光刻机的双工件台系统技术领域 本发明涉及一种光刻机，且特别涉及一种具有光刻机中的双工件台系统。 BACKGROUND workpiece dual stage lithography system  The present invention relates to lithography, and more particularly relates to a two stage system, the workpiece having a lithography machine. 背景技术 在集成电路芯片的生产过程中，芯片的设计图形在硅片表面光刻胶上的曝光转印(光刻）是其中最重要的工序之一，该工序所用的设备为光刻机（曝光机）。  In the production process of an integrated circuit chip, the chip design pattern on the wafer surface exposure of the photoresist transfer (lithography) is one of the most important step in which the equipment used for the light engraving machine (exposure machine). 光刻机的分辨率和曝光效率，又在很大程度上决定了光刻机的分辨率和曝光效率。 Exposure lithography resolution and efficiency, but also to a large extent determines the resolution and exposure lithography machine efficiency.  步进扫描投影光刻机基本原理如图1所示。  step and scan projection lithography basic principle shown in Figure 1. 来自光源10的深紫外光透过掩膜版20、透镜系统30将掩膜版上的一部分图形成像在硅片40的某个芯片上。 Deep ultraviolet light from the light source 10 through the mask 20, lens system 30 forming a part of the pattern on the mask on a silicon chip 40. 掩膜版和硅片反向按一定的速度比例作同步运动，最终将掩膜版上的全部图形成像在硅片的特定芯片上。 Reverse mask and wafer at a certain speed ratio for synchronous movement, eventually the entire mask pattern is imaged on a particular chip in the silicon wafer.  硅片台运动定位系统的基本作用就是在曝光过程中承载着硅片并按设定的速度和方向运动，以实现掩膜版图形向硅片上各区域的精确转移。  The basic function of motion wafer stage positioning system is carrying the wafer during exposure settings and press speed and direction, to achieve accurate pattern transfer of the mask to the regions on the wafer. 由于芯片的线宽非常小（目前最小线宽已经达到45nm)，为保证光刻的套刻精度和分辨率，就要求硅片台具有极高的运动定位精度。 Since the chip is very small width (line width has reached the smallest 45nm), to ensure the overlay accuracy and resolution of the lithography, the wafer stage requires extremely high positioning accuracy. 同时，由于硅片台的运动速度在很大程度上影响着光刻的生产率，从提高生产率的角度，又要求硅片台的运动速度不断提高。 At the same time, due to the speed of movement of the wafer stage lithography affects productivity in large part, from the perspective of improving productivity, but also requires the movement speed of the wafer stage continues to increase. 硅片台需要在稳定度和速度之间达到平衡。 Wafer stage needs to achieve a balance between speed and stability.  传统的硅片台，如专利EP0729073和专利US5996437所描述的，光刻机中只有一个硅片运动定位单元，即一个硅片台。  a conventional wafer stage,, lithography as described in patent EP0729073 and US5996437 patent described only a wafer movement positioning unit, i.e., a wafer stage. 调平调焦等准备工作都要在硅片台上完成，这些工作所需的时间很长。 Leveling focusing and other preparatory work should be completed in the wafer stage, the time required to work very long. 特别是对准工作，由于要求进行精度极高的低速扫描（典型的对准扫描速度为lmm/s)，因此所需时间很长，这样的情形下，要减少光刻机的工作时间非常困难。 In particular the alignment work, due to the high precision required slow scan (typically aligned with a scanning speed of lmm / s), so long time required, under such circumstances, to reduce the operating time of the lithography machine is very difficult .  为了提闻光刻机的生广效率，就必须不断提闻娃片台的步进和曝光扫描的运动速度。  In order to improve the efficiency of smell Shengguang lithography, it must continue to provide audible and exposure scanning speed of the stepping movement of the substrate stage baby. 而速度的提高将不可避免导致系统动态性能的恶化，需要采取大量的技术措施保障和提闻娃片台的运动精度。 The increase in speed will inevitably lead to a deterioration of dynamic performance of the system, we need to take a large number of technical measures to protect and raise the baby smell motion accuracy of the wafer stage. 因此，为保持现有精度或达到更闻精度的同时提闻速度，付出的成本大大提闻。 Therefore, to achieve or maintain the existing precision accuracy smell but also mention speed smell, the smell pay the costs greatly enhanced.  专利W098/40791所描述的结构采用双硅片台结构该专利公开说明书的第三图所示，在第一个硅片台21进行曝光时，将上下片、预对准、对准等曝光准备工作在第二个硅片台23上进行。  The structure described in Patent W098 / 40791 uses a third view of a dual wafer stage structure disclosed in this patent specification, in the first station 21 a wafer is exposed, the upper and lower sheets, pre-alignment, the alignment other preparations for the exposure on the second wafer stage 23. 且两个硅片台同时独立运动，在不提高硅片台运动速度的前提下，曝光硅片台大量的准备工作由第二个硅片台分担，从而大大缩短了每片硅片在曝光光程上的停留时间。 And the independent movement of two wafer stages at the same time, without increasing the speed of movement of the wafer stages, wafer stage exposure shared by a lot of work to prepare the second wafer stage, thereby greatly reducing the light exposure in each wafer the residence time in the process.  然而该双台专利方案在实现光刻工序时，两个硅片台21、23需要停留在如图所示的交换位置上，以进行硅片台21、23连接到另一个移动装置上，进行切换操作，将做好准备工作的硅片台转移至曝光光程中，以进行曝光工序。  However, this patent dual stage lithography step in implementing the embodiment, two wafer stages 21 and 23 need to stay in the position as shown on the exchange to make another mobile device connected to the wafer stage 21 and 23 , the switching operation, the preparatory work is transferred to the wafer stage of an exposure light path for exposure step. 而上述切换操作与光刻工序无关，其产生了相当多的时间消耗，影响产率。 And said switching operation independent of the lithographic process, which produces a considerable amount of time consumption, affect the yield. 发明内容 本发明提出一种光刻机中的双工件台系统，能够解决上述问题，提高光刻机的产率。 SUMMARY OF THE INVENTION  The present invention provides a system for dual stage lithography machine work in, it is possible to solve the above problems and improve the yield of the lithography machine.  为了达到目的,本发明提出一种光刻机的双工件台系统,包括导向表面,其包括一对平行设置的X向导向表面以及一对平行设置的Y向导向表面；第一娃片台和第二娃片台， 其各自沿平行于X向和Y向从第一位置移动到第二位置：移动系统，设置成使第一硅片台和第二娃片台沿该X向导向表面和Y向导向表面移动。  To achieve the object, the present invention proposes a dual stage system for a lithography machine a workpiece, comprising a guide surface, which comprises a pair of parallel Y X disposed to guide arranged parallel to the surface and a guide surface; a first baby doll sheet substrate stage and the second stage, each parallel to the X direction and Y direction from the first position to the second position: the mobile system is arranged so that the first wafer stage and the second substrate stage along the X baby moved to the guide surface and the guide surface of the Y. 其中，该移动系统包括第一移动单兀和第二移动单元，第一硅片台和第二硅片台各自藕接至第一移动单元和第二移动单元，当第一移动单元带动第一娃片台依次沿一X向导向表面的正向、一Y向导向表面的正向以及另一X向导向表面的负向移动时，第二移动单元带动第二硅片台依次沿另一X向导向表面的负向、另一Y向的导向表面的负向以及前述X向导向表面的正向移动，使第一娃片台和第二硅片台交换位置，其中第一移动单元和第二移动单元相互避让不会触碰。 Wherein the movement system comprises a first and a second mobile unit Wu mobile unit, the first wafer and the second wafer stage to the first stage moving each coupling unit and the second moving unit, a first drive when the first mobile unit baby table sequentially in a sheet forward direction X toward the guide surface, a guide surface of the Y-positive and the other negative X-direction when the guide surface moves the second moving unit are sequentially driven in the other of the second wafer stage X the guide surface of the other Y-direction and the negative direction of the X guide surface moves in the negative direction toward the forward surface of the guide, the first substrate stage and the second baby stage wafer exchange position, and wherein the first mobile unit two mobile units do not touch each other escape.  与现有技术相比，本发明所提供的双工件台系统使得该第一移动单元、第二移动单元与第一硅片台和第二硅片台同时移动，不会产生如现有技术中因两个硅片台滞留在一交换位置进行切换而消耗相当的时间，影响产率。  Compared with the prior art, dual stage systems according to the present invention, the workpiece is provided such that the first mobile unit, while the second moving unit moves the first wafer stage and a second wafer stage, will not produce such the prior art by two wafer stages remain in a switched position switches consume considerable time, affect the yield. 附图说明 图1所示为已知的步进扫描投影光刻机结构示意图；图2所示为本发明较佳实施例的光刻装置中的双工件台系统结构示意图； 图3所示为交换图2中的两个硅片台位置之后的双工件台系统的结构示意图； 图4a〜4d所示为双工件台系统中两个硅片台交换位置示意图。 BRIEF DESCRIPTION shown a schematic view of a known projection lithography in step-scan structure  FIG. 1; dual stage system configuration of the workpiece lithographic apparatus  FIG. 2 shows the preferred embodiment of the present invention a schematic view;  FIG. 3 shows a schematic view of exchange of two wafer stages after the 2 position of the workpiece table dual structure of the system;  Figure 4a~4d dual bed system two workpieces a schematic view of exchange position of the wafer stage. 具体实施方式 为了更了解本发明的技术内容，特举具体实施例并配合所附图式说明如下。 DETAILED DESCRIPTION  In order to better understand the technical content of the present invention, several specific embodiments with the accompanying drawings and described below.  图2-3所示为本发明较佳实施例的光刻装置中的双工件台系统结构示意图。  FIG. 2-3 is a schematic diagram dual stage system configuration of the workpiece lithographic apparatus of one embodiment in FIG. 双工件台系统包括四个导向表面，其中包括一对平行设置的X向导向表面1、2以及一对平行设置的Y向导向表面3、4 ;第一娃片台7和第二娃片台8,其各自沿平行于X向和Y向从第一位置移动到第二位置；移动系统，设置成使第一硅片台7和第二硅片台8沿该X向导向表面1、2和Y向导向表面3、4移动,其中，该移动系统包括第一移动单兀和第二移动单兀,第一娃片台7和第二硅片台8各自藕接至第一移动单元和第二移动单元，当第一移动单元带动第一硅片台7依次沿一X向导向表面I的正向、一Y向导向表面4的正向以及另一X向导向表面2的负向移动时，第二移动单元带动第二硅片台8依次沿该另一X向导向表面2的负向、另一Y向导向表面3的负向以及前述X向导向表面I的正向移动，使第一娃片台7和第二硅片台8交换位置，其中第一移动单元和第二移动单元相互避让不会触碰。 Dual-stage system comprising four guide the workpiece surface, wherein X comprises a pair of guide surfaces arranged parallel to the Y 1,2 and a pair of parallel guide surface disposed to 3,4; 7 first substrate stage and the second baby doll sheet table 8, each parallel to the X direction and Y direction from a first position to move to a second position; mobile system, arranged such that the first wafer stage 7 and the second wafer stage 8 along the X-direction guide surface 1, Y 2 and 3, 4 is moved to the guide surface, wherein the system comprises a first mobile and a second mobile unit moving unit Wu Wu, baby first sheet and the second wafer table 7 table 8 are each connected to the first mobile unit lotus and a second mobile unit, the mobile unit when the first wafer stage 7 are sequentially drive the first X-direction along a guide surface of the forward I, a Y-positive and the other guide surface of the guide surface X 4 negative 2 when moving the second moving unit are sequentially driven by the second wafer stage 8 along the negative X-direction to the other surface of the guide 2 and the other Y I moved forward toward the guide surface and the guide surface of the negative direction of X 3, baby table 7 of the first sheet and the second switching position of the wafer stage 8, wherein the first moving unit and the second moving unit relief do not touch each other. 并且，第一硅片台7和第二硅片台8可各自沿第一移动单元和第二移动单元移动。 And, a first and a second wafer stage 7 can each wafer stage 8 along the first moving unit and the second movement of the mobile unit.  在本实施例中，第一移动单元和第二移动单元各自为第一Y向导轨5和第二Y向导轨6,第一娃片台7和第二娃片台8各自藕接至第一Y向导轨5和第二Y向导轨6相对的侧边11、12。  In the present embodiment, the first mobile unit and the second moving unit are each a first Y-direction guide rails 5 and the second Y-6, a first 7 and the second substrate stage baby doll coupling each contact sheet table 8 6 to the first Y 11,12 to the opposite side rail to rail 5 and the second Y. 第一Y向导轨5的另一侧边，即未藕接第一硅片台7的一侧边，供藕接该另一Y向导向表面3并沿其移动,该第一Y向导轨5的两端各设有供对接任一个X向导向表面1、2的第一对接头9、13 ;而第二Y向导轨6的另一侧边，即未藕接第二硅片台8的一侧边，供藕接任该Y向导向表面4并沿其移动，该第二Y向导轨6的两端各设有供对接任一个X向导向表面1、2的第二对接头10、14。 A first side rail to the other Y 5, i.e. not connected to a coupling side of the first wafer table 7, then the other Y for coupling to guide its movement along the surface 3, the first Y-direction guide 5 the ends of each pair is provided for a succession of X toward the guide surface of the first connector 1, 9, 13; Y and a second side to the other guide rail 6, i.e., not connected to a second coupling of the wafer stage 8 a side for coupling took the Y direction and moved along the guide surface 4, to the second Y are each provided at both ends of the guide rail 6 for a succession of X toward the guide surface of the second joint 10, 14, 2 .  如图2至图3，在图2初始工作状态时，即在第一硅片台与第二硅片台交换位置前， 分别位于预处理工位区域I和曝光工位区域II的Y向导轨5、6各自由其一端的对接头9、 10藕接X向导向表面1、2，并受驱动装置（未图示）驱动下，进入如图4a-4d的交换过程， 位于预处理工位区域I的第一Y向导轨5先沿X向导向表面I的正向移动，直到其未藕接硅片台的一侧边藕接至Y向导向表面4并沿其正向移动，直到第一Y向导轨5的另一端的对接头13藕接另一X向导向表面2，并使第一Y向导轨5沿该另一X向导向表面2的负向移动至曝光工位区域II，在第一Y向导轨5移动的过程中,第一Y向导轨5上的第一娃片台7自身可沿第一Y向导轨5移动并可移动至曝光工位，具有局部微调位置的功能；而位于曝光工位区域II的第二Y向导轨6则与位于预处理工位区域I的第一Y向导轨5同时但相反方向运动，  As shown in FIG. 2 to FIG. 3, when the initial operation state of FIG 2, i.e. in a first position and a second wafer stage before the wafer table exchange, are located in region I and the pre-processing workstation exposure station area II Y 1 to guide its respective pair of contacts 5, 6 9, 10 coupling connected to the guide surface of one end of X, and by driving means (not shown) is driven, exchanged into the process in FIG. 4a-4d, the pre-positioned processing station Y to a first region I is moved to the forward surface of the guide rail 5 I along the X-direction, until it is not connected to a coupling side coupling is coupled to the wafer stage and the Y direction is moved to the forward guide surfaces 4 until the first Y toward the other end of the guide rail 5 to the exposure station connected to another joint coupling 13 moves in the X direction to the guide surface 2, and the first Y negative rail 5 along the guide surface of the other X 2 region II, the first move in the Y rail 5 during a first sheet Y to a first baby stage itself on the rail 57 and movable along a first Y to the exposure station 5 is moved toward the guide rail, having a local fine tuning functional position; and the exposure station is located in a second region II of the first Y Y simultaneously but in opposite directions toward the guide rail 5 is located in the region I of the pre-processing workstation to the rail 6, 即位于曝光工位区域II的第二Y向导轨6先沿该另一X向导向表面2的负向移动，直到其未藕接娃片台的一侧边藕接至另一Y向导向表面3并其负向移动,直到第二Y 向导轨6的另一端的对接头14藕接至前述X向导向表面1，使第二Y向导轨6沿前述X向导向表面I的负向移动至预处理工位区域，在第二Y向导轨6移动过程中，第二Y向导轨6 上的第二硅片台8自身可沿第二Y向导轨6移动并移动至预处理工位，这样，该交换系统中Y向导轨5、6、与第一娃片台7和第二娃片台8同时移动,不会产生如现有技术中因两个娃片台滞留在一交换位置进行切换而消耗相当的时间，影响产率。 That region is located in the exposure station II, a second Y-direction guide 6 to the other along the guide surface of the negative X 2 to the mobile, until a coupling side which is not connected to coupling piece baby stage is coupled to another guide surface of the Y 3 and its negative direction until the second X-direction Y is connected to the other end of the guide rail 6 for the coupling joint 14 to the guide surface 1, the I of the second Y negative direction along the guide surface of the guide rail 6 is moved to the X-direction pre-processing workstation area, the second Y-direction guide 6 is moved during the second Y-direction guide on the second wafer stage 68 itself may be moved to the second rail 6 and Y to move along the pre-processing workstation, and the switching system Y, the first baby stage plate 7 and the second substrate stage is moved to baby 5,6 rail 8 while the prior art does not occur as a result of switching two sheets baby table retained in a replacement position consume considerable time, affecting the yield.  虽然本发明已以较佳实施例揭露如上，然其并非用以限定本发明。  While the present invention has been disclosed above by the preferred embodiments, they are not intended to limit the present invention. 本发明所属技术领域中具有通常知识者，在不脱离本发明的精神和范围内，当可作各种的更动与润饰。 Technical Field The present invention pertains having ordinary knowledge in the present invention without departing from the spirit and scope, may make various modifications and variations. 因此，本发明的保护范围当视权利要求书所界定者为准。 Accordingly, the scope of the present invention when the book following claims and their equivalents.