CN102371431B - Laser processing device - Google Patents
Laser processing device Download PDFInfo
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- CN102371431B CN102371431B CN201010256139.4A CN201010256139A CN102371431B CN 102371431 B CN102371431 B CN 102371431B CN 201010256139 A CN201010256139 A CN 201010256139A CN 102371431 B CN102371431 B CN 102371431B
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- laser
- frequency signal
- processing device
- laser beam
- template
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Abstract
The invention relates to a laser processing device which comprises a chip, a laser device, an acousto-optic modulation device and a focusing device. Different from a known laser processing device, a customized laser processing device provided by the invention is characterized in that the acousto-optic modulation device is used for respectively receiving a second frequency signal generated by the chip and a laser beam emitted by the laser device, adjusting the laser beam according to the second frequency signal and outputting an adjusted laser beam. Then, the focusing device is used for receiving and focusing the adjusted laser beam, outputting a focused laser beam to a formwork, and repeatedly dotting the formwork, thereby forming a dotted pattern on the surface of the formwork.
Description
Technical field
The present invention relates to a kind of laser processing device, particularly relate to a kind of surface for a template for the outward appearance of stipple pattern, the radius that are formed and a kind of customization laser processing device of proposition consistent with the specification of the degree of depth.
Background technology
Generally speaking, backlight module (Back light module) can distinguish side-light type and straight-down negative according to the scale of size.Be below the introduction of this two profiles formula:
Side-light type (Edge lighting) structure: light emitting source is the light inlet mode of monolateral or bilateral side, as shown in Figure 1.Light guide plate 1 adopts and cuts or shapingly to design without printing-type, the backlight module of general length less than 20 inches, its side incident light source designs, having the characteristic of light weight, slim, narrow frame, is also the mainstay framework of mobile phone, personal digital assistant, mobile computer and desktop PC monitor backlight module.
Straight-down negative (Bottom lighting) structure: the backlight module of oversize, side-light type structure cannot take advantage in weight, electric power and brightness, and the straight-down negative structure immediately below not therefore being positioned over containing light guide plate and light source is just developed.Light source upwards penetrates in front by from spontaneous luminous (such as fluorescent tube, luminescence two and body etc.) after diffuser plate is dispersed, because accommodation space becomes large, fluorescent tube can use according to TFT panel size organize fluorescent tube more, but this kind of framework too increases the thickness of module, weight and power consumption etc. simultaneously.
From the above, with regard to using side-light type structure as the ray structure of backlight module, light guide plate is one of significant components affecting luminous efficiency.The widely used processing procedure of current industry has two kinds, a kind of processing procedure adopts ejection formation by PMMA plastic pellet shaping output of matched moulds after high-temperature molten glue, another kind is then after cutting flat-plate compressed gram force, utilizes screen printing mode by tool high reflectance and the material (S of low suction optical activity
io
2aMP.AMp.Amp T
io
2) coat bottom acrylic plate and form site.It is below the table of comparisons 1 of above-mentioned two kinds of different processing procedures.
Table 1
Wherein symbol O represents good, and symbol Δ represents Shang Ke, and it is poor that symbol X represents.
But unfortunately, when backlight module according to size scale adopt side-light type (Edge lighting) no matter structure and adopt printing-type light guide plate or non-printing formula light guide plate time: when using light emitting diode as light emitting source, the luminescence due to light emitting diode has certain diffusion angle to make backlight module easily occur the problem that light and shade is uneven.Wherein with in light emitting diode diffusion angle the closer to LED source place brighter and between two light emitting diodes and edge be more secretly the most obvious.
Existing technical solution strategy is, strategy one, deal with for light source, optical lens (Cup & Lens) is utilized to expand the lighting angle of light emitting diode to disperse rising angle, using many light emitting diodes to line up row allows lumination of light emitting diode overlap, make light source as large-scale liquid crystal display adopt cold-cathode tube (CCFL) in line source, or use many light emitting diodes to be arranged in each corner of backlight module, disperse luminosity in multi-angle light source mode and reduce edge blanking bar, but these methods can cause cost to increase, or strategy two, change is done some to destroy light total reflection and to allow light that surface can be penetrated on the surface of light guide plate.So add diffusion site bottom light guide plate, and be distributed in bottom surface with different densities, wherein spread site to manufacture by the mode such as Ink Application or chemical etching, because the luminous intensity near light source place is stronger, so in design near the bottom surface diffuser screen dot density of light source is lower and area is less, the design away from light source place is then contrary.And have in addition and for diffusion site arrangement mode be: being designed to these diffusion sites centered by light emitting diode in concentric arrays or carefully drawing longitudinal direction and the lateral density of method dispersion conventional mesh formula site with segmentation, the distribution according to light emitting diode light energy sets different densities with the brightness adjusted near light source place and the phenomenon compensating edge luminosity deficiency.
Not not goodly, when panel increased in size (large scales for more than 37 inches), also represent used light guide plate size and also increase thereupon, this measure, the technical tactic of the diffusion site formed in the bottom of light guide plate can be caused to lose efficacy.
Therefore, technical conceive of the present invention is propose a kind of customization laser processing device based on large-sized panel and on the surface of this light guide plate for the unified specification of the outward appearance of the stipple pattern of formation, radius and the degree of depth.
Summary of the invention
An object of the present invention is to provide a kind of laser processing device, for as a template of large-size light-conducting plate is repeatedly got ready via laser beam the surface of this template formed stipple pattern process in, desirably, the outward appearance of each site, radius are consistent with the specification of the degree of depth.
Therefore, according to above-mentioned object, the invention provides a kind of laser processing device, it comprises:
One chip, uses the PWM program being burned onto this chip carry out PWM to a first frequency signal and produce a second frequency signal;
One laser aid, receives this first frequency signal and launches a laser beam;
One acousto-optical modulating device, receives this second frequency signal and this laser beam respectively and exports an adjusted laser beam according to this second frequency signal to this laser beam adjustment; And
One focusing arrangement, receives this adjusted laser beam and carries out focusing on and exported to by a laser focusing bundle and a template is repeatedly got ready the surface of this template and forms multiple site.
Accompanying drawing explanation
Fig. 1 is the surface structure schematic diagram that backlight module adopts traditional side-light type;
Fig. 2 is the constructional appearance schematic diagram of laser processing device of the present invention;
Fig. 3 is the oscillogram of multiple frequency signals of Ying Yu laser processing device of the present invention;
Fig. 4 (a) and Fig. 4 (b) is when adopting the backlight module of one-sided or bilateral incident type, as light guide plate the schematic appearance of this template (large scales for more than 37 inches);
To be the size (also referring to the outward appearance of each site, radius and the degree of depth) of each site be Fig. 5 according to having intercepted the range wide of this laser beam of predetermined segment and controlled schematic diagram.
Detailed description of the invention
For solve previously known on scarce plain, an object of the present invention is to provide a kind of laser processing device, its object is to for as large-size light-conducting plate the surface of a template repeatedly to get ready via the laser beam that this laser processing device is launched and on the surface of this template in the process forming stipple pattern, desirably, the outward appearance of each site, radius are consistent with the specification of the degree of depth.And this template is with made by PMMA material.
As shown in Figure 2, this figure is the constructional appearance schematic diagram of laser processing device of the present invention.Can clearly represent, this laser processing device 2 comprises PWM burning program to chip 21, laser aid 22, acousto-optical modulating device 23 and a focusing arrangement 24.
And be the known ground of people, as this chip 21 and be included in this laser aid 22 multiple electronic building bricks (electronics) also must by a frequency generator (clock generator) (not shown) produce with a frequency signal (frequency signal) of a such as frequency signal (clock signal) this type as the signal triggering aforementioned electronic assembly.
By this frequency generator (clock generator) produce in a continuity high state (high state, represent with binary one in the drawings) and low state (low state, represent with Binary Zero in the drawings) first frequency signal freq1 (frequency 10kHz, pulsewidth 10us) be input to this laser aid 22 respectively (with pulsed CO
2laser is the pulse type laser, continous way laser etc. of embodiment) and this chip 21 in, so far, this pulsed CO
2according to being triggered in this first frequency signal freq1 of high state, emission wavelength is a laser beam L1 (energy is about 20W) of 9.2um to 10.6um to laser 22.Synchronously, a reference signal is then considered as receiving this chip 21 of this first frequency signal freq1 that this frequency generator produces, at the same time, by a computer, this chip 21 receives informs that this chip 21 of switching carries out opening or closing an external command command (time that wherein, opens or closes is for artificial predetermined) of temporal information.Need understand ground, as Fig. 3, this figure is the oscillogram of the multiple frequency signals being applied to laser processing device 22 of the present invention.Wherein, A1 is expressed as the periodic waveform of first frequency signal freq1, A2 is expressed as the waveform that this first frequency signal feq1 is the pulsewidth of high state, and A3 is expressed as and makes the predetermined time number of seconds of closing of this chip 21 1, and A4 is expressed as and makes the predetermined time number of seconds opened of this chip 21 1.Be burned onto this PWM program in this chip 21 according to this first frequency signal freq1 be in positive edge trigger (positive-edge-triggered) just start according to switch this chip 21 and carry out opening or closing this external command command related of temporal information and produce a second frequency signal freq2, wherein the pulsewidth of this second frequency signal freq2 can be not equal to and (is namely greater than, be less than, equal) pulsewidth (with frequency 10kHz, pulsewidth represents the periodic waveform of this second frequency signal freq2) of this first frequency signal freq1.
Be illustrated as in more detail, when to be in this first frequency signal freq1 be the waveform of the pulsewidth of high state to A2, this PWM program in this chip 21 of being burned onto allows this chip 21 be in the state of pass until after a predetermined A3 section time number of seconds terminates according to this external command sent by this computer, this PWM program of this chip 21 again according to by this computer send state that this external command allows this chip 21 be in out until a predetermined A4 section time number of seconds.In other words, by this chip 21 this second frequency signal freq2 produced in a continuity high state A4 and low state A3 be displayed on Fig. 3.
Then, refer to Fig. 2, two receiving terminals of this acousto-optical modulating device 23 to receive respectively by this chip 21 produce this second frequency signal freq2 and this pulsed CO
2this laser beam L1 that laser 22 is launched, now, this acousto-optical modulating device 23 can carry out energy adjusting to export an adjusted laser beam L2 according to the pulsewidth of current this second frequency signal freq2 to this laser beam L1.In other words, this acousto-optical modulating device 23 according to this chip 21 produce this second frequency signal freq2 pulsewidth to intercept the predetermined segment from this laser beam L1 of this laser aid 22.Explain for: when the pulsewidth of this second frequency signal freq2 is wider, intercept wider from this predetermined segment of this laser beam L1 of this laser aid 22, from this acousto-optical modulating device 23 export the energy that this adjusted laser beam L2 accumulates then can be larger, vice versa.
This adjusted laser beam L2 launched from this acousto-optical modulating device 23 can be output to the focusing arrangement 24 (wherein, this focusing arrangement 24 be embedded in a mobile platform S and this mobile platform S carries out a horizontal direction processing to this template M) comprising the speculum 241 (noting: the incidence angle of this speculum 241 is greater than zero degree) for light reflection and the focus lamp 242 for light focusing.Now, this adjusted laser beam L2 exported from this acousto-optical modulating device 23 changes opticpath through this speculum 241 and is reflected, and makes the some O that this adjusted laser beam L2 being parallel to optical axis is collected on the optical axis of this focus lamp 242 through this focus lamp 242.At the same time, one laser focusing bundle L3 to export on the surface of this template M to the focal spot O of this focusing arrangement 24 of this mobile platform S and gets ready with the surface of horizontal direction from left to right or from right to left to this template M by self-embedding, and from the focal spot O of this focusing arrangement 24 after to export this laser focusing bundle L3 be get ready the surface of this template M along a horizontal direction movement, this template M moves along a vertical direction again, make the focal spot O of this focusing arrangement 24 export this laser focusing bundle L3 and just can continue to get ready to the surface of this template M along another horizontal direction movement, and form surface that multiple site makes this template M on the surface of this template M all in a stipple pattern.
Finally, as shown in Fig. 4 (a) and Fig. 4 (b), this figure is when adopting the backlight module of one-sided or bilateral incident type, as light guide plate the schematic appearance of this template (large scales for more than 37 inches).Wherein, due to the outward appearance of each site of being formed on the surface of this template, radius and the consistent advantage of the degree of depth, bottom the incident light guide plate made with PMMA of incident ray, site action breaks down light total reflection effect causes internal communication, during each site making the light sent from LED BAR or CCFL pass through this template surface, light can be dispersed equably and then go into area source, makes light guide plate integral brightness arrive preferably all homogeneous.
Inevitably, from the focal spot O of this focusing arrangement 24 export this laser focusing bundle L3 and get ready on the surface of this template M, and to form the outward appearance of each site, radius and the degree of depth be foundation from this chip 21 produces this second frequency signal freq2 and be the pulsewidth of high state and determined in the surface institute of this template M.
As shown in Figure 5, this figure is that the size of each site (also refers to the outward appearance of each site, radius and the degree of depth) be range wide according to this laser beam having intercepted predetermined segment and controlled schematic diagram, ground can be spreaded to, when this second frequency signal produced from this chip be high state pulsewidth wider time, represent from this acousto-optical modulating device export the energy that this adjusted laser beam accumulates then can be larger, make from the focal spot of this focusing arrangement to export the energy of this laser focusing bundle accumulation also thereupon larger, repeatedly getting to the surface of this template the size forming each site ready then can be larger, vice versa.Wherein, in Figure 5, when the pulsewidth of this second frequency signal freq2 is range wide (a) state of this laser beam having intercepted predetermined segment, the outward appearance of each site B2, radius and Depth display reduced size.When the pulsewidth of this second frequency signal freq2 is range wide (b) state of this laser beam having intercepted predetermined segment, the outward appearance of each site B3, radius and Depth display large-size.When the pulsewidth of this second frequency signal freq2 is range wide (c) state of this laser beam having intercepted predetermined segment, the outward appearance of each site B3, radius and Depth display are between B2 and B4 size.Knownly, the outward appearance of each site B1, radius and depth dimensions are according to not intercepting the range wide of this laser beam and being formed (outward appearance of each site can be similar to ellipse).
When from this pulsed CO
2when laser emission wavelength is this laser beam (energy is about 20W) of 9.2um to 10.6um, can verify ground, the radius of each site that the surface of this template is formed is 25um to 125um.
Conclusion: the size that technical advantage of the present invention is: each site that the surface of this template is formed is adjusted according to the range wide of this laser beam having intercepted predetermined segment, with the brightness adjusted near light source place and the phenomenon compensating edge luminosity deficiency, and then the light guide plate that design outgoing light homogeneity is splendid.
Moreover, laser processing device proposed by the invention is preferably interpreted as customization: when panel increased in size (large scales for more than 37 inches), also represent used light guide plate size when also increasing thereupon, only needing to adjust this second frequency signal institute that this chip produces is high state pulsewidth, then forming each site this template surperficial then can be larger.No matter be that existing printing-type light guide plate or non-printing formula light guide plate all cannot reach this effect.
The above embodiment is only illustrate for convenience of description, and unrestricted the present invention.Therefore the personnel being familiar with this skill, without prejudice to spirit of the present invention, modify for above-described embodiment, change, so neither de-if attached claim institute is for Protector.
Claims (8)
1. a laser processing device, comprises a laser aid, and receive a first frequency signal and launch a laser beam, it is characterized in that, this laser processing device more comprises:
One chip, uses the PWM program being burned onto this chip carry out PWM to this first frequency signal and produce a second frequency signal;
One acousto-optical modulating device, receives this second frequency signal and this laser beam respectively and exports an adjusted laser beam according to this second frequency signal to this laser beam adjustment; And
One focusing arrangement, receives this adjusted laser beam and carries out focusing on and exported to by a laser focusing bundle and a template is repeatedly got ready the surface of this template and forms multiple site,
Wherein this acousto-optical modulating device according to this chip produce this second frequency signal to intercept from a predetermined segment of this laser beam of this laser aid, the outward appearance of each site, radius and the degree of depth are adjusted according to the range wide of this laser beam having intercepted predetermined segment.
2. laser processing device as claimed in claim 1, wherein this laser aid is a pulsed CO
2laser, and the wavelength of this laser beam is 9.2um to 10.6um.
3. laser processing device as claimed in claim 1, wherein this focusing arrangement comprises a speculum and a focus lamp.
4. laser processing device as claimed in claim 1, wherein this laser focusing bundle is after getting ready this template along a horizontal direction movement, this template moves along a vertical direction again, makes this laser focusing bundle be continue to get ready to this template along another horizontal direction movement.
5. laser processing device as claimed in claim 1, wherein this template is PMMA.
6. laser processing device as claimed in claim 1, wherein the radius of each site is 25um to 125um.
7. laser processing device as claimed in claim 1, wherein this chip receives an external command to modify to this PWM program, use this acousto-optical modulating device of adjustment intercept another predetermined segment of this laser beam from this laser aid.
8. laser processing device as claimed in claim 1, wherein the pulsewidth of this second frequency signal is not equal to the pulsewidth of this first frequency signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010256139.4A CN102371431B (en) | 2010-08-13 | 2010-08-13 | Laser processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010256139.4A CN102371431B (en) | 2010-08-13 | 2010-08-13 | Laser processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102371431A CN102371431A (en) | 2012-03-14 |
| CN102371431B true CN102371431B (en) | 2015-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010256139.4A Expired - Fee Related CN102371431B (en) | 2010-08-13 | 2010-08-13 | Laser processing device |
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| CN (1) | CN102371431B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017042357A1 (en) * | 2015-09-09 | 2017-03-16 | Sei S.P.A. | Laser machining apparatus and method for forming a pattern comprising a plurality of marks on a workpiece |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103894734A (en) * | 2012-12-31 | 2014-07-02 | 上海微电子装备有限公司 | Laser annealing device and operation method of laser annealing device |
| CN104347368A (en) * | 2013-07-26 | 2015-02-11 | 上海微电子装备有限公司 | Laser annealing device for multiple lasers and method thereof |
| CN104332809B (en) * | 2014-08-25 | 2015-08-26 | 深圳市创鑫激光股份有限公司 | Based on the adjustable pulse width pulse optical fiber of acoustooptic switch |
| CN109532243B (en) * | 2018-09-27 | 2020-07-24 | 合肥泰沃达智能装备有限公司 | High-speed light guide plate laser printer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1309826A (en) * | 1998-06-12 | 2001-08-22 | 通用扫描公司 | Pulse control in laser systems |
| CN101116928A (en) * | 2006-08-04 | 2008-02-06 | 株式会社迪思科 | Laser beam irradiation apparatus and laser working machine |
| CN101461105A (en) * | 2006-05-31 | 2009-06-17 | 彩覇阳光株式会社 | Laser pulse generating divice and method, and laser working apparatus and method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050087522A1 (en) * | 2003-10-24 | 2005-04-28 | Yunlong Sun | Laser processing of a locally heated target material |
| JP4795886B2 (en) * | 2006-07-27 | 2011-10-19 | 株式会社キーエンス | Laser processing device, laser processing condition setting device, laser processing condition setting method, laser processing condition setting program |
| JP2008207210A (en) * | 2007-02-26 | 2008-09-11 | Disco Abrasive Syst Ltd | Laser beam radiating apparatus, and laser beam machine |
-
2010
- 2010-08-13 CN CN201010256139.4A patent/CN102371431B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1309826A (en) * | 1998-06-12 | 2001-08-22 | 通用扫描公司 | Pulse control in laser systems |
| CN101461105A (en) * | 2006-05-31 | 2009-06-17 | 彩覇阳光株式会社 | Laser pulse generating divice and method, and laser working apparatus and method |
| CN101116928A (en) * | 2006-08-04 | 2008-02-06 | 株式会社迪思科 | Laser beam irradiation apparatus and laser working machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017042357A1 (en) * | 2015-09-09 | 2017-03-16 | Sei S.P.A. | Laser machining apparatus and method for forming a pattern comprising a plurality of marks on a workpiece |
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| CN102371431A (en) | 2012-03-14 |
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