CN102380708A - Wire positioning device for welding packaging machine of double-interface card - Google Patents
Wire positioning device for welding packaging machine of double-interface card Download PDFInfo
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- CN102380708A CN102380708A CN2011103877134A CN201110387713A CN102380708A CN 102380708 A CN102380708 A CN 102380708A CN 2011103877134 A CN2011103877134 A CN 2011103877134A CN 201110387713 A CN201110387713 A CN 201110387713A CN 102380708 A CN102380708 A CN 102380708A
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- positioning device
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- wire positioning
- packaging machine
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Abstract
The invention relates to a wire positioning device for a welding packaging machine of a double-interface card. The wire positioning device comprises a welding station (1), a cylinder (2), first correcting forks (3) and a correcting cylinder (4), wherein the cylinder (2) is mounted on a frame and is used for supporting the welding station (1); the primary correcting forks (3) are mounted at the front and rear ends of the welding station (1) and are used for correcting the position of a to-be-welded wire (1.1); the correcting cylinder (4) is used for driving the primary correcting forks (3) to ascend and descend. The wire positioning device is characterized in that the frame is provided with a lifting mechanism (5) located above the middle part of the welding station (1); and a secondary correcting fork (6) is arranged at the movable end of the lifting mechanism (5), is located right above an IC (Integrated Circuit) card and butts against the to-be-welded wire (1.1). With such a structure, the wire positioning device is capable of improving the wire positioning precision and greatly enhancing the welding success rate, thereby reducing the halt frequency of equipment.
Description
Technical field
The invention belongs to double-interface card IC-card sealed in unit manufacturing technology field, be specifically related to a kind of wire positioning device that is used for double-interface card welding packaging machine.
Background technology
The present IC-card welder that is used for double-interface card welding packaging machine; Mainly by rack-mounted welding post 1, the belt conveyor 7 of the IC chip 1.3 that is used to transmit IC-card 1.2 and be welded with lead 1.1 and the laser weld mechanism 8 that is positioned at welding post 1 top form; IC-card 1.2 is delivered to welding post 1 place continuously through belt conveyor 7; The lead to be welded 1.1 that will be connected with IC chip 1.3 through laser weld mechanism 8 again is welded on the tin sheet 1.4 of IC-card 1.2, the IC chip 1.3 of IC-card 1.2 is connected with induction coil (tin sheet 1.4 in the early stage of IC-card manufacture craft operation with IC-card in induction coil weld).Yet laser is when welding lead 1.1; Error when revising owing to the once correction fork 3 that is positioned at welding post 1 front and back end; When the line ball pin 80 of laser weld mechanism 8 is pressed on 1.4 last times of tin sheet with lead 1.1, the position deviation of 0.5-1.5mm might appear, and make the Laser Welding contact not over against lead 1.1; Cause welding failure (permissible accuracy generally is the position of lead in laser weld dot center during laser weld, and offset distance is about 0.15mm).
Summary of the invention
The object of the present invention is to provide a kind of high wire positioning device that is used for double-interface card welding packaging machine of lead positioning accuracy to be welded, raising is welded into power greatly, reduces the equipment downtime number of times.
The objective of the invention is to realize like this: a kind of wire positioning device that is used for double-interface card welding packaging machine; Comprise welding post (1), be installed in the cylinder (2) that supports welding post (1) on the frame, be installed in welding post (1) front and back end be used for lead to be welded (1.1) is carried out the once correction fork (3) of position correction and drives once revising the correction cylinder (4) that fork (3) goes up and down; It is characterized in that: the top that said frame is positioned at welding post (1) middle part is provided with elevating mechanism (5), and the movable end of elevating mechanism (5) is provided with the secondary correction fork (6) that can be resisted against on the lead to be welded (1.1) directly over being positioned at IC-card.
Said elevating mechanism (5) is a lift cylinder.
Said elevating mechanism (5) is liftable hydraulic jack.
Said elevating mechanism (5) is liftable lead screw motor.
Said elevating mechanism (5) is gear, tooth bar elevating mechanism.
Said secondary correction fork (6) has the locating aperture that opening is big, the inner end is little (60) that lead to be welded (1.1) is positioned.
The degree of depth of said locating aperture (60) is between 0.5-2mm, and opening angle is between 45 °-70 °.
Said secondary correction fork (6) is 15-25mm apart from the floor projection distance of the once correction fork (3) of welding post platform (1) front end.
Good effect of the present invention: set up the correcting principle of forming by elevating mechanism, secondary correction fork that lead to be welded is carried out the secondary correction at welding post middle part; Can improve positioning accuracy to lead to be welded; Thereby make lead be positioned at the laser weld point range; Raising is welded into power and production efficiency, reduces production costs.
Description of drawings
Fig. 1 is for being used for double-interface card welding packaging machine partial structurtes sketch map;
Fig. 2 is for being used for double-interface card welding packaging machine partial structurtes exploded view;
Fig. 3 is the wire positioning device partial view;
Fig. 4 is secondary correction fork stereogram.
The specific embodiment
Below in conjunction with accompanying drawing the specific embodiment of the wire positioning device that is used for double-interface card welding packaging machine is done further explain.
The specific embodiment: shown in Fig. 1-4; The IC-card welder that is used for double-interface card welding packaging machine of the present invention; Mainly by rack-mounted welding post 1, be installed in the cylinder 2 that supports welding post 1 on the frame, be installed in welding post 1 front and back end be used for to lead to be welded 1.1 carry out elevating mechanism 5 that the top of once revising fork 3, drive the correction cylinder 4 once revising fork 3 and go up and down, being positioned at welding post 1 middle part of position correction is provided with, the movable end of being located at elevating mechanism 5 is positioned at directly over the IC-card and can be resisted against secondary correction fork 6 on the lead to be welded 1.1, the belt conveyor 7 of the IC chip 1.3 that is used to transmit IC-card 1.2 and be welded with lead 1.1 and the laser weld mechanism 8 that is positioned at welding post 1 top form; During equipment work; Cylinder 2 ventilations make welding post 1 be increased to working depth; IC-card 1.2 is delivered to welding post 1 place through belt conveyor 7; When IC-card 1.2 is positioned at welding post 1 place; Revise cylinder 4 ventilation work; To once revise fork 3 and raise, IC-card 1.2, lead 1.1 to be welded will be carried out position correction, once revise fork 3 with lead to be welded 1.1 suitably be raised to the about 0.5-3mm of the upper surface of IC-card 1.2 about height.At this moment elevating mechanism 5 work press down secondary correction fork 6, lead to be welded 1.1 is carried out the position make amendment once more; The line ball pin 80 of laser weld mechanism 8 toward moving down, is pressed on the upper surface place of IC-card 1.2 with lead to be welded 1.1 under the effect of driver part then, and lead 1.1 contacts with the tin sheet 1.4 at place to be welded; The laser head of laser weld mechanism 8 welds lead 1.1 at this moment; Lead 1.1 is fixedly connected on the tin sheet 1.4, and after welding was good, line ball pin 80, elevating mechanism 5 upwards lifting resetted; Revise cylinder 4 reverse ventilation work; To once revise fork 3 and be reduced to working position, wait for that belt conveyor 7 will descend a slice IC-card 1.2 to be delivered to welding post 1 place, carry out next circulation.Elevating mechanism 5 can adopt lift cylinder or liftable hydraulic jack or liftable lead screw motor, can certainly adopt comparatively complicated elevating mechanism, such as the elevating mechanism that is made up of parts such as gear, tooth bars.Secondary correction fork 6 has the locating aperture 60 that the opening that lead to be welded 1.1 is positioned is big, the inner end is little, and the degree of depth of locating aperture 60 between 0.5-2mm, is preferably 1mm greatly, and opening angle between 45 °-70 °, is preferably 60 ° greatly.Secondary correction fork 6 apart from the floor projection distance of once revising fork 3 of welding post platform 1 front end greatly between 15-25mm.
Claims (8)
1. one kind is used for the wire positioning device that double-interface card welds packaging machine; Comprise welding post (1), be installed in the cylinder (2) that supports welding post (1) on the frame, be installed in welding post (1) front and back end be used for lead to be welded (1.1) is carried out the once correction fork (3) of position correction and drives once revising the correction cylinder (4) that fork (3) goes up and down; It is characterized in that: the top that said frame is positioned at welding post (1) middle part is provided with elevating mechanism (5), and the movable end of elevating mechanism (5) is provided with the secondary correction fork (6) that can be resisted against on the lead to be welded (1.1) directly over being positioned at IC-card.
2. according to the said wire positioning device that is used for double-interface card welding packaging machine of claim 1, it is characterized in that: said elevating mechanism (5) is a lift cylinder.
3. according to the said wire positioning device that is used for double-interface card welding packaging machine of claim 1, it is characterized in that: said elevating mechanism (5) is liftable hydraulic jack.
4. according to the said wire positioning device that is used for double-interface card welding packaging machine of claim 1, it is characterized in that: said elevating mechanism (5) is liftable lead screw motor.
5. according to the said wire positioning device that is used for double-interface card welding packaging machine of claim 1, it is characterized in that: said elevating mechanism (5) is gear, tooth bar elevating mechanism.
6. according to the said wire positioning device that is used for double-interface card welding packaging machine of arbitrary claim among the claim 1-5, it is characterized in that: said secondary correction fork (6) has the locating aperture that opening is big, the inner end is little (60) that lead to be welded (1.1) is positioned.
7. according to the said wire positioning device that is used for double-interface card welding packaging machine of claim 6, it is characterized in that: the degree of depth of said locating aperture (60) is between 0.5-2mm, and opening angle is between 45 °-70 °.
8. according to the said wire positioning device that is used for double-interface card welding packaging machine of claim 1, it is characterized in that: said secondary correction fork (6) is 15-25mm apart from the floor projection distance of the once correction fork (3) of welding post platform (1) front end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103877134A CN102380708A (en) | 2011-11-23 | 2011-11-23 | Wire positioning device for welding packaging machine of double-interface card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103877134A CN102380708A (en) | 2011-11-23 | 2011-11-23 | Wire positioning device for welding packaging machine of double-interface card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102380708A true CN102380708A (en) | 2012-03-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103877134A Pending CN102380708A (en) | 2011-11-23 | 2011-11-23 | Wire positioning device for welding packaging machine of double-interface card |
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| Country | Link |
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| CN (1) | CN102380708A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106346102A (en) * | 2016-10-26 | 2017-01-25 | 东莞市锐祥智能卡科技有限公司 | Tin supplying and tin soldering device and method of double-interface chip tin soldering gum application machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2426231A1 (en) * | 2003-04-17 | 2004-10-22 | Chi Ming Wong | Method and apparatus for making smart card solder contacts |
| CN1539591A (en) * | 2003-07-18 | 2004-10-27 | 中卡智能卡(上海)有限公司 | Technique for welding non-contact type IC card |
| CN101499428A (en) * | 2009-02-19 | 2009-08-05 | 东莞锐发智能卡科技有限公司 | Double-interface card production method and equipment |
| CN102114578A (en) * | 2010-12-27 | 2011-07-06 | 上海一芯智能科技有限公司 | Antenna welding process of non-contact intelligent card |
| CN102133686A (en) * | 2011-01-24 | 2011-07-27 | 东莞锐发智能卡科技有限公司 | Wire soldering method and device for dual interface cards |
| CN202356791U (en) * | 2011-11-23 | 2012-08-01 | 佛山市顺德区德芯智能科技有限公司 | Lead positioning device for double-interface card welding packaging machine |
-
2011
- 2011-11-23 CN CN2011103877134A patent/CN102380708A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2426231A1 (en) * | 2003-04-17 | 2004-10-22 | Chi Ming Wong | Method and apparatus for making smart card solder contacts |
| CN1539591A (en) * | 2003-07-18 | 2004-10-27 | 中卡智能卡(上海)有限公司 | Technique for welding non-contact type IC card |
| CN101499428A (en) * | 2009-02-19 | 2009-08-05 | 东莞锐发智能卡科技有限公司 | Double-interface card production method and equipment |
| CN102114578A (en) * | 2010-12-27 | 2011-07-06 | 上海一芯智能科技有限公司 | Antenna welding process of non-contact intelligent card |
| CN102133686A (en) * | 2011-01-24 | 2011-07-27 | 东莞锐发智能卡科技有限公司 | Wire soldering method and device for dual interface cards |
| CN202356791U (en) * | 2011-11-23 | 2012-08-01 | 佛山市顺德区德芯智能科技有限公司 | Lead positioning device for double-interface card welding packaging machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106346102A (en) * | 2016-10-26 | 2017-01-25 | 东莞市锐祥智能卡科技有限公司 | Tin supplying and tin soldering device and method of double-interface chip tin soldering gum application machine |
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Application publication date: 20120321 |