CN102237467A - Directly replaceable high-power light-emitting diode (LED) for medical equipment - Google Patents
Directly replaceable high-power light-emitting diode (LED) for medical equipment Download PDFInfo
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- CN102237467A CN102237467A CN2010101597596A CN201010159759A CN102237467A CN 102237467 A CN102237467 A CN 102237467A CN 2010101597596 A CN2010101597596 A CN 2010101597596A CN 201010159759 A CN201010159759 A CN 201010159759A CN 102237467 A CN102237467 A CN 102237467A
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- radiator
- led
- negative electrode
- pin
- power led
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The invention discloses a directly replaceable high-power light-emitting diode (LED) for medical equipment. The LED comprises a silica gel convex lens, an LED luminous wafer, a positive electrode pole, a negative electrode pole, insulation material tubes, a heat dissipation body and a plastic base, wherein the LED luminous wafer is a double-electrode wafer and is adhered in a groove in the center of the surface of the upper end of the heat dissipation body by an efficient thermally conductive adhesive; the positive electrode pole and the negative electrode pole are strip-shaped and parallel to each other; the positive electrode pole and the negative electrode pole are fixed inside the insulation material tubes; the positive electrode pole and the negative electrode pole as well as the insulation material tubes pass through the heat dissipation body and the plastic base; the heat dissipation body is directly contacted with air; the lower end of the heat dissipation body is embedded, fixed and adhered at the upper end of the plastic base; and the silica gel convex lens is fixed on the surface of the upper end of the heat dissipation body. The LED has the advantages of thermoelectric separated structure, good heat dissipation effect, high light emitting intensity and low cost and capacity of directly replacing a tungsten filament lamp bulb of the conventional medical equipment.
Description
Technical field
The present invention relates to a kind of LED, relate in particular to a kind of great power LED that is used for Medical Devices.
Background technology
The conventional light source energy consumption is big, brightness is low, useful life is short, and led light source has advantages such as power consumption is little, brightness is high, the life-span is long.In recent years since, LED is applied to medical field gradually.The application of LED in medical field starts from medical illumination, as the disclosed a kind of for example array integrated high power LED illumination chip etc. of operating room illumination of large scale space that is used for of China Patent No. 200810214411.5.LED also is used as the light source of some particular medical device.As China Patent No. 200510122819.6 disclosed a kind of ophthalmoscopes, China Patent No. 200510081870.7 disclosed a kind of dental lamps, and China Patent No. 200720073953.6 disclosed a kind of endoscopes.These Medical Devices all only use led chip as its light source, LED wherein only is applicable to described particular device, and comprise that with existing Medical Devices the employed osram lamp of distal end illumination part does not have interoperability and replaceability, and radiating effect is not good.In addition, the NSK dental handpiece of comparativity can be arranged with the present invention, its shortcoming is the special plane special use, neither possesses replaceability, can not substitute the like product of medical field in the market, and very expensive of price.
Existing Medical Devices still are extensive use of osram lamp as light source.LED is used for Medical Devices to replace original osram lamp, still is in the tentative stage at present, therefore yet there are no relevant matured product.Common LED product on market, have Fig. 4, Fig. 5, three kinds shown in Figure 6.Shown in Figure 4 is low-power LED, at the tungsten lamp that can be used on the physical dimension replace on the existing Medical Instruments.But because there is heat dissipation problem in it, power can only arrive (power can seriously shorten its life-span because of overheated greater than 0.3W) about 0.3W, thereby causes the illumination intensity deficiency; And Fig. 5 and great power LED shown in Figure 6, volume is big, and (great power LED shown in Figure 5 is that diameter 15mm patch-type SMD great power LED diameter discoid, shown in Figure 6 surpasses 8mm, and Medical Devices particularly distal end illumination partly the osram lamp diameter of usefulness less than 8mm), and do not have and the similar resemblance of the employed osram lamp of Medical Devices, so can not directly replace the osram lamp of existing Medical Instruments.
Therefore, the Medical Devices of visible light are badly in need of providing a kind of directly replacement, good heat dissipation effect and luminous intensity height, lighting apparatus that cost is low.
Summary of the invention
The object of the present invention is to provide a kind of low directly alternate form great power LED of directly replacement, good heat dissipation effect and luminous intensity height, cost that is applied to Medical Devices, with the osram lamp that uses in the existing Medical Devices of direct replacement, and solved LED and the employed illuminating product of existing Medical Devices can't general exchange and technical problem such as existing illuminating product radiating effect difference.
The objective of the invention is to be achieved through the following technical solutions:
A kind of directly alternate form great power LED that can be used for Medical Devices comprises silica gel convex lens, radiator, plastic cement base, anodal bar, negative pole bar and the luminescent wafer that is electrically connected with the positive and negative electrode bar.Described positive and negative electrode bar is a fine strip shape, and placement parallel to each other; The outer suit of described positive and negative electrode bar also is fixed with insulating material pipe; The insulating material pipe of described positive and negative electrode bar and external fixation thereof passes from radiator and plastic cement base inside; The upper end of fixing and being adhered to the plastic cement base is inlayed in the lower end of described radiator; Central recess place, described radiator upper surface is inlayed and be fixed in to described luminescent wafer; Described luminescent wafer is equipped with the silica gel convex lens of fixedlying connected with the radiator upper end face outward; Described luminescent wafer is LED.
Preferably, described positive and negative electrode bar is silver-plated PIN pin, plating magnesium PIN pin with the luminescent wafer link certainly outward, and described silver-plated PIN pin and insulating material pipe are fixed together, thereby guarantee silver-plated PIN pin and radiator insulation; Plating magnesium PIN pin adopts arc welding to be in the same place with silver-plated PIN pin, and adopts efficient insulating cement to guarantee pad and radiator insulation.
Preferably, described luminescent wafer adopts the wafer of bipolar electrode, and and radiator between adopt the high-efficiency heat conduction elargol to fix.
Preferably, be bonding with the surface glue that reaches good thermoelectric separating effect between described plastic cement base and the radiator by playing the silver-plated PIN pin of isolation, plating magnesium PIN pin and radiator.
Preferably, described luminescent wafer is connected by gold thread with the positive and negative electrode bar.
Preferably, the cross section of described radiator and plastic cement base is circle, ellipse, hexagon, square.
Preferably, described radiator is a metallic copper and gold-plated or silver-plated.
Beneficial effect of the present invention is: because the silica gel convex lens on the luminescent wafer has the effect of optically focused, dwindled lighting angle, increased the illumination intensity in the effective area; Adopt the high-efficiency heat conduction elargol between luminescent wafer and the radiator, thermal conductivity is 30W, has extraordinary bonding and heat-conducting effect; The radiator surface area is big, and 〉=85% radiator surface energy contacts with air, has good radiating condition; Luminescent wafer adopts the LED wafer of bipolar electrode, and silver-plated PIN pin adopts the insulating material pipe insulation, and the plastic cement base is bonding by surface glue and radiator, plays the effect of isolating PIN pin and radiator, and therefore described great power LED has good thermoelectric separating effect; Because good heat dissipation effect, LED power of the present invention can be to more than the 1W, thereby can provide enough illumination intensities, and again because just, the negative pole bar passes from described radiator and plastic cement base inside, thereby the space of having saved whole device is provided with and can dwindles the whole LED volume, and and existing Medical Devices comprise distal end illumination partly the osram lamp of usefulness similar resemblance is arranged, therefore do not need Medical Instruments is done any change, can directly replace the tungsten lamp of existing Medical Instruments, solved and the interoperability difficult problem of the employed illuminating product of Medical Devices at present, had a multi-functional replacement advantage; Simultaneously, because product structure involved in the present invention is simple, cost is lower.
Description of drawings
Figure 1 shows that great power LED schematic appearance of the present invention;
Figure 2 shows that great power LED decomposing schematic representation of the present invention;
Figure 3 shows that great power LED structural representation of the present invention;
Figure 4 shows that traditional low-power LED structural representation;
Figure 5 shows that traditional great power LED structural representation;
Figure 6 shows that traditional patch-type SMD great power LED structural representation;
Figure 7 shows that the typical sizes structure chart of LED radiator of the present invention (comprising plastic feet).
Figure 8 shows that the structural representation and the overall dimension scope of employed osram lamp in the existing Medical Devices.
Among the figure:
1, silica gel convex lens; 2, luminescent wafer; 3, silver-plated PIN pin; 4, plating magnesium PIN pin; 5, insulating material pipe; 6, radiator; 7, plastic cement base; 8; Gold thread; 9; Anodal bar; 10, negative pole bar; 11, support.
Embodiment
Below in conjunction with accompanying drawing 1-8, specify the present invention.
As depicted in figs. 1 and 2, the directly alternate form great power LED that can be used for Medical Devices that the present invention relates to comprises silica gel convex lens 1, radiator 6, plastic cement base 7, passes and is fixed in anodal bar 9, negative pole bar 10 on the plastic cement base 7 and the luminescent wafer 2 that is electrically connected with the positive and negative electrode bar.Described positive and negative electrode bar 9,10 is a fine strip shape, and placement parallel to each other.In order to save the design space, described positive and negative electrode bar 9,10 outer suits also are fixed with insulating material pipe 5, thereby make described positive and negative electrode bar 9,10 pass insulating material pipe 5.In order to help heat radiation, outside the described insulating material pipe 5 radiator 6 that outer surface contacts with air is installed simultaneously.The upper end of fixing and being adhered to plastic cement base 7 is inlayed in described radiator 6 lower ends; Described positive and negative electrode bar 9,10 passes from described radiator 6 and plastic cement base 7 inside.Preferably, described radiator 6 and plastic cement base 7 inner perforated or side mill duct pass for the insulating material pipe of positive and negative electrode bar and overcoat thereof.
The center, upper surface of described radiator 6 is provided with groove, and the central recess place, upper surface of described radiator 6 is inlayed and be fixed in to described luminescent wafer 2.The described luminescent wafer 2 outer silica gel convex lens 1 of fixedlying connected that are equipped with radiator 6 upper end faces.Described silica gel convex lens 1 is fixed in the upper end of radiator 6, and the gold thread 8 of described connection luminescent wafer 2 and positive and negative electrode bar 9,10 embeds in the silica gel convex lens 1.Described luminescent wafer 2 is LED.
Preferably, described positive and negative electrode bar 9,10 is silver-plated PIN pin 3, plating magnesium PIN pin 4 with luminescent wafer 2 links certainly outward, and described silver-plated PIN pin 3 is fixed together with insulating material pipe 5, thereby guarantees silver-plated PIN pin 3 and radiator 6 insulation; Plating magnesium PIN pin 4 adopts arc welding to be in the same place with silver-plated PIN pin 3, and adopts efficient insulating cement to guarantee pad and radiator 6 insulation.
Preferably, described luminescent wafer 2 adopts the wafer of bipolar electrodes, and and radiator 6 between adopt the high-efficiency heat conduction elargol to fix.
Preferably, be bonding with the surface glue that reaches good thermoelectric separating effect between described plastic cement base 7 and the radiator 6 by playing the silver-plated PIN pin 3 of isolation, plating magnesium PIN pin 4 and radiator 6.
Preferably, described luminescent wafer 2 and positive and negative electrode bar 9,10 are connected by gold thread 8.
Preferably, the cross section of described radiator 6 and plastic cement base 7 is circle, ellipse, hexagon, square.
Preferably, described radiator 6 is a metallic copper and gold-plated or silver-plated.
Adopt the high-efficiency heat conduction elargol bonding between luminescent wafer 2 and the radiator 6, heat conduction elargol thermal conductivity is 30W, has good bonding and heat-conducting effect; Radiator 6 surface areas are big, and 〉=85% radiator surface energy contacts with air, has good radiating condition; Luminescent wafer 2 adopts bipolar electrode LED wafers, and silver-plated PIN pin 3 adopts glass tubes 5 insulation, and plastic cement base 7 is connected with radiator 6 by surface glue, plays the effect of isolation PIN pin and radiator 6, has good thermoelectric separating effect.
Be silica gel convex lens 1 on the luminescent wafer 2, convex lens has the effect of optically focused, has dwindled lighting angle, forms special lens effect, has increased optical efficiency, has improved the illumination intensity in the effective area.
The invention solves the heat dissipation problem of traditional LED, thermoelectric simultaneously the separation, make LED can accomplish high-power and small size, to satisfy the requirement of various Medical Devices.
Shown in the size that marks among Fig. 7 and Fig. 8, LED of the present invention has and has the similar resemblance of osram lamp that Medical Devices use now, therefore, the present invention can be used for lamp socket being arranged or do not have lamp socket illumination and indirect lighting in the existing Medical Devices, comprise the distal end illumination in the Medical Devices, need not to do on equipment change, directly replacement cost is invented LED or is used sub-assembly of the present invention.
Described insulating material pipe 5 can be glass or other insulating material.
LED in the market, only low-power LED may be used for Medical Devices on size and resemblance.The low-power LED structure chart is seen Fig. 4.Support 11 and negative pole bar 10 are an integral body, and luminescent wafer 2 is connected by gold thread 8 with anodal bar 9.Support 11, luminescent wafer 2 and gold thread 8 are fixed in the silica gel convex lens 1.
As Fig. 2, Fig. 3 and shown in Figure 4, the architectural difference of LED of the present invention and traditional low-power LED is as follows:
(1) LED of the present invention uses the bipolar electrode wafer, and anodal bar 9 all is connected with wafer by gold thread with negative pole bar 10; And traditional low-power LED has only anodal bar 9 to be connected with wafer by gold thread, and the negative pole of wafer directly contacts with negative pole bar 10.
(2) LED of the present invention has independently radiator 6, has thermoelectric isolating construction; And the radiator of traditional low-power LED is a negative pole bar 10, does not have independently radiator, does not have thermoelectric isolating construction.
(3) radiator 6 of LED of the present invention is exposed in the air, and the radiator of traditional low-power LED wraps up and is fixed in the colloidal silica.
(4) the present invention's insulating material 5 of using glass tube or other to have identical function is wrapped in outside anodal bar 9 and the negative pole bar 10, guarantees to insulate between anodal bar 9 and negative pole bar 10 and the radiator.Traditional low-power LED does not have this structure.
(5) LED of the present invention has plastic cement base 7; The tradition low-power LED does not have special insulation plastic cement base.
(6) LED wafer 2 of the present invention is near silica gel convex lens 1, the luminous utilance height of wafer; The optical length of the luminous arrival colloid convex lens of tradition low-power LED wafer, light intensity loss is big.
(7) when identical physical dimension, LED power of the present invention can be to 1 watt; Traditional low-power LED is because of weak heat-dissipating, and power is lower than 0.3 watt.
Anodal bar 9 wherein of the present invention and negative pole bar 10 all are made of by arc welding silver-plated PIN pin 3 and plating magnesium PIN pin 4.
For the advance of LED of the present invention is described better, we further compare LED of the present invention and traditional great power LED.What need indicate is that traditional great power LED is because its resemblance and physical dimension are not suitable for being directly used in existing Medical Devices to replace osram lamp.Tradition great power LED structure chart is seen Fig. 5.
As shown in Figure 5, the difference of LED of the present invention and traditional great power LED structure is:
(1) radiator 6 of LED of the present invention is exposed in the air; The radiator of traditional great power LED almost completely is embedded in the plastics support, and limited with the air contact area, radiating efficiency is poor.
(2) anodal bar 9 of the present invention and negative pole bar 10 pass radiator, and are connected respectively by the both positive and negative polarity of gold thread 8 with wafer 2, compact conformation, and good looking appearance does not need extra support; The both positive and negative polarity of traditional great power LED uses gold thread leap radiator to be connected with anodal bar and negative pole bar, and loosely organized, volume is bigger, needs extra support.
(3) LED of the present invention uses insulating material pipe 5 to be wrapped in anodal bar 9 and negative pole bar 10 peripheries, guarantees to insulate between anodal bar 9 and negative pole bar 10 and the radiator; The tradition great power LED does not have this structure.
(4) LED of the present invention has plastic cement base 7 below radiator 6; The tradition great power LED does not have this insulation plastic cement base.
(5) LED of the present invention can directly replace the tungsten lamp in the existing Medical Devices, does not need equipment is transformed; Traditional great power LED can not directly be used in existing Medical Devices.
Patch-type SMD great power LED structure chart is seen Fig. 6.The same with the great power LED among Fig. 5, SMD SMD great power LED can not be directly used in existing Medical Devices.
In great power LED of the present invention, radiator 6 surface areas are big, and 〉=85% radiator surface energy contacts with air.And the physical dimension of the physical dimension of each element of the present invention and shape, particularly radiator and shape can design according to different environments for use and purpose.We are that orbicular cylinder is analyzed as embodiment with radiator and base cross section, and as shown in Figure 7, cylindrical length (cylinder comprises heat dissipation metal body+plastic cement base) is 8 millimeters, and cylindrical diameter is 4.55 millimeters.We are calculated as follows:
The total surface area of radiator is:
Square millimeter; The radiator surface area that contacts with air is:
Square millimeter.So the surface area that contacts with air surpasses 88.9% of total surface area.
Condition same as the previously described embodiments, changing cylindrical length (cylinder comprises heat dissipation metal body+base) is 9 millimeters, cylindrical diameter is 4.68 millimeters, and can draw the surface area that contacts with air is 149.5 square millimeters, and the ratio that accounts for the radiator total surface area is 89.7%.
As required, we can make the cross section to radiator and base and be oval cylinder, and perhaps the cross section is the cylinder of hexagon, Else Rule shape such as square.Because electrode stem passes (outsourcing insulating material) from radiator inside, so the radiator shape is unrestricted.In addition, do more high-power LED if desired, under the still unappeasable situation of the physical dimension of the radiator shown in Fig. 7 embodiment, can increase the diameter and the length of radiator, increasing the area that radiator contact with air, thereby satisfy the requirement of dispelling the heat.
Compare with prior art, the present invention also has following advantage:
1. replaceable: the present invention can be used for lamp socket being arranged or do not have lamp socket illumination and indirect lighting in the existing Medical Devices, comprises the distal end illumination in the Medical Devices, need not to do on equipment change, and directly replacement cost is invented LED or used sub-assembly of the present invention.
2. good heat dissipation effect: heat carrier of the present invention and radiator close as a whole, engaged by the high-efficiency heat conduction elargol between pyrotoxin and the radiator, and LED of the present invention need not support, and independently radiator directly contacts with air, has strengthened radiating efficiency.
3. brightness height: even require under the condition of diameter less than 5mm in physical dimension, LED power of the present invention can be to more than the 1W.And the surface adopts the mode of secondary optics to carry out leaded light, has the effect of optically focused.
4. thermoelectric the separation: LED of the present invention is wrapped in anodal bar and negative pole bar in the insulating material pipe and the layout that passes from radiator inside has reduced the physical dimension of LED effectively, and makes compact conformation, good looking appearance, and constitutes thermoelectric isolating construction.
More than disclosed only be the specific embodiment of this patent; but this patent is not limited thereto; any those skilled in the art can think variation (such as, but be not limited to; with the glass tube in the identical insulating material alternative embodiment of function, with the material of good heat conductivity replace the copper radiator of the gold-plated/silver among the embodiment, simply change the shape in radiator or plastic cement base cross section, radiator is designed to the column of surface coverage blade etc.), all should drop in the protection range of this patent.
Claims (10)
1. directly alternate form great power LED that can be used for Medical Devices, comprise silica gel convex lens, luminescent wafer, anodal bar, negative pole bar, insulating material pipe, radiator and plastic cement base, it is characterized in that: described positive and negative electrode bar is electrically connected with luminescent wafer, described positive and negative electrode bar is a fine strip shape, and placement parallel to each other, the outer suit of described positive and negative electrode bar also is fixed with insulating material pipe; Described positive and negative electrode bar and insulating material pipe thereof pass from radiator and plastic cement base inside; Described radiator directly contacts with air; The upper end of fixing and being adhered to the plastic cement base is inlayed in the lower end of described radiator; Described luminescent wafer is adhered in the groove of center, radiator upper surface; Described luminescent wafer is equipped with the silica gel convex lens of fixedlying connected with radiator outward, and described luminescent wafer is LED.
2. great power LED according to claim 1 is characterized in that: radiator and plastic cement base inner perforated or side mill duct, pass for the insulating material pipe of positive and negative electrode bar and overcoat thereof.
3. great power LED as claimed in claim 1 or 2, it is characterized in that: described positive and negative electrode bar is from being silver-plated PIN pin, plating magnesium PIN pin outward with the luminescent wafer link, described silver-plated PIN pin and insulating material pipe are fixed together, thereby guarantee silver-plated PIN pin and radiator insulation; Plating magnesium PIN pin adopts arc welding to be in the same place with silver-plated PIN pin, and adopts efficient insulating cement to guarantee pad and radiator insulation.
4. as great power LED as described in the claim 3, it is characterized in that: be to isolate silver-plated PIN pin, plating magnesium PIN pin and radiator and be adhesively fixed between described plastic cement base and the radiator with the surface glue that reaches good thermoelectric separating effect by playing.
5. great power LED as claimed in claim 1 or 2 is characterized in that: described positive and negative electrode bar with its separately the insulating material pipe of overcoat adopt sintering or bonding mode to fix.
6. great power LED as claimed in claim 1 or 2, it is characterized in that: described luminescent wafer adopts the wafer of bipolar electrode, and and radiator between adopt the high-efficiency heat conduction elargol to fix.
7. great power LED as claimed in claim 1 or 2, it is characterized in that: described luminescent wafer is connected by gold thread with the positive and negative electrode bar.
8. great power LED as claimed in claim 1 or 2, it is characterized in that: described radiator is a metallic copper and gold-plated or silver-plated.
9. great power LED as claimed in claim 1 or 2, it is characterized in that: described radiator side directly contacts with air fully.
10. great power LED as claimed in claim 1 or 2, it is characterized in that: the center, upper surface of described radiator is provided with groove to inlay described luminescent wafer, described silica gel convex lens is fixed in the upper end of radiator, and the gold thread of described connection luminescent wafer and positive and negative electrode bar embeds in the silica gel convex lens.
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| CN101382263A (en) * | 2007-08-22 | 2009-03-11 | 重庆邦桥科技有限公司 | Color temperature adjustable integration high-power LED medical illumination chip |
| CN201638851U (en) * | 2010-04-29 | 2010-11-17 | 光鸿电子(吴江)有限公司 | Direct replaceable high-power LED capable of being used for medical device |
| CN301638851S (en) * | 2010-12-03 | 2011-08-10 | 陈梓平 | Cool Union Lid (04n) |
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| CN1715739A (en) * | 2004-07-01 | 2006-01-04 | 尤罗登特股份公司 | Dental lamp particularly for medical and dental surgeries |
| US20070090272A1 (en) * | 2005-10-21 | 2007-04-26 | Bwt Property, Inc. | Light Emitting Apparatus for Medical Applications |
| US20070106347A1 (en) * | 2005-11-09 | 2007-05-10 | Wun-Chen Lin | Portable medical and cosmetic photon emission adjustment device and method using the same |
| CN201139543Y (en) * | 2007-08-21 | 2008-10-29 | 复旦大学 | Endoscope with LED back light source |
| CN101382263A (en) * | 2007-08-22 | 2009-03-11 | 重庆邦桥科技有限公司 | Color temperature adjustable integration high-power LED medical illumination chip |
| CN201638851U (en) * | 2010-04-29 | 2010-11-17 | 光鸿电子(吴江)有限公司 | Direct replaceable high-power LED capable of being used for medical device |
| CN301638851S (en) * | 2010-12-03 | 2011-08-10 | 陈梓平 | Cool Union Lid (04n) |
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