CN102278936A - Test structure of metal interconnection wire thickness and width, and test method thereof - Google Patents
Test structure of metal interconnection wire thickness and width, and test method thereof Download PDFInfo
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- CN102278936A CN102278936A CN2011100806476A CN201110080647A CN102278936A CN 102278936 A CN102278936 A CN 102278936A CN 2011100806476 A CN2011100806476 A CN 2011100806476A CN 201110080647 A CN201110080647 A CN 201110080647A CN 102278936 A CN102278936 A CN 102278936A
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Abstract
The invention provides a test structure of a metal interconnection wire thickness and width, and a test method thereof. The test structure comprises a fence type metal interconnection wire structure and winding shape metal interconnection wire structures. The equivalent thickness and width of the metal interconnection wires can be extracted through measuring resistors of the fence type and the winding shape structures.
Description
Technical field
The present invention relates to semiconductor applications, relate in particular to the test structure and the method for a kind of metal interconnecting wires thickness and width.
Background technology
Along with the development of integrated circuit technique, interconnection line postpones to become the bottleneck that influences the integrated circuit development gradually, because interconnection parasitic parameters such as interconnect capacitance and resistance have decisive influence to interconnect delay, so the test of interconnection line parasitic parameter obtains paying close attention to day by day.
Summary of the invention
The invention provides the test structure and the method for metal interconnecting wires thickness and width, with equivalent thickness and the width that obtains metal interconnecting wires accurately.
The present invention proposes the test structure of metal interconnecting wires thickness and width, comprise metal interconnected line structure of described paliform and the metal interconnected line structure of described serpentine shape.Described paliform interconnecting construction is formed by connecting by n criss-cross interconnecting construction; The width of a wherein branch of described decussate texture is to be measured, and the width of another branch is value arbitrarily, and the width of a described serpentine shape structure and thickness are that branch to be measured is identical with width in the described decussate texture; A described metal interconnected line structure of serpentine shape has identical W/S (ratio of the interval S of metal interconnecting wires width W and metal interconnecting wires) with the paliform metal interconnecting wires; A described metal interconnected line structure of serpentine shape is a branch of the metal interconnected line structure of paliform, and described two serpentine shape interconnecting constructions have identical width and thickness; Described rivulose test structure respectively has a pair of test Pad.
The invention allows for the method for testing of metal interconnecting wires thickness and width, comprising: described test structure is applied test signal by test Pad; After applying test signal, test the resistance value of each structure in the conductor length direction; Calculate described thickness and the width of waiting to ask metal interconnecting wires according to the resistance value that measures and resistance value with the physical relation of metal interconnecting wires thickness and width.
Description of drawings
Fig. 1 is the test structure figure that measures metal interconnecting wires thickness and width in the embodiment of the invention;
Fig. 2 be in the embodiment of the invention metal interconnecting wires at the sectional drawing of conductor length direction;
Fig. 3 is the vertical view of cruciform test structure in the embodiment of the invention;
Embodiment
Below be that those skilled in the art can understand other advantages of the present invention and effect easily by the content that this explanation disclosed by specific instantiation explanation embodiments of the present invention.
Referring to Fig. 1, for measuring the test structure synoptic diagram of metal interconnecting wires thickness and width in the embodiment of the invention, in conjunction with this figure, this test structure 10 that the embodiment of the invention provides comprises:
Test Pad (15), (16) and 17 of the metal interconnected line structure of paliform (11), rivulose metal interconnected line structure (12), (13), (14) and metal interconnecting wires), the metal interconnected line structure of wherein said paliform (11) is formed by connecting by the individual criss-cross interconnection line structure of n (), the width W 11 of a branch (18) of described decussate texture is to be measured, and the width W 13 of another branch (19) can be got arbitrary value; The width of the metal interconnected line structure of described serpentine shape (12) is identical with thickness with the width of branch (18) in the described decussate texture with thickness; The metal interconnected line structure of described serpentine shape (12) has identical W/S (ratio of the interval S of metal interconnecting wires width W and metal interconnecting wires) with paliform metal interconnecting wires (11); The metal interconnected line structure of described serpentine shape (13) is a branch (19) of the metal interconnected line structure of paliform (11); The width W 14 of the metal interconnected line structure of described serpentine shape (14) is identical with the width W 13 of the metal interconnected line structure of described serpentine shape (13); There are Pad (15), (16), (17) of measuring its resistance value described rivulose metal interconnected line structure (12), (13), (14).
Referring to Fig. 2, for the xsect of metal interconnecting wires in the embodiment of the invention at length direction, in conjunction with this figure, this metal interconnecting wires cross section (20) that the embodiment of the invention provided comprising:
Trapezoidal metallic object (21), the upper surface width (22) of wherein said this metallic object (21) is W1, lower surface width (23) is W2; The thickness (24) of described metallic object (21) is t; The sidewall of described metallic object (21) with the angle (25) of lower surface is, with the angle (26) of upper surface is.Under set process conditions, the metal interconnecting wires of live widths such as making, regardless of the thickness of metal interconnecting wires, its deposit angle is a definite value; Under set process conditions, the etching angle is a definite value.
Referring to Fig. 3, be the vertical view of decussate texture in the embodiment of the invention, in conjunction with this figure, this cruciform test structure (30) that the embodiment of the invention provides comprising:
Metal interconnecting wires (31) and (32), wherein (31) corresponding to (18) among Fig. 1, (32) are corresponding to (19) among Fig. 1; (33) be the upper surface width W 1 of described metal interconnecting wires (31), (34) are the lower surface width W 2 of described metal interconnecting wires (31).
The testing procedure of thickness of metal interconnecting wires described in the embodiment of the invention and width comprises:
Step 1, by the resistance R 12 of Pad (15) measurement structure (12) in the interconnect length direction, the length of its pairing metal interconnecting wires (12) is that width is that the length of the branch (18) of each decussate texture in the structure (11) is that width is.When design and making, can set and be certain ratio, promptly, have simultaneously, and then learn the resistance of the middle branch (18) of structure (11) in the conductor length direction, and (a), wherein be the resistivity of metal interconnecting wires in the lead direction, be the length of the n strip metal interconnection line of structure (11), t is the thickness of n strip metal interconnection line.
Step 2, by the resistance of Pad (16) measurement structure (14) in the interconnect length direction, the length of its pairing metal interconnecting wires is, in design with when making, can set (length of structure (13)) and be certain ratio,, thereby (b) arranged that is.
Step 3, measure the interconnection line formed by structure (11) and (13) resistance at the length direction of structure (13) by Pad (17), resistance (c) wherein, is the length of structure (13), upper surface width for structure (11), for structure (11) lower surface width, be the length of structure (11), be the number of interconnection line in the structure (11), t is the thickness of metal interconnecting wires in the structure (11), is the resistivity of metal interconnecting wires on Width.
Step 4 is by formula (a) and (b) and the system of equations of (c) forming (1)
Wherein and can measure by other modes.In conjunction with, the group of solving an equation (1) can and t.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if these modifications of the present invention and modification are belonged within the scope of claim of the present invention and equivalent technologies, then the present invention also is intended to comprise these change and modification.
Claims (9)
1. the test structure of metal interconnecting wires thickness and width is characterized in that, comprises the metal interconnected line structure of paliform (11), other interconnection lines part (12), (13) and (14), metal interconnecting wires test lead (15), (16) and (17).
Optionally, can there be one or more employing serpentine shape interconnecting constructions other interconnection line part (12), (13), (14).
2. the test structure of a kind of metal interconnecting wires thickness according to claim 1 and width is characterized in that described paliform interconnecting construction (11) is formed by connecting by n cruciform interconnecting construction, and n is a natural number.
3. the cruciform interconnecting construction of composition paliform interconnecting construction according to claim 2 (11) is characterized in that, the width of the branch of described decussate texture (18) is to be measured, and the width of another branch (19) can be got arbitrary value.
4. the test structure of a kind of metal interconnecting wires thickness according to claim 1 and width is characterized in that, the width of the metal interconnected line structure of described serpentine shape (12) is identical with spacing with the width of branch (18) in the described decussate texture with spacing.
5. the test structure of a kind of metal interconnecting wires thickness according to claim 1 and width, it is characterized in that the metal interconnected line structure of described serpentine shape (12) has identical W/S (ratio of the interval S of metal interconnecting wires width W and metal interconnecting wires) with paliform metal interconnecting wires (11).
6. the test structure of a kind of metal interconnecting wires thickness according to claim 1 and width, it is characterized in that, the metal interconnected line structure of described serpentine shape (13) is the branch (19) of the metal interconnected line structure of paliform, and interconnecting construction (13) is identical with the live width of interconnecting construction (19).
7. the test structure of a kind of metal interconnecting wires thickness according to claim 1 and width, it is characterized in that the interconnection line width of the metal interconnected line structure of described serpentine shape (14) is identical with spacing with the width of the metal interconnected line structure of described serpentine shape (13) with the interconnection line spacing.
8. the test structure of a kind of metal interconnecting wires thickness according to claim 1 and width, it is characterized in that there are test lead (15), (16) and (17) of its resistance value of test the metal interconnected line structure of described paliform (12) and metal interconnected line structure (13), (14).
9. the measuring method of metal interconnecting wires thickness and width is characterized in that, comprising:
Test structure is made in the chip;
Apply test signal for respectively structure (12), (14) and (13) by test lead (15), (16) and (17);
After applying test signal, test the resistance value of each structure in the conductor length direction;
Calculate thickness and the width of waiting to ask metal interconnecting wires according to the resistance value that measures and resistance value with the physical relation of metal interconnecting wires thickness and width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100806476A CN102278936A (en) | 2011-03-30 | 2011-03-30 | Test structure of metal interconnection wire thickness and width, and test method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100806476A CN102278936A (en) | 2011-03-30 | 2011-03-30 | Test structure of metal interconnection wire thickness and width, and test method thereof |
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| CN102278936A true CN102278936A (en) | 2011-12-14 |
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| CN2011100806476A Pending CN102278936A (en) | 2011-03-30 | 2011-03-30 | Test structure of metal interconnection wire thickness and width, and test method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102521468A (en) * | 2011-12-30 | 2012-06-27 | 中国科学院微电子研究所 | Method and device for extracting parasitic parameters of interconnection line |
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2011
- 2011-03-30 CN CN2011100806476A patent/CN102278936A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102521468A (en) * | 2011-12-30 | 2012-06-27 | 中国科学院微电子研究所 | Method and device for extracting parasitic parameters of interconnection line |
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Application publication date: 20111214 |