CN102386143A - Circuit device - Google Patents

Circuit device Download PDF

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Publication number
CN102386143A
CN102386143A CN2010102673493A CN201010267349A CN102386143A CN 102386143 A CN102386143 A CN 102386143A CN 2010102673493 A CN2010102673493 A CN 2010102673493A CN 201010267349 A CN201010267349 A CN 201010267349A CN 102386143 A CN102386143 A CN 102386143A
Authority
CN
China
Prior art keywords
pad
circuit arrangement
connection pad
connection
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102673493A
Other languages
Chinese (zh)
Inventor
陈则朋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ali Corp
Richwave Technology Corp
Original Assignee
Ali Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ali Corp filed Critical Ali Corp
Priority to CN2010102673493A priority Critical patent/CN102386143A/en
Publication of CN102386143A publication Critical patent/CN102386143A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Abstract

The invention discloses a circuit device, which comprises a selection pad, a first power connecting pad and a first grounding pad, wherein the selection pad, the first power connecting pad and the first grounding pad are positioned in the different places of a top surface of the circuit equipment; the selection pad is coupled with one of the first power connecting pad and the first grounding pad by a welded wire, thereby determining the function of the circuit equipment.

Description

Circuit arrangement
Technical field
The present invention relates to the making of integrated circuit, and particularly relate to a kind of circuit arrangement with joint selection (bondingoption) structure.
Background technology
In integrated circuit (integrated circuit) design, use usually to engage and select (bonding option) structure, be used for optionally changing the hardware capability in the integrated circuit.Therefore; The visual practical application request of producer and optionally change the different hardware condition such as internal logic, specification function, sequential of the circuit chip in the IC apparatus, and then the IC apparatus that has similar hardware structure but have the plurality of optional function is provided.
It is that power supply/ground connection (power/ground) engages choice structure that the joint that adopts is at present selected one of selection of (bonding option) structure.Please with reference to Fig. 1, it has shown that employing power supply/ground connection (power/ground) engages the signal situation of a kind of existing IC apparatus 300 of choice structure.
As shown in Figure 1, its shown IC apparatus 300 on look situation, it has comprised base plate for packaging 100 and has been positioned at the circuit arrangement (circuit device) 200 on an one of base plate for packaging 100.At this, circuit arrangement 200 can be arranged on the base plate for packaging 100 through the canned program like surface adhering technology (SMT).
In one embodiment; Circuit arrangement 200 for example is by the prepared semiconductor chip that forms of silicon wafer, then is provided with several joint connection pads (bonding pads) 202,204,208,210,212,214,216,218,220,222,224,226,228 and 230 of mutual separation along the edge of circuit arrangement 200 end faces.In one embodiment, base plate for packaging 100 for example is that substrates such as ceramic substrate, printed circuit board (PCB) are made, then is provided with several engagement members 102 of mutual separation on the edge of base plate for packaging 100 end faces 1, 102 2, 104 1, 104 2, 106,108,110,112,114,116,118,120,122,124,126,128.
In Fig. 1, these a little engagement members 102 1, 102 2, 104 1, 104 2, 106,108,110,112,114,116,118,120,122,124,126,128 illustrate into the conduction joint connection pad (bonding pads); But do not limit with above-mentioned enforcement situation, it also can be to be arranged at and waits other conductive engagement members like pin (lead) or pin (pin) on the base plate for packaging 100.
Please continue with reference to Fig. 1; This be arranged at a little engagement members 106,108,110,112,114,116,118,120,122,124,126,128 of on the base plate for packaging 100 this as as I/O (input/output), control the usefulness of (control), clock pulse functional circuit members such as (clock), and engagement member 102 1With 102 2As the usefulness of power source means, and engagement member 104 1, 104 2Usefulness as earthing component.The joint connection pad (bonding pads) 202 and 204 that is arranged at circuit arrangement 200 end faces is then respectively as the usefulness of power supply connection pad (power source pad) with ground connection connection pad (ground pad), and is electrically connected at the engagement member 102 as power source means respectively through bonding wire 400 1And as the engagement member 104 of earthing component 1, engaging connection pad 206 then as the usefulness of selecting pad (option pad), it is coupled to also the engagement member 102 as power source means through bonding wire 400 2Or be coupled to also engagement member 104 as earthing component through bonding wire 400 ' (illustrate and be dotted line) 2, be used to set the interlock circuit functions such as internal logic, specification function, sequential of the circuit arrangement 200 in the IC apparatus 300.Be arranged at the usefulness that on circuit arrangement 200 end faces all the other engage then conduct such as I/O (input/output) of connection pads 208,210,212,214,216,218,220,222,224,226,228 and 230, control (control), clock pulse functional circuit connection pads (function circuit pad) such as (clock); And be respectively coupled to one of engagement member 106,108,110,112,114,116,118,120,122,124,126,128 that is arranged on the base plate for packaging 100 through the routing juncture, be used to provide the electrically connect situation between the functional circuit in circuit arrangement 200 and the base plate for packaging 100.
As shown in Figure 1, through selecting pad 206 and engagement member 102 as power source means 1Or as the engagement member 104 of earthing component 1Though between two kinds possibly couple situation and can be used for the interlock circuit function such as internal logic, specification function, sequential of initialization circuit device 200 and provide IC apparatus 300 two kinds of different functions designs, but be formed at the engagement member 102 on the base plate for packaging 100 2With engagement member 104 2Therefore belong to extra power supply engagement member and the engagement member of setting up, need on base plate for packaging 100 these a little engagement members of extra formation and increased base plate for packaging 100 usable floor areas.In addition, engagement member 102 2With engagement member 104 2Setting then possibly take other functional circuit member the position is set, and then reduced the quantity of the engagement member that is used to be electrically connected at the functional circuit connection pad on the IC chip 200.
Power supply/the ground connection (power/ground) of being adopted in the IC apparatus 300 so, as shown in Figure 1 engages choice structure and probably is unfavorable for the dimension shrinks of base plate for packaging 100 in it and can causes the position of engagement member above that to take situation.
Therefore, just need a kind of power supply/ground connection of improvement to engage choice structure, engage the problem that IC apparatus was met with of choice structure with the power supply/ground connection (power/ground) that solves above-mentioned employing.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of circuit arrangement that power supply/ground connection (power/ground) engages choice structure that has, adopted power supply/ground connection to engage choice structure in it to solve aforesaid existing issue through improvement.
According to an embodiment, the invention provides a kind of circuit arrangement, comprising:
One selects pad; One first power supply connection pad; And one first ground connection connection pad; Wherein this selection pad, this first power supply connection pad and this first ground connection connection pad are positioned on the diverse location of an end face of this circuit arrangement, and this selection pad couples the function that one of this first power supply connection pad and this first ground connection connection pad determine this circuit arrangement through a bonding wire.
In order to let above-mentioned and other purposes of the present invention, characteristic and the advantage can be more obviously understandable, hereinafter is special lifts a preferred embodiment, and cooperates appended diagram, elaborates as follows:
Description of drawings
Fig. 1 has shown the existing integrated circuits device, has one in it and engages choice structure;
Fig. 2 has shown a kind of IC apparatus with joint choice structure according to one embodiment of the invention; And
Fig. 3 has shown a kind of IC apparatus with joint choice structure according to another embodiment of the present invention.
The main element symbol description
100～base plate for packaging;
102 1, 102 2, 104 1, 104 2, 106,108,110,112,114,116,118,120,122,124,126,128～engagement member;
200～circuit arrangement;
202,204,208,210,212,214,216,218,220,222,224,226,228,230～joint connection pad;
206～select to fill up;
300～IC apparatus;
400,400 '～bonding wire;
500～IC apparatus;
600～base plate for packaging;
602,604,606,608,610,612,614,616,618,620,622,624,626,628,630,632～engagement member;
700～circuit arrangement;
702 1, 702 2, 704,706 1, 706 2, 708,712,714,716,718,720,722,724,726,728,730,732,734～engage connection pad;
710～select to fill up;
800,800 '～bonding wire.
Embodiment
Please with reference to hereinafter and cooperate accompanying drawings such as Fig. 2-Fig. 3 to explain orally enforcement situation of the present invention.
Please, shown the signal situation that power supply/ground connection (power/ground) engages a kind of IC apparatus 500 of choice structure that has according to one embodiment of the invention with reference to Fig. 2.
As shown in Figure 2, from looking sight, IC apparatus 500 has comprised base plate for packaging 600 and has been positioned at the circuit arrangement 700 on an one of base plate for packaging 600.At this, circuit arrangement 700 can be arranged at through the canned program like surface adhering technology (SMT) on an one of base plate for packaging 600.
In one embodiment, circuit arrangement 700 for example is by the prepared semiconductor chip that forms of silicon wafer, and several that then are provided with mutual separation on the diverse location at the edge of circuit arrangement 700 end faces engage connection pads (bonding pads) 702 1, 702 2, 706 1, 706 2, 710,712,714,716,718,720,722,724,726,728,730,732 and 734.And in one embodiment; Base plate for packaging 600 for example is the made base plate for packaging of substrate such as ceramic substrate, printed circuit board (PCB), then is provided with several engagement members 602,604,606,608,610,612,614,616,618,620,622,624,626,628,630 and 632 of mutual separation on the diverse location at the edge of base plate for packaging 600 end faces.
In Fig. 2; These a little engagement members 602,604,606,608,610,612,614,616,618,620,622,624,626,628,630 and 632 illustrate and engage connection pad (bondingpads) for conduction; But do not limit with above-mentioned enforcement situation, it also can be to be arranged at and waits the engagement member of other conduction like pin (lead) or pin (pin) on the base plate for packaging 600.
Please continue with reference to Fig. 2; Be arranged on the base plate for packaging 600 these a little engagement members 606,608,610,612,614,616,618,620,622,624,626,628,630 and 632 as as I/O (input/output), control the usefulness of (control), clock pulse functional circuit connection pads (functioncircuit pad) such as (clock); And engagement member 602 is as the usefulness of power supply connection pad (power source pad), and engagement member 604 is as the usefulness of ground connection connection pad (ground pad).At this, be arranged at the joint connection pad (bonding pads) 702 on the diverse location of circuit arrangement 700 end faces 1With 702 2As the usefulness of power supply connection pad, and these a little connection pads (bonding pads) 702 that engage 1With 702 2Form electrically connect situation therebetween through being arranged at a power supply bus bar in the circuit arrangement 700 (power source bus line, illustrate be dotted line) 704.And be arranged at the joint connection pad (bonding pads) 706 on the diverse location of circuit arrangement 700 end faces 1With 706 2As the usefulness of ground connection connection pad, and these a little connection pads (bonding pads) 706 that engage 1With 706 2Concern through being arranged at the electrically connect that a ground strap line in the circuit arrangement 700 (ground bus line, illustrate be dotted line) forms therebetween.These a little connection pads 702 that engage 1With 702 2One of and engage connection pad 706 1With 706 2Be coupled to respectively through a bonding wire 800 respectively first as the engagement member 602 of power source means and as the joint connection pad 604 of earthing component.In addition, be arranged at 710 usefulness as selection pad (option pad) of joint connection pad of circuit arrangement 700 end faces, it can be coupled to the joint connection pad 702 as the power supply connection pad through bonding wire 800 or 800 ' (illustrate and be dotted line) 1With 702 2One of or as the joint connection pad 706 of ground connection connection pad 1With 706 2One of, be used to determine the interlock circuit functions such as internal logic, specification function, sequential of the circuit arrangement 700 in the IC apparatus 500.It should be noted that not to be coupled to and be used to couple the power source means that is positioned on the base plate for packaging or the bonding wire 800 of earthing component as then being formed with on the power supply connection pad of the joint connection pad 710 of selecting pad or the ground connection connection pad.On circuit arrangement 700 end faces all the other engage then conduct such as I/O (input/output) of connection pad 712,714,716,718,720,722,724,726,728,730,732 and 734, control the usefulness of (control), clock pulse functional circuit connection pads (function circuit pad) such as (clock); And be respectively coupled to one of these a little engagement members 610,612,614,616,618,620,622,624,626,628,630 of being arranged on the base plate for packaging 600 and 632 through the routing juncture, be used to provide the electrically connect situation between the functional circuit in circuit arrangement 700 and the base plate for packaging 600.
As shown in Figure 2, (for example engage connection pad 702 through two power supply connection pads that on circuit arrangement 700, form electrically connect 1With 702 2) (engage connection pad 706 with the ground connection connection pad 1With 706 2), and through engage to select connection pad 710 and engage connection pad 702 as the power supply connection pad 1With 702 2One of them or as the joint connection pad 706 of ground connection connection pad 1With 706 2Two kinds of possible electrically connect situations between one of them; Then can be used for the interlock circuit function such as internal logic, specification function, sequential of initialization circuit device 700 and provide IC apparatus 500 two kinds of different functions designs, on base plate for packaging 600, then do not need this moment to be provided with like engagement member 102 extraly as the existing IC apparatus 300 as shown in Figure 1 2With engagement member 104 2Deng power supply and ground connection engagement member, therefore can't take the space on the base plate for packaging 600 and more can on base plate for packaging 600, increase functional circuit connection pad extraly, to make full use of base plate for packaging 100 usable floor areas like joint connection pad 630 and 632.In addition; Binding situation through selection pad 710 as shown in Figure 2; Be familiar with this operator and can reduce formation joint connection pad 712,714,716,718,720,722,724,726,728,730,732 and 734 quantity above that according to the dimension reduction demand of circuit arrangement 700; And reduce the engagement member 610,612,614,616,618,620,622,624,626,628,630 be formed on the base plate for packaging 600 and 632 quantity accordingly, to reach the purpose of the size of dwindling IC apparatus 500.So, adopt the power supply/ground connection (power/ground) shown in the IC apparatus 500 as shown in Figure 2 to engage the dimension shrinks that choice structure helps circuit arrangement 700 with the base plate for packaging 600 of application in it.
In Fig. 2, select pad 710 to illustrate to being arranged at contiguous joint connection pad 706 as the ground connection connection pad 2A side, but do not limit the present invention with above-mentioned enforcement situation.In another embodiment, engage to select connection pad then can be arranged at other positions, for example shown in Figure 3 being arranged at engages one of connection pad 720 and 722 situation is set.
In like Fig. 2 and enforcement situation shown in Figure 3, engage connection pad 702 1With 702 2And non-limiting as the power supply connection pad, it also can be used as the usefulness of ground connection connection pad, and the engagement member 602 that be arranged on the base plate for packaging 600 this moment also will be as the usefulness of earthing component.Likewise, in above-mentioned enforcement situation, engage connection pad 706 1With 706 2And non-limiting as the ground connection connection pad, it also can be used as the usefulness of power supply connection pad, and the engagement member 604 that be arranged on the base plate for packaging 600 this moment also will be as the usefulness of power source means.Be familiar with the application scenarios that this operator can moderately adjust above-mentioned member with reference to the practical application situation.
Though disclosed the present invention in conjunction with above preferred embodiment; Yet it is not in order to limiting the present invention, anyly is familiar with this operator, is not breaking away from the spirit and scope of the present invention; Can do various changes and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.

Claims (6)

1. circuit arrangement comprises:
Select pad;
The first power supply connection pad; And
The first ground connection connection pad;
Wherein this selection pad, this first power supply connection pad and this first ground connection connection pad are positioned on the diverse location of an end face of this circuit arrangement, and this selection pad couples the function that one of this first power supply connection pad and this first ground connection connection pad determine this circuit arrangement through a bonding wire.
2. circuit arrangement as claimed in claim 1; Also comprise a plurality of functional circuit connection pads; Be arranged at separatedly on the diverse location of end face of this circuit arrangement; Wherein those functional circuit connection pads are the diverse location around this circuit arrangement edge, and those functional circuit connection pads the position that is provided with that the position is different from this selection pad, this first power supply connection pad and this first ground connection connection pad is set.
3. circuit arrangement as claimed in claim 1 also comprises the second source connection pad, is positioned at last and contiguous this first power supply connection pad of this end face of this circuit arrangement.
4. circuit arrangement as claimed in claim 3 also comprises power supply bus bar, is arranged within this circuit arrangement, with this first power supply connection pad of electrical ties and this second source connection pad.
5. circuit arrangement as claimed in claim 1 also comprises the second ground connection connection pad, is positioned at last and contiguous this first ground connection connection pad of this end face of this circuit arrangement.
6. circuit arrangement as claimed in claim 1 also comprises the ground strap line, is arranged in this circuit arrangement, with this first ground connection connection pad of electrical ties and this second ground connection connection pad.
CN2010102673493A 2010-08-27 2010-08-27 Circuit device Pending CN102386143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010102673493A CN102386143A (en) 2010-08-27 2010-08-27 Circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010102673493A CN102386143A (en) 2010-08-27 2010-08-27 Circuit device

Publications (1)

Publication Number Publication Date
CN102386143A true CN102386143A (en) 2012-03-21

Family

ID=45825420

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102673493A Pending CN102386143A (en) 2010-08-27 2010-08-27 Circuit device

Country Status (1)

Country Link
CN (1) CN102386143A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5880596A (en) * 1996-11-05 1999-03-09 Altera Corporation Apparatus and method for configuring integrated circuit option bits with different bonding patterns
US5998869A (en) * 1997-07-17 1999-12-07 Winbond Electronics Corp. High storage capacity, wide data input/output channel, static random access memory device
CN101436584A (en) * 2007-11-13 2009-05-20 海力士半导体有限公司 Stacked semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5880596A (en) * 1996-11-05 1999-03-09 Altera Corporation Apparatus and method for configuring integrated circuit option bits with different bonding patterns
US5998869A (en) * 1997-07-17 1999-12-07 Winbond Electronics Corp. High storage capacity, wide data input/output channel, static random access memory device
CN101436584A (en) * 2007-11-13 2009-05-20 海力士半导体有限公司 Stacked semiconductor package

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Application publication date: 20120321