CN102187685B - 具有多个换能器元件的传声器 - Google Patents
具有多个换能器元件的传声器 Download PDFInfo
- Publication number
- CN102187685B CN102187685B CN200980140993.XA CN200980140993A CN102187685B CN 102187685 B CN102187685 B CN 102187685B CN 200980140993 A CN200980140993 A CN 200980140993A CN 102187685 B CN102187685 B CN 102187685B
- Authority
- CN
- China
- Prior art keywords
- substrate
- microphone
- transducer
- shell
- mems transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
- H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
- H04R1/406—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers microphones
Landscapes
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10507308P | 2008-10-14 | 2008-10-14 | |
US61/105,073 | 2008-10-14 | ||
PCT/US2009/060115 WO2010045107A2 (en) | 2008-10-14 | 2009-10-09 | Microphone having multiple transducer elements |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102187685A CN102187685A (zh) | 2011-09-14 |
CN102187685B true CN102187685B (zh) | 2015-03-11 |
Family
ID=42098875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980140993.XA Active CN102187685B (zh) | 2008-10-14 | 2009-10-09 | 具有多个换能器元件的传声器 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8170244B2 (de) |
JP (1) | JP5844155B2 (de) |
CN (1) | CN102187685B (de) |
DE (1) | DE112009002542A5 (de) |
WO (1) | WO2010045107A2 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
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US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
EP2415278A4 (de) * | 2009-04-01 | 2013-05-15 | Knowles Electronics Llc | Empfängeranordnungen |
US20100303274A1 (en) * | 2009-05-18 | 2010-12-02 | William Ryan | Microphone Having Reduced Vibration Sensitivity |
JP4505035B1 (ja) * | 2009-06-02 | 2010-07-14 | パナソニック株式会社 | ステレオマイクロホン装置 |
CN103999484B (zh) | 2011-11-04 | 2017-06-30 | 美商楼氏电子有限公司 | 作为声学设备中的屏障的嵌入式电介质和制造方法 |
JP5741487B2 (ja) * | 2012-02-29 | 2015-07-01 | オムロン株式会社 | マイクロフォン |
CN102595295B (zh) * | 2012-03-06 | 2015-08-05 | 歌尔声学股份有限公司 | 一种mems麦克风 |
CN102595294B (zh) * | 2012-03-06 | 2015-01-21 | 歌尔声学股份有限公司 | 一种mems麦克风 |
US20130284537A1 (en) * | 2012-04-26 | 2013-10-31 | Knowles Electronics, Llc | Acoustic Assembly with Supporting Members |
US9402118B2 (en) | 2012-07-27 | 2016-07-26 | Knowles Electronics, Llc | Housing and method to control solder creep on housing |
US9491539B2 (en) | 2012-08-01 | 2016-11-08 | Knowles Electronics, Llc | MEMS apparatus disposed on assembly lid |
CN104604248B (zh) | 2012-09-10 | 2018-07-24 | 罗伯特·博世有限公司 | 具有模制互联器件的mems麦克风封装 |
KR20150087410A (ko) | 2012-12-19 | 2015-07-29 | 노우레스 일렉트로닉스, 엘엘시 | 고전압 i/o 정-전기 방전 보호를 위한 장치 및 방법 |
US9407231B2 (en) | 2013-02-06 | 2016-08-02 | Htc Corporation | Apparatus and method of multi-sensor sound recording |
US9809448B2 (en) | 2013-03-13 | 2017-11-07 | Invensense, Inc. | Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same |
US8692340B1 (en) | 2013-03-13 | 2014-04-08 | Invensense, Inc. | MEMS acoustic sensor with integrated back cavity |
US9467785B2 (en) | 2013-03-28 | 2016-10-11 | Knowles Electronics, Llc | MEMS apparatus with increased back volume |
ITPZ20130004A1 (it) * | 2013-05-10 | 2013-08-09 | Stmg S R L | Sistema per l'acquisizione di dati da sensori rumorosi |
US9254995B2 (en) | 2013-09-17 | 2016-02-09 | Analog Devices, Inc. | Multi-port device package |
CN104602171A (zh) * | 2013-10-30 | 2015-05-06 | 北京卓锐微技术有限公司 | 一种集成的硅电容麦克风 |
US10589987B2 (en) | 2013-11-06 | 2020-03-17 | Infineon Technologies Ag | System and method for a MEMS transducer |
US9307328B2 (en) | 2014-01-09 | 2016-04-05 | Knowles Electronics, Llc | Interposer for MEMS-on-lid microphone |
DE102014100464B4 (de) * | 2014-01-16 | 2022-02-17 | Tdk Corporation | Multi-MEMS-Modul |
CN105101024A (zh) * | 2014-04-22 | 2015-11-25 | 钰太芯微电子科技(上海)有限公司 | 多振膜微机电系统麦克风结构 |
GB2526945B (en) * | 2014-06-06 | 2017-04-05 | Cirrus Logic Inc | Noise cancellation microphones with shared back volume |
US9532125B2 (en) | 2014-06-06 | 2016-12-27 | Cirrus Logic, Inc. | Noise cancellation microphones with shared back volume |
US9554214B2 (en) | 2014-10-02 | 2017-01-24 | Knowles Electronics, Llc | Signal processing platform in an acoustic capture device |
TW201620312A (zh) * | 2014-11-27 | 2016-06-01 | Lingsen Precision Ind Ltd | 倒裝式微機電麥克風 |
WO2016113199A1 (en) * | 2015-01-16 | 2016-07-21 | Chambre De Commerce Et D'industrie De Region Paris Ile De France (Esiee Paris) | Miniature kinetic energy harvester for generating electrical energy from mechanical vibrations |
US9800971B2 (en) | 2015-03-17 | 2017-10-24 | Knowles Electronics, Llc | Acoustic apparatus with side port |
CN104936116B (zh) * | 2015-06-01 | 2018-12-04 | 山东共达电声股份有限公司 | 一种集成的差分硅电容麦克风 |
KR101673347B1 (ko) * | 2015-07-07 | 2016-11-07 | 현대자동차 주식회사 | 마이크로폰 |
US10412491B2 (en) * | 2015-10-30 | 2019-09-10 | Goertek, Inc. | Band-pass acoustic filter and acoustic sensing apparatus |
KR20180015482A (ko) | 2016-08-03 | 2018-02-13 | 삼성전자주식회사 | 음향 스펙트럼 분석기 및 이에 구비된 공진기들의 배열방법 |
US11341973B2 (en) | 2016-12-29 | 2022-05-24 | Samsung Electronics Co., Ltd. | Method and apparatus for recognizing speaker by using a resonator |
KR102335774B1 (ko) | 2017-09-01 | 2021-12-06 | 삼성전자주식회사 | 다중 공진기 어레이를 포함하는 소리 방향 탐지 센서 |
CN111133768A (zh) * | 2017-09-21 | 2020-05-08 | 美商楼氏电子有限公司 | 具有进入保护的麦克风中的提升mems器件 |
CN107948781A (zh) * | 2017-11-27 | 2018-04-20 | 钰太芯微电子科技(上海)有限公司 | 一种新型麦克风结构及翻盖式电子设备 |
JP2020036215A (ja) | 2018-08-30 | 2020-03-05 | Tdk株式会社 | Memsマイクロフォン |
JP2020036214A (ja) | 2018-08-30 | 2020-03-05 | Tdk株式会社 | Memsマイクロフォン |
CN112806026B (zh) | 2018-10-09 | 2022-05-31 | 美商楼氏电子有限公司 | 集成电路、麦克风组件、多麦克风系统、处理音频流的方法 |
EP3672277B1 (de) | 2018-12-19 | 2024-04-03 | Sonion Nederland B.V. | Miniaturlautsprecher mit mehreren schallhohlräumen |
KR102682129B1 (ko) | 2018-12-20 | 2024-07-09 | 삼성전자주식회사 | Adc, 집적 회로, 및 센서 시스템 |
KR102626924B1 (ko) | 2019-06-20 | 2024-01-19 | 삼성전자주식회사 | 지향성 음향 센서와, 이를 이용한 지향 특성의 조절 방법 및 특정 방향의 음향 신호 감쇄 방법 |
CN213547840U (zh) * | 2019-12-30 | 2021-06-25 | 美商楼氏电子有限公司 | 用于麦克风组件的声音端口适配器 |
CN113132838A (zh) | 2019-12-30 | 2021-07-16 | 美商楼氏电子有限公司 | 用于麦克风组件的亥姆霍兹共振器 |
DE102020204773A1 (de) | 2020-04-15 | 2021-10-21 | Robert Bosch Gesellschaft mit beschränkter Haftung | Sensoranordnung, umfassend eine Mehrzahl von einzelnen und separaten Sensorelementen |
US11284187B1 (en) * | 2020-10-26 | 2022-03-22 | Fortemedia, Inc. | Small-array MEMS microphone apparatus and noise suppression method thereof |
KR20230086877A (ko) | 2021-12-08 | 2023-06-16 | 삼성전자주식회사 | 지향성 음향 센서 |
KR20230095689A (ko) | 2021-12-22 | 2023-06-29 | 삼성전자주식회사 | 마이크로폰 패키지 및 이를 포함하는 전자 장치 |
CN216626054U (zh) * | 2021-12-22 | 2022-05-27 | 瑞声开泰科技(武汉)有限公司 | 一种mems麦克风 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1387741A (zh) * | 1999-09-06 | 2002-12-25 | 微电子有限公司 | 基于硅的传感器系统 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002152873A (ja) * | 2000-11-09 | 2002-05-24 | Nippon Hoso Kyokai <Nhk> | マイク |
US7434305B2 (en) * | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
JP4336256B2 (ja) * | 2004-06-18 | 2009-09-30 | 株式会社オーディオテクニカ | コンデンサマイクロホン |
JP2006211468A (ja) * | 2005-01-31 | 2006-08-10 | Sanyo Electric Co Ltd | 半導体センサ |
KR100648398B1 (ko) * | 2005-07-07 | 2006-11-24 | 주식회사 비에스이 | 실리콘 콘덴서 마이크로폰의 패키징 구조 및 그 제조방법 |
US20100155863A1 (en) * | 2005-08-11 | 2010-06-24 | Koninklijke Philips Electronics, N.V. | Method for manufacturing a microelectronic package comprising a silicon mems microphone |
JP4804095B2 (ja) * | 2005-10-07 | 2011-10-26 | パナソニック株式会社 | マイクロホン装置 |
KR100737728B1 (ko) * | 2006-04-21 | 2007-07-10 | 주식회사 비에스이 | 멤스 마이크로폰의 패키징 구조 및 그 조립방법 |
US7763488B2 (en) * | 2006-06-05 | 2010-07-27 | Akustica, Inc. | Method of fabricating MEMS device |
KR100737726B1 (ko) * | 2006-07-10 | 2007-07-10 | 주식회사 비에스이 | 멤스 마이크로폰 패키징 구조체 |
US7657025B2 (en) * | 2006-07-17 | 2010-02-02 | Fortemedia, Inc. | Microphone module and method for fabricating the same |
TW200904222A (en) * | 2007-02-26 | 2009-01-16 | Yamaha Corp | Sensitive silicon microphone with wide dynamic range |
-
2009
- 2009-10-09 DE DE112009002542T patent/DE112009002542A5/de not_active Withdrawn
- 2009-10-09 WO PCT/US2009/060115 patent/WO2010045107A2/en active Application Filing
- 2009-10-09 JP JP2011532157A patent/JP5844155B2/ja not_active Expired - Fee Related
- 2009-10-09 CN CN200980140993.XA patent/CN102187685B/zh active Active
- 2009-10-12 US US12/577,491 patent/US8170244B2/en active Active
-
2012
- 2012-04-26 US US13/456,348 patent/US8594347B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1387741A (zh) * | 1999-09-06 | 2002-12-25 | 微电子有限公司 | 基于硅的传感器系统 |
Also Published As
Publication number | Publication date |
---|---|
JP2012506211A (ja) | 2012-03-08 |
US20100092020A1 (en) | 2010-04-15 |
DE112009002542A5 (de) | 2011-09-08 |
DE112009002542T5 (de) | 2012-01-19 |
WO2010045107A3 (en) | 2010-08-05 |
US20120207334A1 (en) | 2012-08-16 |
CN102187685A (zh) | 2011-09-14 |
US8170244B2 (en) | 2012-05-01 |
US8594347B2 (en) | 2013-11-26 |
JP5844155B2 (ja) | 2016-01-13 |
WO2010045107A2 (en) | 2010-04-22 |
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