CN102418914A - Heat dissipation platform for light-emitting diodes - Google Patents

Heat dissipation platform for light-emitting diodes Download PDF

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Publication number
CN102418914A
CN102418914A CN2011102983244A CN201110298324A CN102418914A CN 102418914 A CN102418914 A CN 102418914A CN 2011102983244 A CN2011102983244 A CN 2011102983244A CN 201110298324 A CN201110298324 A CN 201110298324A CN 102418914 A CN102418914 A CN 102418914A
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CN
China
Prior art keywords
platform
heat
emitting diode
light emitting
cooling platform
Prior art date
Application number
CN2011102983244A
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Chinese (zh)
Inventor
陈理诚
Original Assignee
陈理诚
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to HK10109265.7A priority Critical patent/HK1144529A2/en
Priority to HK10109265.7 priority
Application filed by 陈理诚 filed Critical 陈理诚
Publication of CN102418914A publication Critical patent/CN102418914A/en

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Abstract

The invention provides a heat dissipation platform for light-emitting diodes. The heat dissipation platform comprises a copper and/or aluminum bottom plate; one surface of the bottom plate is provided with at least one light-emitting diode, and the other surface of the bottom plate is provided with integrated vacuum heat conduction pipes. In the technical scheme, heat conduction media are arranged between the light-emitting diodes and the vacuum heat conduction pipes, and an aluminum platform is not additionally needed to be welded on a copper heat pipe; moreover, a working solution and a drive three-dimensional heat conduction general platform structure are optimized; and compared with that of a driven heat conduction pipe, the efficiency of the platform can be improved by about 40 percent.

Description

The cooling platform of light emitting diode
Technical field
Put it briefly and the present invention relates to the cooling platform of light emitting diode.Specifically, the invention particularly relates to the three-dimensional heat dissipation platform of light emitting diode.
Background technology
Usually, the life-span of light emitting diode (LED) light source relies on good heat radiation heat conduction design.
Publication number is the radiating mode that the one Chinese patent application 02809084.5 of CN1535482A discloses a kind of high power led lighting equipment.Wherein the great power LED lamp apparatus comprises: great power LED; Be used for mould to LED supply heat energy; Be fixed on the heat-sink shell on the mould; And the shell between heat-sink shell and external environment condition.Heat in the mould conducts to heat-sink shell.Shell conducts to external environment condition to the heat that receives from heat-sink shell.
What occur in recent years dispels the heat with the thermally conductive pathways that is different from common filament bulb equipment than high-power LED (light emitting diode) lighting equipment.Specifically, this type distributes most of heat than high-power LED (light emitting diode) lighting equipment via cathode leg or through the mould that is fixed on the direct die equipment.Therefore, traditional radiating mode can not fully reduce the heat that great power LED equipment sends, so that has under higher operating temperature, move than great power LED equipment.
Higher operating temperature has reduced the performance of high-power LED (light emitting diode) lighting equipment.The experiment of doing with various different LED shows, becomes the power exponent relation service life of LED with operating temperature.The Arhenius function that people know is the aging approximate model of LED: degree of aging D is along with te KtAnd change, wherein t is the time, and e is the end of natural logrithm, and K is the activation constant, and T is the absolute temperature of Kelvin's thermometric scale.Although this formula might not be accurate, and clearly relevant with equipment, in designated LED series, can satisfactory simulation empirical data.For example, can reach 100,000 hours the service life of LED down in room temperature (25 ℃), and when working down for about 90 ℃, can be reduced by at least in 7000 hours the service life of LED.
Summary of the invention
An object of the present invention is to provide a kind of cooling platform that improves the LED heat dissipation characteristics.
Another object of the present invention provides a kind of light fixture that has disposed LED and cooling platform thereof.
The inventor is through for many years research; Find that the led chip junction temperature should be lower than 70 ℃ and just have the 50000 hours 70% smooth life-spans of surpassing; Thereby research and develop and adopt aluminium or copper heat sink directly to connect the vacuum heat-conduction pipe, the high temperature heat radiation of LED node is discharged, solve LED node high temperature coagulation problems.Connecting on LED and the vacuum heat-conduction pipe, improve usefulness with three dimensional design, except the LED element, the breakthrough employing unified platform combination of heat pipe.
According to the cooling platform of light emitting diode of the present invention, comprise copper and/or aluminum soleplate, on the face of said base plate at least one said light emitting diode has been installed, incorporate vacuum heat-conduction pipe then is installed on another face of said base plate.。
Preferably, said vacuum heat-conduction pipe is copper.Said light emitting diode can have the pore fin, and said light emitting diode can be connected to said vacuum heat-conduction pipe through full copper light emitting diode general-purpose platform, and/or is connected to ventilative secondary optics element through plume.This cooling platform can comprise the integrated full copper heat pipe general-purpose platform of the increased area of different geometries thermal source, and/or comprises the band pore heat conduction platform of the heat pipe reflow soldering that strengthens heat source-contacting surface.
Advantageously, be marked with low latent heat working solution in the said vacuum heat-conduction pipe.Said working solution can be hydrogen peroxide and aldehyde C-9, and the mixed liquor of the different relatively height shares of its balance is set in the flat heat pipe of the left and right sides, to strengthen heat transfer efficiency.
According to a kind of improvement project, disposed the secondary optics element on the said light emitting diode, said full copper light emitting diode general-purpose platform with acquired the light emitting diode bulb behind the lamp socket and matched.This cooling platform can be constructed to three-dimensional light emitting diode heat pipe general-purpose platform.Can install porous runner water proof lamp shell in addition additional near said vacuum heat-conduction pipe and thermal source place, install fan in addition additional, so that adopt active water-cooled of fan and or active air-flow cooling in its bottom.
Said cooling platform also can comprise the full aluminium light emitting diode of low-power heat conduction general-purpose platform and/or the heat radiating fin structure vertical with this platform.The peak power of said light emitting diode is preferably in below the 42W.
Described cooling platform can also comprise the heat pipe general-purpose platform of three-dimensional light emitting diode, and comprising model E39, the light emitting diode of E40 band E39 or E40 lamp socket is along vertical and horizontal direction setting.Also can comprise the convertible general-purpose platform of three-dimensional heat pipe, be used for cold-cathode tube CCFL or electrodeless lamp.Said light emitting diode can be inorganic and flip-chip BGA light emitting diode.In addition, said cooling platform also comprises can reflector, more than one piece full copper vacuum heat-conduction pipe perpendicular to the configuration of reflector ground, more than at least two pieces full copper vacuum heat-conduction pipe flatly be arranged in reflector and the radiator lamp housing crack.
Light fixture provided by the invention can adopt the cooling platform of above-mentioned light emitting diode.The present invention is of many uses, is mainly used in high-power and super-high-power LED, can be used as ordinary luminaire, substitutes inflation light sources such as halogen, metal halogen, and conventional lamp such as energy-conservation light pipe.
LED light fixture of the present invention can be used for all general lightings basically, and commercial value is high.For industry is brought high economic benefit, and very environmental protection, high development potentiality had.
Description of drawings
Fig. 1 a shows integrated full copper heat pipe of the present invention.
Fig. 1 b shows reflow soldering heat pipe general-purpose platform of the present invention.
Fig. 2 shows European light fixture of the present invention.
Fig. 3 shows European floor-lamp of the present invention.
Fig. 4 a shows the general-purpose platform that is used for the three-dimensional heat pipe of light emitting diode of the present invention.
Fig. 4 b shows the general-purpose platform that another kind of the present invention is used for the three-dimensional heat pipe of light emitting diode.
Introduce most preferred embodiment of the present invention with reference to the accompanying drawings.
The specific embodiment
Consult Fig. 1 a, wherein show the front view and the vertical view of general-purpose platform 10 of the heat pipe 2 of integrated full copper of the present invention.As shown in Figure 1, heat pipe 2 is bent into L shaped, and the one of which end is connected with the central authorities of the bottom surface of square floor 1.
Fig. 1 b shows the embodiment that the present invention adopts the heat pipe general-purpose platform 10 of reflow soldering.Heat pipe 2 is bent into L shape, and in wherein be parallel to each other two sections, one section long slightly, and another section is short slightly.The cross section of short slightly this section heat pipe is processed to semicircle, and the planar section of this section of cross section semicircular in shape is positioned at the outside of heat pipe 2 so that with for example be copper base plate 1 applying.Shown in Fig. 1 a, the planar section of this section of the cross section semicircular in shape of heat pipe 2 adopts Reflow Soldering and the bottom surface applying that for example be copper base plate 1.As stated, the heat pipe 2 here preferably is constructed to copper.
In the making, the aluminium radiator fin of LED bottom is directly connected to copper heat pipe 2.Heat pipe 2 inside are constructed to vacuum.
Be injected with low latent heat liquid in the heat pipe 2 of vacuum, low latent heat liquid down to lamp outer casing, drains into light fixture outer air with high temperature with supersonic speed heat conduction to aluminium radiator.It is integrated copper that vacuum tube connects platform, and LED connects the heat radiation of vacuum copper heat pipe, and this being designed with is beneficial to restriction LED junction temperature, makes it to be lower than 70 ℃.
Fig. 2 shows the embodiment of European light fixture of the present invention.This European light fixture 20 comprises the heat pipe 2 of integrated full copper.Disposed LED 3 on the end face of the copper soleplate 1 that is connected with an end of heat pipe 2.One end of heat pipe 2 bendings is fixed on the bottom inside of band fin lamp housing 5 through clamping element 4.The top of LED 3 has disposed hemispheric secondary optics element 6.The top of whole light fixture 20 covers with lampshade 7.
Fig. 3 shows the embodiment of European floor-lamp of the present invention.This European floor-lamp 30 comprises some pieces of integrated full copper heat pipes 2.Disposed LED 3 separately on the end face of the copper soleplate 1 that is connected with an end of each heat pipe 2.One end of heat pipe 2 bendings is fixed to the bottom inside of the inner casing 8 of floor-lamp, and inner casing 8 is provided with flat heat pipe 9.Inner casing 8 is configured in the band fin lamp housing 5.Each self-configuring of top of LED 3 ventilative secondary optics element 6.The top of whole floor-lamp 20 covers with a lampshade 7.
Fig. 4 a shows the general-purpose platform 40 of three-dimensional heat pipe of the present invention and diode bulb.Wherein light fixture 40 comprises some pieces of upright full copper heat pipes 2, and the two ends up and down of these heat pipes 2 have disposed flat heat pipe 11,12 respectively.
Gone out the general-purpose platform 50 of three-dimensional heat pipe of another kind of the present invention and diode bulb like Fig. 4 b.Flat heat pipe 11,12 wherein comprises the flat heat pipe 12 of upper panel formula heat pipe 11 and lower floor.Similarly, flat heat pipe 11,12 can be copper, or other materials.
Light emitting diode of the present invention comprises inorganic and flip-chip BGA light emitting diode.General-purpose platform adopts three-dimensional vacuum heat-conduction pipe design.Full copper vacuum heat-conduction pipe is perpendicular to reflector more than one piece, and full copper vacuum heat-conduction pipe is horizontally placed in reflector and the radiator lamp housing crack more than at least two pieces, and indoor lamp has adopted radiator; Heat sink arrangements radiating fin; Heat pipe is got rid of used heat with modes such as air or compulsory thermal convection currents, at its cold junction or bottom the temperature-sensitive fan is set, and the temperature-sensitive fan is just worked when the LED junction temperature is higher than 70 ℃; The three-dimensional supersonic flow of this compressible fluid; With 10W LED load is example, under 40 ℃ of room temperatures, makes < 2 ℃/>W of the thermal resistances of light fixture.
Led lamp for general outdoor environment; Installing capable of using has fin, LED reflector above that; Connect flat-plate loop heat pipe radiator and fin lamp housing; Perhaps add and be horizontally disposed with the samming bag, perhaps enclose temperature-uniforming plate in the thermal source bottom or, flat heat pipe or flat heat pipe are arranged at lower floor or its cold junction all around; Incorporate cooling platform matches with full copper vertical heat transfer pipe more than one piece, together with flat heat pipe, reflector and have the full thermal contact conductance of Z-axle (vertically) fin aluminium lamp housing.
When LED uses as water-bed light fixture or diving torch, can install porous runner water proof lamp shell in addition additional near said vacuum heat-conduction pipe and thermal source place, install fan in addition additional in its bottom, so that adopt the active water-cooled of fan.
The heat pipe thermal source partly is the extension of drawing a bow, and to strengthen heat conduction total surface area, manages to improve heat and passes coefficient or heat exchange amount, becomes a kind of preferable heat exchanger designs; The dividing plate of setting up changes direction of flow, increases disturbance; Improve the heat exchange chance, increase efficient, reduce volume and weight.Working solution is hydrogen peroxide and aldehyde C-9 mixture in the pipe; In optimal heat conduction design, balance heat pipe one side is main with hydrogen peroxide, and opposite side is main with aldehyde C-9; Compare with the heat transfer type of heat pipe orthoscopic on the whole, LED light fixture heat dispersion of the present invention promotes more than three one-tenth.
In the present invention; There is not medium between LED and vacuum heat-conduction pipe; Copper heat pipe does not need other welding of aluminum matter platform, belongs to technical brand-new breakthrough, and other adds optimization work liquid and active three-dimensional heat conduction general-purpose platform structure; Compare the nearly four one-tenth differences of both efficient with passive type one dimension heat pipe, and its conduit is not provided with general-purpose platform.
Result of study of the present invention shows, is lower than under the condition of 70C in the junction temperature of led chip, and LED just has the 50000 hours 70% smooth life-spans of surpassing.Thereby the inventor has researched and developed employing aluminium or the copper heat sink directly connects the vacuum heat-conduction pipe, makes the discharge of in time dispelling the heat of the high temperature of LED node, has solved LED node high temperature coagulation problems.When connecting LED and vacuum heat-conduction pipe, adopt three dimensional design to improve usefulness.Except the LED element, heat pipe has adopted the unified platform Combination Design.
Although the applicant combines embodiment that the present invention is described hereinbefore, these embodiment only are exemplary, rather than restrictive.Those skilled in the art can make various remodeling according to the principle of the invention and spirit, but these remodeling all belong to protection scope of the present invention.Protection scope of the present invention is limited appending claims.

Claims (17)

1. the cooling platform of a light emitting diode; It is characterized in that; Said cooling platform comprises copper and/or aluminum soleplate, on the face of said base plate at least one said light emitting diode has been installed, and incorporate vacuum heat-conduction pipe then is installed on another face of said base plate.
2. according to the cooling platform of claim 1, it is characterized in that said vacuum heat-conduction pipe is copper.
3. according to the cooling platform of claim 2; It is characterized in that; Said light emitting diode has the pore fin, and said light emitting diode is connected to said vacuum heat-conduction pipe through full copper light emitting diode general-purpose platform, and/or is connected to ventilative secondary optics element through plume.
4. according to the cooling platform of claim 3; It is characterized in that; Wherein this cooling platform comprises the integrated full copper heat pipe general-purpose platform of the increased area of different geometries thermal source, and/or comprises the band pore heat conduction platform of the heat pipe reflow soldering that strengthens heat source-contacting surface.
5. according to the cooling platform of claim 1, it is characterized in that, be marked with low latent heat working solution in the said vacuum heat-conduction pipe.
6. according to the cooling platform of claim 5, it is characterized in that said working solution is hydrogen peroxide and aldehyde C-9, the mixed liquor of the different relatively height shares of its balance is set in the flat heat pipe of the left and right sides, to strengthen heat transfer efficiency.
7. according to the cooling platform of claim 3, it is characterized in that, disposed the secondary optics element on the said light emitting diode, said full copper light emitting diode general-purpose platform with acquired the light emitting diode bulb behind the lamp socket and matched.
8. according to the cooling platform of claim 1, it is characterized in that this cooling platform is constructed to three-dimensional light emitting diode heat pipe general-purpose platform.
9. according to Claim 8 cooling platform is characterized in that, is installing porous runner water proof lamp shell in addition additional near said vacuum heat-conduction pipe and thermal source place, installs fan in addition additional in its bottom, so that adopt active water-cooled of fan and or active air-flow cooling.
10. according to the cooling platform of claim 1, it is characterized in that, comprise the full aluminium light emitting diode of low-power heat conduction general-purpose platform and/or the heat radiating fin structure vertical with this platform.
11. the cooling platform according to claim 10 is characterized in that, the peak power of said light emitting diode is below 42W.
12. the cooling platform according to claim 1 is characterized in that, comprises the heat pipe general-purpose platform of three-dimensional light emitting diode, comprising model E39, the light emitting diode of E40 is along vertical and horizontal direction setting.
13. the cooling platform according to claim 1 is characterized in that, comprises the convertible general-purpose platform of three-dimensional heat pipe, is used for cold-cathode tube CCFL or electrodeless lamp.
14. the cooling platform according to claim 1 is characterized in that, said light emitting diode is inorganic and flip-chip BGA light emitting diode.
15. the cooling platform according to claim 1 is characterized in that, also comprises reflector, full copper vacuum heat-conduction pipe is perpendicular to the configuration of reflector ground more than one piece, and full copper vacuum heat-conduction pipe flatly is arranged in reflector and the radiator lamp housing crack more than at least two pieces.
16. a light fixture has adopted the cooling platform according to each light emitting diode among the claim 1-15.
17. the light fixture according to claim 16 is characterized in that, the top of whole light fixture covers with lampshade.
CN2011102983244A 2010-09-28 2011-09-28 Heat dissipation platform for light-emitting diodes CN102418914A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
HK10109265.7A HK1144529A2 (en) 2010-09-28 2010-09-28 A heat-conduction platform of vacuum tubes for light emitting diodes
HK10109265.7 2010-09-28

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CN102418914A true CN102418914A (en) 2012-04-18

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CN201120375910XU CN202423392U (en) 2010-09-28 2011-09-28 Heat radiation platform of light emitting diode

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TW (1) TW201221846A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HK1144529A2 (en) * 2010-09-28 2011-02-18 Chan Lee Shing William A heat-conduction platform of vacuum tubes for light emitting diodes

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080055911A1 (en) * 2006-08-30 2008-03-06 Yu-Nung Shen Light source device for a projector
CN101526202A (en) * 2008-03-05 2009-09-09 鸿富锦精密工业(深圳)有限公司 Light-emitting diode (LED) illuminating apparatus
CN101598320A (en) * 2009-07-14 2009-12-09 史杰 The LED lamp adopts the heat-pipe radiating apparatus of enhanced evaporation section
JP2010027212A (en) * 2008-07-02 2010-02-04 ▲じつ▼新科技股▲ふん▼有限公司 Protective cover for led lamp tube and led lamp tube including the same
CN201487891U (en) * 2009-04-27 2010-05-26 厦门格绿能光电有限公司 Novel heat-dissipating structure of semi-conductor illuminating lamp
CN201561294U (en) * 2009-10-19 2010-08-25 深圳市俄菲照明有限公司 Large-power LED lamp
CN202423392U (en) * 2010-09-28 2012-09-05 陈理诚 Heat radiation platform of light emitting diode

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080055911A1 (en) * 2006-08-30 2008-03-06 Yu-Nung Shen Light source device for a projector
CN101526202A (en) * 2008-03-05 2009-09-09 鸿富锦精密工业(深圳)有限公司 Light-emitting diode (LED) illuminating apparatus
JP2010027212A (en) * 2008-07-02 2010-02-04 ▲じつ▼新科技股▲ふん▼有限公司 Protective cover for led lamp tube and led lamp tube including the same
CN201487891U (en) * 2009-04-27 2010-05-26 厦门格绿能光电有限公司 Novel heat-dissipating structure of semi-conductor illuminating lamp
CN101598320A (en) * 2009-07-14 2009-12-09 史杰 The LED lamp adopts the heat-pipe radiating apparatus of enhanced evaporation section
CN201561294U (en) * 2009-10-19 2010-08-25 深圳市俄菲照明有限公司 Large-power LED lamp
CN202423392U (en) * 2010-09-28 2012-09-05 陈理诚 Heat radiation platform of light emitting diode

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HK1144529A2 (en) 2011-02-18
TW201221846A (en) 2012-06-01
CN202423392U (en) 2012-09-05

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Application publication date: 20120418

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