CN102223590B - Planar loudspeaker with heat-dissipation structure and heat-dissipation method of planar loudspeaker - Google Patents
Planar loudspeaker with heat-dissipation structure and heat-dissipation method of planar loudspeaker Download PDFInfo
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- CN102223590B CN102223590B CN201010163201.5A CN201010163201A CN102223590B CN 102223590 B CN102223590 B CN 102223590B CN 201010163201 A CN201010163201 A CN 201010163201A CN 102223590 B CN102223590 B CN 102223590B
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Abstract
The invention relates to a planar loudspeaker with a heat-dissipation structure and a heat-dissipation method of the planar loudspeaker. The planar loudspeaker device comprises a driving circuit module, a planar loudspeaker and a heat conduction adapter; the planar loudspeaker comprises a pored electrode and a diaphragm, the pored electrode can vibrate the diaphragm to make a sound according to a sound signal output by the driving circuit module. The heat conduction adapter is connected with the driving circuit module and the planar loudspeaker to transfer heat generated by electronic elements of the driving circuit module to a metal body of the planar loudspeaker for heat dissipation. The invention also provides a heat-dissipation method of the planar loudspeaker, comprising the step of building a heat conduction path between the driving circuit module and the planar loudspeaker; and when the driving circuit module drives the planar loudspeaker, the diaphragm vibrates air to make a sound under the mutual action of the pored electrode and the diaphragm, and simultaneously, the heat generated by the electronic elements of the driving circuit module is dissipated through the metal body of the planar loudspeaker by air convection.
Description
Technical field
The present invention relates to a kind of flat loudspeaker device, and particularly relate to a kind of heat dissipating method that there is the flat loudspeaker device of radiator structure and utilize flat loudspeaker device.
Background technology
Vision and the sense of hearing are the most direct two kinds of sensory responses of the mankind, therefore for a long time, and the various renewable visions of development that scientists is done one's utmost and the related system of the sense of hearing.At present, be mainly still by coil-moving speaker and dominate whole market.But along with people in recent years promote day by day for the requirement of organoleptic quality, and 3C Product (Computer, communication, consumer electronics) is being pursued under short and small, frivolous prerequisite, a kind of power saving, frivolous, can be according to the loud speaker of ergonomics Demand Design, no matter be the large-sized dynamic planar loudspeakers of collocation, also be small enough to the earphone of walkman, stereosonic mobile phone, in predictable tomorrow, technology in this respect by have a large amount of need to the development of application.
Electroacoustic loud speaker classification at present is mainly divided into directly, indirec radiation type, and type of drive is probably divided into moving-coil type, piezoelectric type and electrostatic loudspeaker.Coil-moving speaker uses at present the type of the widest and technology maturation, but due to the shortcoming of its congenital framework, and cannot be by volume flattening, make, in the face of the 3C Product trend of little Ji family theater flattening more and more, will not to be inconsistent demand.
Piezo-electric loudspeaker utilizes the piezoelectric effect of voltage material, when an additional electric field is in the characteristic of material deformation that piezoelectric causes, is used for promoting vibration membrane sounding, although this loud speaker flat structure microminiaturization, restriction to some extent in sound quality.
The current market of electrostatic loudspeaker is mainly earphone and the loudspeaker of top (Hi-end), the action principle of conventional electrostatic formula loud speaker is to seize the fixed electrode of two perforates on both sides by the arms vibrating diaphragm to form a kind of capacitor, by the alternating voltage of supplying with vibrating diaphragm direct current (DC) bias and giving two fixed electrode audio frequency, the electrostatic force that utilizes positive negative electric field to occur, drives vibrating diaphragm vibration and acoustic radiating is gone out.But the bias voltage of conventional electrostatic formula loud speaker need reach hundreds of supreme kilovolts, need the enlarger of external high unit price and bulkiness, therefore cannot popularize.
Traditional technology need be to complete indivedual monomers one by one in volume production, and loud speaker has the restriction of a fixed size or external form substantially, therefore cannot manufacture effectively in a large number and reduce costs, and cannot reach in appearance the characteristics such as soft, thin, low driving voltage and deflection.
In addition,, no matter be the drive circuit module of moving-coil type, piezoelectric type or electrostatic loudspeaker, its volume is neither little, weight is not light and often occupy suitable space with weight.It is the radiator structure that comes from drive circuit module that these volumes and weight have most.
Particularly for dynamic planar loudspeakers, because it must reach larger volume and frequency response curve preferably by high voltage, high electric current and high-power type of drive, the electronic component in drive circuit module will certainly produce high heat.For fear of high heat, the general common practice is by temperature-sensitive sticker, fin and fan, to reach the object of heat radiation, to guarantee that system normally works.Yet important the stating of making every effort to light, soft, thin, low driving voltage and deflection and be dynamic planar loudspeakers asked; And the existence of temperature-sensitive sticker, fin and fan really states therewith to ask and run in the opposite direction, and fan also can produce disturbance current and noise, affects the running of dynamic planar loudspeakers and the tonequality that user hears.If can effectively remove fin, temperature-sensitive sticker, controller and actuation switch, approximately can save 35% circuit board space and 20% cost of parts.
Summary of the invention
The invention provides a kind of flat loudspeaker device with radiator structure.In this flat loudspeaker device, the heat energy that heat conduction connector directly produces the electronic component of drive circuit module, be transmitted to the electrode of dynamic planar loudspeakers, in the time of after loud speaker is activated, utilize that vibrating diaphragm vibrate air produces to stream mechanism, make loud speaker in sounding, in the lump the heat in apertured electrodes is delivered to the external world by the sound hole of apertured electrodes.In above cooling mechanism, do not need additionally to increase the heat dissipation elements such as fan, fin, temperature detecting device, actuation switch and can reach equally heat radiation function.Meanwhile, also further make flexible loud speaker and drive circuit module be integrated into a single device.
In addition, the invention provides a kind of heat dissipating method of dynamic planar loudspeakers, dynamic planar loudspeakers device at least comprises drive circuit module and dynamic planar loudspeakers, and dynamic planar loudspeakers at least comprises apertured electrodes and vibrating diaphragm.The heat dissipating method of this loud speaker comprises the following steps.Between drive circuit module and dynamic planar loudspeakers, set up heat conduction path; And when drive circuit module drives dynamic planar loudspeakers, between apertured electrodes and vibrating diaphragm, by interacting, make vibrating diaphragm vibrate air produce sound, and the metallic object of the heat energy simultaneously by the convection current of air, the electronic component of drive circuit module being produced in dynamic planar loudspeakers dispel the heat.
Accompanying drawing explanation
At this, add that accompanying drawing is so that further understanding of the present invention to be provided, and be incorporated to the present invention and form the part of this specification.Accompanying drawing illustrates embodiments of the invention and illustrates in order to explain principle of the present invention together with it.
Fig. 1 is the generalized section according to the dynamic planar loudspeakers of one embodiment of the invention;
Fig. 2 is the block schematic diagram according to the dynamic planar loudspeakers device of one embodiment of the invention;
Fig. 3 is the schematic top plan view according to the dynamic planar loudspeakers device of one embodiment of the invention;
Fig. 4 is the schematic top plan view according to the dynamic planar loudspeakers device of one embodiment of the invention;
Fig. 5 is the schematic top plan view according to the dynamic planar loudspeakers device of one embodiment of the invention;
Fig. 6 is that the dynamic planar loudspeakers device of Fig. 5 is along the generalized section of A-A ';
Fig. 7 A～Fig. 7 C is the block schematic diagram according to the drive circuit module of one embodiment of the invention;
Fig. 8 is heat dissipating method according to an embodiment of the invention.
Main element symbol description
100,100a, 100b, 100c: dynamic planar loudspeakers device
102: dynamic planar loudspeakers
110: vibrating diaphragm
112: electret layer
112a: upper surface
112b: lower surface
114: metal film electrode
120,120a, 120b, 120c: apertured electrodes
130,130c: frame supporter
140,140c: supporter
142: chamber
150: film
160,160c: sound chamber substrate
170,170c: supporter
172: tone chamber's structure
180,180a, 180b, 180c: heat conduction connector
190,190a, 190b, 190c: drive circuit module
192: dynamic planar loudspeakers drive circuit module
194: power module
196: wireless transport module
193: source of sound amplification module
193A: source of sound amplifying circuit
193B: impedance inverter circuit
Embodiment
Implement example one of them, provide a kind of dynamic planar loudspeakers device to comprise drive circuit module, dynamic planar loudspeakers and heat conduction connector, wherein heat conduction connector connects drive circuit and dynamic planar loudspeakers, with the heat that drive circuit module is produced, be transmitted to the metallic object in dynamic planar loudspeakers, for example apertured electrodes.
According to the present embodiment, dynamic planar loudspeakers comprises apertured electrodes and vibrating diaphragm, wherein vibrating diaphragm comprises electret layer and conductive electrode layer, and apertured electrodes and vibrating diaphragm be suitable for according to the audio signal of drive circuit module output, interacts and makes vibrating diaphragm vibration and produce according to this corresponding sound.
According to the present embodiment, dynamic planar loudspeakers more comprises supporter, and it is placed between electrode and vibrating diaphragm, and is circular geometry.
According to the present embodiment, heat conduction connector is connected to the apertured electrodes of dynamic planar loudspeakers.
According to the present embodiment, dynamic planar loudspeakers more comprises frame supporter, and fixedly apertured electrodes is with vibrating diaphragm in corresponding both sides for they, and heat conduction connector is connected to the frame supporter of dynamic planar loudspeakers, dispels the heat according to this by the circulation of air of vibrating diaphragm generation of vibration.
According to the present embodiment, dynamic planar loudspeakers more comprises sound chamber base material, and it is placed in vibrating diaphragm back to a side of electrode, and heat conduction connector is connected to the sound chamber base material of dynamic planar loudspeakers, dispels the heat according to this by the circulation of air of vibrating diaphragm generation of vibration.That is vibrating diaphragm and the common radiator that forms of apertured electrodes.
According to the present embodiment, heat conduction connector is clipped between apertured electrodes and sound chamber base material, dispels the heat according to this by the circulation of air of vibrating diaphragm generation of vibration.
According to the present embodiment, dynamic planar loudspeakers more comprises another apertured electrodes, and it is placed in vibrating diaphragm back to a side of electrode.
According to the present embodiment heat conduction connector be clipped in apertured electrodes and and another apertured electrodes between, by the circulation of air of vibrating diaphragm generation of vibration, dispel the heat according to this.
According to the present embodiment, the material of apertured electrodes, frame supporter, sound chamber base material and/or another apertured electrodes is metal material, nonmetallic materials or the bendable material with the capacity of heat transmission.
According to the present embodiment, drive circuit module is printed circuit board (PCB), integrated circuit or flexible PCB.
According to the present embodiment, drive circuit module comprises dynamic planar loudspeakers drive circuit, power module and wireless transport module.
According to the present embodiment, wireless transport module is the category that application technology that bluetooth (BLUETOOTH) wireless transport module, WIFI wireless transport module or other any form have a wireless transmission function all belongs to the present embodiment.
In addition, at another, implement, in example, to the invention provides a kind of heat dissipating method of loud speaker, be applicable to dynamic planar loudspeakers device, wherein dynamic planar loudspeakers device at least comprises drive circuit module and dynamic planar loudspeakers, and dynamic planar loudspeakers at least comprises apertured electrodes and vibrating diaphragm.The heat dissipating method of this loud speaker comprises the following steps.Between drive circuit module and dynamic planar loudspeakers, set up heat conduction path; And when drive circuit module drives dynamic planar loudspeakers, between apertured electrodes and vibrating diaphragm, by interacting, make vibrating diaphragm vibrate air produce sound, and the heat energy simultaneously by the convection current of air, the electronic component of drive circuit module being produced is dispelled the heat by loud speaker and metallic object thereof.
According to the present embodiment, heat conduction path is between the vibrating diaphragm that to be based upon drive circuit module be dynamic planar loudspeakers with heat dissipation element, to carry out heat conduction to engage.
According to the present embodiment, heat conduction path is to be based upon to engage carrying out heat conduction between the apertured electrodes of drive circuit module and dynamic planar loudspeakers.
According to the present embodiment, heat conduction path is to be based upon to engage carrying out heat conduction between the frame supporter of drive circuit module and dynamic planar loudspeakers, wherein frame supporter in order to fixing apertured electrodes with vibrating diaphragm in corresponding both sides.
With reference to Fig. 1, it is the generalized section according to the dynamic planar loudspeakers of one embodiment of the invention.
For the vibrating diaphragm 110 between the two-layer adjacent supporter in office of position, loud speaker 102 can have several service areas.The both sides of vibrating diaphragm 110 can define or define by different way its service area in the same manner.The tone chamber's structure illustrating can have two cavity space, to produce sympathetic response sound field or the effect of loud speaker, one of them is positioned at the top of vibrating diaphragm 110 and one and is positioned at its below.Loud speaker 102 can have a plurality of supporters, within these supporters can be designed to have specific shape and be placed on higher and lower cavity space.In one embodiment, the higher cavity space of Fig. 1 can be sound transmission aperture region, and can be tone chamber's structure 172 in the lower cavity space of the Fig. 1 on opposite, sound transmission aperture region.Space at the lower chamber between sound chamber substrate 160 and vibrating diaphragm 110 can produce via a plurality of vibrating diaphragms service area between any two adjacent tone chamber's supporters the sympathetic response sound field of loud speaker 102.
Vibrating diaphragm 110 can comprise electret layer 112 and metal film electrode 114.In certain embodiments, the upper surface 112a of electret layer 112 can electric coupling frame supporter 130 and supporter 140, and the lower surface 112b of electret layer 112 can the above-mentioned metal film electrode 114 of electric coupling.Insulating barrier (not illustrating) can be clipped between electret layer 112 and electrode 114.
When apertured electrodes 120 is consisted of the non electrically conductive material layer that plates layer of metal thin layer, this non electrically conductive material can be plastic cement, rubber, paper, nonconducting cloth (cotton fiber or polymer fiber) or other non electrically conductive material; And this metallic film can be aluminium, gold, silver, copper, nickel/golden bimetallic, tin indium oxide (Indium tin oxide; ITO), indium zinc oxide (Indium zinc oxide; IZO), the poly-dioxy ethene thiophene (Polyethylenedioxythiophene of large molecular conductive material; PEDOT) etc.; Or alloy; Or any combination of the material listing or its equivalent material.When apertured electrodes 120 is used the material of conduction, the material of this conduction can be cloth (metallic fiber, metal oxide fiber, carbon fiber or graphite fibre) of metal (iron, copper, aluminium or its alloy), conduction etc., or any combination of these materials or other materials.
Electret layer 112 can be dielectric material, and this material can be processed or charge and retain the time interval that electrostatic charge reaches a period of time or an extension, and in this material, has in electrical effect or electrostatic effect after charging.Electret layer 112 can have one or more layers dielectric layer.The example of dielectric material comprises perfluoroethylene-propylene (Fluorinated hylenepropylene; FEP), polytetrafluoroethylene (Polytetrafluoethylene; PTFE), polyvinylidene fluoride (Polyvinylidene fluoride; PVDF), fluoropolymer material or other suitable material.Above-mentioned dielectric material can comprise the hole with micron grade or nano-scale diameter.Because electret layer 112 can retain electrostatic charge for an extension time interval, and can have piezoelectric property after accepting charging process, so the hole in vibrating diaphragm can be promoted the piezoelectric property of transmitting and strengthening this material.In one embodiment, at corona charging (Coronacharging), can produce afterwards bipolarity electric charge (Dipolar charges) and remain in dielectric material to produce in electrical effect or electrostatic effect.
For good tension force and/or the dither effect of vibrating diaphragm 110 are provided, metal film electrode 114 can be very thin metal film electrode.For instance, its thickness can be between 0.2 micron and 0.8 micron or between 0.2 micron and 0.4 micron.Can be about 0.3 micron in certain embodiments.The range scale illustrating is considered as " ultra-thin " conventionally.
The electret layer 112 that act has negative electrical charge is example, when supplying input audio signal to the pertusate apertured electrodes 120 of tool and metal film electrode 114, the positive voltage of input signal can produce attraction to the negative electrical charge of vibrating diaphragm, and the negative voltage of input signal can produce repulsive force to the negative electrical charge of this element, thereby vibrating diaphragm 110 is moved with a direction.Relatively, when the voltage-phase of input sound source signal changes, similarly positive voltage can produce attraction to the negative electrical charge of vibrating diaphragm, and negative voltage can produce repulsive force to the negative electrical charge of this element, thereby vibrating diaphragm 110 is moved with the opposite direction of direction described in leading portion.Vibrating diaphragm can repeatedly move around and vibrocompression surrounding air, with the interaction of the different power of the direction via different, produces sound.In other words, apertured electrodes and vibrating diaphragm be according to audio signal, interacts and make vibrating diaphragm vibration and produce according to this corresponding sound.
In one embodiment, film 150 can cover one side or the both sides of loud speaker 102.Film 150 can be ventilative but waterproof, for example, by comprising expanded PTFE (Expandedpolytetrafluoroethylene; EPTFE) etc. GORE-TEX
film forms.GORE-TEX
or the effect of similar material energy prevention of water and oxygen, thereby avoid electret layer 112 its electric charges of leakage and reduce it and stay electrical effect.
A plurality of service areas of vibrating diaphragm 110 can be formed between any two adjacent supporters 140 and between above-mentioned apertured electrodes 120 and vibrating diaphragm 110.These service areas of higher chamber 142 can be in order to produce the sympathetic response sound field of loud speaker 102.A plurality of service areas of vibrating diaphragm 110 can be formed between any two adjacent supporters 170 and between sound chamber substrate 160 and vibrating diaphragm 110.These service areas of lower chamber 172 also can be in order to produce the sympathetic response sound field of loud speaker 102.In both chambers of adjustable support body 140 and supporter 170, position, height and shape are as a part for loudspeaker design.In addition, the number of supporter 170 can be greater than, be equal to or less than the number of supporter 140, and can directly manufacture supporter 140 or supporter 170 on apertured electrodes 120 or sound chamber substrate 160 or above it.
Tone chamber's structure approaches the surface of the metal film electrode 114 of vibrating diaphragm 110, can be by considering the acoustic characteristic of loud speaker or the factor of other the sense of hearing or structure is designed.Tone chamber can comprise sound-absorbing material; And supporter or tone chamber's supporter can be designed to various shapes.Space, the formed chamber of frame supporter 130 can have sound hole among frame supporter 130, to discharge the pressure of the sound producing, and in some example, produces good sound field effect.
The drive circuit module of supplying with apertured electrodes 120 voltages can and be electrically connected to dynamic planar loudspeakers 102 independences.Thus, the drive circuit module that comprises heat dissipation element adds that the overall weight of dynamic planar loudspeakers 102 and volume will be not little.Therefore, the present invention proposes a kind of dynamic planar loudspeakers device, dynamic planar loudspeakers and drive circuit module is integrated, and saved heat dissipation element in drive circuit module, to reduce overall weight and volume.
This figure illustrated embodiment is double-tone chamber, and the present invention also can be single-tone chamber, that is remove tone chamber 172.
Please refer to Fig. 2, it is the block schematic diagram according to the dynamic planar loudspeakers device of one embodiment of the invention.According to this embodiment, dynamic planar loudspeakers device 100 comprises above-mentioned dynamic planar loudspeakers 102, drive circuit module 190 and heat conduction connector 180, wherein the arrow in Fig. 2 means heat conducting direction, the heat that instant heating conduction connector 180 can produce drive circuit module 190 conduct to the metallic object in dynamic planar loudspeakers 102, with the metallic object by dynamic planar loudspeakers 102 by heat dissipation.Wherein, the material of heat conduction connector 180 is Heat Conduction Material; In Heat Conduction Material and the capacity of heat transmission of this definition, refer to that the coefficient of heat conduction is higher than 0.5 watt/meter * degree (Watt/Meter * Kelven; Abbreviation W/m * K) ability that material and this type of material have.According to one embodiment of the invention, the conductive coefficient of heat conduction connector 180 is higher than 10W/m * K; According to another embodiment of the present invention, the conductive coefficient of heat conduction connector 180 is higher than 100W/m * K.In addition, heat conduction connector 180 can be arbitrary structures.For instance, heat conduction connector 180 can be screw, thermal grease, fin or any structure with capacity of heat transmission.
In order to allow the heat of drive circuit module 190 be conducted to smoothly heat conduction connector 180 and dynamic planar loudspeakers 102, the area of drive circuit module 190 and the contact surface of heat conduction connector 180 be greater than drive circuit module 190 area 25%.According to one embodiment of the invention, the area of this contact surface be greater than drive circuit module 190 area 50%; According to another embodiment of the present invention, the area of this contact surface be greater than drive circuit module 190 area 75%.
Please refer to Fig. 3, it is the schematic top plan view according to the dynamic planar loudspeakers device of one embodiment of the invention.According to this embodiment, the drive circuit module 190a of dynamic planar loudspeakers device 100a conducts by heat the apertured electrodes 120a that connector 180a is connected to dynamic planar loudspeakers.Thus, the heat that electronic component in drive circuit module 190a produces is just able to conduct connector 180a by heat and conducts to the metallic object in dynamic planar loudspeakers, metallic object is for example his metallic object of apertured electrodes or phase, then by apertured electrodes 120a or other hardware loss of dynamic planar loudspeakers.When heat is conducted to after apertured electrodes 120a, the cross-ventilation that while utilizing dynamic planar loudspeakers sounding, vibrating diaphragm vibrate air produces, when making loud speaker sounding, walks the torrid zone in passing, reaches the effect of heat radiation.
Although according to this embodiment, heat conduction connector 180a connects apertured electrodes 120a, the present invention is not as limit; Heat conduction connector 180a can be connected to other elements of dynamic planar loudspeakers, and for example frame supporter or the substrate of sound chamber, dispels the heat by the circulation of air of vibrating diaphragm generation of vibration according to this.
The present invention is the configuration mode with heat conduction connector about drive circuit module, is not only applicable to rigid thin, planar loud speaker; It is also applicable to soft thin, planar loud speaker, and as shown in Figure 4, it is the schematic top plan view according to the dynamic planar loudspeakers device of one embodiment of the invention.According to this embodiment, the drive circuit module 190b of dynamic planar loudspeakers device 100b conducts by heat the side that connector 180b is connected to dynamic planar loudspeakers.Wherein, the apertured electrodes 120b of dynamic planar loudspeakers, frame supporter and the substrate of sound chamber are except can be metal material, it also can be nonmetallic materials or the bendable material with the capacity of heat transmission, so dynamic planar loudspeakers device 100b integral body has flexible characteristic.By above-mentioned configuration, the heat that the electronic component of drive circuit module 190b produces just can be conducted the metallic object that connector 180b conducts to dynamic planar loudspeakers by heat, then by apertured electrodes 120b or other hardware loss of dynamic planar loudspeakers.When heat is conducted to after apertured electrodes 120b, the cross-ventilation that while utilizing dynamic planar loudspeakers sounding, vibrating diaphragm 110b vibrate air produces, when making loud speaker sounding, in passing heat is carried out to heat exchange by the surface of apertured electrodes 120b or sound hole or sound hole periphery and the external world, reach the effect of heat radiation.
Although according to this embodiment, heat conduction connector 180b connects apertured electrodes 120b, the present invention is not as limit; Heat conduction connector 180b can be connected to other elements of dynamic planar loudspeakers, for example frame supporter or the substrate of sound chamber.
In addition, except drive circuit module and heat conduction connector being disposed at the upper and lower or side of dynamic planar loudspeakers, also drive circuit module and heat conduction connector can be disposed in dynamic planar loudspeakers, as shown in Fig. 5 and Fig. 6.Wherein Fig. 5 is the schematic top plan view according to the dynamic planar loudspeakers device of one embodiment of the invention, and the dynamic planar loudspeakers device that Fig. 6 is Fig. 5 is along the generalized section of A-A '.
Referring to Fig. 5 and Fig. 6, according to this embodiment, the drive circuit module 190c of dynamic planar loudspeakers device 100c conducts connector 180c by heat, in hot linked mode, is clipped between apertured electrodes 120c and sound chamber substrate 160c.Wherein, the apertured electrodes 120c of dynamic planar loudspeakers, frame supporter 130c and sound chamber substrate 160c are except can be metal material, and it also can be nonmetallic materials or the bendable material with the capacity of heat transmission.By above-mentioned configuration, the heat energy that the electronic component in drive circuit module 190c produces just can conduct apertured electrodes 120c and the sound chamber substrate 160c that connector 180c conducts to dynamic planar loudspeakers by heat.When heat is conducted to after apertured electrodes 120c, the cross-ventilation that while utilizing dynamic planar loudspeakers sounding, vibrating diaphragm vibrate air produces, when making loud speaker sounding, convection current air is walked the torrid zone in passing, reaches the effect of heat radiation.
Although according to this embodiment, heat conduction connector 180c connects apertured electrodes 120c and sound chamber substrate 160c, the present invention is not as limit.Heat conduction connector 180c can be connected to other elements of dynamic planar loudspeakers, for example frame supporter 130c; If utilize another apertured electrodes to replace sound chamber substrate 160c, drive circuit module 190c and heat conduction connector 180c are clipped between two apertured electrodes, dispel the heat according to this by the circulation of air of vibrating diaphragm generation of vibration.
Although according to this embodiment, drive circuit module 190c conducts with heat the side that connector 180c is positioned over dynamic planar loudspeakers device 100c, the present invention is not as limit.Drive circuit module 190c conducts with heat central authorities or other regions that connector 180c also can be positioned over dynamic planar loudspeakers device 100c.
Dynamic planar loudspeakers device in above-described embodiment, except receiving by the mode of wire transmission sound source signal and operational order, also can receive by the mode of wireless transmission.For instance, drive circuit module 190 is as shown in Figure 7 A except comprising that dynamic planar loudspeakers drive circuit module 192 is with power module 194, more can comprise wireless transport module 196, and for example bluetooth (BLUETOOTH) wireless transport module, WIFI wireless transport module or other any form have the application technology of wireless transmission function for they.Thus, user only need have the electronic product of wireless transmission function by mobile phone, PC or digital walkman etc., can dial easily and put the music on, and goes to that and hears that, realizes the irrealizable special applications situation of traditional acoustics.
And as shown in Figure 7 B, this dynamic planar loudspeakers drive circuit module 192 can comprise a source of sound amplification module 193 in one embodiment, in order to receive a sound source signal, and the heat conduction framework by the present embodiment is sent to the metallic object in dynamic planar loudspeakers after amplification.In addition, as shown in Fig. 7 C, this source of sound amplification module 193 at least comprises a source of sound amplifying circuit 193A in one embodiment, or at least comprise two kinds of combinations of source of sound amplifying circuit 193A and impedance inverter circuit 193B one of them.Impedance inverter circuit 193B is comprised of at least more than one transformer.
In addition, the invention provides a kind of heat dissipating method of loud speaker, be applicable to dynamic planar loudspeakers device, wherein dynamic planar loudspeakers device at least comprises drive circuit module and dynamic planar loudspeakers, and dynamic planar loudspeakers at least comprises apertured electrodes and vibrating diaphragm.This loud speaker cooling control method comprises the following steps.Between drive circuit module and dynamic planar loudspeakers, set up heat conduction path; And when drive circuit module drives dynamic planar loudspeakers, between apertured electrodes and vibrating diaphragm, by interacting, make vibrating diaphragm vibrate air produce sound, and the heat energy simultaneously by the convection current of air, the electronic component of drive circuit module being produced is dispelled the heat by loud speaker and metallic object thereof.That is vibrating diaphragm and the common radiator that forms of apertured electrodes.
At this, between drive circuit module and dynamic planar loudspeakers, set up heat conduction path that is by direct or indirect mode, make the heat energy of the electronic component of drive circuit module be conducted to the metallic object of dynamic planar loudspeakers.For instance, the area of the contact surface of drive circuit module and dynamic planar loudspeakers, or the area of the contact surface of drive circuit module and the heat between drive circuit module and dynamic planar loudspeakers conduction connector, be greater than drive circuit module area 25%.According to one embodiment of the invention, indivedual areas of these a little contact surfaces be greater than drive circuit module area 50%; According to another embodiment of the present invention, indivedual areas of these a little contact surfaces be greater than drive circuit module area 75%.Above bonding drive circuit module engages with the i.e. so-called heat conduction of mode of dynamic planar loudspeakers.
According to one embodiment of the invention, heat conduction path is between the vibrating diaphragm that to be based upon drive circuit module be dynamic planar loudspeakers with heat dissipation element, to carry out heat conduction to engage.
According to one embodiment of the invention, heat conduction path is to be based upon to engage carrying out heat conduction between the apertured electrodes of drive circuit module and dynamic planar loudspeakers.
According to one embodiment of the invention, heat conduction path is to be based upon to engage carrying out heat conduction between the frame supporter of drive circuit module and dynamic planar loudspeakers, wherein frame supporter be in order to fixing apertured electrodes with vibrating diaphragm in corresponding both sides.
Except the heat dissipating method of above loud speaker, the present invention also provides the method for a regulation and control rate of heat dispation.In general, for example, if will decide according to the power output of the electronic component in drive circuit module and the heat of sending the rate of heat dispation of active heat removal element (fan), most must detecting by temperature-sensitive sticker.When power output higher, the heat that electronic component of drive circuit module sends also can be more, after extra heat is sensed by temperature-sensitive sticker, temperature-sensitive sticker can output signal to drive circuit module, makes drive circuit module increase the rate of heat dispation of active heat removal element.Yet, according to one embodiment of the invention, need not be by any temperature-sensitive sticker, any current sensor, also can reach equally above automatic back coupling mechanism with any voltage-sensor.Please refer to Fig. 8, its be according to an embodiment of the invention heat radiation method, wherein active heat removal element is in dynamic planar loudspeakers, to have the vibrating diaphragm of the function of speaking concurrently, and drive circuit module and dynamic planar loudspeakers independent of one another.Be different from Fig. 2, the arrow in Fig. 8 refers to the flow process of step herein, but not heat conducting direction.When drive circuit module increases its power output (step 202), the heat of its generation also can increase (step 204), and the amplitude of vibrating diaphragm and/or vibration frequency also can raise (step 206), therefore the air velocity that vibrating diaphragm drives also can increase, and then improve rate of heat dispation (step 208), and the temperature (step 210) that reduces dynamic planar loudspeakers and adjacent drive circuit module.In this so-called rate of heat dispation, can be defined as the heat-sinking capability of heat dissipation element, or the efficiency of the actual loss heat energy of heat dissipation element.
Comprehensively above-mentioned, the cross-ventilation that the dynamic planar loudspeakers device in above embodiment with radiator structure produces while directly utilizing dynamic planar loudspeakers sounding reaches the object of heat radiation.This measure not only can reduce hardware space and the manufacturing cost of drive circuit module, is more conducive to integrate dynamic planar loudspeakers and drive circuit module, to reach real frivolous and integrated conformability new product.In addition, also can pass through mobile phone, personal digital assistant or digital walkman, directly voice signal is sent to dynamic planar loudspeakers device and dial and put.By this invention, dynamic planar loudspeakers is played the part of prior role on following Sound design.
Although disclosed the present invention in conjunction with above embodiment; yet it is not in order to limit the present invention; under any, in technical field, be familiar with this operator; without departing from the spirit and scope of the present invention; can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (17)
1. a dynamic planar loudspeakers device with radiator structure, comprising:
Drive circuit module;
Dynamic planar loudspeakers, comprising:
Apertured electrodes;
At least one in frame supporter and sound chamber base material; And
Vibrating diaphragm, wherein this apertured electrodes and this vibrating diaphragm be according to a voice signal of this drive circuit module output, interacts and make this vibrating diaphragm vibration and produce according to this corresponding sound;
Heat conduction connector, it connects this apertured electrodes or this frame supporter or this sound chamber base material in this drive circuit module and this dynamic planar loudspeakers, with the heat that this drive circuit module is produced, be transmitted to this dynamic planar loudspeakers, with the air stream by vibrating diaphragm generation of vibration, dispel the heat.
2. the dynamic planar loudspeakers device with radiator structure as claimed in claim 1, wherein this dynamic planar loudspeakers also comprises supporter, it is placed between this electrode and this vibrating diaphragm.
3. the dynamic planar loudspeakers device with radiator structure as claimed in claim 1, wherein this vibrating diaphragm comprises electret layer and conductive electrode layer.
4. the dynamic planar loudspeakers device with radiator structure as claimed in claim 1, wherein this frame supporter fix this apertured electrodes with this vibrating diaphragm in corresponding both sides.
5. the dynamic planar loudspeakers device with radiator structure as claimed in claim 1, wherein this sound chamber base material is placed in this vibrating diaphragm back to a side of this electrode.
6. the dynamic planar loudspeakers device with radiator structure as claimed in claim 5, wherein this heat conduction connector is clipped between this apertured electrodes and this sound chamber base material.
7. the dynamic planar loudspeakers device with radiator structure as claimed in claim 1, wherein also comprises another apertured electrodes, and it is placed in this vibrating diaphragm back to a side of this electrode.
8. the dynamic planar loudspeakers device with radiator structure as claimed in claim 7, wherein this heat conduction connector is clipped between this apertured electrodes and this another apertured electrodes.
9. the dynamic planar loudspeakers device with radiator structure as claimed in claim 1, wherein this drive circuit module at least comprises a source of sound amplification module.
10. the dynamic planar loudspeakers device with radiator structure as claimed in claim 1, wherein this dynamic planar loudspeakers drive circuit module at least comprises that a source of sound amplifies mould certainly and an impedance inverter circuit.
The 11. dynamic planar loudspeakers devices with radiator structure as claimed in claim 10, wherein this impedance inverter circuit comprises at least more than one transformer.
The 12. dynamic planar loudspeakers devices with radiator structure as claimed in claim 1, wherein this drive circuit module comprises dynamic planar loudspeakers drive circuit module, power module and wireless transport module.
The heat dissipating method of 13. 1 kinds of loud speakers, be applicable to a dynamic planar loudspeakers device, wherein this dynamic planar loudspeakers device at least comprises driving circuit module and a dynamic planar loudspeakers, this dynamic planar loudspeakers at least comprises at least one and the vibrating diaphragm in an apertured electrodes, frame supporter and sound chamber base material, and the heat dissipating method of this loud speaker comprises:
Between this drive circuit module and this dynamic planar loudspeakers, via this apertured electrodes, this frame supporter or this sound chamber base material, set up heat conduction path; And
When this drive circuit module drives this dynamic planar loudspeakers, between this apertured electrodes and this vibrating diaphragm, by interacting, make this vibrating diaphragm vibrate air produce sound, and the heat energy simultaneously by the convection current of this air, the electronic component of this drive circuit module being produced is dispelled the heat by loud speaker and metallic object thereof.
The heat dissipating method of 14. loud speakers as claimed in claim 13, wherein this heat conduction path is to be based upon to engage carrying out heat conduction between this vibrating diaphragm of this drive circuit module and this dynamic planar loudspeakers.
The heat dissipating method of 15. loud speakers as claimed in claim 13, wherein this heat conduction path is to be based upon to engage carrying out heat conduction between this apertured electrodes of this drive circuit module and this dynamic planar loudspeakers.
The heat dissipating method of 16. loud speakers as claimed in claim 13, wherein this heat conduction path is to be based upon to engage carrying out heat conduction between a frame supporter of this drive circuit module and this dynamic planar loudspeakers, wherein this frame supporter in order to fix this apertured electrodes with this vibrating diaphragm in corresponding both sides.
17. 1 have the dynamic planar loudspeakers device of radiator structure, comprising:
Drive circuit module, comprises that source of sound amplification module or source of sound amplification module and impedance transformation module form, and wherein this impedance transformation module comprises that one or more transformer forms;
Dynamic planar loudspeakers, comprising:
Apertured electrodes, most supporting body structure, and vibrating diaphragm, wherein this apertured electrodes and this vibrating diaphragm be according to a voice signal of this drive circuit module output, interacts and make this vibrating diaphragm vibration and produce according to this corresponding sound; And
Heat conduction connector, connects this drive circuit module and this dynamic planar loudspeakers.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010163201.5A CN102223590B (en) | 2010-04-14 | 2010-04-14 | Planar loudspeaker with heat-dissipation structure and heat-dissipation method of planar loudspeaker |
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| CN201010163201.5A CN102223590B (en) | 2010-04-14 | 2010-04-14 | Planar loudspeaker with heat-dissipation structure and heat-dissipation method of planar loudspeaker |
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Cited By (1)
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| TWI580278B (en) * | 2015-07-03 | 2017-04-21 | 富祐鴻科技股份有限公司 | Electrostatic headphones sound structure |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104735949B (en) * | 2013-12-19 | 2019-02-05 | 中兴通讯股份有限公司 | Driving device, radiator, method and the mobile terminal of Loudspeaker diaphragm coil |
| CN203722986U (en) * | 2014-01-03 | 2014-07-16 | 中兴通讯股份有限公司 | Mobile terminal |
| CN105430124B (en) * | 2015-10-28 | 2019-03-05 | 努比亚技术有限公司 | A kind of terminal and heat dissipating method |
| CN105549946A (en) * | 2015-12-08 | 2016-05-04 | 深圳天珑无线科技有限公司 | Intelligent audio system |
| CN106162391A (en) * | 2016-08-09 | 2016-11-23 | 青岛海信移动通信技术股份有限公司 | Mobile terminal |
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| CN101370374A (en) * | 2008-09-25 | 2009-02-18 | 杨敏 | Silent cooling system |
| CN101656906A (en) * | 2008-08-20 | 2010-02-24 | 财团法人工业技术研究院 | Speaker monomer structure |
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| CN101656906A (en) * | 2008-08-20 | 2010-02-24 | 财团法人工业技术研究院 | Speaker monomer structure |
| CN101370374A (en) * | 2008-09-25 | 2009-02-18 | 杨敏 | Silent cooling system |
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| TWI580278B (en) * | 2015-07-03 | 2017-04-21 | 富祐鴻科技股份有限公司 | Electrostatic headphones sound structure |
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