CN102194809A - Large-area light-emitting diode module and packaging method thereof - Google Patents
Large-area light-emitting diode module and packaging method thereof Download PDFInfo
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- CN102194809A CN102194809A CN2010101220782A CN201010122078A CN102194809A CN 102194809 A CN102194809 A CN 102194809A CN 2010101220782 A CN2010101220782 A CN 2010101220782A CN 201010122078 A CN201010122078 A CN 201010122078A CN 102194809 A CN102194809 A CN 102194809A
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Abstract
The invention discloses a large-area light-emitting diode module and a packaging method thereof. A light source shape is elastically configured, the light-emitting area can be freely expanded and shadow duplication can be prevented. The large-area light-emitting diode module comprises a base provided with a groove, a plurality of light source base plate components, a silica gel diffusion layer and a fluorescent layer, wherein certain light source base plate component comprise a circuit base plate and at least one crystal particle; the crystal particle is arranged on the surface of the circuit base plate; the circuit base plate of each light source base plate is arranged adjacent to the bottom of the groove, and is electrically coupled with the groove; the silica gel diffusion layer is filled in the groove, and covers the light source base plate component; and the fluorescent layer is arranged on the surface of the silica gel diffusion layer.
Description
Technical field
The present invention relates to a kind of light-emitting diode (LED) module, refer to a kind of large area light emitting diode module and method for packing thereof especially, be applicable to the planar light source of making even bright dipping, but elasticity configuration light source form and expansion light-emitting area.
Background technology
Light-emitting diode possesses that power consumption is low, long service life, need not warm up excellent properties such as lamp time, reaction time is quick, and being seen everywhere in the life, it uses commodity.1996, the appearance of white light emitting diode was opened the illumination of light-emitting diode and has been used the epoch.
Package structure for LED mainly can be divided into single-chip package and the multicore sheet encapsulates two types.Single-chip package is that single LED crystal particle is encapsulated as a light emitting-type assembly, when being applied to lighting apparatus, many pieces of assemblies must be installed, to reach the brightness of illumination demand on substrate.The light emitting diode light group lighting that Taiwan patent M354700 patent is disclosed is a kind of typical LED source, Fig. 1 is the stereogram of this LED source, as shown in the figure, lighting 10 is provided with the many pieces of light-emitting diode components 11 that are arranged as the matrix kenel, because each light-emitting diode component 11 can emit beam towards different directions and angle, to produce multiple shadow, therefore must additionally set up guard shield 12 adjusts the light directive.The also common employing lens of other existing example are reached the secondary light-distribution function, and industry drops into considerable design resource in the secondary light-distribution field at present, so that more suitable lighting apparatus to be provided.Yet light distribution structure will increase the lighting apparatus cost.In addition, some light-emitting diode (led) assembly exists luminous efficiency to cross low and shortcoming such as radiating efficiency is not good, though therefore can be combined into the conventional bulb brightness of illumination, invalid energy waste is still too high.
The encapsulation of multicore sheet then is to adopt COB (Chip On Board) technology, and many pieces of LED crystal particle are packaged in single substrate, becomes the surface-emitting type luminescence component.Though multicore sheet encapsulation technology has been improved the shortcoming of single-chip point luminescence component, is limited to the factor of productions such as manufacturing equipment and structure technology, and can't break through the size of components restriction, cause bright dipping length and area to further expand.
Continue under the situation of rising in energy prices and environmental requirement, the led lighting market scale will continue to promote, thereby improve above-mentioned shortcoming, promote the lighting apparatus quality, be the task of top priority in fact.In view of this, this case inventor based on for many years in the research and development experience in light-emitting diode manufacturing equipment and light-source system structure field, thereby the present invention is proposed, to improve every shortcoming of prior art.
Summary of the invention
Main purpose of the present invention is to be to provide a kind of large area light emitting diode module and method for packing thereof, with elasticity configuration light source form and freely expand light-emitting area and prevent the shadow overlapping.
For reaching above-mentioned purpose, the present invention discloses a kind of large area light emitting diode module, comprises a base, a plurality of light source substrate assembly, a silica gel diffusion layer and a fluorescence coating.Base comprises a groove; These light source substrate assemblies comprise a circuit substrate and at least one crystal grain individually, and crystal grain is to be arranged at the circuit substrate surface, and the circuit substrate of light source substrate assembly is that adjacency is disposed at groove floor, and mutual electric property coupling; The silica gel diffusion layer is filled in the groove, covers the light source substrate assembly; Fluorescence coating is arranged at silica gel diffusion layer surface.
Wherein, the circuit substrate of these light source substrate assemblies is that permutation and combination is the groove floor contour shape that roughly meets base.
Wherein, the crystal grain of these light source substrate assemblies is to be evenly distributed.
The present invention discloses a kind of method for packing of large area light emitting diode module again, and its step provides a base at first, and this base has a groove; Secondly, provide a plurality of light source substrate assembly adjacent rows to list in groove floor, wherein the light source substrate assembly comprises a circuit substrate and at least one crystal grain individually, and crystal grain is to be arranged at the circuit substrate surface; Thereafter, the circuit substrate of these light source substrate assemblies of electric property coupling; Subsequently, a silica gel diffusion layer is set in groove, makes the silica gel diffusion layer cover the light source substrate assembly; At last, in silica gel diffusion layer surface one fluorescence coating is set.
The present invention is by arranging a plurality of light source assemblies according to the configuration of base contour shape, silica gel diffusion layer and fluorescence coating are set in regular turn again, and the exterior design by base and light source substrate assembly, but elasticity configuration light source form with freely expand light-emitting area, and prevent the shadow overlapping.Preferable, the crystal grain of all light source assemblies of base is evenly distributed, can present the flat luminous effect of even bright dipping, can promote luminous efficiency and prevent that shadow from overlapping.Further, the present invention also can utilize the metal substrate of tool high heat dissipation efficiency to improve the heat dissipation of this large area light emitting diode module.
Description of drawings
Fig. 1 is the stereogram for the LED source of a prior art;
Fig. 2 is the front view for first specific embodiment of large area light emitting diode module of the present invention;
Fig. 3 is the cutaway view for Fig. 2;
Fig. 4 is the stereogram for the base of Fig. 2;
Fig. 5 is the flow chart of steps for the method for packing of large area light emitting diode module of the present invention; And
Fig. 6 is the front view for second specific embodiment of large area light emitting diode module of the present invention.
Specific embodiment
Below in conjunction with Figure of description the specific embodiment of the present invention is done detailed description.
The present invention proposes a kind of large area light emitting diode module and method for packing thereof, aims to provide the planar light source manufacturing technology of even bright dipping.By the technological concept of this case, but elasticity is disposed light source form and freely expands light-emitting area.
The design feature of large area light emitting diode module of the present invention at first is described.See also Fig. 2 to Fig. 4, be respectively front view, the cutaway view of first specific embodiment of this case, and the stereogram of base.As shown in the figure, large area light emitting diode module 20 comprises a base 30, a plurality of light source assembly 41,42,43, a reflector 51, a silica gel diffusion layer 53 and a fluorescence coating 55.
Circuit substrate 410,420,430 surfaces of frame 33 inner wall surface and crystal grain 411,421,431 peripheries are coated with reflectorised paint, to form a reflector layer 51.The groove 32 inner silica gel of sneaking into spread powder of filling, the process oven dry is solidified and is formed a silica gel diffusion layer 53, is covered in light source substrate assembly 41,42,43 tops.The silica gel of fluorescent material are sneaked on silica gel diffusion layer 53 surface evenly coating, solidify and form a fluorescence coating 55 through oven dry.
The main feature of this case is for roughly meeting groove 32 bottom profile shapes with circuit substrate 410,420,430 permutation and combination, crystal grain 411,421,431 is evenly distributed, thereby make the 20 even bright dippings of large area light emitting diode module, needn't additionally set up the secondary light-distribution structure, and but simplified apparatus reduces cost.Moreover, by the contour structures design of base and circuit substrate, but with elasticity configuration light source form and free expansion light source lighting area or length.In addition, existing light emitting diode lighting equipment must adopt High Power LED to reach the brightness of illumination of demand, this case then uses many pieces of low-power LED crystal particle combinations to reach demand brightness, so can effectively reduce energy loss and promote heat dissipation.
Subsidiary one carry be, large area light emitting diode module 20 is in order to produce the illumination white light, LED crystal particle 411,421,431 will produce white light by the fluorescence coating 55 that is doped with fluorescent material, in other embodiments, also can adopt the fluorescent material of yellow fluorescent powder, red/green glow or other combination that blue light-emitting diode crystal grain cooperates yttrium-aluminium-garnet producing the light of various color, or can adopt ultraviolet light-emitting diodes crystal grain to cooperate the fluorescent material of red/green/blue light or other combination to do various combinations and then produce the light of various color.
Go on to say the method for packing of large area light emitting diode module of the present invention.See also Fig. 5, the flow chart of steps of method for packing of the present invention, wherein Xiang Guan CONSTRUCTED SPECIFICATION please be simultaneously with reference to Fig. 2 to Fig. 4.As shown in the figure, the method for packing of described large area light emitting diode module comprises the following steps:
At first, provide a base 30, base 30 is to be made of jointly base plate 32 and frame 33, and frame 33 is the common grooves 31 (step S11) that form with base plate 32;
Secondly, provide a plurality of light source substrate assembly 41,42,43 adjacent rows to list in groove 32 bottoms of base 30, but circuit substrate 410,420,430 permutation and combination of light source substrate assembly 41,42,43 are for roughly meeting groove 31 bottom profile shapes, and make crystal grain 411,421,431 be evenly distributed (step S12);
Thereafter, by soldering group composite electrode portion 412,422,432, with the circuit substrate 410,420,430 (step S13) of electric property coupling adjacency;
Thereafter, in frame 33 inner wall surface of base 30 and circuit substrate 410,420, the 430 surface spraying reflectorised paints of crystal grain 411,421,431 peripheries, to form a reflector layer 51 (step S14);
, in groove 31 fill the silica gel of sneaking into spread powder, solidify,, be covered in light source substrate assembly 41,42,43 surfaces (step S15) one silica gel diffusion layer 53 to be set in groove 31 inside through oven dry thereafter; And
At last, sneak into the silica gel of fluorescent material in silica gel diffusion layer 53 surface coated, so that a fluorescence coating 55 (step S16) to be set in silica gel diffusion layer 53 surfaces.
Ben is that among first embodiment, base 30 is to be strip structure, adopts three pieces of light source substrate assemblies 41,42,43 that are similarly strip to be combined into large area light emitting diode module 20.By the notion that this case proposed, then can be by the structure external form of conversion base and circuit substrate, with light source form and the lighting area of obtaining demand.See also Fig. 6, the front view of second specific embodiment of large area light emitting diode module of the present invention.Among this embodiment, large area light emitting diode module 80 is a rectangular shaped light source, be that four light source substrate assemblies 81,82,83,84 are set above rectangular base 70, its other circuit substrate the 810,820,830, the 840th, rectangular, crystal grain 811,821,831,841 then is staggered to be arranged, by electrode part 812,822,832, the 842 mutual electric property couplings that are arranged at each substrate periphery.
In other embodiment, be base designs can be circular, square or other given shape, cooperate circuit substrate to be combined into given shape, above legend is the basic conception in order to explanation this case, so it is not the protection range in order to restriction this case.
In sum, the large area light emitting diode module and the method for packing thereof of this case, but elasticity configuration light source form and expansion light-emitting area, and can reach the flat luminous effect of even bright dipping, prevent that shadow from overlapping, simplify the lighting apparatus structure, and can promote luminous efficiency and heat dissipation, meet the requirement of carbon reduction.This shows that the present invention is that a big innovation of led lighting application breaks through in fact.
More than; only be preferred embodiment of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range that claim was defined.
Claims (10)
1. a large area light emitting diode module is characterized in that, comprising:
One base comprises a groove;
A plurality of light source substrate assemblies comprise a circuit substrate and at least one crystal grain individually, and this crystal grain is arranged at this circuit substrate surface, and the circuit substrate adjacency of each light source substrate assembly is disposed at this groove floor, and mutual electric property coupling;
One silica gel diffusion layer is filled in this groove, covers these light source substrate assemblies; And
One fluorescence coating is arranged at this silica gel diffusion layer surface.
2. large area light emitting diode module as claimed in claim 1, it is characterized in that, the circuit substrate of each light source substrate assembly is selected from the one kind of substrate of being made up of metal substrate, ceramic substrate and flexible base plate of a group, and arrangement is combined as this groove floor contour shape that roughly meets this base.
3. large area light emitting diode module as claimed in claim 1 is characterized in that, this base comprises a base plate and a frame, and this frame is arranged at the side of this substrate, forms this groove jointly.
4. large area light emitting diode module as claimed in claim 3 more comprises a reflector layer, is arranged at this frame inner wall surface, and the circuit substrate surface of the crystal grain periphery of each light source substrate assembly.
5. large area light emitting diode module as claimed in claim 1, it is characterized in that, the circuit substrate of these light source substrate assemblies is provided with an electrode part individually, and the light source substrate assembly of adjacency is welded to each other combination with the electrode part of circuit substrate in these light source substrate assemblies.
6. large area light emitting diode module as claimed in claim 1 is characterized in that the crystal grain of these light source substrate assemblies is evenly distributed.
7. the method for packing of a large area light emitting diode module is characterized in that, comprises the following steps:
One base is provided, and this base has a groove;
Provide a plurality of light source substrate assembly adjacent rows to list in this groove floor, wherein these light source substrate assemblies comprise a circuit substrate and at least one crystal grain individually, and this crystal grain is arranged at this circuit substrate surface;
The circuit substrate of these light source substrate assemblies of electric property coupling;
One silica gel diffusion layer is set in this groove, makes this silica gel diffusion layer cover these light source substrate assemblies; And
In this silica gel diffusion layer surface one fluorescence coating is set.
8. the method for packing of large area light emitting diode module as claimed in claim 7, it is characterized in that, the circuit substrate of these light source substrate assemblies is provided with an electrode part individually, in the circuit substrate step of these light source substrate assemblies of electric property coupling, be the electrode part of light source substrate assembly other circuit substrate of welding combination adjacency.
9. the method for packing of large area light emitting diode module as claimed in claim 7 is characterized in that, this base comprises a base plate and a frame, and this frame and this base plate form this groove jointly, before the step that this silica gel diffusion layer is set, more comprise the following steps:
Circuit substrate surface in the crystal grain periphery of this frame inner wall surface and these light source substrate assemblies, the spraying reflectorised paint is to form a reflector layer.
10. the method for packing of large area light emitting diode module as claimed in claim 7, it is characterized in that, the circuit substrate of these light source substrate assemblies is selected from the one kind of substrate of being made up of metal substrate, ceramic substrate and flexible base plate of a group, and arrangement is combined as this groove floor contour shape that roughly meets this base.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101220782A CN102194809A (en) | 2010-03-11 | 2010-03-11 | Large-area light-emitting diode module and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101220782A CN102194809A (en) | 2010-03-11 | 2010-03-11 | Large-area light-emitting diode module and packaging method thereof |
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| CN102194809A true CN102194809A (en) | 2011-09-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779245A (en) * | 2014-01-12 | 2015-07-15 | 广东天下行光电有限公司 | Contiguous automobile reading lamp |
| CN111344518A (en) * | 2017-11-13 | 2020-06-26 | 电化株式会社 | Lighting device having LED lighting mounting board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1579791A (en) * | 2003-08-01 | 2005-02-16 | 富士胶片株式会社 | Light source unit |
| CN1624915A (en) * | 2003-12-03 | 2005-06-08 | 政齐科技股份有限公司 | LED luminous module |
| JP2008016797A (en) * | 2006-07-07 | 2008-01-24 | Lg Electronics Inc | Packaging sub-mount for light-emitting element and light emitting element package |
| CN201133990Y (en) * | 2007-06-04 | 2008-10-15 | 亿光电子工业股份有限公司 | Luminous diode backlight module group |
| CN201689887U (en) * | 2010-03-11 | 2010-12-29 | 许凯淳 | Large-area light-emitting diode module |
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2010
- 2010-03-11 CN CN2010101220782A patent/CN102194809A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1579791A (en) * | 2003-08-01 | 2005-02-16 | 富士胶片株式会社 | Light source unit |
| CN1624915A (en) * | 2003-12-03 | 2005-06-08 | 政齐科技股份有限公司 | LED luminous module |
| JP2008016797A (en) * | 2006-07-07 | 2008-01-24 | Lg Electronics Inc | Packaging sub-mount for light-emitting element and light emitting element package |
| CN201133990Y (en) * | 2007-06-04 | 2008-10-15 | 亿光电子工业股份有限公司 | Luminous diode backlight module group |
| CN201689887U (en) * | 2010-03-11 | 2010-12-29 | 许凯淳 | Large-area light-emitting diode module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779245A (en) * | 2014-01-12 | 2015-07-15 | 广东天下行光电有限公司 | Contiguous automobile reading lamp |
| CN111344518A (en) * | 2017-11-13 | 2020-06-26 | 电化株式会社 | Lighting device having LED lighting mounting board |
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Application publication date: 20110921 |