Summary of the invention
The manufacture method that the purpose of this invention is to provide the efficient film solar cell that a kind of photoelectric conversion efficiency is higher, production cost is lower.
Technical solution of the present invention is:
The manufacture method that the purpose of this invention is to provide the efficient film solar cell that a kind of photoelectric conversion efficiency is higher, production cost is lower.
Technical solution of the present invention is:
The manufacture method of efficient film solar cell, it selects for use ultra-thin, high transmission rate ultra-white float glass as glass substrate, is prepared into high transmission rate, efficient film solar cell by the bonding back-panel glass of high-strength hot sealing by fusing package material, and it specifically may further comprise the steps:
1) selecting thickness is that 0.4 ~ 1mm, light transmission rate are that 95% ~ 99% the low iron float glass of ultrawhite, high strength is as glass substrate;
2) on this glass substrate, prepare TCO with LPCVD or magnetron sputtering; Thicknesses of layers: 500 ~ 700nm;
Square resistance: less than 15 Ω/; Light permeable rate: the light transmission rate of wavelength 400~800 nm is greater than 90%;
3) to the TCO rete laser grooving and scribing on the glass substrate;
4) preparation PIN battery layers on the TCO rete, the continuous preparation PIN/PIN rete of binode, preparation technology is as follows:
Preparation p layer process parameter is:
Use B (CH
4)
3, SiH
4, CH
4, H
2Gas, 180 ℃ ~ 210 ℃ of depositing temperatures, power density 0.2 ~ 0.35W/cm
2, hydrogen thinner ratio R:H
2/ SiH
4Be 23 ~ 35, silane is 10:(1 ~ 1.35 with the methane flow ratio), deposition pressure is 100 ~ 140p
a
Preparation I layer process parameter is:
Use SiH
4, H
2Gas, wherein H
2/ SiH
4The R that compares is 19~21,180 ℃ ~ 220 ℃ of depositing temperatures, power density 0.29 ~ 0.55W/cm
2, deposition pressure is 110 ~ 155p
a
Preparation N layer process parameter is:
Use PH
3, SiH
4, H
2Gas, wherein H
2/ SiH
4The R that compares is 21~32,180 ℃ ~ 210 ℃ of depositing temperatures, power density 0.25 ~ 0.45W/cm
2, deposition pressure is 110 ~ 150p
a
5) laser grooving and scribing PIN battery rete;
6) prepare the battery back electrode with magnetron sputtering, comprise AZO rete, Al rete and NiV rete;
AZO thicknesses of layers: 80 ~ 100nm; Square resistance: less than 280 Ω/;
Al thicknesses of layers: 250 ~ 300nm;
NiV thicknesses of layers: 80 ~ 110nm;
7) laser grooving and scribing back electrode, the clear limit of machine, the clear limit of laser, ultrasonic waves for cleaning;
8) bonding: solar cell that selection high strength hot melt adhesives will prepare and the thick all steel back-panel glass of 4mm laminate and bond together;
9) precompressed; Solar cell and the back-panel glass utilizing roll squeezer to laminate to bond together are carried out precompressed;
10) encapsulation: the cell panel after the precompressed is encapsulated by autoclave lamination, just produce qualified efficient film solar cell through operations such as cleaning, check, detection, packings.
Technique effect of the present invention is: the thin film solar cell photoelectric conversion efficiency of using this method to make is higher, and production cost is lower, can make the application of hull cell more extensive, thereby has expanded the market of hull cell.By changing the thickness and the back side encapsulating material of glass substrate, both guaranteed the quality and the security performance of thin film solar cell, improved the conversion efficiency of thin film solar cell again.This manufacture method changes to 0.4 ~ 1mm to the thickness of glass substrate by existing 3.2mm, and its light transmission rate does not coexist between 95% ~ 99% according to thickness, is higher than the light transmission rate of the thick common ultra-white float glass 90% of 3.2mm far away.It is 7.1% that battery conversion efficiency is promoted by present unijunction 6.5%, and it is 9.5% that binode promotes by 9%.Under the prerequisite that promotes efficient, save production cost again greatly, made that the application of hull cell is more extensive, expanded the market of hull cell.
Embodiment
Embodiment one, the manufacture method of efficient film solar cell, it selects for use ultra-thin, high transmission rate ultra-white float glass as glass substrate, is prepared into high transmission rate, efficient film solar cell by the bonding back-panel glass of high-strength hot sealing by fusing package material, and it specifically may further comprise the steps:
1) selecting thickness is that 0.4mm, light transmission rate are that 99% the low iron float glass of ultrawhite, high strength is as glass substrate;
2) on this glass substrate, prepare TCO with LPCVD or magnetron sputtering; Thicknesses of layers: 500nm;
Square resistance: 10 Ω/; Light permeable rate: the light transmission rate of wavelength 400 nm is 91%;
3) to the TCO rete laser grooving and scribing on the glass substrate;
4) preparation PIN battery layers on the TCO rete, the continuous preparation PIN/PIN rete of binode, preparation technology is as follows:
Preparation p layer process parameter is:
Use B (CH
4)
3, SiH
4, CH
4, H
2Gas, 180 ℃ of depositing temperatures, power density 0.2W/cm
2, hydrogen thinner ratio R:H
2/ SiH
4Be 23, silane is 10:1 with the methane flow ratio, and deposition pressure is 100p
a
Preparation I layer process parameter is:
Use SiH
4, H
2Gas, wherein H
2/ SiH
4The R that compares is 19,180 ℃ of depositing temperatures, power density 0.29W/cm
2, deposition pressure is 110p
a
Preparation N layer process parameter is:
Use PH
3, SiH
4, H
2Gas, wherein H
2/ SiH
4The R that compares is 21,180 ℃ of depositing temperatures, power density 0.25W/cm
2, deposition pressure is 110p
a
5) laser grooving and scribing PIN battery rete;
6) prepare the battery back electrode with magnetron sputtering, comprise AZO rete, Al rete and NiV rete;
AZO thicknesses of layers: 80nm; Square resistance: 220 Ω/;
Al thicknesses of layers: 250nm;
NiV thicknesses of layers: 80nm;
7) laser grooving and scribing back electrode, the clear limit of machine, the clear limit of laser, ultrasonic waves for cleaning;
8) bonding: solar cell that selection high strength hot melt adhesives will prepare and the thick all steel back-panel glass of 4mm laminate and bond together;
9) precompressed; Solar cell and the back-panel glass utilizing roll squeezer to laminate to bond together are carried out precompressed;
10) encapsulation: the cell panel after the precompressed is encapsulated by autoclave lamination, just produce qualified efficient film solar cell through operations such as cleaning, check, detection, packings.
Embodiment two, with the difference of embodiment one be specifically to may further comprise the steps:
1) selecting thickness is that 1mm, light transmission rate are that 95% the low iron float glass of ultrawhite, high strength is as glass substrate;
2) on this glass substrate, prepare TCO with LPCVD or magnetron sputtering; Thicknesses of layers: 700nm;
Square resistance: 14 Ω/; Light permeable rate: the light transmission rate of wavelength 800 nm is greater than 95%;
3) to the TCO rete laser grooving and scribing on the glass substrate;
4) preparation PIN battery layers on the TCO rete, the continuous preparation PIN/PIN rete of binode, preparation technology is as follows:
Preparation p layer process parameter is:
Use B (CH
4)
3, SiH
4, CH
4, H
2Gas, 210 ℃ of depositing temperatures, power density 0.35W/cm
2, hydrogen thinner ratio R:H
2/ SiH
4Be 35, silane is 10:1.35 with the methane flow ratio, and deposition pressure is 140p
a
Preparation I layer process parameter is:
Use SiH
4, H
2Gas, wherein H
2/ SiH
4The R that compares is 21,220 ℃ of depositing temperatures, power density 0.55W/cm
2, deposition pressure is 155p
a
Preparation N layer process parameter is:
Use PH
3, SiH
4, H
2Gas, wherein H
2/ SiH
4The R that compares is 32,210 ℃ of depositing temperatures, power density 0.45W/cm
2, deposition pressure is 150p
a
5) laser grooving and scribing PIN battery rete;
6) prepare the battery back electrode with magnetron sputtering, comprise AZO rete, Al rete and NiV rete;
AZO thicknesses of layers: 100nm; Square resistance: 270 Ω/;
Al thicknesses of layers: 300nm;
NiV thicknesses of layers: 110nm;
7) laser grooving and scribing back electrode, the clear limit of machine, the clear limit of laser, ultrasonic waves for cleaning;
8) bonding: solar cell that selection high strength hot melt adhesives will prepare and the thick all steel back-panel glass of 4mm laminate and bond together;
9) precompressed; Solar cell and the back-panel glass utilizing roll squeezer to laminate to bond together are carried out precompressed;
10) encapsulation: the cell panel after the precompressed is encapsulated by autoclave lamination, just produce qualified efficient film solar cell through operations such as cleaning, check, detection, packings.
Embodiment three, with the difference of embodiment one be specifically to may further comprise the steps:
1) selecting thickness is that 0.7mm, light transmission rate are that 97% the low iron float glass of ultrawhite, high strength is as glass substrate;
2) on this glass substrate, prepare TCO with LPCVD or magnetron sputtering; Thicknesses of layers: 600nm;
Square resistance: 13 Ω/; Light permeable rate: the light transmission rate of wavelength 600 nm is 93%;
3) to the TCO rete laser grooving and scribing on the glass substrate;
4) preparation PIN battery layers on the TCO rete, the continuous preparation PIN/PIN rete of binode, preparation technology is as follows:
Preparation p layer process parameter is:
Use B (CH
4)
3, SiH
4, CH
4, H
2Gas, 200 ℃ of depositing temperatures, power density 0.28W/cm
2, hydrogen thinner ratio R:H
2/ SiH
4Be 27, silane is 10:1.2 with the methane flow ratio, and deposition pressure is 120p
a
Preparation I layer process parameter is:
Use SiH
4, H
2Gas, wherein H
2/ SiH
4The R that compares is 20,200 ℃ of depositing temperatures, power density 0.42W/cm
2, deposition pressure is 130p
a
Preparation N layer process parameter is:
Use PH
3, SiH
4, H
2Gas, wherein H
2/ SiH
4The R that compares is 26,195 ℃ of depositing temperatures, power density 0.34W/cm
2, deposition pressure is 130p
a
5) laser grooving and scribing PIN battery rete;
6) prepare the battery back electrode with magnetron sputtering, comprise AZO rete, Al rete and NiV rete;
AZO thicknesses of layers: 90nm; Square resistance: 260 Ω/;
Al thicknesses of layers: 270nm;
NiV thicknesses of layers: 95nm;
7) laser grooving and scribing back electrode, the clear limit of machine, the clear limit of laser, ultrasonic waves for cleaning;
8) bonding: solar cell that selection high strength hot melt adhesives will prepare and the thick all steel back-panel glass of 4mm laminate and bond together;
9) precompressed; Solar cell and the back-panel glass utilizing roll squeezer to laminate to bond together are carried out precompressed;
10) encapsulation: the cell panel after the precompressed is encapsulated by autoclave lamination, just produce qualified efficient film solar cell through operations such as cleaning, check, detection, packings.
Select the high-strength hot sealing by fusing package material of different-thickness according to thickness of glass substrate.In general, the thickness of the thin more selection encapsulating material of thickness of glass substrate is thick more.This encapsulating material can be effectively bonding with the packaged glass plate at the glass substrate and the back side behind hot melt, and intensity can reach the requirement of IEC61730.