CN102347294A - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
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- CN102347294A CN102347294A CN2011100616490A CN201110061649A CN102347294A CN 102347294 A CN102347294 A CN 102347294A CN 2011100616490 A CN2011100616490 A CN 2011100616490A CN 201110061649 A CN201110061649 A CN 201110061649A CN 102347294 A CN102347294 A CN 102347294A
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- semiconductor device
- thermal component
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/30—Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors
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- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Abstract
Description
Claims (9)
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JP2010-169574 | 2010-07-28 | ||
JP2010169574A JP2012033559A (ja) | 2010-07-28 | 2010-07-28 | 半導体装置 |
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CN102347294A true CN102347294A (zh) | 2012-02-08 |
CN102347294B CN102347294B (zh) | 2016-02-17 |
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US (1) | US9059143B2 (zh) |
JP (1) | JP2012033559A (zh) |
KR (2) | KR101757478B1 (zh) |
CN (1) | CN102347294B (zh) |
TW (1) | TWI521653B (zh) |
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CN103871979A (zh) * | 2012-12-07 | 2014-06-18 | 株式会社吉帝伟士 | 半导体装置及其制造方法 |
CN105448860A (zh) * | 2014-09-19 | 2016-03-30 | 瑞萨电子株式会社 | 半导体装置 |
CN109659285A (zh) * | 2017-10-10 | 2019-04-19 | 本田技研工业株式会社 | 电力转换装置 |
CN110310933A (zh) * | 2018-03-20 | 2019-10-08 | 株式会社东芝 | 半导体装置及半导体装置的制造方法 |
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JP2014082245A (ja) | 2012-10-15 | 2014-05-08 | J Devices:Kk | 半導体記憶装置及びその製造方法 |
US10510707B2 (en) * | 2013-11-11 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thermally conductive molding compound structure for heat dissipation in semiconductor packages |
US9559064B2 (en) * | 2013-12-04 | 2017-01-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Warpage control in package-on-package structures |
US10141201B2 (en) * | 2014-06-13 | 2018-11-27 | Taiwan Semiconductor Manufacturing Company | Integrated circuit packages and methods of forming same |
JP6314729B2 (ja) * | 2014-07-30 | 2018-04-25 | 株式会社ソシオネクスト | 半導体装置及び半導体装置の製造方法 |
JP6421050B2 (ja) | 2015-02-09 | 2018-11-07 | 株式会社ジェイデバイス | 半導体装置 |
JP6711098B2 (ja) * | 2016-04-15 | 2020-06-17 | オムロン株式会社 | 半導体装置の放熱構造 |
JP7143647B2 (ja) * | 2018-06-27 | 2022-09-29 | 株式会社村田製作所 | 回路モジュール及び回路モジュールの製造方法 |
EP3850666B1 (en) * | 2019-01-22 | 2023-05-24 | Yangtze Memory Technologies Co., Ltd. | Integrated circuit packaging structure and manufacturing method thereof |
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- 2011-03-09 KR KR1020110020878A patent/KR101757478B1/ko active IP Right Grant
- 2011-03-15 CN CN201110061649.0A patent/CN102347294B/zh active Active
- 2011-03-30 US US13/075,890 patent/US9059143B2/en active Active
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CN103871979A (zh) * | 2012-12-07 | 2014-06-18 | 株式会社吉帝伟士 | 半导体装置及其制造方法 |
CN105448860A (zh) * | 2014-09-19 | 2016-03-30 | 瑞萨电子株式会社 | 半导体装置 |
CN105448860B (zh) * | 2014-09-19 | 2019-06-18 | 瑞萨电子株式会社 | 半导体装置 |
CN109659285A (zh) * | 2017-10-10 | 2019-04-19 | 本田技研工业株式会社 | 电力转换装置 |
CN109659285B (zh) * | 2017-10-10 | 2022-12-27 | 本田技研工业株式会社 | 电力转换装置 |
CN110310933A (zh) * | 2018-03-20 | 2019-10-08 | 株式会社东芝 | 半导体装置及半导体装置的制造方法 |
CN110310933B (zh) * | 2018-03-20 | 2024-02-02 | 株式会社东芝 | 半导体装置及半导体装置的制造方法 |
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US20120025367A1 (en) | 2012-02-02 |
TW201205737A (en) | 2012-02-01 |
KR101757478B1 (ko) | 2017-07-12 |
KR20170083515A (ko) | 2017-07-18 |
JP2012033559A (ja) | 2012-02-16 |
KR101827215B1 (ko) | 2018-02-07 |
CN102347294B (zh) | 2016-02-17 |
TWI521653B (zh) | 2016-02-11 |
KR20120011313A (ko) | 2012-02-07 |
US9059143B2 (en) | 2015-06-16 |
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