CN102376311A - Cantilever part, head gimbal assembly and disc driving unit - Google Patents

Cantilever part, head gimbal assembly and disc driving unit Download PDF

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Publication number
CN102376311A
CN102376311A CN2010102543324A CN201010254332A CN102376311A CN 102376311 A CN102376311 A CN 102376311A CN 2010102543324 A CN2010102543324 A CN 2010102543324A CN 201010254332 A CN201010254332 A CN 201010254332A CN 102376311 A CN102376311 A CN 102376311A
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China
Prior art keywords
circuit
layer
printing circuit
negative
printing
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CN2010102543324A
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Chinese (zh)
Inventor
周海鸣
邱金波
江新
冯先文
谷保
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SAE Magnetics HK Ltd
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SAE Magnetics HK Ltd
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Priority to CN2010102543324A priority Critical patent/CN102376311A/en
Publication of CN102376311A publication Critical patent/CN102376311A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a cantilever part, a head gimbal assembly and a disc driving unit. The invention discloses the cantilever part which comprises a flexible member and a plurality of flexible circuits, wherein the flexible member is provided with a front part and a tail part opposite to the front part; the flexible circuits are formed on the flexible member and extend to the tail part of the flexible member from the front part of the flexible member; each flexible circuit is provided with a multilayer structure; each multilayer structure comprises a lower circuit layer, an upper circuit layer and an insulating layer sandwiched between the lower circuit layer and the upper circuit layer; both each lower circuit layer and each upper circuit layer comprise at least one positive writing circuit and at least one negative writing circuit which are arranged in a staggered way; and each positive writing circuit of each upper circuit layer is over against each negative writing circuit of the corresponding lower circuit layer. In the invention, stronger capacitive coupling can be generated between the positive and negative writing circuits of the upper circuit layers and the lower circuit layers and an electric field is uniformly distributed, so that the signal transmission loss is reduced, and thus, the impedance is reduced and the bandwidth of a frequency is improved.

Description

Cantilever part, magnetic head fold piece combination and disc drive unit
Technical field
The present invention relates to the information recording disk driver element, relate in particular to a kind of cantilever part, magnetic head fold piece combination (head gimbal assembly, HGA) and disc drive unit.
Background technology
Disc drive unit is common information storing device.Fig. 1 a is the synoptic diagram of a typical disc drive unit 100.It comprises a series of rotatable disk 101 that is installed on the Spindle Motor 102, magnetic head cantilever combination (head stack assembly, HSA) 130.HSA 130 comprises an at least one motor arm 104 and a HGA 150.Typically, (spindling voice-coil motor, VCM) (figure does not show) is with the action of control motor arm 104 voice coil motor to be set.
With reference to figure 1b, HGA 150 comprises magnetic head 103 that is embedded with read/write transducers (figure does not show) and the cantilever part 190 that supports this magnetic head 103.When disc drive unit 100 running, Spindle Motor 102 makes disk 101 high speed rotating, and magnetic head 103 flies above disk 101 because of the air pressure that disk 101 rotations produce.This magnetic head 103 moves with radial direction on the surface of disk 101 under the control of voice coil motor.For different tracks, magnetic head 103 can be gone up reading of data or data are write into disk 101 from disk 101 surfaces.
Fig. 1 c has showed a kind of traditional cantilever part, and this cantilever part 190 comprises load beam 106, substrate 108, hinge element 107 and flexible element 105, and above element all is assembled together.
Load beam 106 is connected on the substrate 108 through hinge element 107.On load beam 106, form a fixed orifice 112, with so that load beam 106 align with flexible element 105.And for increasing flexible element 105 integrally-built intensity, load beam 106 welds together with flexible element 105.
Substrate 108 is as the rigidity of structure that strengthens whole HGA 150.One end of substrate 108 forms mounting hole 113, in order to whole HGA 150 is mounted to motor arm 104 (with reference to figure 1a); Another tail end at substrate 108 forms another hole 110, in order to will be formed on the hole 110 ' on the hinge element 107 and to be formed on the hole 110 on the flexible element 105 " alignment.Hinge element 107 is formed with a mounting hole 131 ' at the mounting hole 113 of the terminal counterpart substrate 108 of one of which, and this hinge element 107 is installed in it on substrate 108 through the mounting hole 131 ' and 113 that aligns each other.Hinge element 107 parts are installed on the substrate 108, and mounting hole 131 ', 113 is in alignment with each other.Hinge element 107 can be through laser bonding together with substrate 108, and pad is distributed in choice refreshments 109 places of hinge element 107.Two steps 115 are integrally formed at the both sides of hinge element 107 contiguous mounting hole 131 ' one ends, to be connected on the flexible element 105.
Flexible element 105 passes hinge element 107 and load beam 106.This flexible element 105 has the near-end 119 of contiguous hinge element 107 and the far-end 118 of contiguous load beam 106.One pilot hole 117 is located at far-end 118 places of flexible element 105, and aligns with the pilot hole 112 of load beam 106, to improve the assembling degree of accuracy.One cantilever tongue piece 116 is arranged on far-end 118 places of flexible element 105, to support magnetic head 103.
Shown in Fig. 1 d, this flexible element 105 has one anterior 121 and the afterbody 122 relative with this front portion 121, and the position of closing on cantilever tongue piece 116 is located in this front portion 121.As shown in the figure, flexible circuit 120 along the length direction setting of flexible element 105 above that.Particularly, this flexible circuit 120 originates in front portion 121 and ends in afterbody 122.Form a plurality of connecting terminals 117 on the cantilever tongue piece 116, in order to connect magnetic head 103.One end of flexible circuit 120 is connected with connecting terminal 117, and the other end is electrically connected to prime amplifier (figure does not show).Generally speaking, shown in Fig. 1 e, this flexible circuit 120 that extends to connecting terminal 117 comprises a pair of circuit 123, printing circuit 124 and the heat circuit 125 read respectively.All flexible circuits 120 all engage with some terminal contacts 126 at afterbody 122.
Fig. 1 f is the sectional view that flexible element 105 is cutd open along Fig. 1 d Vertical Centre Line A-A, and it has showed the detailed structure of flexible element 105.This flexible element 105 has a stratiform structure 130, and it comprises flexible stainless steel layer 131 and and is formed at the polyimide layer 133 on this stainless steel layer 131.Reading circuit 123, printing circuit 124 and heat circuit 125 is formed on this polyimide layer 133.Wherein, printing circuit 124 comprises positive printing circuit 1241, negative printing circuit 1242, and when in work, this will produce capacitive and be coupled.Yet this kind coupling is mainly sent out between positive printing circuit 1241 and negative printing circuit 1242; Correspondingly, this will be difficult to realize simultaneously the printing circuit of Low ESR, high bandwidth and narrower width.This is because the coupling of this kind capacitive is strong inadequately, and the distribution of electric field is even inadequately.Finally, make the impedance of flexible circuit become big, and then increased signal transmission attenuation.On the other hand, can make that like this frequency bandwidth narrows down, therefore, this kind setting can't be satisfied actual demand.
Therefore, demand a kind of improved cantilever part, magnetic head fold piece combination and disc drive unit urgently to overcome above-mentioned defective.
Summary of the invention
One object of the present invention is to provide a kind of cantilever part; It can produce stronger capacitive coupling between the positive and negative printing circuit of last circuit layer and following circuit layer; And make Electric Field Distribution all with, thereby reduce signal transmission attenuation, and then reduce impedance, increase frequency bandwidth.
Another object of the present invention is to provide a kind of magnetic head fold piece combination; Cantilever part on it can produce stronger capacitive coupling between the positive and negative printing circuit of last circuit layer and following circuit layer; And make Electric Field Distribution all with, thereby reduce signal transmission attenuation, and then reduce impedance, increase frequency bandwidth.
Another purpose of the present invention is to provide a kind of disc drive unit; Cantilever part on it can produce stronger capacitive coupling between the positive and negative printing circuit of last circuit layer and following circuit layer; And make Electric Field Distribution all with, thereby reduce signal transmission attenuation, and then reduce impedance, increase frequency bandwidth.
For realizing above-mentioned purpose, the invention provides a kind of cantilever part, it comprises flexible element, said flexible element has front portion and the afterbody relative with said front portion; And a plurality of flexible circuits, said flexible circuit is formed on the said flexible element and from said front portion and extends to said afterbody.Wherein, Said flexible circuit has sandwich construction; Said sandwich construction comprises down circuit layer, go up circuit layer and layer is sandwiched in the insulation course between said circuit layer down and the last circuit layer; Said circuit layer down and last circuit layer include staggered at least one positive printing circuit and at least one negative printing circuit, and said each positive printing circuit of going up circuit layer is over against said each negative printing circuit of circuit layer down.
As a preferred embodiment; Said circuit layer down comprises the negative printing circuit of the upright printing circuit and first below first time; Said first below is negative to be write by the linear side that is formed in said first time upright printing circuit; The said circuit layer of going up comprises upright printing circuit on the negative printing circuit and first in first top; Upright printing circuit is formed at by the side of the negative printing circuit in said first top on said first, and said first time upright printing circuit be negative printing circuit over against said first top, the negative printing circuit in said first below upright printing circuit on said first.
As another preferred embodiment; Said circuit layer down also comprises the second time other upright printing circuit of side that is formed at the negative printing circuit in said first below; The said circuit layer of going up also comprises the other negative printing circuit in second top of side that is formed at upright printing circuit on said first, and said second time upright printing circuit be negative printing circuit over against said second top.
Preferably, the thickness range of said insulation course is 10 μ m to 20 μ m.
Preferably, said flexible element has layer structure, and layered structure comprises substrate layer and is formed at the dielectric layer on the said substrate layer.
Preferably, the thickness range of said dielectric layer is 10 μ m to 20 μ m.
Preferably, the sandwich construction of said flexible circuit is formed on the said dielectric layer.
Preferably, the said circuit layer of going up also comprises at least one circuit and at least one negative circuit of reading just read, and is saidly just reading circuit and said negative reading by the side that circuit is formed at said positive printing circuit and said negative printing circuit.
Preferably, the width range of said positive printing circuit and said negative printing circuit is 20 μ m to 100 μ m.
Preferably, in same circuit layer, the spacing range between said positive printing circuit and the said negative printing circuit is 10 μ m to 20 μ m.
The present invention provides a kind of magnetic head fold piece combination, the cantilever part that it comprises magnetic head and is used to support said magnetic head.Said cantilever part comprises: flexible element, said flexible element have front portion and the afterbody relative with said front portion; And a plurality of flexible circuits, said flexible circuit is formed on the said flexible element and from said front portion and extends to said afterbody.Wherein, Said flexible circuit has sandwich construction; Said sandwich construction comprises down circuit layer, go up circuit layer and layer is sandwiched in the insulation course between said circuit layer down and the last circuit layer; Said circuit layer down and last circuit layer include staggered at least one positive printing circuit and at least one negative printing circuit, and said each positive printing circuit of going up circuit layer is over against said each negative printing circuit of circuit layer down.
The present invention also provides a kind of disc drive unit, and it comprises the magnetic head fold piece combination of the cantilever part that has magnetic head and support said magnetic head, with the actuating arm that said magnetic head fold piece combination is connected, a series of disks, and the Spindle Motor that is used to rotate said disk.Wherein, said cantilever part comprises: flexible element, said flexible element have front portion and the afterbody relative with said front portion; And a plurality of flexible circuits, said flexible circuit is formed on the said flexible element and from said front portion and extends to said afterbody.Wherein, Said flexible circuit has sandwich construction; Said sandwich construction comprises down circuit layer, go up circuit layer and layer is sandwiched in the insulation course between said circuit layer down and the last circuit layer; Said circuit layer down and last circuit layer include staggered at least one positive printing circuit and at least one negative printing circuit, and said each positive printing circuit of going up circuit layer is over against said each negative printing circuit of circuit layer down.
Compared with prior art; The present invention is the printing circuit of two circuit layers up and down, arranges with the mode of polarity, promptly; The positive printing circuit of each of last circuit layer faces down each negative printing circuit of circuit layer; Therefore, capacitive coupling not only can take place between the positive and negative printing circuit on the same circuit layer, and can between the positive and negative printing circuit of two circuit layers up and down, take place.Therefore, because the capacitive coupling that strengthens makes the centrality of electric current reduce, Electric Field Distribution is more even.Simultaneously, reduce signal transmission attenuation, thereby reduce impedance, finally improve frequency bandwidth.
Through following description and combine accompanying drawing, it is more clear that the present invention will become, and these accompanying drawings are used to explain embodiments of the invention.
Description of drawings
Fig. 1 a is the stereographic map of traditional disc drive unit.
Fig. 1 b is the stereographic map of traditional HGA.
Fig. 1 c is the three-dimensional exploded view of HGA among Fig. 1 b.
Fig. 1 d is the top view of the flexible element of cantilever part among Fig. 1 c.
Fig. 1 e is the enlarged drawing of the front portion of the flexible element shown in the dotted line among Fig. 1 d.
Fig. 1 f is the cut-open view of flexible element along A-A hatching line gained among Fig. 1 d.
Fig. 2 is the three-dimensional exploded view of an embodiment of cantilever part of the present invention.
Fig. 3 is the top view of the flexible element of cantilever part among Fig. 2.
Fig. 4 is the cut-open view of flexible element of the present invention along B-B hatching line gained among Fig. 3.
Fig. 5 has showed the detailed structure of the flexible circuit that flexible element is anterior.
Fig. 6 has showed the detailed structure of the flexible circuit of flexible element afterbody.
Fig. 7 has showed that the present invention has another embodiment of the flexible circuit of sandwich construction.
Fig. 8 has showed the capacitively coupled situation between the printing circuit.
Fig. 9 is a form, and it has showed two groups of experimental datas according to two embodiment gained of the present invention.
Figure 10 is the stereographic map of the embodiment of HGA of the present invention.
Figure 11 is the stereographic map of an embodiment of disc drive unit of the present invention.
Embodiment
Set forth the several different most preferred embodiments of the present invention below with reference to accompanying drawing, identical label is represented identical parts among the wherein different figure.As stated; Essence of the present invention is the cantilever part in a kind of disc drive unit; It comprises circuit layer and following circuit layer; It includes staggered at least one positive printing circuit and at least one negative printing circuit, and said each positive printing circuit of going up circuit layer is over against said each negative printing circuit of circuit layer down.The present invention can produce the coupling of stronger capacitive between the positive and negative printing circuit of last circuit layer and following circuit layer, and make Electric Field Distribution all with, thereby reduce signal transmission attenuation, and then reduction impedance, increase frequency bandwidth.
Fig. 2 has showed an embodiment of cantilever part of the present invention.As shown in Figure 2, cantilever part 290 comprises load beam 206, substrate 208, hinge element 207 and flexible element 205, and above element all is assembled together.
With reference to figure 2, load beam 206 passes to flexible element 205 to load force and is installed on the magnetic head on the flexible element 205.Load beam 206 can be processed by any material with suitable rigidity, such as stainless steel, so that it has enough rigidity to transmit load force.Load beam 206 is connected with substrate 208 through hinge element 207.The pilot hole 212 ' that is arranged on the load beam 204 is used to make load beam 206 and flexible element 205 alignment.One salient point 211 ' is formed on the load beam 206 and supports flexible element 205 with the position corresponding at the magnetic head center.Through cooperating of this salient point 211 ' and flexible element 205, load force is able to be delivered on the magnetic head equably.
Substrate 208 is used to increase the rigidity of whole cantilever part 290, and it can be processed such as stainless steel by the rigidity material.Substrate 208 1 ends form a mounting hole 213, cantilever part 290 are installed to the actuating arm of disc drive unit 100 through this mounting hole 213.
Hinge element 207 1 ends have a mounting hole 210, and its mounting hole 213 with substrate 208 is corresponding.Hinge element 207 parts are installed on the substrate 208, and mounting hole 210,213 is in alignment with each other.Hinge element 207 can be through laser bonding together with substrate 208, and pad is distributed in choice refreshments 209 places of hinge element 207.In addition, two pivot joint poles 216 are extended from the both sides of hinge element 207, so that hinge element 207 parts are installed on the load beam 206.
Like Fig. 2 and shown in Figure 3, flexible element 205 passes hinge element 207 and load beam 206.This flexible element 205 has anterior 211 and the afterbody 212 relative with this front portion 211.One cantilever tongue piece 213 is arranged to support the magnetic head 203 (with reference to Figure 10) on it in the front portion 211 of flexible element 205.A plurality of flexible circuits 220 are along the length direction of flexible element 205 and be provided with above that.Particularly, flexible circuit 220 extends to afterbody 212 from anterior 211.More specifically, flexible circuit 220 is equipped with some contacts (not indicating among the figure) in the position of flexible element 205 anterior 211, on cantilever tongue piece 213, to couple with magnetic head 203.And be provided with some contacts (not indicating among the figure) equally in the position of afterbody 212, flexible circuit 220 is connected to (figure does not show) on the flexible print cable.
Fig. 4 has showed the detailed structure of flexible element 205 and flexible circuit 220.As shown in the figure, this flexible element 205 has a stratiform structure, and it comprises the substrate layer of being processed by low conduction thin slice 251 and is formed on the dielectric layer 252 on the substrate layer 251.Should lowly conduct thin slice, can be flexible stainless steel (SST) thin slice.Particularly, the thickness of this substrate layer 251 preferably, is 15 μ m at 10 μ m to 20 μ m.In the present invention, dielectric layer 252 is processed like polyimide by the flexible media resin, and its thickness is 10 μ m to 20 μ m.On this dielectric layer 252, be formed with flexible circuit 220.Preferably, an overlayer 254 covers on the flexible layer 220, receives external force etc. to prevent it, and the thickness of this overlayer 254 is 5 μ m.
More specifically, be loyal to design of the present invention, this flexible circuit 220 has sandwich construction, and it comprises following circuit layer 221 and is formed on down the last circuit layer 223 on the circuit layer 221.Preferably, this sandwich construction comprises that also one is laminated to down the insulation course 222 between circuit layer 221 and the last circuit layer 223.This time circuit layer 221 includes staggered at least one positive printing circuit and at least one negative printing circuit with last circuit layer 223, and each positive printing circuit of last circuit layer 223 faces down each negative printing circuit of circuit layer 221.Preferably, each negative printing circuit of last circuit layer 223 faces down each positive printing circuit of circuit layer 221.
Because printing circuit is provided with sandwich construction; And the printing circuit of two circuit layers is up and down arranged with the mode of polarity, promptly; The positive printing circuit of each of last circuit layer 223 faces down each negative printing circuit of circuit layer 221; Therefore, capacitive coupling not only can take place between the positive and negative printing circuit on same circuit layer 221 or 223, and can between the positive and negative printing circuit of two circuit layers 223,221 up and down, take place.Therefore, because the coupling that strengthens makes the centrality of electric current reduce, Electric Field Distribution is more even.Simultaneously, reduce signal transmission attenuation, thereby reduce impedance, finally improve frequency bandwidth.
Please refer again to Fig. 4, it has showed preferred embodiment of the present invention.Particularly, this time circuit layer 221 comprises the negative printing circuit 2215 of the upright printing circuit 2214 and first below first time, and this first below printing circuit 2215 is formed at by the side of this first time upright printing circuit 2214.Should go up circuit layer 223 and comprise upright printing circuit 2237 on the negative printing circuit 2236 and first in first top, this on first upright printing circuit 2237 be formed at by the side of the negative printing circuit 2236 in first top.This first time upright printing circuit 2214 be negative printing circuit 2236 over against first top, the negative printing circuit 2215 in this first below upright printing circuit 2237 on said first.
Particularly, the positive and negative printing circuit 2214,2215 in this below has identical width with the positive and negative printing circuit 2237,2236 in top, and it all between 20 μ m to 100 μ m, is preferably 50 μ m.The wherein positive and negative printing circuit in top 2214, the spacing between 2215, or the positive and negative printing circuit in top 2237, the spacing between 2236 are preferably 10 μ m between 10 μ m to 20 μ m.The thickness of this time circuit layer 221 and last circuit layer 223 is preferably 12 μ m between 10 μ m to 20 μ m.And the thickness of insulation course 222 is between 10 μ m to 20 μ m.
In addition, circuit layer 223 also comprises at least one circuit 2231 and at least one negative circuit 2232 of reading just read on this, and this is just being read circuit 2231 and is reading by the side that circuit 2232 is formed at positive printing circuit and negative printing circuit with negative.Particularly, this is just reading circuit 2231 is 20 μ m to 100 μ m with the negative width range of reading circuit 2232, and their spacing range is 10 μ m to 20 μ m.Preferably, the spacing of the width of 25 μ m and 20 μ m is good.
Alternatively, a functional circuit 2233 can be formed on the insulation course 222, constitutes simultaneously to go up circuit layer 223.And a pair of heat circuit (figure does not show) can be arranged on this insulation course 222 equally.
It should be noted that this flexible circuit 220 is not provided with the above-mentioned sandwich construction of mentioning in the front portion 211 of flexible element 205 with afterbody 212 (being the two ends of flexible element 205).Please refer to Fig. 5-6, it has showed the structure of the flexible circuit 220 of front portion 211 and afterbody 212 respectively.As shown in Figure 5, it has a plurality of contacts 2111 and is connected with flexible circuit 220.The printing circuit of flexible circuit 220 has two, that is, and and an initial positive printing circuit and an initial negative printing circuit.Then, a furcation 261 is formed on the initial positive and negative printing circuit, and its purpose is initial positive printing circuit is branched into two or many positive printing circuits, and initial negative printing circuit is branched into two or many negative printing circuits.Be loyal to design of the present invention, this flexible circuit 220 is provided with a sandwich construction, promptly above mentioned circuit layer 223 and the following circuit layer 221 gone up.This is gone up circuit layer 223 and includes staggered at least one positive printing circuit and at least one negative printing circuit with following circuit layer 221, and each positive printing circuit of last circuit layer 223 faces down each negative printing circuit of circuit layer 221.Preferably, each negative printing circuit of last circuit layer 223 faces down each positive printing circuit of circuit layer 221.
As shown in Figure 6; The afterbody 212 of these flexible circuit 220 flexible elements 205 is provided with a fluidic junction 262; Its purpose is the positive printing circuit that separates is merged into the positive printing circuit of a termination, likewise, the negative printing circuit that separates is merged into the negative printing circuit of a termination.Be provided with some contacts 2121 at the terminal of flexible element 205, in order to be connected with flexible circuit 220.Because the bifurcated of flexible circuit 220 or the method for converging belong to traditional technical skill, therefore omit its detailed description at this.
Fig. 7 has showed that the present invention has another preferred embodiment of the flexible circuit of sandwich construction.The structure of the basic structure of this sandwich construction and above-mentioned first embodiment is roughly the same; Difference is; The following circuit layer 221 of sandwich construction also comprises the second time other upright printing circuit 2216 of side that is formed at the negative printing circuit 2215 in first below; Also comprise the other negative printing circuit 2238 in second top of side that is formed at upright printing circuit 2237 on first and go up circuit layer 223, this second time upright printing circuit 2216 is born printing circuit 2238 over against this top.
Based on this kind setting, capacitive coupling meeting produces between the printing circuit with opposite polarity of same circuit layer or different circuit layers.Fig. 8 has showed the capacitive coupling between the printing circuit.Circuit layer 223 is represented on the upper strata, and lower floor representes circuit layer 221 down, and the blocks of grey is represented positive printing circuit, and the blocks of white is then represented the negative line of writing.The arrow 239 of band both direction points to and produces capacitively coupled two objective bodies.This shows that because the capacitive coupling also can take place circuit layer up and down, therefore compare prior art, capacitive coupling of the present invention obviously strengthens.Therefore, the centrality of the electric current of generation reduces, and Electric Field Distribution is more even.Simultaneously, reduce signal transmission attenuation, thereby reduce impedance, finally improve frequency bandwidth.
Fig. 9 is a form, and it has showed two groups of experimental datas according to two embodiment gained of the present invention.Thus it is clear that, under the state of the material (shown in form 9a) of the thick dielectric layer of the thick insulation course of 15 μ m, 15 μ m and other parameters, can obtain the bandwidth of 6GHz-3dB and the impedance of 10Ohm.Preferably, under another group data (shown in form 9b), can obtain the bandwidth of 6GHz-3dB and the impedance of 10Ohm, but its practical requirement.
Please refer to Figure 10, the magnetic head 203 that one embodiment comprises cantilever part 290 and carry of HGA200 of the present invention by this cantilever part 290 at present.This cantilever part 290 comprises load beam 206, substrate 208, hinge element 207 and flexible element 205, and said elements all is assemblied in together.This hinge element 207 has mounting hole 210 so that hinge element 207 and substrate 208 are installed.Magnetic head 203 is then carried by flexible element 205.Known that by many magnetic head 203 is provided with the destination node that is connected with writing component and reading component (sensor), these destination nodes are connected with the contact of writing component and reading component.Writing component can be a standard induction type magnetic writing head, and reading component can be to have MR element, GMR element or the TMR element that height reads sensitivity.
Figure 11 is an embodiment of harddisk driving unit of the present invention.This disc drive unit 300 comprises HGA
200, the actuating arm 304 that links to each other with this HGA 200, a series of rotatable disk 301 and the Spindle Motor 301 that makes disk 301 rotations, above element all is assemblied in the shell 309.As stated, this HGA 200 comprises cantilever part 290 and the magnetic head 203 with flexible element 205.As stated, cantilever part 290 has above-mentioned same characteristic features, and can obtain identical effect.Because the structure and the assembling process of disc drive unit are known by persons skilled in the art, so omit detailed description about its structure and assembling at this.
Above disclosedly be merely preferred embodiment of the present invention, can not limit the present invention's interest field certainly with this, the equivalent variations of therefore doing according to claim of the present invention still belongs to the scope that the present invention is contained.

Claims (21)

1. cantilever part that is used for magnetic head fold piece combination comprises:
Flexible element, said flexible element have front portion and the afterbody relative with said front portion; And
A plurality of flexible circuits, said flexible circuit is formed on the said flexible element and from said front portion and extends to said afterbody; It is characterized in that:
Said flexible circuit has sandwich construction; Said sandwich construction comprises down circuit layer, go up circuit layer and layer is sandwiched in the insulation course between said circuit layer down and the last circuit layer; Said circuit layer down and last circuit layer include staggered at least one positive printing circuit and at least one negative printing circuit, and said each positive printing circuit of going up circuit layer is over against said each negative printing circuit of circuit layer down.
2. cantilever part as claimed in claim 1; It is characterized in that: said circuit layer down comprises the negative printing circuit of the upright printing circuit and first below first time; Said first below is negative to be write by the linear side that is formed in said first time upright printing circuit; The said circuit layer of going up comprises upright printing circuit on the negative printing circuit and first in first top; Upright printing circuit is formed at by the side of the negative printing circuit in said first top on said first, and said first time upright printing circuit be negative printing circuit over against said first top, the negative printing circuit in said first below upright printing circuit on said first.
3. cantilever part as claimed in claim 2; It is characterized in that: said circuit layer down also comprises the second time other upright printing circuit of side that is formed at the negative printing circuit in said first below; The said circuit layer of going up also comprises the other negative printing circuit in second top of side that is formed at upright printing circuit on said first, and said second time upright printing circuit be negative printing circuit over against said second top.
4. cantilever part as claimed in claim 1 is characterized in that: the thickness range of said insulation course is 10 μ m to 20 μ m.
5. cantilever part as claimed in claim 1 is characterized in that: said flexible element has layer structure, and layered structure comprises substrate layer and is formed at the dielectric layer on the said substrate layer.
6. cantilever part as claimed in claim 5 is characterized in that: the thickness range of said dielectric layer is 10 μ m to 20 μ m.
7. cantilever part as claimed in claim 5 is characterized in that: the sandwich construction of said flexible circuit is formed on the said dielectric layer.
8. cantilever part as claimed in claim 1 is characterized in that: the said circuit layer of going up also comprises at least one circuit and at least one negative circuit of reading just read, and is saidly just reading circuit and said negative reading by the side that circuit is formed at said positive printing circuit and said negative printing circuit.
9. cantilever part as claimed in claim 1 is characterized in that: the width range of said positive printing circuit and said negative printing circuit is 20 μ m to 100 μ m.
10. cantilever part as claimed in claim 1 is characterized in that: in same circuit layer, the spacing range between said positive printing circuit and the said negative printing circuit is 10 μ m to 20 μ m.
11. a magnetic head fold piece combination comprises:
Magnetic head; And
Be used to support the cantilever part of said magnetic head;
Said cantilever part comprises:
Flexible element, said flexible element have front portion and the afterbody relative with said front portion; And
A plurality of flexible circuits, said flexible circuit is formed on the said flexible element and from said front portion and extends to said afterbody; It is characterized in that:
Said flexible circuit has sandwich construction; Said sandwich construction comprises down circuit layer, go up circuit layer and layer is sandwiched in the insulation course between said circuit layer down and the last circuit layer; Said circuit layer down and last circuit layer include staggered at least one positive printing circuit and at least one negative printing circuit, and said each positive printing circuit of going up circuit layer is over against said each negative printing circuit of circuit layer down.
12. magnetic head fold piece combination as claimed in claim 11; It is characterized in that: said circuit layer down comprises the negative printing circuit of the upright printing circuit and first below first time; Said first below is negative to be write by the linear side that is formed in said first time upright printing circuit; The said circuit layer of going up comprises upright printing circuit on the negative printing circuit and first in first top; Upright printing circuit is formed at by the side of the negative printing circuit in said first top on said first, and said first time upright printing circuit be negative printing circuit over against said first top, the negative printing circuit in said first below upright printing circuit on said first.
13. magnetic head fold piece combination as claimed in claim 12; It is characterized in that: said circuit layer down also comprises the second time other upright printing circuit of side that is formed at the negative printing circuit in said first below; The said circuit layer of going up also comprises the other negative printing circuit in second top of side that is formed at upright printing circuit on said first, and said second time upright printing circuit be negative printing circuit over against said second top.
14. magnetic head fold piece combination as claimed in claim 11 is characterized in that: the thickness range of said insulation course is 10 μ m to 20 μ m.
15. magnetic head fold piece combination as claimed in claim 11 is characterized in that: said flexible element has layer structure, and layered structure comprises substrate layer and is formed at the dielectric layer on the said substrate layer.
16. magnetic head fold piece combination as claimed in claim 15 is characterized in that: the thickness range of said dielectric layer is 10 μ m to 20 μ m.
17. magnetic head fold piece combination as claimed in claim 15 is characterized in that: the sandwich construction of said flexible circuit is formed on the said dielectric layer.
18. magnetic head fold piece combination as claimed in claim 11; It is characterized in that: the said circuit layer of going up also comprises at least one circuit and at least one negative circuit of reading just read, and is saidly just reading circuit and said negative reading by the side that circuit is formed at said positive printing circuit and said negative printing circuit.
19. magnetic head fold piece combination as claimed in claim 11 is characterized in that: the width range of said positive printing circuit and said negative printing circuit is 20 μ m to 100 μ m.
20. magnetic head fold piece combination as claimed in claim 11 is characterized in that: in same circuit layer, the spacing range between said positive printing circuit and the said negative printing circuit is 10 μ m to 20 μ m.
21. a disc drive unit comprises:
Have magnetic head and support the magnetic head fold piece combination of the cantilever part of said magnetic head;
The actuating arm that is connected with said magnetic head fold piece combination;
A series of disks; And
Be used to rotate the Spindle Motor of said disk;
Wherein, said cantilever part comprises:
Flexible element, said flexible element have front portion and the afterbody relative with said front portion; And
A plurality of flexible circuits, said flexible circuit is formed on the said flexible element and from said front portion and extends to said afterbody; It is characterized in that:
Said flexible circuit has sandwich construction; Said sandwich construction comprises down circuit layer, go up circuit layer and layer is sandwiched in the insulation course between said circuit layer down and the last circuit layer; Said circuit layer down and last circuit layer include staggered at least one positive printing circuit and at least one negative printing circuit, and said each positive printing circuit of going up circuit layer is over against said each negative printing circuit of circuit layer down.
CN2010102543324A 2010-08-04 2010-08-04 Cantilever part, head gimbal assembly and disc driving unit Pending CN102376311A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010102543324A CN102376311A (en) 2010-08-04 2010-08-04 Cantilever part, head gimbal assembly and disc driving unit

Publications (1)

Publication Number Publication Date
CN102376311A true CN102376311A (en) 2012-03-14

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103474084A (en) * 2012-06-08 2013-12-25 新科实业有限公司 Cantilever part, magnetic head folding sheet combination and disk driving unit
CN109360586A (en) * 2015-09-10 2019-02-19 日本发条株式会社 A kind of method of disc driver cantilever flexible element and the galvanic circle part for manufacturing the flexible element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1178985A (en) * 1996-10-03 1998-04-15 昆腾公司 Suspension with multi-layered integrated conductor trace array for optimized electrical parameters
JP2008165880A (en) * 2006-12-27 2008-07-17 Toshiba Corp Head actuator assembly and disk apparatus equipped with the same
CN101483045A (en) * 2008-01-07 2009-07-15 日东电工株式会社 Wired circuit board
CN101630671A (en) * 2008-07-14 2010-01-20 日立环球储存科技荷兰有限公司 Integrated lead suspension

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1178985A (en) * 1996-10-03 1998-04-15 昆腾公司 Suspension with multi-layered integrated conductor trace array for optimized electrical parameters
JP2008165880A (en) * 2006-12-27 2008-07-17 Toshiba Corp Head actuator assembly and disk apparatus equipped with the same
CN101483045A (en) * 2008-01-07 2009-07-15 日东电工株式会社 Wired circuit board
CN101630671A (en) * 2008-07-14 2010-01-20 日立环球储存科技荷兰有限公司 Integrated lead suspension

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103474084A (en) * 2012-06-08 2013-12-25 新科实业有限公司 Cantilever part, magnetic head folding sheet combination and disk driving unit
CN103474084B (en) * 2012-06-08 2018-06-05 新科实业有限公司 Cantilever part, magnetic head fold piece combination and disc drive unit
CN109360586A (en) * 2015-09-10 2019-02-19 日本发条株式会社 A kind of method of disc driver cantilever flexible element and the galvanic circle part for manufacturing the flexible element
CN109360586B (en) * 2015-09-10 2020-01-14 日本发条株式会社 Disk drive suspension flexure and method of making a conductive loop portion of the flexure

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Application publication date: 20120314