanamines, benzo guanamine, melamine, 2; 4-diamido-6-methacryloxyethyl-s-triazine, 2-vinyl-2,4-diamido-s-triazine, 2-vinyl-4,6-diamido-s-triazine isocyanuric acid addition product, 2; 4-diamido-6-methacryloxyethyl-Striazine derivatives such as s-triazine isocyanuric acid addition product preferably uses these compound and combinations of aforementioned hot curing catalysts of also playing the tackifiers effect.
The fit rate of these thermal curing catalysts is just enough with the ratio of common amount; For example contain the Thermocurable composition (F) that has 2 above ring-types (sulphur) ether in carboxylic acid resin (A) or the molecule, be preferably 0.1～20 mass parts, 0.5～15.0 mass parts more preferably with respect to 100 mass parts.
For intensity of improving its physics of filming etc., also can in Photocurable resin composition of the present invention, cooperate filler as required.As such filler, can use known inorganic or organic filler commonly used, but especially preferably use barium sulphate, spherical silicon dioxide and talcum.Further, also can use nano silicon is dispersed in the compound with the ethylenically unsaturated group more than 1 or NANOCRYL (trade name) XP 0396, XP 0596, XP 0733, XP 0746, XP 0765, XP0768, XP 0953, XP 0954, XP 1045 (any all is the product hierarchy name), NANOPOX (trade name) XP0516 of Hanse-Chemie corporate system, XP 0525, the XP 0314 (any all is the product hierarchy name) of the Hanse-Chemie corporate system in the aforementioned polyfunctional epoxy resin (F-1).Also can be separately or be used more than 2 kinds with these.
The fit rate of these fillers contains carboxylic acid resin (A) with respect to 100 mass parts are above-mentioned, is preferably below 300 mass parts, and more preferably 0.1～300 mass parts is preferably 0.1～150 mass parts especially.The fit rate of filler is surpassing under the situation of 300 mass parts, and the viscosity of photosensitive composite uprises and the printing reduction, and solidfied material becomes fragile, so not preferred.
Further, contain carboxylic acid resin (A), adjustment composition for synthetic above-mentioned, or in order to adjust the viscosity that is applied on substrate, the carrier film, Photocurable resin composition of the present invention can be with an organic solvent.
As such organic solvent, can enumerate out ketone, aromatic hydrocarbon based, glycol ethers, glycol ether acetic acid ester class, ester class, alcohols, aliphatic hydrocarbon, oil series solvent etc.More particularly, ketone such as MEK, cyclohexanone; Toluene, xylene, tetramethylbenzene etc. are aromatic hydrocarbon based; Glycol ethers such as cellulose, methylcellulose, butyl cellulose, carbitol, methyl carbitol, BC, propylene glycol monomethyl ether, DPGME, DPG Anaesthetie Ether, Triethylene glycol ethyl ether; Ester classes such as ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetic acid esters, methyl proxitol acetate, propylene glycol ethylether acetic acid esters, propylene glycol butyl ether acetic acid esters; Alcohols such as ethanol, propyl alcohol, monoethylene glycol, propylene glycol; Aliphatic hydrocarbon such as octane, decane; Oil series solvents such as sherwood oil, naphtha, hydrogenated naphtha, solvent naphtha etc.Such organic solvent can use separately or as the potpourri more than 2 kinds.
Photocurable resin composition of the present invention also can be as required, cooperates silane coupling agent, anti-oxidants such as foam-breaking agent such as known habitual tackifier such as known hot polymerization inhibitor commonly used, fine particle silica, organobentonite, polynite, silicone-based, fluorine system, macromoleculars such as quinhydrones, hydroquinone monomethyl ether, tert-butyl catechol, pyrogaelol, phenothiazine and/or levelling agent, imidazoles system, thiazole system, triazole system, prevents such additive kind known commonly used such as Qiang agent.
Then, dry film, solidfied material that obtains and the printed circuit board (PCB) with the solder mask that is formed by this solidfied material describe for using Photocurable resin composition of the present invention.
Photocurable resin composition of the present invention is coated with the dry dry film that obtains photo-curable through common method on carrier film.Photocurable resin composition of the present invention or its dry film form solidfied material through photocuring on copper.Photocuring can use ultraviolet exposure apparatus according, but makes its curing through oscillating laser light source, the particularly laser of wavelength 350～410nm.Printed circuit board (PCB) of the present invention is to obtain through behind such photocuring, carrying out heat curing.
Specifically, can be formed as follows dry film, solidfied material, printed circuit board (PCB).Promptly; For example Photocurable resin composition of the present invention is adjusted to the viscosity that is suitable for coating process with aforementioned organic solvent; Be applied on the substrate through methods such as dip coating, flow coat method, rolling method, line rod rubbing method, silk screen print method, curtain-type rubbing methods; The organic solvent volatile dry that under about 60～100 ℃ temperature, makes in the composition to be comprised (temporary transient dry), thus filming of dry to touch can be formed.In addition, above-mentioned composition is coated on the carrier film, makes it dry and, it is fitted on the base material, can form resin insulating barrier as winding film.Thereafter; Adopt contact (or noncontact mode); Through forming figuratum photomask; Optionally, unexposed portion is developed through alkaline aqueous solution (for example 0.3～3% aqueous sodium carbonate), form corrosion-resisting pattern by the active energy beam exposure or through the direct exposing patterns of the direct exposure machine of laser.Further; Contain under the situation of composition of heat curing composition (F); For example be heated to about 140～180 ℃ temperature, make its heat curing, thus; The Thermocurable composition (F) that has 2 above ring-types (sulphur) ether in the aforementioned carboxylic acid resin's of containing (A) carboxyl and the molecule reacts, and can form the cured coating film of each excellents such as thermotolerance, chemical proofing, anti-hydroscopicity, adaptation, electrical characteristics.
In addition, even under the situation that does not contain Thermocurable composition (F), through thermal treatment, residual ethylenic unsaturated bond hot radical polymerization under the unreacted situation in order to improve coating characteristic, also can be heat-treated (heat curing) according to the purpose purposes when exposure.
As above-mentioned base material; Can enumerate the high-frequency circuit that uses paper phenolics, paper epoxy resin, glass cloth epoxy resin, glass polyimide, glass cloth/nonwoven fabrics epoxy resin, glass cloth/paper epoxy resin, synthon epoxy resin, fluoro-tygon-polyphenylene oxide (PPO)-cyanate etc. copper clad laminate with all models (FR-4 etc.) of materials such as copper clad laminate, and polyimide film, polyethylene terephthalate film (PET film), glass substrate, ceramic substrate, wafer board etc.
Being coated with the volatile dry that carries out behind the Photocurable resin composition of the present invention carries out through using heated air circulation type drying oven, IR stove, electric furnace, convective drying case etc. (with the method for the contact of the hot air convection in the dryer and by the mode of nozzle spraying support, wherein the hot blast in the dryer uses the material of the thermal source that possesses the air heat mode through steam).
Behind following coating Photocurable resin composition of the present invention, the volatile dry, for resulting make public (irradiation of active energy beam) of filming.The exposed portion of filming (by the part of active energy beam irradiation) solidifies.
Can use the exposure machine of the direct drawing apparatus of laser (laser direct imaging device), the exposure machine that carries metal halide lamp, lift-launch (surpass) high-pressure sodium lamp, the exposure machine that carries mercury shot arc lamp, or the direct drawing apparatus of UV-lamp such as use (surpassing) high-pressure sodium lamp as the used exposure machine of above-mentioned active energy beam irradiation.As active energy beam, if use the laser of maximum wavelength in the scope of 350～410nm, then gas laser, Solid State Laser any can.In addition, its exposure is according to thickness etc. and different, but is generally 5～200mJ/cm
2, be preferably 5～100mJ/cm
2, 5～50mJ/cm more preferably
2Scope in.As above-mentioned direct drawing apparatus, for example can use the product of Japanese ORB OTECH corporate system, PENTAX corporate system etc., also can use the arbitrary device of maximum wavelength at the device of the oscillating laser of 350～410nm.
As aforementioned developing method, can utilize infusion process, spray process, spray-on process, brushing method etc., as developer solution, can use alkaline aqueous solutions such as potassium hydroxide, NaOH, sodium carbonate, sal tartari, sodium phosphate, sodium silicate, ammonia, amine.
Embodiment
Below, embodiment and comparative example are shown, the present invention is specified, the present invention is not limited to following embodiment certainly." part " short of special qualification all is meant " mass parts " in addition, below.
< containing the synthetic of carboxylic acid resin >
According to following synthetic example, make the carboxy resin (A) that contains of the present invention.
With 220 parts of cresols phenolic resin varnish type epoxy resins (big Japanese ink chemical industry (strain) system, " EPICLON " (registered trademark) N-695, epoxide equivalent: 220) put into the four-hole boiling flask that has stirring machine and reflux condenser; Add 214 parts of carbitol acetic acid esters, heating for dissolving.Then, add 0.46 part of quinhydrones, 1.38 parts of triphenylphosphines as catalysts as polymerization inhibitor.With this mixture heated to 95～105 ℃, slowly drip 72 parts of acrylic acid, make its reaction 16 hours.This reaction product is cooled to 80～90 ℃, adds 106 parts of tetrabydrophthalic anhydrides, make its reaction 8 hours, after the cooling, take out reaction solution (being called " varnish (A-1) ").The acid number of the solid matter that contains the carboxylic acid photoresist that obtains like this is that 100mgKOH/g, non-volatile content are 65%.
< embodiment 1～7 and comparative example 1～2 >
It is mixing with three roller roller mills the varnish (A-1) that obtains in the aforementioned carboxylic acid resin of containing synthetic and the composition shown in the table 1 to be pressed the described cooperation ratio of table 1, obtains Photocurable resin composition.
Table 1
For the Photocurable resin composition of embodiment 1～7 and comparative example 1～2, according to following metewand assess performance and characteristic.The result is shown in table 2.
Performance evaluation:
< the righttest exposure/light sensitivity >
The circuit pattern substrate polishing of the thick 35 μ m of copper is ground after washing, drying, and then through silk screen print method whole coating of Photocurable resin composition with embodiment 1～7 and comparative example 1～2, drying is 60 minutes in 80 ℃ heated air circulation type drying oven.After the drying; Use the exposure device that carries metal halide lamp; Through stage metraster (Kodak No.2) exposure, when the pattern of residual stage metraster is 7 sections when developing (30 ℃, 0.2MPa, 1 quality % aqueous sodium carbonate) 60 seconds as the righttest exposure.
< resolution >
The circuit pattern substrate polishing of line/be spaced apart 300/300, the thick 35 μ m of copper is ground after washing, drying; Through the Photocurable resin composition coating of silk screen print method with embodiment 1～7 and comparative example 1～2, drying is 30 minutes in 80 ℃ heated air circulation type drying oven then.After the drying, use the exposure device exposure of carrying metal halide lamp.Exposing patterns uses directly retouches the line of describing 20/30/40/50/60/70/80/90/100 μ m with data or photomask in spacer portion.Exposure is shone active energy beam with the righttest exposure of photosensitive polymer combination.After the exposure, develop, describe pattern, obtain cured coating film through 150 ℃ * 60 minutes heat curings with 30 ℃ 1 quality % aqueous sodium carbonates.
Use is adjusted to 200 times optical microscope and is obtained the minimum residual wires of resulting solder resist with the cured coating film of photosensitive polymer combination.
Attribute testing:
(estimating the making of substrate)
Be applied on the copper clad laminate that forms pattern, descend dry 20 minutes, cool to room temperature through the whole face of composition of serigraphy at 80 ℃ with embodiment 1～4 and comparative example 1～2.On this substrate, use the exposure device that carries metal halide lamp with the righttest exposure exposure solder resist pattern, with expulsion pressure 2kg/cm
2Condition with 1%Na
2CO
3The WS developed 60 seconds, obtained corrosion-resisting pattern.Through the UV furnace conveyor at accumulated exposure amount 1000mJ/cm
2Condition under this substrate carried out ultraviolet ray irradiation after, 150 ℃ of heating 60 minutes and solidifying down.Estimate following characteristic for resulting printed base plate (evaluation substrate).
< color of filming >
Judge the solder resist of the foregoing description and comparative example through the color of visual solidfied material.
< copper circuit variable color >
To estimate substrate again and heat 2 hours down, by degree like the variable color on the copper circuit that judges at 150 ℃.
00: do not have variable color fully.
Zero: with prima facies than some variable color a little, but thin part of resist layer and thick part do not have difference fully.
△: confirm variable color, but part that resist layer approaches and thick part do not have difference fully.
*: confirm the variable color of the part that resist layer is thin, with the significant difference of thick part.
< solder heat resistance property >
The evaluation substrate of coating rosin series solder flux is immersed in the solder bath that is redefined for 260 ℃, behind modification alcohol washing solder flux, peels off through the visual expansion of estimating resist layer.Determinating reference is following.
Zero:, also can confirm less than peeling off even flooded for 10 seconds, flood more than 3 times repeatedly at every turn.
△: flooded for 10 seconds at every turn, when flooding more than 3 times repeatedly, peel off a little.
*: flooded for 10 seconds at every turn, flood in 3 times, exist resist layer to expand, peel off.
< the gold-plated property of chemically-resistant >
Use the electroless nickel bath and the chemical gilding of commercially available article to bathe; Under the condition of nickel 0.5 μ m, golden 0.03 μ m, carry out plating; Through belt stripping test estimate resist layer have or not peel off, plating have or not infiltration after, under the test condition of aforementioned solder heat resistance property, be immersed in 10 seconds of solder bath; Washing, after the drying, estimate resist layer through belt stripping test and have or not and peel off.Determinating reference is following.
Zero: can't see variation fully.
△: see a little infiltration behind the plating, peel off after seeing solder heat resistance.
*: peel off behind the plating.
< electrochemical corrosion resistant property >
Use the comb-type electrode B sample Alloy instead of Copper foil substrate of IPC B-25, under above-mentioned condition, make and estimate substrate, this comb-type electrode is applied the bias voltage of DC100V, confirm in 85 ℃, the constant temperature and humidity cabinet of 85%R.H., to have or not migration after 1000 hours.Determinating reference is following.
Zero: full confirmation is less than variation
△: some variation a little
*: move
< acid resistance >
At room temperature at 10vol%H
2SO
4Dipping is estimated substrate 30 minutes in the WS, and what stripping that affirmation is infiltrated, filmed and tape stripping caused peels off.Determinating reference is following.
Zero: do not have infiltration, stripping, peel off.
△: confirm a little infiltration, stripping, or peel off.
*: confirm infiltration significantly, stripping, perhaps peel off.
Table 2
Claims (14)
1. use in printed circuit board Photocurable resin composition; It is applied on the copper and is used; It is characterized in that; Said use in printed circuit board Photocurable resin composition contains any at least a and not halogen-containing red stain (D) in the compound (C) that has 2 above ethylenically unsaturated groups in carboxylic acid resin (A), Photoepolymerizationinitiater initiater (B), the molecule and bisdiazo system, monoazo color lake, benzimidazolone Xi 、 perylene system, pyrrolopyrrole diketone system, anthraquinone system, the quinacridone, further contains yellow colorants (E2).
2. use in printed circuit board Photocurable resin composition according to claim 1, the fit rate that contains carboxylic acid resin (A) is 20～60 quality % in whole compositions.
3. use in printed circuit board Photocurable resin composition according to claim 1, the scope of the use amount of Photoepolymerizationinitiater initiater (B) are that to contain carboxylic acid resin (A) with respect to 100 mass parts be the ratio of 1～30 mass parts.
4. use in printed circuit board Photocurable resin composition according to claim 1, the fit rate that has the compound (C) of 2 above ethylenically unsaturated groups in the molecule are to be the ratio of 5～100 mass parts with respect to the aforementioned carboxylic acid resin of containing of 100 mass parts (A).
5. use in printed circuit board Photocurable resin composition according to claim 1, it further contains blue colorant (E1).
6. according to each described use in printed circuit board Photocurable resin composition of claim 1 to 5, the tone of said Photocurable resin composition is blue, green, purple or orange.
7. use in printed circuit board Photocurable resin composition according to claim 1, red stain (D) are not halogen-containing and red stain azo group.
8. use in printed circuit board Photocurable resin composition according to claim 5, blue colorant (E1) is a phthalocyanine blue.
9. use in printed circuit board Photocurable resin composition according to claim 1, it further contains Thermocurable composition (F).
10. photo-curable dry film, it is applied to claim 1 to 5,9 each described use in printed circuit board Photocurable resin compositions on the carrier film, and is dry and obtain.
11. the blueness of claim 1 to 5,9 each described use in printed circuit board Photocurable resin compositions, green, purple or orange solidfied material.
12. the blueness of the described dry film of claim 10, green, purple or orange solidfied material.
13. printed circuit board (PCB), it has the solder mask that is formed by the described solidfied material of claim 11 being formed with on substrate of copper circuit.
14. printed circuit board (PCB), it has the solder mask that is formed by the described solidfied material of claim 12 being formed with on substrate of copper circuit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-123828 | 2007-05-08 | ||
| JP2007123828A JP5291893B2 (en) | 2007-05-08 | 2007-05-08 | Photocurable resin composition and cured product thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100818575A Division CN101303528B (en) | 2007-05-08 | 2008-05-08 | Photocuring resin composition, dry film, and print circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102419514A true CN102419514A (en) | 2012-04-18 |
| CN102419514B CN102419514B (en) | 2014-05-28 |
Family
ID=40113489
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100818575A Active CN101303528B (en) | 2007-05-08 | 2008-05-08 | Photocuring resin composition, dry film, and print circuit board |
| CN201110288406.0A Active CN102419514B (en) | 2007-05-08 | 2008-05-08 | Photocurable resin composition and cured product thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100818575A Active CN101303528B (en) | 2007-05-08 | 2008-05-08 | Photocuring resin composition, dry film, and print circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5291893B2 (en) |
| KR (2) | KR101028604B1 (en) |
| CN (2) | CN101303528B (en) |
| TW (2) | TWI401531B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103676475A (en) * | 2012-09-24 | 2014-03-26 | 株式会社田村制作所 | Black curable resin composition |
| CN103901719A (en) * | 2014-04-28 | 2014-07-02 | 无锡德贝尔光电材料有限公司 | Quick-drying-type carboxyl-containing photosensitive resin and preparation method thereof |
| WO2019128256A1 (en) * | 2017-12-27 | 2019-07-04 | 太阳油墨（苏州）有限公司 | Curable resin composition, dry film, cured product, and printed circuit board |
| CN110396315A (en) * | 2019-07-22 | 2019-11-01 | 深圳市华星光电技术有限公司 | It is modified to repair liquid, preparation method and the method for repairing color blocking |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009122504A (en) * | 2007-11-16 | 2009-06-04 | Toyo Ink Mfg Co Ltd | Halogen atom-free ultraviolet-curing green ink composition for printed wiring board, method for producing the same and substrate coated with the same |
| JP2011100545A (en) * | 2009-11-04 | 2011-05-19 | L-Design:Kk | Led lighting fixture |
| JP2011253911A (en) * | 2010-06-01 | 2011-12-15 | Shinko Electric Ind Co Ltd | Wiring board |
| CN102375339B (en) * | 2010-08-20 | 2013-06-12 | 太阳油墨（苏州）有限公司 | Alkali development-type photosensitive resin composition |
| TWI424268B (en) * | 2010-08-26 | 2014-01-21 | Taiyo Ink Suzhou Co Ltd | An alkaline developing type photosensitive resin composition |
| TWI519581B (en) * | 2010-12-28 | 2016-02-01 | Tamura Seisakusho Kk | White hardening resin composition |
| CN103477282A (en) * | 2011-04-13 | 2013-12-25 | 太阳油墨制造株式会社 | Photocurable resin composition, dry film, cured product, and printed wiring board |
| WO2013012035A1 (en) * | 2011-07-20 | 2013-01-24 | 日本ゼオン株式会社 | Negative-type photosensitive resin composition, resin film, and electronic component |
| TW201435495A (en) * | 2011-09-30 | 2014-09-16 | Taiyo Ink Mfg Co Ltd | Photosensitive resin composition, cured film thereof and printed circuit board |
| JP6495214B2 (en) * | 2016-09-23 | 2019-04-03 | 株式会社タムラ製作所 | Photosensitive resin composition |
| JP6374595B1 (en) * | 2017-09-26 | 2018-08-15 | 東京応化工業株式会社 | Photosensitive resin composition, cured film, display device, and pattern forming method |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11209632A (en) * | 1998-01-30 | 1999-08-03 | Hitachi Chem Co Ltd | Red resin composition, photosensitive red resin composition, red image-forming photosensitive solution, production of colored image, and production of color filter |
| JP4476417B2 (en) * | 2000-02-29 | 2010-06-09 | 新日鐵化学株式会社 | Red color resist ink and color filter |
| CN1144096C (en) * | 2000-03-03 | 2004-03-31 | 奇美实业股份有限公司 | Photosensitive resin composition |
| CA2453237A1 (en) * | 2001-07-26 | 2003-02-06 | Ciba Specialty Chemicals Holding Inc. | Photosensitive resin composition |
| CN1181145C (en) * | 2002-06-28 | 2004-12-22 | 广州市乃天精密电子器材有限公司 | Welding-resistant low-alkaline ink for developing and photosenstive imaging |
| JP4133137B2 (en) * | 2002-09-06 | 2008-08-13 | 東洋インキ製造株式会社 | Photosensitive coloring composition |
| KR101081756B1 (en) * | 2002-11-28 | 2011-11-10 | 시바 홀딩 인크 | Photosensitive resin composition comprising a halogen-free colorant |
| JP4380333B2 (en) * | 2003-01-14 | 2009-12-09 | 住友化学株式会社 | Photosensitive resin composition |
| JP3938375B2 (en) * | 2003-03-12 | 2007-06-27 | 三菱化学株式会社 | Photosensitive coloring composition, color filter, and liquid crystal display device |
| JP4538220B2 (en) * | 2003-12-16 | 2010-09-08 | 東洋インキ製造株式会社 | Red coloring composition for color filter and color filter |
| KR20050101920A (en) * | 2004-04-20 | 2005-10-25 | 주식회사 엘지화학 | Photosensitive resin composition for black matrix of liquid crystal display |
| KR100842168B1 (en) * | 2005-01-21 | 2008-06-30 | 주식회사 엘지화학 | Photosensitive resin composition and liquid crystal display device using the same |
| JP4809006B2 (en) * | 2005-07-05 | 2011-11-02 | 太陽ホールディングス株式会社 | Colored photosensitive resin composition and cured product thereof |
| JP2007025358A (en) * | 2005-07-19 | 2007-02-01 | Fujifilm Holdings Corp | Color filter and manufacturing method therefor |
| JP2007071994A (en) * | 2005-09-05 | 2007-03-22 | Tokyo Ohka Kogyo Co Ltd | Black photosensitive resin composition |
| TW200728379A (en) * | 2005-09-06 | 2007-08-01 | Taiyo Ink Mfg Co Ltd | Resin composition, cured product of the same, and printed circuit board made of the same |
| JP4752650B2 (en) * | 2006-04-13 | 2011-08-17 | 日立化成工業株式会社 | Photosensitive resin composition |
| JP4994923B2 (en) * | 2007-04-06 | 2012-08-08 | 太陽ホールディングス株式会社 | Black solder resist composition and cured product thereof |
-
2007
- 2007-05-08 JP JP2007123828A patent/JP5291893B2/en active Active
-
2008
- 2008-05-07 KR KR1020080042341A patent/KR101028604B1/en active IP Right Grant
- 2008-05-08 TW TW097117000A patent/TWI401531B/en active
- 2008-05-08 CN CN2008100818575A patent/CN101303528B/en active Active
- 2008-05-08 CN CN201110288406.0A patent/CN102419514B/en active Active
- 2008-05-08 TW TW102113955A patent/TWI486707B/en active
-
2011
- 2011-01-31 KR KR1020110009385A patent/KR101120252B1/en active IP Right Grant
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103676475A (en) * | 2012-09-24 | 2014-03-26 | 株式会社田村制作所 | Black curable resin composition |
| CN103676475B (en) * | 2012-09-24 | 2019-05-07 | 株式会社田村制作所 | Black curable resin composition |
| CN103901719A (en) * | 2014-04-28 | 2014-07-02 | 无锡德贝尔光电材料有限公司 | Quick-drying-type carboxyl-containing photosensitive resin and preparation method thereof |
| WO2019128256A1 (en) * | 2017-12-27 | 2019-07-04 | 太阳油墨（苏州）有限公司 | Curable resin composition, dry film, cured product, and printed circuit board |
| CN109976092A (en) * | 2017-12-27 | 2019-07-05 | 太阳油墨（苏州）有限公司 | Hardening resin composition, dry film, solidfied material and printed circuit board |
| CN109976092B (en) * | 2017-12-27 | 2022-04-01 | 太阳油墨（苏州）有限公司 | Curable resin composition, dry film, cured product, and printed wiring board |
| CN110396315A (en) * | 2019-07-22 | 2019-11-01 | 深圳市华星光电技术有限公司 | It is modified to repair liquid, preparation method and the method for repairing color blocking |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201333629A (en) | 2013-08-16 |
| TW200921272A (en) | 2009-05-16 |
| JP5291893B2 (en) | 2013-09-18 |
| CN102419514B (en) | 2014-05-28 |
| TWI401531B (en) | 2013-07-11 |
| CN101303528A (en) | 2008-11-12 |
| KR101028604B1 (en) | 2011-04-11 |
| JP2008281652A (en) | 2008-11-20 |
| KR101120252B1 (en) | 2012-03-16 |
| KR20080099182A (en) | 2008-11-12 |
| TWI486707B (en) | 2015-06-01 |
| CN101303528B (en) | 2013-03-27 |
| KR20110028477A (en) | 2011-03-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101303528B (en) | Photocuring resin composition, dry film, and print circuit board | |
| CN101303527B (en) | Photocuring resin composition, dry film, curing product and print circuit board | |
| CN101403859B (en) | Photosensitive resin composition and curing article thereof | |
| CN101542392B (en) | Photocurable resin composition, dry film, cured product, and printed wiring board | |
| CN101320213B (en) | Light sensitive resin composition and flexible printed circuit board produced with the same | |
| CN101546123B (en) | Light sensitive resin composition, cured matter and printed circuit substrate having solder mask layer formed with the cured matter | |
| TWI398458B (en) | A photohardenable thermosetting resin composition, a dry film and a hardened product thereof, and a printed wiring board | |
| CN1927944B (en) | Resin composition, cured composition and printed circuit board using same | |
| CN101192001B (en) | Welding-proof film forming method and photosensitive composition | |
| CN101410757A (en) | Photocurable/thermosetting resin composition, cured product thereof and printed wiring board obtained by using same | |
| CN102498141A (en) | Curable resin composition | |
| CN101400706A (en) | Photocurable/thermosetting resin composition, cured product and printed wiring board | |
| CN101738858A (en) | Flame retardant photocurable resin composition, dry film and cured product thereof, and printed wiring board using the same | |
| KR20090033804A (en) | Composition, dry film, cured product, and printed wiring board | |
| CN101981131B (en) | Curable resin composition, cured article thereof, and printed circuit board | |
| CN102112920B (en) | Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof | |
| CN101183212B (en) | Optical tool and method for forming soldering-resistant pattern | |
| JP5526248B2 (en) | Photocurable resin composition and cured product thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |