CN102380829B - The method of sand blasting unit and formation pattern - Google Patents
The method of sand blasting unit and formation pattern Download PDFInfo
- Publication number
- CN102380829B CN102380829B CN201010268019.6A CN201010268019A CN102380829B CN 102380829 B CN102380829 B CN 102380829B CN 201010268019 A CN201010268019 A CN 201010268019A CN 102380829 B CN102380829 B CN 102380829B
- Authority
- CN
- China
- Prior art keywords
- nozzle
- filtration channel
- blasting unit
- sand blasting
- photoresistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The invention provides a kind of sand blasting unit, it comprises a main body and has an inner space, and one to be connected with this main body and to export the nozzle aiming at this body interior space, and one be contained in this body interior space and with the filtration channel of this nozzle pitch certain distance.This filtration channel has an interior bone for aiming at the workpiece presumptive area treating sandblasting.The present invention also provides a kind of method forming pattern, and it comprises step: provide a substrate, and it has the rete of a pattern to be formed; Cover a dry film photoresist layer in this rete; One is provided to have the light shield of pattern to be formed and utilize this light shield to expose this dry film photoresist layer; Development remove can developer dissolves photoresistance and stay and the photoresistance of developer dissolves can not become photoresistance protective layer; Utilize above-mentioned sand blasting unit sandblasting to etch and remove not by this rete that this photoresistance protective layer hides; And remove this photoresistance protective layer, on this substrate, form film pattern.
Description
Technical field
The present invention relates to sand blasting unit, and relate to the method utilizing sand blasting unit to form pattern.
Background technology
The sandblasting of sand blasting unit utilizes the method for physical impacts cutting workpiece to be often used to level decontamination, makes surface of the work have certain cleannes and roughness.A kind of sand blasting unit of prior art has a nozzle, and namely sand grains spreads to surface of the work through this nozzle.This sand grains has the physical etch effect of anisotropic to workpiece.
Along with present workpiece is more and more accurate, its region to be processed is more and more less.But because sand grains sprays through nozzle, it can spread to a wider region, namely inlet zone may be larger than jet size 2 ~ 3 times.Therefore, application sandblasting is difficult in Precision Machining field.
Summary of the invention
In view of this, be necessary that providing a kind of can be applicable to the sand blasting unit in Precision Machining field and utilize this sand blasting unit to form the method for pattern.
A kind of sand blasting unit, it comprises the main body that has an inner space, and one to be connected with this main body and to export the nozzle aiming at this inner space, and one be contained in this body interior space and with the filtration channel of this nozzle pitch certain distance.This filtration channel has an interior bone for accepting the sand grains that sprays from this nozzle and for aiming at the workpiece presumptive area treating sandblasting.This filtration channel comprises one to connect this tubulated ends and this plate-shaped end near the plate-shaped end and of the workpiece presumptive area treating sandblasting circular arc connecting portion near the tubulated ends, of this nozzle, and this interior bone runs through this tubulated ends and this plate-shaped end.
Form a method for pattern, it comprises the steps: to provide a substrate, and it has the rete of a pattern to be formed; Cover a dry film photoresist layer in this rete; One is provided to have the light shield of pattern to be formed and utilize this light shield to expose this dry film photoresist layer; Development remove can developer dissolves photoresistance and stay and the photoresistance of developer dissolves can not become photoresistance protective layer; Utilize above-mentioned sand blasting unit sandblasting to etch and remove not by this rete that this photoresistance protective layer hides; Remove this photoresistance protective layer, on this substrate, form film pattern.
Relative to prior art, sand blasting unit provided by the invention is provided with the filtration channel relative with nozzle, the sandblasting etching workpiece presumptive area to be processed fallen from filtration channel and make surface of the work formed pattern.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the sand blasting unit that first embodiment of the invention provides.
Fig. 2 is the cut-away view of sand blasting unit along II-II line of Fig. 1, and wherein sand grains makes an addition to and flows to show sand grains.
Fig. 3 is the cut-away view of the sand blasting unit that second embodiment of the invention provides.
Fig. 4 to Fig. 9 is the schematic diagram utilizing sand blasting unit to form the step of the method for pattern.
Main element symbol description
Sand blasting unit 100,200
Main body 110,210
Pillar 112,212
Baffle plate 140
Inner space 142
Nozzle 120,220
Outlet 122,222
Filtration channel 130,230
Accepting groove 238
Interior bone 132
Tubulated ends 134
Plate-shaped end 136
Circular arc connecting portion 138
Sand grains 20
Substrate 30
Rete 40
Dry film photoresist layer 50
Roller 52
Light shield 54
Photoresistance protective layer 60
Film pattern 70
Detailed description of the invention
Below in conjunction with accompanying drawing and multiple embodiment, the sand blasting unit provide the technical program and the method utilizing this sand blasting unit to form pattern are described in further detail.
Refer to Fig. 1 and Fig. 2 in the lump, the sand blasting unit 100 that first embodiment of the invention provides comprises a main body 110, nozzle 120 be connected with this main body 110, and a filtration channel 130.
This main body 110 comprises four pillars 112 and four baffle plates 140.These four pillars 112 and these four baffle plates 140 surround an inner space 142.These four baffle plates 140 are one-body molded with this pillar 112.When these four baffle plates 140 are highly higher, when can support this main body 110, these four pillars 112 can omit.This main body 110 carries sand grains 20, and is sprayed from this nozzle 120 with certain speed by this sand grains 20.The kind of this sand grains 20 and particle diameter, according to treating the workpiece material of sandblasting and the degree of depth to be etched and determining, are advisable not destroy workpiece ground.Such as when workpiece ground is a metal, the sand grains that this metal of hardness ratio is low can be selected, when workpiece ground is a glass, the sand grains that hardness ratio bead is low can be selected, when workpiece ground is PET (Polyethyleneterephthalate, PET) substrate, because PET has high molecular toughness, the material of sand grains is more unrestricted.
The size of this nozzle 120 is complied with the injection rate of area to be sprayed and needs and determines.This inner space 142 is aimed in the outlet 122 of this nozzle 120.
This filtration channel 130 is contained in this inner space 142, and keeps at a certain distance away with this nozzle 120.This filtration channel 130 is coaxially arranged with this nozzle 120.This filtration channel 130 has the tubulated ends 134 of close nozzle 120 and the relative close plate-shaped end 136 treating the workpiece area of sandblasting.The interior bone 132 that has this filtration channel 130 runs through this tubulated ends 134 and this plate-shaped end 136, for aiming at the workpiece area treating sandblasting.The size of this interior bone 132 is determined according to the workpiece presumptive area size treating sandblasting.Such as, this treats that the workpiece presumptive area size of sandblasting is less, then the size of this interior bone 132 is also less, only aims at and etch to make the sand grains 20 sprayed from this interior bone 132 the workpiece presumptive area that this treats sandblasting.This plate-shaped end 136 is for stopping the sand grains 20 of the interior bone 132 not falling into this filtration channel 130.The further circular arc connecting portion 138 comprising connecting tubular end 134 and plate-shaped end 136 of this filtration channel 130, this circular arc connecting portion 138 has the effect of the speed of the sand grains 20 of the interior bone 132 not falling into this filtration channel 130 that slows down.
The inner space 142 of this main body 110 can stop further and accommodate the sand grains 20 of the interior bone 132 not falling into this filtration channel 130.This sand grains 20 can reclaim.
Please again consult Fig. 2, when sand grains 20 is after the ejection of this nozzle 120, this filtration channel 130 of part sand grains 20 spirt, the interior bone 132 via this filtration channel 130 arrives the workpiece presumptive area treating sandblasting, thus etches this workpiece presumptive area.Remainder sand grains 20 is ejected on this circular arc connecting portion 138 and this plate-shaped end 136, is finally stopped by baffle plate 140, can not drop down onto the workpiece that this treats sandblasting.
Refer to Fig. 3, the sand blasting unit 200 that second embodiment of the invention provides comprises a main body 210, nozzle 220 be connected with this main body 210, and a filtration channel 230.This sand blasting unit 200 is with the difference of above-mentioned sand blasting unit 100: this main body 210 does not establish the baffle plate near filtration channel 230; Multiple pillars 212 of this main body 210 limit an inner space 242, and this inner space 242 is aimed in the outlet 222 of this nozzle 220, and this filtration channel 230 is housed in this inner space 242, and the periphery of this filtration channel 230 coordinates with the plurality of pillar 212; The plate dress end 236 of this filtration channel 230 offers one towards the annular accepting groove 238 of this inner space 242, and this annular accepting groove 238 can accommodate the sand grains of the interior bone 232 not falling into this filtration channel 230, makes it drop down onto and treats on the workpiece of sandblasting.
Refer to Fig. 4 to Fig. 9, utilize above-mentioned sand blasting unit 100 to form the method for a pattern as shown in the figure.
First, as Fig. 4, provide a substrate 30 as ground.This substrate 30 can select metal according to need, and glass or PET are as material.Then, a rete 40 is coated with in a surface of this substrate 30.In the present embodiment, this rete 40 is indium tin oxide (IndiumTinOxide, ITO) conductive single layer film.
Next, as Fig. 5, cover a dry film photoresist layer 50 on this rete 40, and with roller 52, dry film photoresist layer 50 is fitted with the substrate 30 with rete 40.This dry film photoresist layer 50 can be positive photoresistance or negative photoresistance, and in the present embodiment, it is positive photoresistance, i.e. the region of this dry film photoresist layer 50 exposure can be dissolved in a developer and can be removed.This dry film photoresist layer 50 is conducive to reclaiming the sand grains be sprayed onto individually on it.
Secondly, as Fig. 6, a light shield 54 is provided and utilizes this light shield 54 this dry film photoresist layer 50 to part to expose.Light represents with the arrow form in scheming.This light shield 54 has required pattern.The positive negativity only depending on dry film photoresist layer 50 is there is in this required pattern with through-hole form or entity form (non through hole form).In the present embodiment, because dry film photoresist layer 50 is positive photoresistance, this required pattern is present in this light shield 54 with entity form.The part of the dry film photoresist layer 50 covered by this light shield 54 can not be dissolved in developer and be removed.
Next, as Fig. 7, dissolve after removal through developer (not shown), only leave the part dry film photoresist layer 50 covered by this light shield 54.This part dry film photoresist layer 50 with pattern, and becomes a photoresistance protective layer 60.
Following again, as Fig. 8, utilize the part of above-mentioned sand blasting unit 100 to the rete 40 do not covered by photoresistance protective layer 60 to carry out sandblasting etching, thus remove the part of the rete 40 that this is not covered by photoresistance protective layer 60.
Finally, as Fig. 9, remove this photoresistance protective layer 60, obtain film pattern 70.This photoresistance protective layer 60 is also removed by exposure imaging method.
Utilize above-mentioned sand blasting unit 100 accurately can form pattern in workpiece presumptive area.
Substrate 30 with film pattern 70 can be applied in the electric series products such as circuit board.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection domain that all should belong to the claims in the present invention with distortion.
Claims (8)
1. a sand blasting unit, it comprises:
One main body, it has an inner space;
A nozzle be connected with this main body, this body interior space is aimed in the outlet of this nozzle; And
One be contained in this body interior space and with the filtration channel of this nozzle pitch certain distance, this filtration channel has an interior bone for accepting the sand grains that sprays from this nozzle and for aiming at the workpiece presumptive area treating sandblasting, this filtration channel comprises one to connect this tubulated ends and this plate-shaped end near the plate-shaped end and of the workpiece presumptive area treating sandblasting circular arc connecting portion near the tubulated ends, of this nozzle, and this interior bone runs through this tubulated ends and this plate-shaped end.
2. sand blasting unit as claimed in claim 1, wherein: this main body comprises multiple pillar and multiple baffle plate, the plurality of pillar and the plurality of baffle plate surround this inner space.
3. sand blasting unit as claimed in claim 1, wherein: this filtration channel and this nozzle are coaxially arranged.
4. sand blasting unit as claimed in claim 1, wherein: this filtration channel comprises one further and is opened in the sand grains accepting groove of this plate-shaped end towards the surface of this inner space.
5. sand blasting unit as claimed in claim 1, wherein: this main body comprises multiple pillar, the plurality of pillar limits this inner space, this filtration channel periphery and the plurality of stanchions.
6. form a method for pattern, it comprises:
There is provided a substrate, it has the rete of a pattern to be formed;
Cover a dry film photoresist layer in this rete;
One is provided to have the light shield of pattern to be formed and utilize this light shield to expose this dry film photoresist layer;
Development remove can developer dissolves photoresistance and stay and the photoresistance of developer dissolves can not become photoresistance protective layer;
One sand blasting unit is provided, this sand blasting unit comprises the main body that has an inner space, one to be connected with this main body and to export the nozzle aiming at this inner space, and one be contained in this body interior space and with the filtration channel of this nozzle pitch certain distance, this filtration channel has an interior bone for accepting the sand grains that sprays from this nozzle and for aiming at the workpiece presumptive area treating sandblasting, this filtration channel comprises one near the tubulated ends of this nozzle, one near the plate-shaped end of workpiece presumptive area and the circular arc connecting portion of this tubulated ends of connection and this plate-shaped end for the treatment of sandblasting, this interior bone runs through this tubulated ends and this plate-shaped end,
Utilize this sand blasting unit sandblasting to etch and remove not by this rete that this photoresistance protective layer hides; And
Remove this photoresistance protective layer, on this substrate, form film pattern.
7. the method forming pattern as claimed in claim 6, wherein: this dry film photoresist layer is positive photoresistance, is exposed and the photoresistance non-corresponding area of the pattern removed that develops.
8. the method forming pattern as claimed in claim 6, wherein: this filtration channel and this nozzle are coaxially arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010268019.6A CN102380829B (en) | 2010-08-31 | 2010-08-31 | The method of sand blasting unit and formation pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010268019.6A CN102380829B (en) | 2010-08-31 | 2010-08-31 | The method of sand blasting unit and formation pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102380829A CN102380829A (en) | 2012-03-21 |
| CN102380829B true CN102380829B (en) | 2015-11-18 |
Family
ID=45820879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010268019.6A Expired - Fee Related CN102380829B (en) | 2010-08-31 | 2010-08-31 | The method of sand blasting unit and formation pattern |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102380829B (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02218600A (en) * | 1989-02-14 | 1990-08-31 | Kiyoyuki Horii | Grinding/cutting method and device thereof |
| CN2099685U (en) * | 1991-06-06 | 1992-03-25 | 崔文金 | Glass carving tool |
| CN1024078C (en) * | 1992-06-25 | 1994-03-23 | 中国科学院半导体研究所职工技术协会 | Method for making photographic sand carving pattern on surface of hard material and appratus thereof |
| JPH0897537A (en) * | 1994-09-26 | 1996-04-12 | Toppan Printing Co Ltd | Method of producing thick film pattern |
| JP3638660B2 (en) * | 1995-05-01 | 2005-04-13 | 松下電器産業株式会社 | Photosensitive resin composition, photosensitive dry film for sandblasting using the same, and etching method using the same |
| JPH11226874A (en) * | 1998-02-16 | 1999-08-24 | Murata Mfg Co Ltd | Recessed groove work method |
| EP0967183B1 (en) * | 1998-06-25 | 2004-04-07 | Heraeus Quarzglas GmbH & Co. KG | Method of machining a quartz glass component |
| US6244927B1 (en) * | 1998-08-31 | 2001-06-12 | Ingersoll-Rand Company | Multi-functional sensing methods and apparatus therefor |
| US6673522B2 (en) * | 2001-12-05 | 2004-01-06 | Plasmion Displays Llc | Method of forming capillary discharge site of plasma display panel using sand blasting |
| FR2912946B1 (en) * | 2007-02-28 | 2009-04-10 | Snecma Sa | ALIGNMENT CONTROL FOR A WATERJET CUTTING SYSTEM |
-
2010
- 2010-08-31 CN CN201010268019.6A patent/CN102380829B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN102380829A (en) | 2012-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101889523B1 (en) | Cutting method by sandblasting | |
| EP2277663B1 (en) | Nozzle, nozzle unit, and blasting machine | |
| CN103481199A (en) | Target material processing method | |
| SG150421A1 (en) | Method of forming thin film metal conductive lines | |
| WO2007133413A3 (en) | Photoresist stripping chamber and methods of etching photoresist on substrates | |
| CN102380829B (en) | The method of sand blasting unit and formation pattern | |
| KR20170019698A (en) | Method of Cutting Glass | |
| CN104369113A (en) | Target material sand blasting clamp and target material sand blasting method | |
| CN103108490A (en) | Circuit manufacturing method of super-thick copper circuit board | |
| CN105304522A (en) | Silicon wafer back surface cleaning device | |
| CN103605448A (en) | Manufacturing method for integrally forming circuit diagram of film-structure capacitive touch screen sensor and product manufactured through manufacturing method | |
| CN203774251U (en) | Device for cleaning back side of wafer | |
| CN106030470A (en) | Conductive film, conductive film manufacturing method, and touch panel | |
| CN100432772C (en) | Glass substrate for plane display device and mfg method thereof | |
| CN108198751A (en) | Photoresist layer stripping means | |
| CN103060920A (en) | High-precision and pollution-free semiconductor wafer cleavage method | |
| CN108519833B (en) | Touch display panel forming method and touch display motherboard | |
| JP2004182586A (en) | Glass substrate for flat panel display and its manufacturing method | |
| TW201708978A (en) | Developing device, developing method, pattern forming apparatus and pattern forming method | |
| CN106409710A (en) | Adhesion detecting method | |
| CN103972062A (en) | Ion implantation method | |
| CN102629571A (en) | Manufacturing method for array substrate and etching equipment | |
| CN107555804A (en) | Touch the preparation method of panel glass and touch panel glass | |
| CN108847381A (en) | The method for testing substrate and extended testing system substrate service life | |
| TWI556872B (en) | Sandblasting apparatus and method for forming pattern |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 Termination date: 20160831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |