CN102236445A - Composite board structure and cover mirror laminar structure for touch panel - Google Patents
Composite board structure and cover mirror laminar structure for touch panel Download PDFInfo
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- CN102236445A CN102236445A CN2010101676070A CN201010167607A CN102236445A CN 102236445 A CN102236445 A CN 102236445A CN 2010101676070 A CN2010101676070 A CN 2010101676070A CN 201010167607 A CN201010167607 A CN 201010167607A CN 102236445 A CN102236445 A CN 102236445A
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Abstract
The invention provides a composite board structure and a cover mirror laminar structure for a touch panel. The composite board structure comprises a substrate, a microstructure layer and a shielding layer, wherein the microstructure layer is formed on the substrate, is provided with a first side and a second side which are opposite to each other and comprises a plurality of prism microstructures; the substrate is attached to the first side of the microstructure layer; and the shielding layer covers the second side of the microstructure layer and comprises a low-transmission material.
Description
Technical field
The present invention is about a kind of composite board structure, and comprises a kind of cover cap mirror layered structure that is used for contact panel of this composite board structure.
Background technology
Mode with sheet material processing generation special substance visual effect generally includes ink printing, CNC processing, etching technics, reaches ultraviolet light die casting (UV molding).The ink printing mode can represent plane lines effect but lack stereoscopic sensation, promote surperficial texture and represent metallic luster though can utilize conductive vacuum metal coating (VM) or non-conducting vacuum metal coating (NCVM) to replace printing ink, but still can't obtain stereoscopic visual effect.The CNC processing mode is to utilize pig metal to process operation, mills out the metal lines on sheet material, but CNC processing operating cost is expensive and can't carry out on glass or silicon crystallization material, reduces consistency of product because of the cutter abrasion easily simultaneously.Moreover the etching mode is to utilize etching liquid medicine and exposure technique to carry out etching to produce the lines effect on the appointment material, though the etching mode can reach precision and conforming requirement, environmental risk improves and the operating cost costliness relatively in the operation.In addition, the ultraviolet light die casting is to adopt the operation of embossing mode, utilize roller or the flat edition mould of being stained with to carry out embossed with generation lines effect, but this technology only can be shaped at present on plasticity acryl or composite plastic, and can't implement on glass or silicon crystallization material.
Summary of the invention
The invention provides a kind of composite board structure, the shortcoming that it can provide good metal gloss and lines effect and can avoid above-mentioned Known designs, and can be integrated on the cover cap mirror of a contact panel.
According to the design of one embodiment of the invention, a kind of composite board structure comprises a substrate, a microstructured layers and a screen layer.Microstructured layers is formed on the substrate, and has one first relative side and one second side, and microstructured layers comprises that a plurality of prism microstructure and substrate are attached at first side of microstructured layers.Screen layer is coated in second side of microstructured layers, and screen layer comprises a low light transmission material.
By the design of present embodiment, prism microstructure can reflect or reflect incident light, makes the substrate with level and smooth sense of touch produce the prism lines of stereoscopic visual effect and the texture and the gloss of metal.Because conform to substrate after the microstructured layers moulding again, so can significantly reduce the risk that substrate is directly processed, effectively improve the finished product yield, and can remove microstructured layers operation again, so can reuse substrate and have good heavy industry characteristic when mistake appears in the applying process.Moreover microstructured layers can provide the light convergence effect of similar brightness enhancement film (BEF) simultaneously, and different lines can be provided and produce different metallic luster effects by height, spacing, the arrangement mode of adjusting each prism microstructure.
In an embodiment, microstructured layers is made of photo-hardening or thermmohardening material, and prism microstructure is formed by embossed.
In an embodiment, microstructured layers is made of metal material, and prism microstructure is formed by the full figure laser treatment.Design by present embodiment, when irradiate light during in the full figure laser microstructure of microstructured layers, can produce phenomenons such as refraction, scattering, reflection, and when light changes because of the diffraction phenomenon produces abundant colors simultaneously by full figure laser microstructure, so can produce gloss identical or the colorful light of dazzling, make a transparency carrier that beautiful eye-catching gloss, texture and special visual effect can be provided with metal-like.
According to the design of another embodiment of the present invention, a kind of cover cap mirror layered structure that is used for contact panel comprises a transparency carrier and is formed on the transparency carrier and a visible area layered structure and non-display area layered structure adjacent one another are.The visible area layered structure comprises an inductive layer, an insulation bridge layer one bridge joint electrical lead, reaches a protective seam.Inductive layer is laid on the transparency carrier, and inductive layer comprises a plurality of X-axis stitchings that are equally spaced and are arranged in parallel with each other along X-direction, and a plurality of Y-axis stitchings that are equally spaced and are arranged in parallel with each other along Y direction.The insulation bridge layer covers the X-axis stitching of inductive layer and Y-axis stitching and is provided with a plurality of through holes with expose portion Y-axis stitching.Two ends of bridge joint electrical lead are electrically connected the Y-axis stitching via through hole respectively.Protective seam covers inductive layer, insulation bridge layer, reaches the bridge joint electrical lead.The non-display area layered structure comprises a microstructured layers and a screen layer, microstructured layers has one first relative side and one second side, microstructured layers comprises that a plurality of prism microstructure and its first side are attached at a side of transparency carrier, screen layer, second side and the screen layer that are coated in microstructured layers comprise the low light transmission material.
According to technical scheme provided by the invention, can significantly reduce the risk that substrate is directly processed, effectively improve the finished product yield; In addition, microstructured layers can provide the light convergence effect of similar brightness enhancement film simultaneously, and different lines can be provided and produce different metallic luster effects by height, spacing, the arrangement mode of adjusting each prism microstructure.
Description of drawings
Fig. 1 applies to for example synoptic diagram of a carrier of mobile phone for each embodiment of the present invention.
Fig. 2 is A-A ' the line cutting along Fig. 1, shows the diagrammatic cross-section according to the composite board structure of one embodiment of the invention.
Fig. 3 A-Fig. 3 C is the process flow diagram of a manufacturing course example of composite board structure.
Fig. 4 is the diagrammatic cross-section of the composite board structure of another embodiment of the present invention.
Fig. 5 A shows the diagrammatic cross-section of another embodiment of composite board structure of the present invention.
Fig. 5 B shows the diagrammatic cross-section of another embodiment of composite board structure of the present invention.
Fig. 6 A-Fig. 6 D is the diagrammatic cross-section of the different embodiment of explanation visible area layered structure.
Drawing reference numeral
10,30 composite board structures, 38 screen layers
12 substrates, 42 full figure laser microstructures
14 adhesive coating 50a, 50b, 50c, 50d visible area layered structure
16 microstructured layers, 52 transparency carriers
16a microstructured layers first side 54 inductive layers
The 16b microstructured layers second side 54a X-axis stitching
18 screen layer 54b Y-axis stitchings
20 metal levels, 56 insulation bridge layers
22 base materials, 58 bridge joint electrical leads
24 polymkeric substance, 62 protective seams
32 substrates, 66 flexible circuit boards
34 surface treatment layers, 100 mobile phone
36 microstructured layers P spacings
The 36a microstructured layers first side T through hole
The 36b microstructured layers second side Δ H difference in height
Embodiment
Other purposes of the present invention and advantage can be further understood from the disclosed technical characterictic of the present invention.For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, embodiment cited below particularly also cooperates appended accompanying drawing, is described below in detail.
About aforementioned and other technology contents, characteristics and effect of the present invention, in the detailed description of following cooperation embodiment with reference to the accompanying drawings, can clearly present.The direction term of being mentioned in following examples, for example: upper and lower, left and right, front or rear etc. only are the directions with reference to attached drawings.Therefore, the direction term of use is to be used for illustrating not to be to be used for limiting the present invention.
Fig. 1 applies to for example synoptic diagram of a carrier of mobile phone for each embodiment of the present invention, and as shown in Figure 1, mobile phone 100 has a visible area (viewing area) and a non-display area.Composite board structure according to each embodiment of the present invention can be arranged at non-display area, so that special material effect to be provided, for example can provide the visual effect of metal-like, color, lines or gloss.
Fig. 2 is A-A ' the line cutting along Fig. 1, shows the diagrammatic cross-section according to the composite board structure 10 of one embodiment of the invention.Fig. 3 A-Fig. 3 C is the process flow diagram of a manufacturing course example of composite board structure 10.As shown in Figure 2, composite structure 10 comprises a substrate 12, is formed at an adhesive coating 14, a microstructured layers 16 and a screen layer 18 on the substrate 12.Microstructured layers 16 has one first relative side 16a and one second side 16b, and the first side 16a of microstructured layers 16 is attached at a side of substrate 12 via adhesive coating 14, and screen layer 18 is coated in the second side 16b of microstructured layers 16.One manufacturing course example of following explanation composite board structure 10.
As shown in Figure 3A, one base material 22 at first is provided, the material of base material 22 for example can be polyethylene terephthalate (PET) or other plastic type material, and the polymkeric substance 24 of lining one deck uV curable or heat curing on the base material 22, utilize the impression forming mode to form needed prism microstructure 24a for another example shown in Fig. 3 B, and irradiating ultraviolet light or be heating and curing.The profile of a plurality of microstructure 24a and arrangement mode can constitute different lines and different light reflection, refraction effects is provided.Shown in Fig. 3 C, the base material 22 with prism microstructure 24a lines can be pasted on the substrate 12 via adhesive coating 14, and adhesive coating 14 for example comprises optics high-penetration adhesion compound (optically clear adhesive; OCA).Substrate 12 can be a cover cap mirror (cover lens) of a contact panel.The material of substrate 12 can be glass, plastic cement or silicon crystallization or the like, and plastic material for example can be polyethylene terephthalate (PET), polycarbonate (PC) or polymethylmethacrylate (PMMA) etc.The screen layer 18 that constitutes of the low light transmission material of black ink or plated film metal for example can utilize the plated film mode to be attached to base material 22 and coats microstructure 24a.By the design of present embodiment, prism microstructure 24a can reflect or reflect incident light, makes the substrate 12 with level and smooth sense of touch produce the prism lines of stereoscopic visual effect and the texture and the gloss of metal.Because conform to substrate 12 again after microstructured layers 16 moulding, so can significantly reduce the risk that substrate 12 is directly processed, effectively improve the finished product yield, and can remove microstructured layers 16 operation again, so can reuse substrate 12 and have good heavy industry characteristic when mistake appears in the applying process.Moreover microstructured layers 16 can provide the light convergence effect of similar brightness enhancement film (BEF) simultaneously, and different lines can be provided and produce different metallic luster effects by height, spacing, the arrangement mode of adjusting each prism microstructure 24a.Therefore, height, spacing, the arrangement mode of each prism microstructure 24a do not limit fully, the prism peaks of for example per two adjacent ribs mirror microstructure 24a can have identical spacing P (Fig. 2), perhaps having different spacings also can, and two adjacent ribs mirror microstructure 24a can have different height (producing difference in height Δ H shown in Figure 2), perhaps have identical height (Fig. 4) and all can.Moreover, as shown in Figure 4, in an embodiment, a metal level 20 can be arranged between adhesive coating 14 and the microstructured layers 16 with further raising metal-like, and metal level 20 materials for example can be conductive vacuum metal coating (VM) or non-conducting vacuum metal coating (NCVM).
Fig. 5 A shows the diagrammatic cross-section of another embodiment of composite board structure of the present invention.Shown in Fig. 5 A, composite board structure 30 comprises a substrate 32, a surface treatment layer 34, a microstructured layers 36, reaches a screen layer 38.Microstructured layers 36 has one first relative side 36a and one second side 36b, microstructured layers 36 for example can be constituted and comprised a plurality of full figure laser microstructures 42 by metal material, and the first side 36a of microstructured layers 36 is attached at a side of substrate 32 via surface treatment layer 34.Screen layer 38 is coated in the second side 36b of microstructured layers 36, and screen layer 38 comprises for example low light transmission material of black ink.Microstructured layers 36 for example can utilize coating, wire mark or transfer printing mode to be formed on the surface treatment layer 34, and screen layer 38 can utilize coating, wire mark or transfer printing mode to be coated in the second side 36b of microstructured layers 36.Full figure laser microstructure 42 is to utilize full figure laser formation mode to form.For example, can provide a figure to carry out art designing's plate-making, will be projected to by the laser light of figure on the glass sheet of a coating photoresist again, electroforming forms the microstructure die again, utilizes the molded full figure laser of this microstructure die microstructure 42 afterwards.Surface treatment layer 34 for example can utilize the corona treatment mode to form, and utilizes the gap of electrode on substrate 32 to produce corona, and surface polarityization is increased clinging power and surface tension, and that improves microstructured layers 36 and substrate 32 combines degree of stability and impermeability.Design according to present embodiment, when irradiate light during in the full figure laser microstructure 42 of microstructured layers 36, can produce phenomenons such as refraction, scattering, reflection, and when light changes because of the diffraction phenomenon produces abundant colors simultaneously by full figure laser microstructure 42, so can produce gloss identical or the colorful light of dazzling, make a transparency carrier that beautiful eye-catching gloss, texture and special visual effect can be provided with metal-like.Substrate 32 for example can be a cover cap mirror (cover lens) of a contact panel, the material of substrate 32 can be light-transmitting materials such as glass, plastic cement or silicon crystallization, and plastic material for example can be polyethylene terephthalate (PET), polycarbonate (PC) or polymethylmethacrylate (PMMA) etc.In an embodiment, shown in Fig. 5 B, also can not form surface treatment layer 34 and a direct side that microstructured layers 36 is attached at substrate 32 with roll extrusion or laminating type.
Because of above-mentioned each embodiment can implement on glass or silicon crystallization material,, this composite board structure directly is integrated on the cover cap mirror of contact panel so can apply to a contact panel.A kind of cover cap mirror layered structure that is used for contact panel of following explanation, cover cap mirror layered structure comprises a visible area layered structure of the visible area that is positioned at Fig. 2 and is positioned at a non-display area layered structure of non-display area, visible area layered structure and non-display area layered structure are adjacent one another are and be formed on the cover cap mirror of a contact panel, the non-display area layered structure can be the disclosed composite board structure of aforementioned each embodiment, repeat no more in this, so the following different embodiment that the visible area layered structure is described with the diagrammatic cross-section of Fig. 6 A-Fig. 6 D.As shown in Figure 6A, visible area layered structure 50a comprises a transparency carrier 52, an inductive layer 54, an insulation bridge layer 56 at least, reaches a bridge joint electrical lead 58.Inductive layer 54 is laid on the surface of this transparency carrier 52, and inductive layer 54 comprises a plurality of X-axis stitching 54a that are equally spaced and are arranged in parallel with each other along X-direction, and a plurality of Y-axis stitching 54b that are equally spaced and are arranged in parallel with each other along Y direction.Insulation bridge layer 56 is the heat insulating lamina of tool light transmission, insulation bridge layer 56 covers the X-axis stitching 54a of inductive layers 54 and Y-axis stitching 54b and is provided with a plurality of through hole T with expose portion Y-axis stitching zone, and bridge joint electrical lead 58 2 ends are electrically connected different Y-axis stitching 54b respectively via those through holes T.One protective seam 62 covers inductive layer 54, insulation bridge layer 56, reaches bridge joint electrical lead 58, and visible area layered structure 50a is electrically connected to a flexible circuit board 66 via a metal wire 64.Shown in Fig. 6 B, in another visible area layered structure 50b, the also scope that the extension downwards of protective seam 62 scopes can be dwindled insulation bridge layer 56, and through hole T is arranged at protective seam 62 and insulate between the bridge layer 56.Shown in Fig. 6 C, in another visible area layered structure 50c, inductive layer 54 can be formed at the top of insulation bridge layer 56 and the below that bridge joint electrical lead 58 is formed at insulation bridge layer 56, and insulation bridge layer 56 is provided with a plurality of through hole T.Perhaps, shown in Fig. 6 D, in another visible area layered structure 50d, inductive layer 54 can be formed at the top of insulation bridge layer 56 and the below that bridge joint electrical lead 58 is formed at insulation bridge layer 56, and the two ends of bridge joint electrical lead 58 connect a Y-axis stitching 54b respectively.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when being as the criterion with claim institute confining spectrum.In addition, arbitrary embodiment of the present invention or claim must not reached the disclosed whole purposes of the present invention or advantage or characteristics.In addition, summary part and title only are the usefulness that is used for assisting the patent document search, are not to be used for limiting interest field of the present invention.
Claims (15)
1. a composite board structure is characterized in that, described composite board structure comprises:
One substrate;
One microstructured layers is formed on the described substrate, and has one first relative side and one second side, and described microstructured layers comprises a plurality of prism microstructure, and wherein said substrate is attached at described first side; And
One screen layer is coated in described second side of described microstructured layers and comprises a low light transmission material.
2. composite board structure as claimed in claim 1 is characterized in that, described composite board structure comprises that also an adhesive coating is arranged between described substrate and the described microstructured layers.
3. composite board structure as claimed in claim 2 is characterized in that, described composite board structure comprises that also a metal level is arranged between described adhesive coating and the described microstructured layers.
4. composite board structure as claimed in claim 2 is characterized in that, described adhesive coating comprises optics high-penetration adhesion compound.
5. composite board structure as claimed in claim 1 is characterized in that, described microstructured layers is made of photo-hardening or thermmohardening material.
6. composite board structure as claimed in claim 5 is characterized in that described prism microstructure is formed by embossed.
7. composite board structure as claimed in claim 6 is characterized in that, described low light transmission material is a black ink or metal material.
8. composite board structure as claimed in claim 1 is characterized in that, described composite board structure comprises that also a surface treatment layer is arranged between described substrate and the described microstructured layers.
9. composite board structure as claimed in claim 8 is characterized in that described microstructured layers is made of metal material.
10. composite board structure as claimed in claim 9 is characterized in that, described prism microstructure is formed by the full figure laser treatment.
11. composite board structure as claimed in claim 10 is characterized in that, described low light transmission material is a black ink.
12. composite board structure as claimed in claim 1 is characterized in that, the prism peaks of described prism microstructure is contour or non-contour.
13. composite board structure as claimed in claim 1 is characterized in that, the spacing of described prism microstructure is equidistant or non-equidistant.
14. composite board structure as claimed in claim 1 is characterized in that, described substrate is a cover cap mirror of a contact panel.
15. a cover cap mirror layered structure that is used for contact panel is characterized in that, described cover cap mirror layered structure comprises:
One transparency carrier;
One visible area layered structure is formed on the described transparency carrier and comprises:
One inductive layer is laid on the described transparency carrier, and described inductive layer comprises a plurality of X-axis stitchings that are equally spaced and are arranged in parallel with each other along X-direction, and a plurality of Y-axis stitchings that are equally spaced and are arranged in parallel with each other along Y direction;
One insulation bridge layer covers the described X-axis stitching of described inductive layer and described Y-axis stitching and is provided with a plurality of through holes with the described Y-axis stitching of expose portion;
One bridge joint electrical lead, two ends of described bridge joint electrical lead are electrically connected described Y-axis stitching via described through hole respectively; And
One protective seam covers described inductive layer, described insulation bridge layer, reaches described bridge joint electrical lead; And
One non-display area layered structure is formed on the described transparency carrier and the described visible area layered structure of adjacency, and described non-display area layered structure comprises:
One microstructured layers has one first relative side and one second side, and described microstructured layers comprises a plurality of prism microstructure, and wherein said transparency carrier is attached at described first side; And
One screen layer, described second side and the described screen layer that are coated in described microstructured layers comprise a low light transmission material.
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| CN2010101676070A CN102236445A (en) | 2010-04-26 | 2010-04-26 | Composite board structure and cover mirror laminar structure for touch panel |
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| CN2010101676070A CN102236445A (en) | 2010-04-26 | 2010-04-26 | Composite board structure and cover mirror laminar structure for touch panel |
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| CN103226405A (en) * | 2012-11-30 | 2013-07-31 | 深圳市骏达光电有限公司 | Technology for forming leading wire of touch screen |
| WO2014161244A1 (en) * | 2013-03-30 | 2014-10-09 | 深圳欧菲光科技股份有限公司 | Single-layer touchscreen and preparation method therefor |
| US9483147B2 (en) | 2013-03-30 | 2016-11-01 | Shenzhen O-Film Tech Co., Ltd. | Monolayer touch screen and method for manufacturing the same |
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Application publication date: 20111109 |