CN102353028A - Upper heat dissipation seat of integrated high-frequency electrodeless lamp and integrated high-frequency electrodeless lamp - Google Patents

Upper heat dissipation seat of integrated high-frequency electrodeless lamp and integrated high-frequency electrodeless lamp Download PDF

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Publication number
CN102353028A
CN102353028A CN 201110278321 CN201110278321A CN102353028A CN 102353028 A CN102353028 A CN 102353028A CN 201110278321 CN201110278321 CN 201110278321 CN 201110278321 A CN201110278321 A CN 201110278321A CN 102353028 A CN102353028 A CN 102353028A
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Prior art keywords
heat sink
heat dissipation
body
dissipation seat
groove
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CN 201110278321
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Chinese (zh)
Inventor
丁春辉
李伟新
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丁春辉
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Abstract

The invention discloses an upper heat dissipation seat of an integrated high-frequency electrodeless lamp and the integrated high-frequency electrodeless lamp. The upper heat dissipation seat comprises a heat dissipation seat body, the heat dissipation seat body is a hollow cylindrical heat dissipation seat body made of metallic aluminum, the heat dissipation seat body is provided with a vertically communicated mounting screw hole, the inner wall of the heat dissipation seat body is provided with a field effect tube holding groove, the field effect tube holding groove is designed to form a whole with the heat dissipation seat body, and an internal and external communicated field effect tube mounting hole is formed in the field effect tube holding groove. The upper heat dissipation seat of the integrated high-frequency electrodeless lamp is arranged in an upper shell of the integrated high-frequency electrodeless lamp, and a field effect tube in a circuit module of the integrated high-frequency electrodeless lamp is arranged in the field effect tube holding groove, so that the heat of the field effect tube can be quickly transferred to the upper heat dissipation seat; and the upper heat dissipation seat is made of aluminum metal, and the upper heat dissipation seat is provided with internal and external heat dissipation grooves, so that the heat can be effectively dissipated.

Description

一体化高频无极灯上散热座及其一体化高频无极灯 Integration frequency electrodeless lamp cooling the lamp holder and integrated tuner

技术领域 FIELD

[0001 ] 本发明涉及了一种一体化高频无极灯的散热座结构。 [0001] The present invention relates to an integrated high-frequency electrodeless lamp heat sink structure.

[0002] 本发明同时还涉及了具有该上散热座结构的一体化高频无极灯。 [0002] The present invention also relates to a lamp having a heat sink integrated tuner on the base structure.

背景技术 Background technique

[0003] 高频无极灯具有高亮度、低能耗、弱光衰等特点,受到广大使用者的欢迎,目前市面上出现有一体化高频无极灯(如中国专利名称为一种一体化高频无极灯,其公开号为CN101635M7),一体化高频无极灯不仅可应用于路灯照明、厂灯照明等工业性照明,而且也可以应用于家庭照明,但是因为高频无极灯在工作过程中会产生大量的热量,若不能有效地散热问题,将严重影响高频无极灯使用寿命,将极大地制约了高频无极灯的推广及应用。 [0003] High frequency induction lamps have high brightness, low-power, low-light failure and other characteristics, welcomed by the majority of users, have appeared on the market at present integrated high frequency induction lamp (such as Chinese patent name for an integrated high frequency lamp, published as CN101635M7), the integration of high-frequency induction lamp not only can be used in street lighting, factory lighting and other industrial lighting, but can also be used in home lighting, but because of the high frequency induction lamp will be in the work process generate a lot of heat, if not effectively heat problem, it will seriously affect Induction lamp life will be greatly restricted the high-frequency induction lamp promotion and application.

发明内容 SUMMARY

[0004] 本发明要解决的技术问题是为了克服上面所述的技术缺陷,提供一种一体化高频无极灯上散热座及其一体化高频无极灯。 [0004] The present invention is to solve the technical problem to overcome the technical drawbacks described above, there is provided a lamp holder and heat sink integrated tuner of an integrated high frequency electrodeless discharge lamp.

[0005] 为了解决上面所述的技术问题,本发明采取以下技术方案。 [0005] In order to solve the above technical problem, the present invention takes the following technical solutions.

[0006] 提供一种一体化高频无极灯上散热座,包括有散热座本体,所述的散热座本体为由金属铝制成的中空的圆柱型散热座本体,所述散热座本体上开设有上下贯通的安装螺孔,所述散热座本体的内壁设有场效应管安置槽,所述的场效应管安置槽与散热座本体设计为一体,所述的场效应管安置槽内开设有内外贯通的场效应管安装孔。 [0006] provide an integrated high-frequency electrodeless lamp heat sink, the heat sink comprises a body, the body of the heat sink is a metal aluminum heat sink hollow cylindrical body, said body defines a heat sink a mounting screw hole vertically penetrating the inner wall of the heat sink body is provided with grooves disposed FET, the FET and the heat dissipation block body groove disposed integrally designed, the FET defines a groove disposed FET mounting hole penetrating the inner and outer.

[0007] 所述的散热座本体的外壁周边开设有规则排列的外散热槽。 [0007] The outer wall of the peripheral body of said heat sink defines a regular array of outer cooling slot. 所述的外散热槽的槽深为1〜3mm。 The groove depth of the outer heat sinks 1~3mm. 所述的散热座本体的内壁周边开设有规则排列的内散热槽。 An inner wall surrounding said heat sink body defines grooves regularly arranged within a heat sink. 所述的内散热槽的槽深为1〜3mm。 The grooves in the heat sinks deeply 1~3mm.

[0008] 本发明还提供了一种一体化高频无极灯,包括有上部外壳,所述的上部外壳内安置有如上所述的上散热座。 [0008] The present invention further provides an integrated high-frequency electrodeless lamp, comprising an upper housing, there is disposed on the heat sink as described above within the upper housing. 所述的上部外壳内部具有与上散热座的安装螺孔相配合的螺丝安装槽,上散热座与上部外壳通过螺丝穿过安装螺孔固定安装在螺丝安装槽中。 Said inner housing having upper and the mounting holes on the heat sink screws cooperating groove on the heat sink and the upper casing by screws through the screw mounting holes in the mounting groove is fixedly mounted.

[0009] 本发明提供的一体化高频无极灯上散热座,将其安装在一体化高频无极灯的上外壳中,一体化高频无极灯电路模块中的场效应管安装于场效应管安置槽中,使得场效应管的热量能够迅速地传至上散热座,而上散热座由铝金属制成,且在上散热座上开设有内、外散热槽,可以有效地进行散热。 [0009] Integration of the heat sink on the high frequency electrodeless discharge lamp of the present invention is provided, which is mounted on the housing of the integrated high-frequency electrodeless lamp, electrodeless lamp the high-frequency integrated circuit module is attached to the FET FET seating grooves, so that the heat of the FET can be rapidly transferred to the heat sink, and the heat sink is made of aluminum, and defines inner and outer grooves on the heat radiating base, heat can be efficiently performed.

[0010] 本发明提供的具有上散热座的一体化高频无极灯的优点如下: [0010] The advantage of having an integrated high-frequency electrodeless lamp base on the heat sink of the present invention are as follows:

[0011] 1、上散热座直接与外面的空气相接触,使得空气对流更有利于散热。 [0011] 1, the heat sink in direct contact with the outside air, so that air convection is more conducive to heat.

[0012] 2、场效应管直接与上散热座的内壁上的场效应管安置槽相接,有利于场效应管的散热。 [0012] 2, FET FET disposed in contact directly with the grooves on the inner wall of the heat sink, heat FET conducive.

[0013] 3、上散热座内、外壁上开设有多个散热槽,且对槽深限制在l_3mm之间,极大地保证了总体的散热面积,使场效应管产生的热量更快地散发。 [0013] 3, the upper heat sink, cooling the outer wall defines a plurality of grooves, and the depth of the groove is limited to between l_3mm, greatly ensure the overall heat dissipation area, so that the heat generated by the FET quickly dissipated. 附图说明 BRIEF DESCRIPTION

[0014] 图1为一体化高频无极灯上散热座的结构示意图。 [0014] FIG. 1 is a schematic diagram of a high frequency integrated heat sink of the lamp structure Promise.

[0015] 图2为一体化高频无极灯的外形结构示意图。 [0015] FIG. 2 is a schematic outline of the lamp a high-frequency integrated structure.

[0016] 图中,1.散热座本体、2.场效应管安置槽、3.安装螺孔、4.场效应管安装孔、5.外散热槽、6.内散热槽、11.灯泡、21.下部外壳、22.中部隔热座、23.上部外壳。 [0016] FIG, 1. Dissipation seat body 2. FET disposed groove 3. Installing screw holes 4. FET mounting hole 5 outer radiating grooves 6 inner heat sinks, 11 bulb, 21. The lower housing 22. central insulation seat 23 of the upper housing.

具体实施方式 detailed description

[0017] 请参阅图1,如图所示,一体化高频无极灯上散热座包括有散热座本体1,散热座本体1为由金属铝制成的中空的圆柱型散热座本体,散热座本体1上开设有上下贯通的安装螺孔3,散热座本体1的内壁设有场效应管安置槽2,场效应管安置槽2与散热座本体1 设计为一体,场效应管安置槽2内开设有内外贯通的场效应管安装孔4。 [0017] Referring to FIG. 1, as shown, the integrated high frequency electrodeless discharge lamp comprises a heat sink body 1 has the heat sink, the heat sink metal body 1 by aluminum heat sink hollow cylindrical body, heat sink 1 on which the body defines mounting holes 3 and down through the inner wall of the heat sink body 1 is provided with grooves disposed FET 2, FET and the heat dissipation is disposed grooves 2 designed to seat body 1 integrally, the inner tank 2 disposed FET FET defines inner and outer mounting hole penetrating 4. 上下贯通的安装螺孔3的上端用于连接一体化高频无极灯的上壳体,其下端用于安装一体化高频无极灯的中隔板,一体化高频无极灯电路模块位于散热座本体的中空部位,电路模块上的场效应管位于场效应管安置槽2中并安装固定后,使场效应管紧贴散热座本体1。 And down through the upper end of the mounting holes 3 for connecting the integrated high-frequency electrodeless lamp housing, the integration of high-frequency electrodeless lamp in its lower end for mounting the separator, a high-frequency integrated circuit module located in lamp heat sink hollow portion of the body, the FET circuit module located in the FET 2 is disposed and fixed in the groove, so that the FET 1 against the heat sink body. 散热座本体1的外壁周边开设有规则排列的外散热槽5,外散热槽5的槽深为1〜3mm。 An outer wall surrounding the heat sink body 1 defines a regular array of outer heat sinks 5, the groove 5 of the outer heat sinks deep 1~3mm. 散热座本体1的内壁周边开设有规则排列的内散热槽6,内散热槽6的槽深为1〜3mm。 Surrounding the inner wall of the heat sink body 1 defines a regular arrangement of the radiating grooves 6, the groove depth of the radiating groove 6 1~3mm.

[0018] 本发明的一种一体化高频无极灯,包括上部外壳23、中部隔热座22、下部外壳21, 安装在下部外壳的灯泡11,所述的上部外壳内安置有如上所述的上散热座。 [0018] The present invention is an integrated high-frequency electrodeless lamp, comprising an upper housing 23, the central insulation seat 22, a lower housing 21, the lamp 11 is mounted in the lower housing, said upper housing there is arranged as described above the heat sink. 所述的上部外壳内部具有与上散热座的安装螺孔相配合的螺丝安装槽,上散热座与上部外壳通过螺丝穿过安装螺孔固定安装在螺丝安装槽中。 Said inner housing having upper and the mounting holes on the heat sink screws cooperating groove on the heat sink and the upper casing by screws through the screw mounting holes in the mounting groove is fixedly mounted.

Claims (7)

  1. 1. 一种一体化高频无极灯上散热座,包括有散热座本体,其特征在于:所述的散热座本体为由金属铝制成的中空的圆柱型散热座本体,所述散热座本体上开设有上下贯通的安装螺孔,所述散热座本体的内壁设有场效应管安置槽,所述的场效应管安置槽与散热座本体设计为一体,所述的场效应管安置槽内开设有内外贯通的场效应管安装孔。 A high-frequency integrated lamp on the heat sink, the heat sink comprises a body, wherein: said heat sink is a metal body of aluminum hollow cylindrical body of the heat sink, the heat sink body defines the mounting holes vertically penetrating the inner wall of the heat sink body is provided with grooves disposed FET, the FET and the heat dissipation block body groove disposed integrally designed, the FET disposed groove FET is opened through the mounting holes inside and outside.
  2. 2.如权利要求1所述的上散热座,其特征在于:所述的散热座本体的外壁周边开设有规则排列的外散热槽。 2 on the heat sink according to claim 1, wherein: the peripheral outer wall of the heat sink body defines a regular array of outer heat sinks.
  3. 3.如权利要求2所述的上散热座,其特征在于:所述的外散热槽的槽深为1〜3mm。 The heat sink according to claim 2, wherein: said groove outer heat sinks deeply 1~3mm.
  4. 4.如权利要求1所述的上散热座,其特征在于:所述的散热座本体的内壁周边开设有规则排列的内散热槽。 4. The heat sink according to the claim 1, wherein: the inner wall of the peripheral body of said heat sink defines a regular arrangement of the heatsink.
  5. 5.如权利要求4所述的上散热座,其特征在于:所述的内散热槽的槽深为1〜3mm。 5. The upper heat sink according to claim 4, wherein: said groove depth of the radiating groove 1~3mm.
  6. 6. 一种一体化高频无极灯,包括有上部外壳,其特征在于:所述的上部外壳内安置有如权利要求1-5任一所述的上散热座。 An integrated high-frequency electrodeless lamp, comprising an upper housing, wherein: a base disposed on the heat sink like according to any one of claims 1-5 within said upper housing.
  7. 7.如权利要求6所述的一体化高频无极灯,其特征在于:所述的上部外壳内部具有与上散热座的安装螺孔相配合的螺丝安装槽,上散热座与上部外壳通过螺丝穿过安装螺孔固定安装在螺丝安装槽中。 The integrated tuner 7. The lamp according to claim 6, wherein: said inner housing having an upper housing mounted on the heat sink screw mounting holes cooperating groove on the heat sink and the upper casing by a screw fixedly mounted through mounting holes in the mounting screw groove.
CN 201110278321 2011-09-19 2011-09-19 Upper heat dissipation seat of integrated high-frequency electrodeless lamp and integrated high-frequency electrodeless lamp CN102353028A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104089261A (en) * 2013-08-15 2014-10-08 都江堰市华刚电子科技有限公司 LED (light-emitting diode) radiation device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080024067A1 (en) * 2006-07-26 2008-01-31 Kazuo Ishibashi LED lighting device
CN101635247A (en) * 2008-11-21 2010-01-27 丁春辉 Integrated high-frequency electrodeless lamp
CN201396609Y (en) * 2009-06-19 2010-02-03 中山辉量普光电科技有限公司 Integrated heat dissipation LED lamp
CN201568935U (en) * 2009-12-09 2010-09-01 曾繁生 Lamp holder of high-power energy-saving lamp
CN201819125U (en) * 2010-10-26 2011-05-04 孟强 Active heat dissipation LED pendent lamp
CN202203908U (en) * 2011-09-19 2012-04-25 丁春辉 Upper radiating base of integrated high-frequency electrodeless lamp and integrated high-frequency electrodeless lamp

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080024067A1 (en) * 2006-07-26 2008-01-31 Kazuo Ishibashi LED lighting device
CN101635247A (en) * 2008-11-21 2010-01-27 丁春辉 Integrated high-frequency electrodeless lamp
CN201396609Y (en) * 2009-06-19 2010-02-03 中山辉量普光电科技有限公司 Integrated heat dissipation LED lamp
CN201568935U (en) * 2009-12-09 2010-09-01 曾繁生 Lamp holder of high-power energy-saving lamp
CN201819125U (en) * 2010-10-26 2011-05-04 孟强 Active heat dissipation LED pendent lamp
CN202203908U (en) * 2011-09-19 2012-04-25 丁春辉 Upper radiating base of integrated high-frequency electrodeless lamp and integrated high-frequency electrodeless lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104089261A (en) * 2013-08-15 2014-10-08 都江堰市华刚电子科技有限公司 LED (light-emitting diode) radiation device

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